WO2006059757A3 - Process for producing resist pattern and conductor pattern - Google Patents

Process for producing resist pattern and conductor pattern Download PDF

Info

Publication number
WO2006059757A3
WO2006059757A3 PCT/JP2005/022255 JP2005022255W WO2006059757A3 WO 2006059757 A3 WO2006059757 A3 WO 2006059757A3 JP 2005022255 W JP2005022255 W JP 2005022255W WO 2006059757 A3 WO2006059757 A3 WO 2006059757A3
Authority
WO
WIPO (PCT)
Prior art keywords
resist pattern
inorganic substance
photoresist
pattern
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/022255
Other languages
French (fr)
Other versions
WO2006059757A2 (en
Inventor
Koichi Misumi
Koji Saito
Kaoru Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to CN2005800407106A priority Critical patent/CN101065707B/en
Priority to US11/720,176 priority patent/US7871758B2/en
Priority to EP05811341A priority patent/EP1825331B1/en
Priority to KR1020077014697A priority patent/KR100888568B1/en
Priority to DE602005007933T priority patent/DE602005007933D1/en
Publication of WO2006059757A2 publication Critical patent/WO2006059757A2/en
Anticipated expiration legal-status Critical
Publication of WO2006059757A3 publication Critical patent/WO2006059757A3/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

This process for producing a resist pattern is a process for producing a resist pattern including: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) an photoresist layer consisting of a chemically amplified type negative photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to the photoresist laminate, and the step of developing the (c ) photoresist layer together with the (b) inorganic substance layer to form a resist pattern.
PCT/JP2005/022255 2004-11-30 2005-11-29 Process for producing resist pattern and conductor pattern Ceased WO2006059757A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2005800407106A CN101065707B (en) 2004-11-30 2005-11-29 Process for producing resist pattern and conductor pattern
US11/720,176 US7871758B2 (en) 2004-11-30 2005-11-29 Process for producing resist pattern and conductor pattern
EP05811341A EP1825331B1 (en) 2004-11-30 2005-11-29 Process for producing resist pattern and conductor pattern
KR1020077014697A KR100888568B1 (en) 2004-11-30 2005-11-29 Process for producing resist pattern and conductor pattern
DE602005007933T DE602005007933D1 (en) 2004-11-30 2005-11-29 LADDER PATTERN

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004347772A JP2006154570A (en) 2004-11-30 2004-11-30 Method for producing resist pattern and conductor pattern
JP2004-347772 2004-11-30

Publications (2)

Publication Number Publication Date
WO2006059757A2 WO2006059757A2 (en) 2006-06-08
WO2006059757A3 true WO2006059757A3 (en) 2007-07-05

Family

ID=36565445

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/022255 Ceased WO2006059757A2 (en) 2004-11-30 2005-11-29 Process for producing resist pattern and conductor pattern

Country Status (8)

Country Link
US (1) US7871758B2 (en)
EP (1) EP1825331B1 (en)
JP (1) JP2006154570A (en)
KR (1) KR100888568B1 (en)
CN (1) CN101065707B (en)
DE (1) DE602005007933D1 (en)
TW (1) TWI312444B (en)
WO (1) WO2006059757A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008077057A (en) * 2006-08-21 2008-04-03 Jsr Corp Photosensitive insulating resin composition, cured product thereof and electronic component including the same
WO2008065827A1 (en) * 2006-11-28 2008-06-05 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive-type photoresist composition for thick film, chemically amplified dry film for thick film, and method for production of thick film resist pattern
CN101952778B (en) * 2008-01-24 2013-04-24 旭化成电子材料株式会社 Photosensitive resin laminate
JP2010040849A (en) * 2008-08-06 2010-02-18 Tokyo Ohka Kogyo Co Ltd Resist pattern-forming method
JP5630181B2 (en) * 2010-03-05 2014-11-26 大日本印刷株式会社 Negative resist composition, method for producing relief pattern using the resist composition, and method for producing photomask
JP2015218364A (en) * 2014-05-19 2015-12-07 東京応化工業株式会社 Resist composition and method for producing conductive pattern using the same
JP6667204B2 (en) * 2015-03-18 2020-03-18 東京応化工業株式会社 Method of forming photosensitive resin layer, method of manufacturing photoresist pattern, and method of forming plated object
US20240219834A1 (en) * 2021-04-26 2024-07-04 Nissan Chemical Corporation Method for forming a resist pattern

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030087187A1 (en) * 2001-11-02 2003-05-08 Tokyo Ohka Kogyo Co., Ltd. Thick film photoresist layer laminate, method of manufacturing thick film resist pattern, and method of manufacturing connecting terminal

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100360554B1 (en) 1993-12-08 2003-01-29 가부시키가이샤 니콘 Method of manufacturing a semiconductor device using the scanning exposure method and the scanning exposure method
JP3436843B2 (en) * 1996-04-25 2003-08-18 東京応化工業株式会社 Base material for lithography and resist material for lithography using the same
JP3633179B2 (en) * 1997-01-27 2005-03-30 Ｊｓｒ株式会社 Positive photoresist composition
JP4185171B2 (en) * 1997-04-10 2008-11-26 富士通マイクロエレクトロニクス株式会社 Charged particle beam exposure method and exposure apparatus therefor
EP1205805B1 (en) * 2000-11-14 2004-09-15 JSR Corporation Anti-reflection coating forming composition
US20040255305A1 (en) 2001-10-19 2004-12-16 Van Doren Egidius Gerardus Petrus Method of forming a pattern of sub-micron broad features
KR20030073875A (en) * 2002-03-13 2003-09-19 주식회사 하이닉스반도체 Method for forming isolation pattern of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030087187A1 (en) * 2001-11-02 2003-05-08 Tokyo Ohka Kogyo Co., Ltd. Thick film photoresist layer laminate, method of manufacturing thick film resist pattern, and method of manufacturing connecting terminal

Also Published As

Publication number Publication date
EP1825331B1 (en) 2008-07-02
CN101065707B (en) 2011-06-01
US20080131819A1 (en) 2008-06-05
KR100888568B1 (en) 2009-03-12
KR20070086723A (en) 2007-08-27
DE602005007933D1 (en) 2008-08-14
JP2006154570A (en) 2006-06-15
WO2006059757A2 (en) 2006-06-08
EP1825331A2 (en) 2007-08-29
US7871758B2 (en) 2011-01-18
TWI312444B (en) 2009-07-21
TW200632561A (en) 2006-09-16
CN101065707A (en) 2007-10-31

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