WO2007010879A3 - Light-emitting module and mounting board used therefor - Google Patents

Light-emitting module and mounting board used therefor Download PDF

Info

Publication number
WO2007010879A3
WO2007010879A3 PCT/JP2006/314118 JP2006314118W WO2007010879A3 WO 2007010879 A3 WO2007010879 A3 WO 2007010879A3 JP 2006314118 W JP2006314118 W JP 2006314118W WO 2007010879 A3 WO2007010879 A3 WO 2007010879A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
mounting board
emitting module
used therefor
board used
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/314118
Other languages
French (fr)
Other versions
WO2007010879A2 (en
Inventor
Makoto Morikawa
Takaari Uemoto
Keiji Nishimoto
Satoshi Shida
Yasuharu Ueno
Hiroyuki Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2007558363A priority Critical patent/JP5065057B2/en
Priority to EP06781143.0A priority patent/EP1908124B1/en
Priority to US11/993,729 priority patent/US7902568B2/en
Publication of WO2007010879A2 publication Critical patent/WO2007010879A2/en
Publication of WO2007010879A3 publication Critical patent/WO2007010879A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

A light-emitting module (2) includes a mounting board (1) with a conductor pattern and a plurality of light-emitting elements (15) mounted on the conductor pattern via wires (21). The extending direction of each of the wires (21) toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (1). This can prevent the shadows of the wires (21) from overlapping, and thus can suppress the luminance nonuniformity.
PCT/JP2006/314118 2005-07-15 2006-07-10 Light-emitting module and mounting board used therefor Ceased WO2007010879A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007558363A JP5065057B2 (en) 2005-07-15 2006-07-10 Light emitting module and mounting board used therefor
EP06781143.0A EP1908124B1 (en) 2005-07-15 2006-07-10 Light-emitting module and corresponding circuit board
US11/993,729 US7902568B2 (en) 2005-07-15 2006-07-10 Light-emitting module with plural light emitters and conductor pattern

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-207352 2005-07-15
JP2005207352 2005-07-15

Publications (2)

Publication Number Publication Date
WO2007010879A2 WO2007010879A2 (en) 2007-01-25
WO2007010879A3 true WO2007010879A3 (en) 2007-06-28

Family

ID=37669245

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/314118 Ceased WO2007010879A2 (en) 2005-07-15 2006-07-10 Light-emitting module and mounting board used therefor

Country Status (5)

Country Link
US (1) US7902568B2 (en)
EP (1) EP1908124B1 (en)
JP (1) JP5065057B2 (en)
TW (1) TWI395342B (en)
WO (1) WO2007010879A2 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7940673B2 (en) * 2007-06-06 2011-05-10 Veedims, Llc System for integrating a plurality of modules using a power/data backbone network
US8303337B2 (en) 2007-06-06 2012-11-06 Veedims, Llc Hybrid cable for conveying data and power
US8421093B2 (en) * 2007-07-13 2013-04-16 Rohm Co., Ltd. LED module and LED dot matrix display
US7856158B2 (en) 2008-03-07 2010-12-21 Ballard Claudio R Virtual electronic switch system
US7963559B2 (en) * 2008-03-07 2011-06-21 Claudio R. Ballard Roll bar with integrated lighting
AT506709B1 (en) * 2008-05-30 2009-11-15 Kuster Martin LAMPS
US8058669B2 (en) * 2008-08-28 2011-11-15 Taiwan Semiconductor Manufacturing Company, Ltd. Light-emitting diode integration scheme
FR2943799B1 (en) * 2009-03-31 2011-09-02 Valeo Vision Sas "LENS FOR LIGHTING MODULE FOR MOTOR VEHICLE".
JP5407993B2 (en) * 2010-03-31 2014-02-05 豊田合成株式会社 Vehicle headlamp
MX2013005202A (en) * 2010-03-30 2013-11-20 Changchn Inst Of Applied Chemistry Chinese Academy Of Sciences ALTERNATE CURRENT DEVICE OF WHITE LED.
JP5528900B2 (en) * 2010-04-30 2014-06-25 ローム株式会社 Light emitting element module
TWD141522S1 (en) * 2010-06-10 2011-07-11 晶元光電股份有限公司 Light emitting diode array
JP5283195B2 (en) * 2010-09-07 2013-09-04 シーシーエス株式会社 LED wiring board and light irradiation device
US8696159B2 (en) 2010-09-20 2014-04-15 Cree, Inc. Multi-chip LED devices
WO2012057038A1 (en) * 2010-10-26 2012-05-03 東芝ライテック株式会社 Light-emitting module and lighting equipment
JP5899476B2 (en) * 2011-06-22 2016-04-06 パナソニックＩｐマネジメント株式会社 LIGHT EMITTING DEVICE AND LIGHTING DEVICE USING THE SAME
US8976541B2 (en) 2011-08-31 2015-03-10 Potens Ip Holdings Llc Electrical power and data distribution apparatus
RU2636055C2 (en) * 2012-04-19 2017-11-20 Филипс Лайтинг Холдинг Б.В. Led lattice device and method of manufacturing led lattice device
JP5999341B2 (en) * 2012-10-05 2016-09-28 東芝ライテック株式会社 Light emitting device and lighting device
JP2016096322A (en) * 2014-11-07 2016-05-26 日亜化学工業株式会社 Light emitting device
US9589940B2 (en) * 2014-11-07 2017-03-07 Nichia Corporation Light emitting device
USD768584S1 (en) * 2014-11-13 2016-10-11 Mitsubishi Electric Corporation Light source module
JP6842246B2 (en) * 2016-05-26 2021-03-17 ローム株式会社 LED module
CN114556558A (en) * 2019-07-23 2022-05-27 亮锐有限责任公司 Semiconductor light emitting device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2707222A1 (en) * 1993-07-07 1995-01-13 Valeo Vision Improved signalling light with light-emitting diodes
JPH1062786A (en) * 1996-08-22 1998-03-06 Omron Corp Light guide device, liquid crystal display device and electronic device
WO2002031794A1 (en) * 2000-10-10 2002-04-18 Lee Gye Seon Led lamp for signal light
JP2002373508A (en) * 2001-06-12 2002-12-26 Koshin Denki Kk Light emitting diode lamp
US20050133811A1 (en) * 2003-12-23 2005-06-23 Han Young S. Nitride semiconductor light emitting device and method for manufacturing the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS636759Y2 (en) * 1980-08-25 1988-02-26
JP3059828B2 (en) * 1992-06-26 2000-07-04 三洋電機株式会社 Light emitting diode display
US6014202A (en) * 1997-09-16 2000-01-11 Polaroid Corporation Optical system for transmitting a graphical image
JP3399440B2 (en) * 1999-04-26 2003-04-21 松下電器産業株式会社 Composite light emitting element, light emitting device and method of manufacturing the same
JP2002033522A (en) * 2000-07-14 2002-01-31 Mitsubishi Cable Ind Ltd Circuit board for surface emitting element module
TWM272232U (en) * 2005-02-04 2005-08-01 Ya-Huei Ke Packaging structure of diode
TWM281296U (en) * 2005-06-20 2005-11-21 Shr-Ling Li Parallel LED module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2707222A1 (en) * 1993-07-07 1995-01-13 Valeo Vision Improved signalling light with light-emitting diodes
JPH1062786A (en) * 1996-08-22 1998-03-06 Omron Corp Light guide device, liquid crystal display device and electronic device
WO2002031794A1 (en) * 2000-10-10 2002-04-18 Lee Gye Seon Led lamp for signal light
JP2002373508A (en) * 2001-06-12 2002-12-26 Koshin Denki Kk Light emitting diode lamp
US20050133811A1 (en) * 2003-12-23 2005-06-23 Han Young S. Nitride semiconductor light emitting device and method for manufacturing the same

Also Published As

Publication number Publication date
WO2007010879A2 (en) 2007-01-25
US20100079997A1 (en) 2010-04-01
JP5065057B2 (en) 2012-10-31
JP2009501431A (en) 2009-01-15
EP1908124A2 (en) 2008-04-09
US7902568B2 (en) 2011-03-08
TWI395342B (en) 2013-05-01
TW200729545A (en) 2007-08-01
EP1908124B1 (en) 2015-06-24

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