WO2006103592A3 - A portable object connectable package. - Google Patents

A portable object connectable package. Download PDF

Info

Publication number
WO2006103592A3
WO2006103592A3 PCT/IB2006/050857 IB2006050857W WO2006103592A3 WO 2006103592 A3 WO2006103592 A3 WO 2006103592A3 IB 2006050857 W IB2006050857 W IB 2006050857W WO 2006103592 A3 WO2006103592 A3 WO 2006103592A3
Authority
WO
WIPO (PCT)
Prior art keywords
portable object
package
connectable package
semiconductor die
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2006/050857
Other languages
French (fr)
Other versions
WO2006103592A2 (en
Inventor
Stephan M Koch
Heinz-Peter Wirtz
Alexander M Jooss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Priority to DE602006004437T priority Critical patent/DE602006004437D1/en
Priority to EP06727689A priority patent/EP1866830B1/en
Priority to US11/910,449 priority patent/US7692280B2/en
Priority to JP2008503640A priority patent/JP4977828B2/en
Publication of WO2006103592A2 publication Critical patent/WO2006103592A2/en
Publication of WO2006103592A3 publication Critical patent/WO2006103592A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Packages (AREA)
  • Purses, Travelling Bags, Baskets, Or Suitcases (AREA)
  • Switches With Compound Operations (AREA)

Abstract

A portable object connectable package 1 , 11 , 21 , 31 , 41 , 51 , 61 , 71 , 81 for an electronic device comprises: - a semiconductor die package 2, 12, 22, 32, 42, 52, 62, 72, 82 comprising a top surface 2A, 12A, 22A, 32A, 42A, 52A, 62A, 72A, 82A and an opposite bottom surface 2B, 12B, 22B, 32B, 42B, 52B, 62B, 72B, 82B, the bottom surface comprising a plurality of connection elements 3A, 13A, 23A, 33A, 43A, 53A, 63A, 73A, 83A for connecting to a printed circuit board PCB, and - a connector body 4, 14, 24, 34, 44, 54, 64, 74, 84 mechanically supported by the semiconductor die package and comprising a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object PO, said circuit comprising a contacting area PO1. The portable object connectable package is arranged to be coupled to a portable object positioner (5) for removably positioning the contacting area (PO1 ) of the portable object (PO) in contact with the plurality of resilient electrical connecting elements (4) when the portable object is present in the portable object positioner.
PCT/IB2006/050857 2005-03-30 2006-03-21 A portable object connectable package. Ceased WO2006103592A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE602006004437T DE602006004437D1 (en) 2005-03-30 2006-03-21 CONNECTABLE HOUSING FOR A PORTABLE OBJECT
EP06727689A EP1866830B1 (en) 2005-03-30 2006-03-21 A portable object connectable package
US11/910,449 US7692280B2 (en) 2005-03-30 2006-03-21 Portable object connectable package
JP2008503640A JP4977828B2 (en) 2005-03-30 2006-03-21 Portable object connectable package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05300228.3 2005-03-30
EP05300228 2005-03-30

Publications (2)

Publication Number Publication Date
WO2006103592A2 WO2006103592A2 (en) 2006-10-05
WO2006103592A3 true WO2006103592A3 (en) 2007-02-22

Family

ID=37053755

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/050857 Ceased WO2006103592A2 (en) 2005-03-30 2006-03-21 A portable object connectable package.

Country Status (7)

Country Link
US (1) US7692280B2 (en)
EP (1) EP1866830B1 (en)
JP (1) JP4977828B2 (en)
CN (1) CN100583121C (en)
AT (1) ATE418764T1 (en)
DE (1) DE602006004437D1 (en)
WO (1) WO2006103592A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8544755B2 (en) * 2010-06-28 2013-10-01 United Test And Assembly Center Ltd. Subscriber identity module (SIM) card
TWI514506B (en) * 2013-08-30 2015-12-21 Arktek Co Ltd Electronic component positioning device
US11088087B2 (en) * 2018-07-25 2021-08-10 Stmicroelectronics, Inc. Micro module with a support structure

Citations (4)

* Cited by examiner, † Cited by third party
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WO1996024111A1 (en) * 1995-02-03 1996-08-08 Framatome Connectors International Connector for a smart card reader apparatus and card reader comprising same
FR2805671A1 (en) * 2000-02-25 2001-08-31 Sagem CONNECTOR FOR CHIP CARDS
EP1205869A1 (en) * 2000-11-07 2002-05-15 Fci Connector for printed circuit card for placing IC cards and in particular SIM cards, in contact in mobile telephones
WO2004029858A1 (en) * 2002-09-25 2004-04-08 Koninklijke Philips Electronics N.V. Connector for chip-card

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US6330164B1 (en) * 1985-10-18 2001-12-11 Formfactor, Inc. Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5360946A (en) * 1991-09-17 1994-11-01 International Business Machines Corporation Flex tape protective coating
US6690186B2 (en) * 1994-07-07 2004-02-10 Tessera, Inc. Methods and structures for electronic probing arrays
US5490072A (en) 1994-07-18 1996-02-06 Kelsey-Hayes Company Method and system for detecting the proper functioning of an ABS control unit utilizing dual programmed microprocessors
DE19530264A1 (en) * 1995-08-17 1997-02-20 Abb Management Ag Power semiconductor module
RU2119276C1 (en) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Three-dimensional flexible electronic module
US6468830B1 (en) * 1998-01-26 2002-10-22 Tessera, Inc. Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor
US6078500A (en) * 1998-05-12 2000-06-20 International Business Machines Inc. Pluggable chip scale package
JPH11330283A (en) * 1998-05-15 1999-11-30 Toshiba Corp Semiconductor module and large semiconductor module
US6586845B1 (en) * 1998-10-28 2003-07-01 Shinko Electric Industries Co., Ltd. Semiconductor device module and a part thereof
EP1085453A1 (en) * 1999-09-20 2001-03-21 TELEFONAKTIEBOLAGET LM ERICSSON (publ) SIM card holder
US6461892B2 (en) * 2000-01-26 2002-10-08 Tessera, Inc. Methods of making a connection component using a removable layer
US6572781B2 (en) * 2000-05-16 2003-06-03 Tessera, Inc. Microelectronic packaging methods and components
JP3280954B2 (en) * 2000-06-02 2002-05-13 株式会社東芝 Circuit module and electronic equipment mounted with circuit module
JP2002057767A (en) * 2000-08-08 2002-02-22 Denso Corp Telephone
US6589819B2 (en) * 2000-09-29 2003-07-08 Tessera, Inc. Microelectronic packages having an array of resilient leads and methods therefor
JP2002151550A (en) * 2000-11-15 2002-05-24 Nec Corp Semiconductor device, manufacturing method thereof, coil spring cutting jig and coil spring supply jig used for manufacturing
JP3923258B2 (en) * 2001-01-17 2007-05-30 松下電器産業株式会社 Power control system electronic circuit device and manufacturing method thereof
US6825552B2 (en) * 2001-05-09 2004-11-30 Tessera, Inc. Connection components with anisotropic conductive material interconnection
US6695623B2 (en) * 2001-05-31 2004-02-24 International Business Machines Corporation Enhanced electrical/mechanical connection for electronic devices
US20030048624A1 (en) * 2001-08-22 2003-03-13 Tessera, Inc. Low-height multi-component assemblies
TW565019U (en) * 2002-01-29 2003-12-01 Molex Inc Electrical connector
US6977434B2 (en) * 2003-10-20 2005-12-20 Hewlett-Packard Development Company, L.P. Semiconductor assembly and spring member therefor
US7057295B2 (en) * 2004-04-22 2006-06-06 Ted Ju IC module assembly
US7335979B2 (en) * 2004-06-28 2008-02-26 Intel Corporation Device and method for tilted land grid array interconnects on a coreless substrate package
US7184202B2 (en) * 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
US7427809B2 (en) * 2004-12-16 2008-09-23 Salmon Technologies, Llc Repairable three-dimensional semiconductor subsystem

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996024111A1 (en) * 1995-02-03 1996-08-08 Framatome Connectors International Connector for a smart card reader apparatus and card reader comprising same
FR2805671A1 (en) * 2000-02-25 2001-08-31 Sagem CONNECTOR FOR CHIP CARDS
EP1205869A1 (en) * 2000-11-07 2002-05-15 Fci Connector for printed circuit card for placing IC cards and in particular SIM cards, in contact in mobile telephones
WO2004029858A1 (en) * 2002-09-25 2004-04-08 Koninklijke Philips Electronics N.V. Connector for chip-card

Also Published As

Publication number Publication date
DE602006004437D1 (en) 2009-02-05
CN101180632A (en) 2008-05-14
ATE418764T1 (en) 2009-01-15
JP2008535076A (en) 2008-08-28
US20080224288A1 (en) 2008-09-18
US7692280B2 (en) 2010-04-06
WO2006103592A2 (en) 2006-10-05
JP4977828B2 (en) 2012-07-18
CN100583121C (en) 2010-01-20
EP1866830A2 (en) 2007-12-19
EP1866830B1 (en) 2008-12-24

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