WO2005086246A2 - Improvements in or relating to thermoelectric heat pumps - Google Patents
Improvements in or relating to thermoelectric heat pumps Download PDFInfo
- Publication number
- WO2005086246A2 WO2005086246A2 PCT/IT2005/000112 IT2005000112W WO2005086246A2 WO 2005086246 A2 WO2005086246 A2 WO 2005086246A2 IT 2005000112 W IT2005000112 W IT 2005000112W WO 2005086246 A2 WO2005086246 A2 WO 2005086246A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermoelectric
- heat
- heat exchangers
- elongated bar
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/82—Interconnections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
Definitions
- thermoelectric heat pumps are solid state devices which make use of a thermoelectric effect known as Peltier effect for refrigerating and/or heating purposes in the domestic and/or industrial field.
- thermoelectric module which is formed of an array of thermoelectric elements consisting in conductors or semiconductors of the P and N type which are connected electrically in series and thermally in parallel together.
- the thermoelectric elements are assembled on supports of electrically insulating and thermally conducting material which is generally a ceramic-like material.
- the thermoelectric modules are connected to heat exchangers for forming a heat pump intended for domestic and industrial applications.
- thermoelectric heat pumps known in the art generally exhibit some drawbacks concerning the way the heat exchangers are connected to the thermoelectric modules and how the latter are electrically connected to a power source, as well as to a controller.
- the present invention addressees these drawbacks of the known art by providing an improved thermoelectric heat pump.
- the thermoelectric heat pump comprises one or more thermoelectric modules having a hot side connected to a first heat exchanger and a cold side connected to a second heat exchanger, and is characterised in that it comprises a pair of elongated barlike elements made of an electrically and thermally insulating material which are arranged at two parallel sides of the heat exchangers, at least partly interposed between facing flanges of said heat exchangers, at least one of said elongated bar-like elements including electric conductors for supplying power to the thermoelectric modules, as well as conductors for supplying control signals therefor, and that said heat exchangers contacting the thermoelectric modules are linked one another via a plurality of fasteners, each fastener being formed of a substantially C-shaped metal clip and being apt to grip with both ends thereof the facing flanges of the heat exchangers in order to hold them together, at least one of said ends of the fastener gripping a corresponding flange of a heat exchanger indirectly with the
- FIG. 10 generally designates a heat pump comprising at least a thermoelectric module 11 connected to a first heat exchanger 12, which thermally contacts the a hot side of the thermoelectric module, and to a second heat exchanger 13, which thermally contacts a cold side of the thermoelectric module.
- thermoelectric heat pump 10 provides an array of thermoelectric modules 11 thermally connected one another in parallel, wherein a hot side of each thermoelectric module 11 thermally contacts a separate heat exchanger, whereas a cold side thermally contacts a heat exchanger which is common to all the thermoelectric modules 11 of the array.
- the configuration of the thermoelectric heat pump 10 may also provide an array of thermoelectric modules 11 thermally connected one another in parallel, wherein each hot side and cold side of the thermoelectric modules 11 contact separate heat exchangers, or alternatively heat exchanger which are common to all the thermoelectric modules 11 of the array.
- the heat exchangers 12 and 13 are arranged in the thermoelectric heat pump so that the fluid currents which touch the thermal exchange surfaces have cross flow directions.
- the structure disclosed above is particularly advantageous in that it provides a heat pump which is capable of adapting itself to different application requirements.
- an insulated bus-bar conductor 14 is provided which is made of an electrically and thermally insulating material containing inside the conductors for supplying electric power to the thermoelectric modules 11.
- the bus-bar conductor 14 may also be used for carrying electrical conductors of a controller circuit means for the thermoelectric modules 11, as well as power supply circuit means for supplying power to a circulating means for causing a current flow of a heat exchange medium over the surfaces of the heat exchangers 12, 13.
- the bus-bar conductor 14 is located on a side of the thermoelectric heat pump 10 and arranged near a pair of edges of facing flanges of the heat exchangers 12, 13, at least in part inserted between said edges of the flanges of the heat exchangers 12,13.
- a similar insulated busbar conductor, designated by 15, which may have other purpose of power or signal supply to the thermoelectric modules 11, or alternatively a bar of electrically and thermally insulating material is arranged on the opposite side of the thermoelectric heat pump 10. Insulated bus-bars 14, 15 are interposed at least partly between the facing flanges of the heat exchangers 12,13 without interfering therewith.
- the heat exchangers 12,13 are thermally into contact with the thermoelectric modules 11 and connected one another via a plurality of fasteners 16 each being formed of a substantially C-shaped metal clip.
- Each fasteners grips the facing flanges of the heat exchangers with its ends 16', 16", at least one of said ends indirectly through an interposing transverse extension 17 of the insulating bus-bar 14,15 which, because of its being electrically and thermally insulating, breaks the thermal bridge which otherwise would be formed between the heat exchangers.
- the concave portion of each fastener 16 encloses the insulated bus-bar 14,15.
- the fasteners 16 are preferably made of stainless steel and are designed in way that there load is adequate to the estimated operating load in order to assure a thermal contact between the heat exchangers 12,13 and the thermoelectric modules in a large range of operating conditions, and developing the clamping force without exceeding the yield point.
- the fasteners 16 are designed to develop a clamping force which is adequate to assure a good contact between the heat exchangers 12, 13 and the thermoelectric modules 11 in a large range of changes in operating conditions in order to reduce thermal resistance.
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Central Heating Systems (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Details Of Reciprocating Pumps (AREA)
- Toys (AREA)
Abstract
Description
Claims
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT05719022T ATE478441T1 (en) | 2004-03-02 | 2005-02-28 | IMPROVEMENTS REGARDING THERMOELECTRIC HEATING PUMPS |
| US10/597,693 US7360365B2 (en) | 2004-03-02 | 2005-02-28 | Thermoelectric heat pumps |
| AU2005219174A AU2005219174A1 (en) | 2004-03-02 | 2005-02-28 | Improvements in or relating to thermoelectric heat pumps |
| JP2007501449A JP2007526650A (en) | 2004-03-02 | 2005-02-28 | Improvement of thermoelectric heat pump or related to it |
| DE602005022984T DE602005022984D1 (en) | 2004-03-02 | 2005-02-28 | IMPROVEMENTS RELATING TO THERMOELECTRIC HEAT PUMPS |
| RU2006134647/28A RU2360328C2 (en) | 2004-03-02 | 2005-02-28 | Advanced thermoelectric heat pumps |
| EP05719022A EP1721343B1 (en) | 2004-03-02 | 2005-02-28 | Improvements in or relating to thermoelectric heat pumps |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT000079U ITMI20040079U1 (en) | 2004-03-02 | 2004-03-02 | IMPROVEMENTS TO THERMOELECTRIC HEAT PUMPS |
| ITMI2004U000079 | 2004-03-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2005086246A2 true WO2005086246A2 (en) | 2005-09-15 |
| WO2005086246A3 WO2005086246A3 (en) | 2005-10-27 |
Family
ID=34917531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IT2005/000112 Ceased WO2005086246A2 (en) | 2004-03-02 | 2005-02-28 | Improvements in or relating to thermoelectric heat pumps |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7360365B2 (en) |
| EP (1) | EP1721343B1 (en) |
| JP (1) | JP2007526650A (en) |
| CN (1) | CN100499196C (en) |
| AT (1) | ATE478441T1 (en) |
| AU (1) | AU2005219174A1 (en) |
| DE (1) | DE602005022984D1 (en) |
| IT (1) | ITMI20040079U1 (en) |
| RU (1) | RU2360328C2 (en) |
| WO (1) | WO2005086246A2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10141492B2 (en) | 2015-05-14 | 2018-11-27 | Nimbus Materials Inc. | Energy harvesting for wearable technology through a thin flexible thermoelectric device |
| US10290794B2 (en) | 2016-12-05 | 2019-05-14 | Sridhar Kasichainula | Pin coupling based thermoelectric device |
| US10367131B2 (en) | 2013-12-06 | 2019-07-30 | Sridhar Kasichainula | Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device |
| US10553773B2 (en) | 2013-12-06 | 2020-02-04 | Sridhar Kasichainula | Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs |
| US10566515B2 (en) | 2013-12-06 | 2020-02-18 | Sridhar Kasichainula | Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device |
| US11024789B2 (en) | 2013-12-06 | 2021-06-01 | Sridhar Kasichainula | Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs |
| US11276810B2 (en) | 2015-05-14 | 2022-03-15 | Nimbus Materials Inc. | Method of producing a flexible thermoelectric device to harvest energy for wearable applications |
| US11283000B2 (en) | 2015-05-14 | 2022-03-22 | Nimbus Materials Inc. | Method of producing a flexible thermoelectric device to harvest energy for wearable applications |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7587901B2 (en) | 2004-12-20 | 2009-09-15 | Amerigon Incorporated | Control system for thermal module in vehicle |
| US8222511B2 (en) * | 2006-08-03 | 2012-07-17 | Gentherm | Thermoelectric device |
| US20080087316A1 (en) | 2006-10-12 | 2008-04-17 | Masa Inaba | Thermoelectric device with internal sensor |
| US9105809B2 (en) * | 2007-07-23 | 2015-08-11 | Gentherm Incorporated | Segmented thermoelectric device |
| WO2009036077A1 (en) | 2007-09-10 | 2009-03-19 | Amerigon, Inc. | Operational control schemes for ventilated seat or bed assemblies |
| WO2009097572A1 (en) | 2008-02-01 | 2009-08-06 | Amerigon Incorporated | Condensation and humidity sensors for thermoelectric devices |
| CN104523071A (en) | 2008-07-18 | 2015-04-22 | 金瑟姆股份公司 | Climate controlled bed assembly |
| KR101050999B1 (en) * | 2009-02-02 | 2011-07-21 | 최병규 | Peltier device cold and hot water system using the structure |
| US20110036384A1 (en) * | 2009-08-12 | 2011-02-17 | Culp Slade R | Thermoelectric device |
| US9112109B2 (en) * | 2009-11-06 | 2015-08-18 | The Boeing Company | Thermoelectric generator assembly and system |
| FR2969380B1 (en) * | 2010-12-20 | 2013-03-01 | Valeo Systemes Thermiques | DEVICE FOR FASTENING A THERMOELECTRIC ASSEMBLY |
| JP2012243879A (en) * | 2011-05-17 | 2012-12-10 | Toyota Industries Corp | Thermoelectric conversion module |
| US9685599B2 (en) | 2011-10-07 | 2017-06-20 | Gentherm Incorporated | Method and system for controlling an operation of a thermoelectric device |
| US9989267B2 (en) | 2012-02-10 | 2018-06-05 | Gentherm Incorporated | Moisture abatement in heating operation of climate controlled systems |
| US9388740B2 (en) * | 2012-02-15 | 2016-07-12 | The Boeing Company | Thermoelectric generator in turbine engine nozzles |
| US9018511B2 (en) | 2013-03-08 | 2015-04-28 | Hamilton Sundstrand Space Systems International, Inc. | Spring-loaded heat exchanger fins |
| US9662962B2 (en) | 2013-11-05 | 2017-05-30 | Gentherm Incorporated | Vehicle headliner assembly for zonal comfort |
| KR102123639B1 (en) | 2014-02-14 | 2020-06-16 | 젠썸 인코포레이티드 | Conductive convective climate controlled seat |
| RU2537647C1 (en) * | 2014-02-18 | 2015-01-10 | Общество с ограниченной ответственностью "НАУЧНО-ПРОИЗВОДСТВЕННАЯ ФИРМА ТЕРМОЭЛЕКТРИЧЕСКОГО ПРИБОРОСТРОЕНИЯ" | Heat exchange unit |
| KR20170063817A (en) * | 2014-10-02 | 2017-06-08 | 알파벳 에너지, 인코포레이티드 | Thermoelectric generating unit and methods of making and using same |
| US10064287B2 (en) | 2014-11-05 | 2018-08-28 | Infineon Technologies Austria Ag | System and method of providing a semiconductor carrier and redistribution structure |
| US10192846B2 (en) | 2014-11-05 | 2019-01-29 | Infineon Technologies Austria Ag | Method of inserting an electronic component into a slot in a circuit board |
| US10553557B2 (en) * | 2014-11-05 | 2020-02-04 | Infineon Technologies Austria Ag | Electronic component, system and method |
| US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
| US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
| EP3726594B1 (en) | 2014-11-14 | 2022-05-04 | Gentherm Incorporated | Heating and cooling technologies |
| US11075331B2 (en) | 2018-07-30 | 2021-07-27 | Gentherm Incorporated | Thermoelectric device having circuitry with structural rigidity |
| CN113167510B (en) | 2018-11-30 | 2025-10-03 | 金瑟姆股份公司 | Thermoelectric regulation system and method |
| US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
| CN211743190U (en) * | 2020-03-12 | 2020-10-23 | 邓炜鸿 | Thick film cold and hot integrated circuit |
| US12552223B2 (en) | 2021-03-18 | 2026-02-17 | Gentherm Incorporated | Optimal control of convective thermal devices |
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|---|---|---|---|---|
| US5099550A (en) | 1990-11-05 | 1992-03-31 | Mi Proprietary | Clamp for attachment of a heat sink |
| US20030193087A1 (en) | 1999-04-01 | 2003-10-16 | Yamaha Corporation | Peltier module with durable power supply lines and exothermic module with built-in cooler |
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| FR2758009B1 (en) | 1996-12-26 | 1999-03-19 | France Etat | UNDERWATER THERMOELECTRIC GENERATOR WITH THERMOELECTRIC MODULES ARRANGED IN SLEEVES |
| JP3238114B2 (en) * | 1997-12-25 | 2001-12-10 | 株式会社エコ・トゥエンティーワン | Thermoelectric converter |
| JP4013446B2 (en) * | 1999-04-01 | 2007-11-28 | ヤマハ株式会社 | Peltier module and optical communication module including the same |
| JP2000294702A (en) * | 1999-04-09 | 2000-10-20 | Matsushita Electric Ind Co Ltd | Video display device |
| RU2179768C2 (en) * | 1999-10-07 | 2002-02-20 | Демидов Андрей Валентинович | Thermoelectric module |
| US6970399B2 (en) | 2000-05-31 | 2005-11-29 | Citizen Watch Co., Ltd. | Thermal power generating timepiece and rear cover for thermal power generating timepiece |
| RU2165363C1 (en) * | 2000-10-06 | 2001-04-20 | Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Квант" | Vehicle thermoelectric air conditioner |
| JP3472550B2 (en) * | 2000-11-13 | 2003-12-02 | 株式会社小松製作所 | Thermoelectric conversion device and method of manufacturing the same |
| US6502405B1 (en) * | 2001-10-19 | 2003-01-07 | John Van Winkle | Fluid heat exchanger assembly |
| GB2381377A (en) | 2001-10-23 | 2003-04-30 | Integrated Technologies | Thermoelectric power generation device |
-
2004
- 2004-03-02 IT IT000079U patent/ITMI20040079U1/en unknown
-
2005
- 2005-02-28 RU RU2006134647/28A patent/RU2360328C2/en not_active IP Right Cessation
- 2005-02-28 AU AU2005219174A patent/AU2005219174A1/en not_active Abandoned
- 2005-02-28 US US10/597,693 patent/US7360365B2/en not_active Expired - Fee Related
- 2005-02-28 DE DE602005022984T patent/DE602005022984D1/en not_active Expired - Lifetime
- 2005-02-28 JP JP2007501449A patent/JP2007526650A/en active Pending
- 2005-02-28 EP EP05719022A patent/EP1721343B1/en not_active Expired - Lifetime
- 2005-02-28 WO PCT/IT2005/000112 patent/WO2005086246A2/en not_active Ceased
- 2005-02-28 AT AT05719022T patent/ATE478441T1/en not_active IP Right Cessation
- 2005-02-28 CN CNB2005800065289A patent/CN100499196C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5099550A (en) | 1990-11-05 | 1992-03-31 | Mi Proprietary | Clamp for attachment of a heat sink |
| US20030193087A1 (en) | 1999-04-01 | 2003-10-16 | Yamaha Corporation | Peltier module with durable power supply lines and exothermic module with built-in cooler |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10367131B2 (en) | 2013-12-06 | 2019-07-30 | Sridhar Kasichainula | Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device |
| US10553773B2 (en) | 2013-12-06 | 2020-02-04 | Sridhar Kasichainula | Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs |
| US10566515B2 (en) | 2013-12-06 | 2020-02-18 | Sridhar Kasichainula | Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device |
| US11024789B2 (en) | 2013-12-06 | 2021-06-01 | Sridhar Kasichainula | Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs |
| US10141492B2 (en) | 2015-05-14 | 2018-11-27 | Nimbus Materials Inc. | Energy harvesting for wearable technology through a thin flexible thermoelectric device |
| US11276810B2 (en) | 2015-05-14 | 2022-03-15 | Nimbus Materials Inc. | Method of producing a flexible thermoelectric device to harvest energy for wearable applications |
| US11283000B2 (en) | 2015-05-14 | 2022-03-22 | Nimbus Materials Inc. | Method of producing a flexible thermoelectric device to harvest energy for wearable applications |
| US10290794B2 (en) | 2016-12-05 | 2019-05-14 | Sridhar Kasichainula | Pin coupling based thermoelectric device |
| US10516088B2 (en) | 2016-12-05 | 2019-12-24 | Sridhar Kasichainula | Pin coupling based thermoelectric device |
| US10559738B2 (en) | 2016-12-05 | 2020-02-11 | Sridhar Kasichainula | Pin coupling based thermoelectric device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100499196C (en) | 2009-06-10 |
| DE602005022984D1 (en) | 2010-09-30 |
| RU2360328C2 (en) | 2009-06-27 |
| AU2005219174A1 (en) | 2005-09-15 |
| CN1926696A (en) | 2007-03-07 |
| ATE478441T1 (en) | 2010-09-15 |
| JP2007526650A (en) | 2007-09-13 |
| WO2005086246A3 (en) | 2005-10-27 |
| ITMI20040079U1 (en) | 2004-06-02 |
| EP1721343B1 (en) | 2010-08-18 |
| US20070157629A1 (en) | 2007-07-12 |
| RU2006134647A (en) | 2008-04-10 |
| EP1721343A2 (en) | 2006-11-15 |
| US7360365B2 (en) | 2008-04-22 |
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