WO2005021826A3 - Titanium foil metallization product and process - Google Patents

Titanium foil metallization product and process Download PDF

Info

Publication number
WO2005021826A3
WO2005021826A3 PCT/US2004/027810 US2004027810W WO2005021826A3 WO 2005021826 A3 WO2005021826 A3 WO 2005021826A3 US 2004027810 W US2004027810 W US 2004027810W WO 2005021826 A3 WO2005021826 A3 WO 2005021826A3
Authority
WO
WIPO (PCT)
Prior art keywords
titanium
titanium foil
foil
metallization product
sputter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2004/027810
Other languages
French (fr)
Other versions
WO2005021826A2 (en
Inventor
Brad M Fye
Thomas A Andersen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Corp
Original Assignee
Northrop Grumman Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northrop Grumman Corp filed Critical Northrop Grumman Corp
Priority to AU2004269356A priority Critical patent/AU2004269356A1/en
Priority to EP04786592A priority patent/EP1660696A2/en
Publication of WO2005021826A2 publication Critical patent/WO2005021826A2/en
Publication of WO2005021826A3 publication Critical patent/WO2005021826A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

According to some preferred embodiments, a physical vacuum deposition process for titanium foil can include: sputter etching one side of the titanium foil for about, e.g., 5 to 20 minutes; sputter depositing Titanium or a Titanium-Tungsten alloy; sputter depositing a low stress nickel; sputter depositing gold; reversing the foil and repeating these steps.
PCT/US2004/027810 2003-08-29 2004-08-27 Titanium foil metallization product and process Ceased WO2005021826A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2004269356A AU2004269356A1 (en) 2003-08-29 2004-08-27 Titanium foil metallization product and process
EP04786592A EP1660696A2 (en) 2003-08-29 2004-08-27 Titanium foil metallization product and process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49865003P 2003-08-29 2003-08-29
US60/498,650 2003-08-29

Publications (2)

Publication Number Publication Date
WO2005021826A2 WO2005021826A2 (en) 2005-03-10
WO2005021826A3 true WO2005021826A3 (en) 2005-12-01

Family

ID=34272712

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/027810 Ceased WO2005021826A2 (en) 2003-08-29 2004-08-27 Titanium foil metallization product and process

Country Status (4)

Country Link
US (1) US20050045469A1 (en)
EP (1) EP1660696A2 (en)
AU (1) AU2004269356A1 (en)
WO (1) WO2005021826A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101708291B1 (en) 2011-06-06 2017-02-27 워싱턴 스테이트 유니버시티 Batteries with nanostructured electrodes and associated methods
WO2014126705A1 (en) 2013-01-29 2014-08-21 Washington State University Research Foundation Lithium-ion batteries with nanostructured electrodes
CN104616983B (en) * 2015-01-31 2017-11-24 上海华虹宏力半导体制造有限公司 Back face metalization technological process

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU382774A1 (en) * 1971-01-04 1973-05-25 Ордена Трудового Красного Знамени Институт физической химии СССР ^ Ya-; l &: -; sesh
US3835007A (en) * 1971-12-24 1974-09-10 Rhone Progil Process for bonding copper or iron to titanium or tantalum
GB1372167A (en) * 1972-05-12 1974-10-30 Cit Alcatel Method of depositing thin metallic layers
US4137370A (en) * 1977-08-16 1979-01-30 The United States Of America As Represented By The Secretary Of The Air Force Titanium and titanium alloys ion plated with noble metals and their alloys
US4216271A (en) * 1976-11-05 1980-08-05 Matsushita Electric Industrial Co., Ltd. Composite diaphragm for speaker
EP0363673A1 (en) * 1988-09-15 1990-04-18 Nippondenso Co., Ltd. Sputter-deposited nickel layer and process for depositing same
EP0402568A2 (en) * 1989-06-16 1990-12-19 Nkk Corporation Method of manufacturing a titanium magnetic disk substrate
EP0460246A1 (en) * 1986-05-21 1991-12-11 The B.F. Goodrich Company Window for acoustic wave form and method for making
FR2683969A1 (en) * 1991-11-15 1993-05-21 Thomson Csf SEALING MEMBRANE FOR UNDERWATER DEVICE, PARTICULARLY FOR UNDERWATER ACOUSTIC DEVICE, AND DEVICE COMPRISING SUCH A MEMBRANE.
US6586114B1 (en) * 2002-07-24 2003-07-01 Vapor Technologies, Inc. Coated article having a dark copper color

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US460246A (en) * 1891-09-29 aytoun
US402568A (en) * 1889-05-07 Store-service apparatus
US4582564A (en) * 1982-01-04 1986-04-15 At&T Technologies, Inc. Method of providing an adherent metal coating on an epoxy surface
US4799745A (en) * 1986-06-30 1989-01-24 Southwall Technologies, Inc. Heat reflecting composite films and glazing products containing the same
US5554889A (en) * 1992-04-03 1996-09-10 Motorola, Inc. Structure and method for metallization of semiconductor devices
CA2417092C (en) * 2000-07-26 2005-05-31 Corus Aluminium Walzprodukte Gmbh Nickel-plated brazing sheet product

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU382774A1 (en) * 1971-01-04 1973-05-25 Ордена Трудового Красного Знамени Институт физической химии СССР ^ Ya-; l &: -; sesh
US3835007A (en) * 1971-12-24 1974-09-10 Rhone Progil Process for bonding copper or iron to titanium or tantalum
GB1372167A (en) * 1972-05-12 1974-10-30 Cit Alcatel Method of depositing thin metallic layers
US4216271A (en) * 1976-11-05 1980-08-05 Matsushita Electric Industrial Co., Ltd. Composite diaphragm for speaker
US4137370A (en) * 1977-08-16 1979-01-30 The United States Of America As Represented By The Secretary Of The Air Force Titanium and titanium alloys ion plated with noble metals and their alloys
EP0460246A1 (en) * 1986-05-21 1991-12-11 The B.F. Goodrich Company Window for acoustic wave form and method for making
EP0363673A1 (en) * 1988-09-15 1990-04-18 Nippondenso Co., Ltd. Sputter-deposited nickel layer and process for depositing same
EP0402568A2 (en) * 1989-06-16 1990-12-19 Nkk Corporation Method of manufacturing a titanium magnetic disk substrate
FR2683969A1 (en) * 1991-11-15 1993-05-21 Thomson Csf SEALING MEMBRANE FOR UNDERWATER DEVICE, PARTICULARLY FOR UNDERWATER ACOUSTIC DEVICE, AND DEVICE COMPRISING SUCH A MEMBRANE.
US6586114B1 (en) * 2002-07-24 2003-07-01 Vapor Technologies, Inc. Coated article having a dark copper color

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
BARSON S D ET AL: "Investigation of ion assisted palladium treatments for improved corrosion resistance of titanium foil in the electron beam dry scrubber process", SURF COAT TECHNOL; SURFACE AND COATINGS TECHNOLOGY 2000 ELSEVIER SEQUOIA SA, LAUSANNE, SWITZERLAND, vol. 127, no. 2, 2000, pages 179 - 192, XP002337872 *
DATABASE WPI Section Ch Week 197405, Derwent World Patents Index; Class M11, AN 1974-08863V, XP002322023 *
KOSKI K ET AL: "The connection between sputter cleaning and adhesion of thin solid films", SURFACE AND COATINGS TECHNOLOGY ELSEVIER SWITZERLAND, vol. 80, no. 1-2, March 1996 (1996-03-01), pages 195 - 199, XP002337873, ISSN: 0257-8972 *

Also Published As

Publication number Publication date
AU2004269356A1 (en) 2005-03-10
US20050045469A1 (en) 2005-03-03
WO2005021826A2 (en) 2005-03-10
EP1660696A2 (en) 2006-05-31

Similar Documents

Publication Publication Date Title
EP2264215A3 (en) Copper alloy sputtering target, process for producing the same and semiconductor element wiring
WO2005007909A3 (en) Cobalt alloys, methods of making cobalt alloys, and implants and articles of manufacture made therefrom
EP1605736A3 (en) Integrated circuits with copper metallization for interconnection
WO2007047511A3 (en) Methods of making molybdenum titanium sputtering plates and targets
EP1233448A3 (en) Reliable interconnects with low via/contact resistance
EP2465969A3 (en) Copper alloy sputtering target and manufacturing method of said target
WO2008028981A3 (en) Process for depositing a thin film of a metal alloy on a substrate, and a metal alloy in thin-film form
EP1094504A3 (en) PVD-IMP tungsten and tungsten nitride as a liner, barrier, and/or seed layer
AU2001229584A1 (en) Process for providing seed layers for aluminium, copper, gold and silver metallurgy
AU1609501A (en) Physical vapor deposition targets, conductive integrated circuit metal alloy interconnections, electroplating anodes, and metal alloys for use as a conductive interconnection in an integrated circuit
WO2007033282A3 (en) Methods of making shape memory films by chemical vapor deposition and shape memory devices made thereby
WO2004114366A3 (en) Hdp-cvd multistep gapfill process
AU2003297616A1 (en) Low cost high speed titanium and its alloy production
WO2004033742A3 (en) Pvd target and method of treating target
USD496155S1 (en) Arm band carrier
AU2003268697A1 (en) Aluminum alloy for casting-forging, aluminum cast/forged article, and method for manufacture thereof
EP0954015A3 (en) High throughput Al-Cu thin film sputtering process on small contact via
WO2003028090A3 (en) Integration of barrier layer and seed layer
WO2002061167A3 (en) Target/backing plate assemblies
EP1126139A3 (en) Muffler made of a titanium alloy
WO2004052785A3 (en) High purity nickel/vanadium sputtering components; and methods of making sputtering components
WO2003027355A1 (en) Soft metal and method for preparation thereof, and exterior part of watch and method for preparation thereof
CA2416093A1 (en) Vapour deposition
WO2003015217A3 (en) Electric contact
WO2005071135A3 (en) Tantalum and other metals with (110) orientation

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2004786592

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2004269356

Country of ref document: AU

ENP Entry into the national phase

Ref document number: 2004269356

Country of ref document: AU

Date of ref document: 20040827

Kind code of ref document: A

WWP Wipo information: published in national office

Ref document number: 2004269356

Country of ref document: AU

WWP Wipo information: published in national office

Ref document number: 2004786592

Country of ref document: EP