WO2007035731A3 - Defectivity and process control of electroless deposition in microelectronics applications - Google Patents

Defectivity and process control of electroless deposition in microelectronics applications Download PDF

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Publication number
WO2007035731A3
WO2007035731A3 PCT/US2006/036479 US2006036479W WO2007035731A3 WO 2007035731 A3 WO2007035731 A3 WO 2007035731A3 US 2006036479 W US2006036479 W US 2006036479W WO 2007035731 A3 WO2007035731 A3 WO 2007035731A3
Authority
WO
WIPO (PCT)
Prior art keywords
defectivity
process control
electroless deposition
microelectronics applications
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2006/036479
Other languages
French (fr)
Other versions
WO2007035731A2 (en
Inventor
Qingyun Chen
Charles Valverde
Vincent Paneccasio
Nicolai Petrov
Daniel Stritch
Christian Witt
Richard Hurtubise
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/230,912 external-priority patent/US7410899B2/en
Application filed by Enthone Inc filed Critical Enthone Inc
Priority to EP06814944A priority Critical patent/EP1938367A2/en
Priority to JP2008532317A priority patent/JP2009509050A/en
Publication of WO2007035731A2 publication Critical patent/WO2007035731A2/en
Anticipated expiration legal-status Critical
Publication of WO2007035731A3 publication Critical patent/WO2007035731A3/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/037—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics the barrier, adhesion or liner layers being on top of a main fill metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
PCT/US2006/036479 2005-09-20 2006-09-19 Defectivity and process control of electroless deposition in microelectronics applications Ceased WO2007035731A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP06814944A EP1938367A2 (en) 2005-09-20 2006-09-19 Defectivity and process control of electroless deposition in microelectronics applications
JP2008532317A JP2009509050A (en) 2005-09-20 2006-09-19 Defects and process control of electroless deposition in microelectronic applications

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/230,912 US7410899B2 (en) 2005-09-20 2005-09-20 Defectivity and process control of electroless deposition in microelectronics applications
US11/230,912 2005-09-20
US11/243,876 US7615491B2 (en) 2005-09-20 2005-10-05 Defectivity and process control of electroless deposition in microelectronics applications
US11/243,876 2005-10-05

Publications (2)

Publication Number Publication Date
WO2007035731A2 WO2007035731A2 (en) 2007-03-29
WO2007035731A3 true WO2007035731A3 (en) 2009-05-07

Family

ID=37889467

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/036479 Ceased WO2007035731A2 (en) 2005-09-20 2006-09-19 Defectivity and process control of electroless deposition in microelectronics applications

Country Status (2)

Country Link
EP (1) EP1938367A2 (en)
WO (1) WO2007035731A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635758A (en) * 1969-08-04 1972-01-18 Photocircuits Corp Electroless metal deposition
US3745039A (en) * 1971-10-28 1973-07-10 Rca Corp Electroless cobalt plating bath and process
US20060280860A1 (en) * 2005-06-09 2006-12-14 Enthone Inc. Cobalt electroless plating in microelectronic devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635758A (en) * 1969-08-04 1972-01-18 Photocircuits Corp Electroless metal deposition
US3745039A (en) * 1971-10-28 1973-07-10 Rca Corp Electroless cobalt plating bath and process
US20060280860A1 (en) * 2005-06-09 2006-12-14 Enthone Inc. Cobalt electroless plating in microelectronic devices

Also Published As

Publication number Publication date
WO2007035731A2 (en) 2007-03-29
EP1938367A2 (en) 2008-07-02

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