WO2005050746A3 - Kostengünstige, miniaturisierte aufbau- und verbindungstechnik für leuchtdioden und andere optoelektronische module - Google Patents

Kostengünstige, miniaturisierte aufbau- und verbindungstechnik für leuchtdioden und andere optoelektronische module Download PDF

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Publication number
WO2005050746A3
WO2005050746A3 PCT/EP2004/052676 EP2004052676W WO2005050746A3 WO 2005050746 A3 WO2005050746 A3 WO 2005050746A3 EP 2004052676 W EP2004052676 W EP 2004052676W WO 2005050746 A3 WO2005050746 A3 WO 2005050746A3
Authority
WO
WIPO (PCT)
Prior art keywords
technique
opto
economic
light emitting
emitting diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2004/052676
Other languages
English (en)
French (fr)
Other versions
WO2005050746A2 (de
Inventor
Ewald Guenther
Joerg-Erich Sorg
Karl Weidner
Joerg Zapf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Ams Osram International GmbH
Siemens Corp
Original Assignee
Osram Opto Semiconductors GmbH
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH, Siemens AG, Siemens Corp filed Critical Osram Opto Semiconductors GmbH
Priority to EP10177356.2A priority Critical patent/EP2262016B1/de
Priority to EP04791319.9A priority patent/EP1685603B1/de
Priority to US10/579,542 priority patent/US7759754B2/en
Priority to JP2006540423A priority patent/JP2007511914A/ja
Priority to KR1020067011986A priority patent/KR101164259B1/ko
Publication of WO2005050746A2 publication Critical patent/WO2005050746A2/de
Publication of WO2005050746A3 publication Critical patent/WO2005050746A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07131—Means for applying material, e.g. for deposition or forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component

Landscapes

  • Led Device Packages (AREA)
  • Photovoltaic Devices (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Ein Erzeugnis weist ein Substrat mit einem optoelektronischen Bauelement auf, das planar kontaktiert ist.
PCT/EP2004/052676 2003-11-17 2004-10-27 Kostengünstige, miniaturisierte aufbau- und verbindungstechnik für leuchtdioden und andere optoelektronische module Ceased WO2005050746A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP10177356.2A EP2262016B1 (de) 2003-11-17 2004-10-27 Kostengünstige, miniaturisierte Aufbau- und Verbindungstechnik für LEDs und andere optoelektronische Module
EP04791319.9A EP1685603B1 (de) 2003-11-17 2004-10-27 Kostengünstige, miniaturisierte aufbau- und verbindungstechnik für leds und andere optoelektronische module
US10/579,542 US7759754B2 (en) 2003-11-17 2004-10-27 Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules
JP2006540423A JP2007511914A (ja) 2003-11-17 2004-10-27 発光ダイオードおよびその他の光電モジュールに対するエコノミーな、小型化されたコンストラクションおよびコネクション技術
KR1020067011986A KR101164259B1 (ko) 2003-11-17 2004-10-27 Ｌｅｄ 및 다른 광전자 모듈을 위한 경제적인 소형화 구조 기법 및 접합 기법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10353679.5 2003-11-17
DE10353679A DE10353679A1 (de) 2003-11-17 2003-11-17 Kostengünstige, miniaturisierte Aufbau- und Verbindungstechnik für LEDs und andere optoelektronische Module

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP10177356.2A Previously-Filed-Application EP2262016B1 (de) 2003-11-17 2004-10-27 Kostengünstige, miniaturisierte Aufbau- und Verbindungstechnik für LEDs und andere optoelektronische Module

Publications (2)

Publication Number Publication Date
WO2005050746A2 WO2005050746A2 (de) 2005-06-02
WO2005050746A3 true WO2005050746A3 (de) 2005-07-28

Family

ID=34530247

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/052676 Ceased WO2005050746A2 (de) 2003-11-17 2004-10-27 Kostengünstige, miniaturisierte aufbau- und verbindungstechnik für leuchtdioden und andere optoelektronische module

Country Status (8)

Country Link
US (1) US7759754B2 (de)
EP (2) EP2262016B1 (de)
JP (1) JP2007511914A (de)
KR (1) KR101164259B1 (de)
CN (2) CN1910761A (de)
DE (1) DE10353679A1 (de)
TW (1) TWI305426B (de)
WO (1) WO2005050746A2 (de)

Families Citing this family (30)

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DE102005019375A1 (de) 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh LED-Array
JP2007036030A (ja) * 2005-07-28 2007-02-08 Nichia Chem Ind Ltd 発光装置及びその製造方法
DE102005055293A1 (de) 2005-08-05 2007-02-15 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Halbleiterchips und Dünnfilm-Halbleiterchip
DE102005041099A1 (de) * 2005-08-30 2007-03-29 Osram Opto Semiconductors Gmbh LED-Chip mit Glasbeschichtung und planarer Aufbau- und Verbindungstechnik
DE102006015117A1 (de) 2006-03-31 2007-10-04 Osram Opto Semiconductors Gmbh Optoelektronischer Scheinwerfer, Verfahren zum Herstellen eines optoelektronischen Scheinwerfers und Lumineszenzdiodenchip
US7626262B2 (en) * 2006-06-14 2009-12-01 Infineon Technologies Ag Electrically conductive connection, electronic component and method for their production
DE102007004303A1 (de) 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
DE102007004304A1 (de) 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
DE102007011123A1 (de) * 2007-03-07 2008-09-11 Osram Opto Semiconductors Gmbh Licht emittierendes Modul und Herstellungsverfahren für ein Licht emittierendes Modul
DE102007015893A1 (de) * 2007-04-02 2008-10-09 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung sowie Verfahren zum Betrieb und Verfahren zur Herstellung einer optoelektronischen Anordnung
DE102007030129A1 (de) * 2007-06-29 2009-01-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente und optoelektronisches Bauelement
DE102008006757A1 (de) 2008-01-30 2009-08-06 Osram Opto Semiconductors Gmbh Oberflächenmontierbares Bauelement
TW200937667A (en) * 2008-02-20 2009-09-01 Advanced Optoelectronic Tech Package structure of chemical compound semiconductor device and fabricating method thereof
DE102008015551A1 (de) * 2008-03-25 2009-10-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit planarer Kontaktierung und Verfahren zu dessen Herstellung
DE102008028299B3 (de) * 2008-06-13 2009-07-30 Epcos Ag Systemträger für elektronische Komponente und Verfahren für dessen Herstellung
DE102008049188A1 (de) 2008-09-26 2010-04-01 Osram Opto Semiconductors Gmbh Optoelektronisches Modul mit einem Trägersubstrat und einer Mehrzahl von strahlungsemittierenden Halbleiterbauelementen und Verfahren zu dessen Herstellung
DE102008049069B8 (de) 2008-09-26 2020-10-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Modul mit einem Trägersubstrat, zumindest einem strahlungsemittierenden Halbleiterbauelement und mindestens einem elektrischen Bauelement und Verfahren zu dessen Herstellung
US7955873B2 (en) * 2009-03-31 2011-06-07 Infineon Technologies Ag Method of fabricating a semiconductor device
DE102009039890A1 (de) 2009-09-03 2011-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einem Halbleiterkörper, einer Isolationsschicht und einer planaren Leitstruktur und Verfahren zu dessen Herstellung
DE102009039891A1 (de) 2009-09-03 2011-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Modul aufweisend zumindest einen ersten Halbleiterkörper mit einer Strahlungsaustrittsseite und einer Isolationsschicht und Verfahren zu dessen Herstellung
DE102009042205A1 (de) * 2009-09-18 2011-03-31 Osram Opto Semiconductors Gmbh Optoelektronisches Modul
DE102010032497A1 (de) * 2010-07-28 2012-02-02 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips
US20120052458A1 (en) * 2010-08-24 2012-03-01 Roger Harman Removable orthodontic or orthopedic appliance with inlaid design piece and the method of construction
JP5625778B2 (ja) * 2010-11-12 2014-11-19 富士ゼロックス株式会社 発光チップ、発光装置、プリントヘッドおよび画像形成装置
US8653542B2 (en) * 2011-01-13 2014-02-18 Tsmc Solid State Lighting Ltd. Micro-interconnects for light-emitting diodes
DE102012200327B4 (de) 2012-01-11 2022-01-05 Osram Gmbh Optoelektronisches Bauelement
DE102013210668A1 (de) * 2013-06-07 2014-12-11 Würth Elektronik GmbH & Co. KG Verfahren zur Herstellung eines optischen Moduls
DE102016109519A1 (de) 2016-05-24 2017-11-30 Osram Gmbh Eindeckungsteil für ein Gewächshaus, Gewächshaus und Verwendung einer Schicht für ein Eindeckungsteil
DE102019220378A1 (de) * 2019-12-20 2021-06-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement und verfahren zu dessen herstellung
DE102020119511A1 (de) 2020-07-23 2022-01-27 Ic-Haus Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements

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Also Published As

Publication number Publication date
US20070190290A1 (en) 2007-08-16
CN1910761A (zh) 2007-02-07
JP2007511914A (ja) 2007-05-10
EP2262016B1 (de) 2019-05-08
KR20060099531A (ko) 2006-09-19
EP2262016A2 (de) 2010-12-15
WO2005050746A2 (de) 2005-06-02
US7759754B2 (en) 2010-07-20
EP2262016A3 (de) 2015-04-29
DE10353679A1 (de) 2005-06-02
EP1685603A2 (de) 2006-08-02
EP1685603B1 (de) 2015-09-30
KR101164259B1 (ko) 2012-07-09
TW200529471A (en) 2005-09-01
CN102088056A (zh) 2011-06-08
TWI305426B (en) 2009-01-11

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