WO2006136942A1

WO2006136942A1 - Portable device comprising two cavities for two data carriers

Info

Publication number: WO2006136942A1
Application number: PCT/IB2006/001754
Authority: WO
Inventors: Leonid Berkovich; Hayat El Yamani; Raffaele Muscetta; San Yut Quan
Original assignee: Axalto SA
Current assignee: Axalto SA
Priority date: 2005-06-24
Filing date: 2006-06-23
Publication date: 2006-12-28
Anticipated expiration: 2007-12-24
Also published as: EP1894149A1; EP1739601A1

Abstract

The invention proposes a new manufacturing method for a chip card including an optical disk 4. According to the invention disk 4 is manufactured separately and is then assembled in a card with two layers (1) and (2). The card thus manufactured comprises a first cavity (11) for receiving a module (3) and a second cavity for receiving disk (4). The second cavity is defined by a circular hole (12) located in layer (1) and is partly obturated by layer (2).

Description

PORTABLE DEVICE COMPRISING TWO CAVITIES FOR TWO DATA CARRIERS

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention concerns a portable device for carrying data. More specifically, the invention concerns a device comprising two data carriers that are used in two different types of reader.

2. Related Art

WO 2004/006179 reveals a divisible portable device comprising an optical data carrier and an integrated circuit. This device is realized as a polycarbonate CD type optical disk, in compliance with a known technique, which is subsequently machined to create a cavity intended to receive a chip card module on the one hand and to shape it like a chip card with at least one break line on the other. The card thus created comprises a square or rectangular optical disk after separation along the break line and a chip that can be used as a SIM format card. Moreover, moulding cards in transparent polycarbonate comprising at least two zones separated by a break line is a known technique. A cavity is moulded in one of the zones to receive a module and a centering hole is moulded in another zone that constitutes an optical disk. A disk in reflecting material is then stuck in a centered manner around the centering hole and a protection label is stuck over the assembly.

These two techniques allow obtaining a SIM format chip card with a separable part that is transformed into an optical disk. Furthermore, if adequate break lines are provided after separation it is possible to use the chip in a SIM format card. A drawback of these techniques is that it is necessary to machine or mould polycarbonate and moulding and machining polycarbonate is relatively expensive for such complex shapes. Also, placing modules in a polycarbonate card is expensive and difficult to control in mass production. Finally, the state of the art allows producing cards combined with CD type optical disks whose 1.2 mm thickness is not compatible with the ISO 7816 format of a chip card whose thickness is limited to 0.8 mm.

SUMMARY OF THE INVENTION

The invention proposes a new manufacturing method for a chip card including an optical disk. According to the invention the disk is manufactured separately and is then assembled in a card realized in more traditional materials for card manufacturing and hence less expensive and easier to implement.

According to a first aspect, the invention is a portable device with two cavities. A first cavity is sized into said body for receiving an electronic module. A second cavity is sized into said body for receiving an optical disk.

According to a preferred realization mode, the body may be made in two layers fixed one to each other. A first layer is made in a first material having a first thickness, said first layer comprising the first cavity and a first circular hole. A second layer is made in a second material having a second thickness and with one face stuck to a face of the first layer. The second layer comprises a second circular hole whose diameter is inferior to that of the first circular hole and which is centered on the same axis. After the first and second layers have been stuck the first circular hole forms the second cavity.

According to a second aspect, the invention is a portable device that comprises a card-like body, a module and an optical disk. The card-like body has a first cavity and a second cavity. The module includes an integrated circuit, said module being positioned in the first cavity. The optical disk has an outer diameter corresponds to a diameter of the second cavity.

According to a preferred realization mode, the card-like body may be made in two layers. A first layer is made in a first material having a first thickness, said first layer comprising the first cavity and a first circular hole, the module being stuck to the first layer. A second layer is made in a second material having a second thickness and with one face stuck to a face of the first layer. The second layer comprises a second circular hole whose diameter is inferior to that of the first circular hole and which is centered on the same axis, a face of the optical disk being stuck to the second layer in the second cavity defined by the first circular hole and the second layer.

Preferably, the device may include at least one break line positioned between the first cavity and the second cavity. The first cavity of the first layer may be open on the face in contact with the second layer and the second layer may include an opening crossed by the module.

According to a third manufacturing mode, the invention is a manufacturing process for a portable device with two cavities. Said process comprises the manufacturing steps of a first and second layer and the positioning and sticking of the first and second layers. The manufacturing of the first layer using a first material is realized to obtain a first thickness, as said first layer comprises a first cavity and a first circular hole. The manufacturing of the second layer using a second material is realized to obtain a second thickness, as the second layer comprises a second circular hole with a diameter that is inferior to that of the first circular hole and centered on the same axis. The positioning and sticking of the first layer on the second layer occurs in such a way that the first circular hole, which is obturated at least partly by the second layer, forms a second cavity.

Moreover, the process may include manufacturing steps for a module, for the manufacturing of a disk, for the positioning of the disk and module.

The manufacturing of the module includes an integrated circuit. The manufacturing of the optical disk preferably occurs to obtain a disk whose thickness is equal to the first thickness and whose outer diameter corresponds to the diameter of the first circular hole. The positioning of the disk occurs in the second cavity and the sticking of the disk occurs on the second layer. The positioning of the module occurs in the first cavity and the sticking of the module occurs on the first layer.

Preferably the manufacturing of the first layer occurs by moulding. During the manufacturing of the second layer an opening can be realized, intended to be opposite the first cavity of the first layer. It is possible to perform a pre-cutting of the device in order to realize at least one break line allowing to separate the part comprising the module from the part comprising the disk, said pre-cutting step can be realized by means of laser cutting. BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be better understood and other specificities and benefits will become clear when the following description is read as this description refers to the annexed drawings which include: Figure 1 represents a first example of the device according to the invention in exploded view.

Figure 2 represents the device in figure 1 in cross section,

Figure 3 represents a variant of a device according to the invention in cross section and Figure 4 represents a front view of the device in figure 3.

DETAILED DESCRIPTION OF THE INVENTION

Figure 1 shows a first manufacturing mode of a portable device according to the invention in exploded view. Figure 2 shows the same device in cross cutting plane allowing to see the structure of the assembled device. The same references are used for the same elements. The drawings were not made to scale to better show certain details.

Preferably the portable device is an ISO format chip card. The portable device comprises a first layer 1 , a second layer 2, a module 3 and an optical disk 4. The first and second layers 2 and 3 can be realized in different manners by machining or by moulding by using various materials such as e.g. PVC or ABS. Optical disk 4 is realized in polycarbonate but its circular shape allows to use a manufacturing process known for the realization of optical disks. Module 3 is a known chip card module realized according to a known technique. According to a preferred manufacturing process, ABS injection moulding in a suitable mould is realized to obtain first layer 1. Moulding allows to obtain first layer 1 , e.g. with the dimensions of an ISO type card with a length of 85.6 mm and a width of 54 mm. During moulding the layer is provided on the one hand with a cavity 11 and on the other with a circular hole 12. Cavity 11 is intended to receive module 3. The circular hole is intended to receive disk 5. Injection moulding allows to achieve greater precision in respect of the size of circular hole 12 for it to correspond as closely as possible to the size of disk 4. For instance the diameter of circular hole 12 and of disk 4 is of 53 mm for a card width of 54 mm.

Preferably optical disk 4 and first layer 1 will have the same thickness, e.g. 600 μm. Such a thickness allows to use a DVD type optical disk. The use of a DVD disk allows to finally obtain a card that is compatible with card format ISO 7816. A CD format disk could be used but is thicker and hence not compatible with the ISO format and allows to store less data than a DVD of the same diameter.

The second layer 2 is a finer layer that may e.g. be in ABS or in PVC. In a preferred manufacturing process, it will be realized by machining using for instance cutting drawing process. Before cutting it is possible to print this layer using a known printing technique. The cutting of the second layer 2 allows to cut said layer to the ISO format and to realise an opening 21 and a circular hole 22. Opening 21 is situated opposite cavity 11 of first layer 1 and of circular hole 22 and is concentric to circular hole 12 of first layer 1 when the two layers are assembled. Opening 21 is of the same shape and size as the connector of module 3. Circular hole 22 is of the same size as the hole situated in disk 4 to drive its rotation in a disk reader. The thickness of second layer 2 is inferior to 200 μm so that the addition of a layer of glue between the first and second layer for the assembly of the first and second layer allows to obtain a thickness of approximately 800 μm after sticking.

The assembly of the card with a deposit of a layer of glue 30 on one face of second layer 2 subsequently by applying the glued face on first layer 1 and disk 4, disk 4 being positioned in the circular hole 12 that also forms a cavity. The assembly is pressed as long as is required for the glue to harden. A glue deposit is then made in cavity 11 and finally module 3 is placed in cavity 11 according to a conventional and controlled technique.

The assembly thus obtained is an ISO format chip card which also has a DVD type optical disk. However, the DVD disk is not centered in respect of the card and the use of the card thus formed in a disk reader is a source of vibrations. To remedy these vibrations, it must be possible to separate the module from the disk. To realise the separation between the chip and the disk, break line 40 is formed on the card. The break line is e.g. realized after the assembly of the card by pre-cutting a dotted line on the card by means of a laser.

Thus, the card can be used as an ISO format chip card as long as the disk has not been separated. Then, to use the disk optimally a user may break the card and obtain a balanced disk carrier that can be used in a disk reader.

Figures 3 and 4 show a manufacturing variant in which the ISO format chip card is separated from a rectangular part 50 that behaves as a balanced disk and also as plug 51 , e.g. with a SIM card format with a length of 25 mm and a width of 15 mm. This example comprises three break lines 40, 41 and 42 that are realized during the moulding of the first layer 1. The break lines correspond to bevelled grooves that weaken the card, as the thickness of break lines 40, 41 and 42 is inferior to the thickness of the first layer.

In this variant module 3 is stuck on the same side as disk 4. Consequently, it is no longer necessary to make an opening in the second layer 2 opposite cavity 11. Moreover, cavity 11 may be connecting as second layer 2 ensures the closing of said cavity. The assembly of this card occurs as stated above.

In another variant, the card body is made in a single material layer. The card body is then moulding of machining a conventional plastic layer, for example PVC, to obtain a first cavity for receiving the electronic module and a second cavity for receiving the optical disk.

Claims

1. A portable device having a card-like body with two cavities wherein:

- a first cavity (11 ) is sized into said body for receiving an electronic module; and

- a second cavity (12) is sized into said body for receiving an optical disk.

2. The portable device of claim 1 , wherein the body is made in two layers fixed one to each other, and wherein:

- a first layer (1 ) is made in a first material having a first thickness, said first layer comprising the first cavity (11) and a first circular hole (12), - a second layer (2) is made in a second material having a second thickness and with one face stuck to a face of the first layer (1 ), the second layer (2) comprising a second circular hole (22) whose diameter is inferior to that of the first circular hole (12) and which is centered on the same axis, and wherein, after the first and second layers (1 and 2) have been stuck the first circular hole forms the second cavity.

3. A portable device that comprises:

- a card-like body having a first cavity (11 ) and a second cavity (12),

- a module (3) including an integrated circuit, said module (3) being positioned in the first cavity (11 ),

- an optical disk (4) whose outer diameter corresponds to a diameter of the second cavity (12).

4. The portable device of claim 3, wherein the card-like body is made in two layers, and wherein: - a first layer (1 ) is made in a first material having a first thickness, said first layer comprising the first cavity (11 ) and a first circular hole (12), the module being stuck to the first layer (1 ),

- a second layer (2) is made in a second material having a second thickness and with one face stuck to a face of the first layer (1 ), the second layer (2) comprising a second circular hole (22) whose diameter is inferior to that of the first circular hole (12) and which is centered on the same axis, a face of the optical disk being stuck to the second layer (2) in the second cavity defined by the first circular hole and the second layer.

5. The portable device according to one of the claims 1 to 4, in which the first layer (1 ) also has at least one break line (40-42) positioned between the first cavity (11) and the second cavity, the thickness of said line being inferior to the first thickness.

6. The portable device according to one of the claims 1 to 4 having at least one break line (40) positioned between the first cavity (11 ) and the second cavity, said break line being realized by pre-cutting the device.

7. The portable device according to one of the claims 1 to 6, in which the first cavity (11 ) of the first layer (1 ) is open on the face in contact with the second layer (2) and in which the second layer (2) comprises an opening (21 ) crossed by the module.

8. The portable device according to one of the claims 1 to 7, said device forming an ISO format chip card.

9. The portable device according to claim 5 or 6 in which after breaking said device, the part (51 ) containing the module (3) forms a SIM format chip card.

10. The portable device according to one of the claims 1 to 9, in which the optical disk (4) is a DVD whose thickness is equal to the thickness of the first layer.

11. Manufacturing process of a portable device with two cavities, said process comprising the following steps:

- manufacturing of a first layer (1 ) in a first material having a first thickness, said first layer comprising a first cavity (11 ) and a first circular hole (12), - manufacturing of a second layer (2) in a second material having a second thickness, the second layer comprising a second circular hole (22) whose diameter is inferior to that of the first circular hole and which is centered on the same axis, - positioning and sticking of the first layer (1 ) on the second layer (2) so that the first circular hole, which is at least partly obturated by the second layer, forms a second cavity.

12. Process according to claim 11 , characterised by the fact that it also includes the following steps: - manufacturing of a module (3) including an integrated circuit,

- manufacturing of an optical disk (4) whose thickness is equal to the first thickness and whose outer diameter corresponds to the diameter of the first circular hole (12),

- positioning of the disk (4) in the second cavity and sticking of the disk (4) on the second layer (2),

- positioning of the module (3) in the first cavity (11 ) and sticking of the module (3) on the first layer (1 ).

13. Process according to claim 11 or 12, in which the manufacturing of the first layer (1 ) occurs by moulding.

14. Process according to one of the claims 11 to 13, in which during manufacturing of the second layer (2), an opening (21 ) is made intended to be opposite the first cavity (11 ) of the first layer (1 ).

15. Process according to one of claims 11 to 14, in which after sticking there is a pre-cutting step of the device in order to realise at least one break line (40) allowing to separate the part comprising the first cavity from the part comprising the second cavity, said pre-cutting step being realized by laser cutting.