WO2007081483A3 - Thermoelectric tunnelling device - Google Patents
Thermoelectric tunnelling device Download PDFInfo
- Publication number
- WO2007081483A3 WO2007081483A3 PCT/US2006/047587 US2006047587W WO2007081483A3 WO 2007081483 A3 WO2007081483 A3 WO 2007081483A3 US 2006047587 W US2006047587 W US 2006047587W WO 2007081483 A3 WO2007081483 A3 WO 2007081483A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor
- thermoelectric
- thermoelectric device
- flow
- nanogap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J45/00—Discharge tubes functioning as thermionic generators
Landscapes
- Electrodes Of Semiconductors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Powder Metallurgy (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Methods and apparatuses for making a thermotunneling device. A method in accordance with the present invention comprises metal/semiconductor or semiconductor/semiconductor bonded material combinations that allows current flow between a hot plate and a cold plate of a thermoelectric device, and interrupting a flow of phonons between the hot plate and the cold plate of the thermoelectric device, wherein the interrupted flow is caused by a nanogap, said nanogap being formed by applying a small voltage or current between the two sides of the thermoelectric device.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06849248.7A EP1961051B1 (en) | 2005-12-15 | 2006-12-13 | Method for creating thermoelectric tunnelling device |
| JP2008545773A JP5078908B2 (en) | 2005-12-15 | 2006-12-13 | Thermoelectric tunnel equipment |
| CN2006800474247A CN101366128B (en) | 2005-12-15 | 2006-12-13 | thermoelectric tunneling device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/304,085 | 2005-12-15 | ||
| US11/304,085 US20070137687A1 (en) | 2005-12-15 | 2005-12-15 | Thermoelectric tunnelling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2007081483A2 WO2007081483A2 (en) | 2007-07-19 |
| WO2007081483A3 true WO2007081483A3 (en) | 2008-07-03 |
Family
ID=38134766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2006/047587 Ceased WO2007081483A2 (en) | 2005-12-15 | 2006-12-13 | Thermoelectric tunnelling device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20070137687A1 (en) |
| EP (1) | EP1961051B1 (en) |
| JP (1) | JP5078908B2 (en) |
| CN (1) | CN101366128B (en) |
| WO (1) | WO2007081483A2 (en) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8018117B2 (en) * | 2006-01-31 | 2011-09-13 | Tempronics, Inc. | Closely spaced electrodes with a uniform gap |
| US7456543B2 (en) * | 2006-01-31 | 2008-11-25 | Tempronics, Inc. | Closely spaced electrodes with a uniform gap |
| US8102096B2 (en) * | 2006-08-30 | 2012-01-24 | Tempronics, Inc. | Closely spaced electrodes with a uniform gap |
| US8653356B2 (en) | 2007-03-26 | 2014-02-18 | The Boeing Company | Thermoelectric devices and methods of manufacture |
| AU2008301988B2 (en) * | 2007-07-12 | 2011-04-07 | Deese, Edward | Solar photovoltaic structure comprising quantized interaction sensitive nanocells |
| WO2009131724A2 (en) * | 2008-01-24 | 2009-10-29 | Massachusetts Institute Of Technology | Insulated nanogap devices and methods of use thereof |
| US20090205695A1 (en) * | 2008-02-15 | 2009-08-20 | Tempronics, Inc. | Energy Conversion Device |
| CN103398494B (en) * | 2008-03-05 | 2017-03-01 | 史泰克公司 | Cooling system and the method for operation thermoelectric cooling system |
| CN101978517A (en) * | 2008-03-19 | 2011-02-16 | 史泰克公司 | Metal-core thermoelectric cooling and power generation device |
| US8940995B2 (en) * | 2009-07-06 | 2015-01-27 | Electronics And Telecommunications Research Institute | Thermoelectric device and method for fabricating the same |
| US8904808B2 (en) | 2009-07-17 | 2014-12-09 | Sheetak, Inc. | Heat pipes and thermoelectric cooling devices |
| US8969703B2 (en) | 2010-09-13 | 2015-03-03 | Tempronics, Inc. | Distributed thermoelectric string and insulating panel |
| JP6341856B2 (en) | 2011-07-06 | 2018-06-13 | テンプロニクス,インコーポレイテッド | Integrated distributed thermoelectric heating and cooling |
| US20140251403A1 (en) * | 2011-10-20 | 2014-09-11 | Sheetak, Inc. | Thermoelectric energy converters and manufacturing method thereof |
| US9638442B2 (en) | 2012-08-07 | 2017-05-02 | Tempronics, Inc. | Medical, topper, pet wireless, and automated manufacturing of distributed thermoelectric heating and cooling |
| JP6307679B2 (en) * | 2012-08-21 | 2018-04-18 | 眞人 馬淵 | Thermoelectric conversion element that has a clue in the space part where the amount of heat transfer to the thermoelectric material is reduced and the working substance flow is more than the original thermoelectric material or the bridged space part |
| JP6090975B2 (en) * | 2012-09-06 | 2017-03-08 | 国立大学法人弘前大学 | Thermoelectric semiconductor device thermoelectric power enhancement method and thermoelectric power test method |
| CN104736387B (en) | 2012-09-25 | 2018-01-02 | 佛吉亚汽车座椅有限责任公司 | Seat with thermal |
| JP5644888B2 (en) * | 2013-04-23 | 2014-12-24 | 株式会社デンソー | Thermoelectric generator |
| US9666781B2 (en) | 2013-08-19 | 2017-05-30 | The Boeing Company | Methods for recovering waste energy from bleed air ducts |
| WO2015066518A1 (en) | 2013-11-04 | 2015-05-07 | Tempronics, Inc. | Design of thermoelectric string, panel, and covers for function and durability |
| CN109417120A (en) * | 2016-06-23 | 2019-03-01 | 3M创新有限公司 | Flexible electrothermal module |
| WO2021211593A1 (en) | 2020-04-14 | 2021-10-21 | Sheetak, Inc. | Thermoelectric energy harvesting apparatus, system and method |
| US12593610B2 (en) | 2022-05-11 | 2026-03-31 | Sheetak, Inc. | Thermoelectric devices on ceramic |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3818192A1 (en) * | 1988-05-28 | 1989-12-07 | Dahlberg Reinhard | Thermoelectric arrangement having tunnel contacts |
| US6403876B1 (en) * | 2000-12-07 | 2002-06-11 | International Business Machines Corporation | Enhanced interface thermoelectric coolers with all-metal tips |
| US20040189141A1 (en) * | 1997-09-08 | 2004-09-30 | Avto Tavkhelidze | Thermionic vacuum diode device with adjustable electrodes |
| US20040195934A1 (en) * | 2003-04-03 | 2004-10-07 | Tanielian Minas H. | Solid state thermal engine |
| US20050016575A1 (en) * | 2003-06-13 | 2005-01-27 | Nalin Kumar | Field emission based thermoelectric device |
| US20050247337A1 (en) * | 2004-05-04 | 2005-11-10 | Massachusetts Institute Of Technology | Surface plasmon coupled nonequilibrium thermoelectric devices |
| WO2006081102A2 (en) * | 2005-01-26 | 2006-08-03 | The Boeing Company | Methods and apparatus for thermal isolation for thermoelectric devices |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3032826B2 (en) * | 1998-03-05 | 2000-04-17 | 工業技術院長 | Thermoelectric conversion material and method for producing the same |
| US6548894B2 (en) * | 2000-11-30 | 2003-04-15 | International Business Machines Corporation | Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication |
-
2005
- 2005-12-15 US US11/304,085 patent/US20070137687A1/en not_active Abandoned
-
2006
- 2006-12-13 JP JP2008545773A patent/JP5078908B2/en active Active
- 2006-12-13 EP EP06849248.7A patent/EP1961051B1/en active Active
- 2006-12-13 WO PCT/US2006/047587 patent/WO2007081483A2/en not_active Ceased
- 2006-12-13 CN CN2006800474247A patent/CN101366128B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3818192A1 (en) * | 1988-05-28 | 1989-12-07 | Dahlberg Reinhard | Thermoelectric arrangement having tunnel contacts |
| US20040189141A1 (en) * | 1997-09-08 | 2004-09-30 | Avto Tavkhelidze | Thermionic vacuum diode device with adjustable electrodes |
| US6403876B1 (en) * | 2000-12-07 | 2002-06-11 | International Business Machines Corporation | Enhanced interface thermoelectric coolers with all-metal tips |
| US20040195934A1 (en) * | 2003-04-03 | 2004-10-07 | Tanielian Minas H. | Solid state thermal engine |
| US20050016575A1 (en) * | 2003-06-13 | 2005-01-27 | Nalin Kumar | Field emission based thermoelectric device |
| US20050247337A1 (en) * | 2004-05-04 | 2005-11-10 | Massachusetts Institute Of Technology | Surface plasmon coupled nonequilibrium thermoelectric devices |
| WO2006081102A2 (en) * | 2005-01-26 | 2006-08-03 | The Boeing Company | Methods and apparatus for thermal isolation for thermoelectric devices |
Non-Patent Citations (1)
| Title |
|---|
| SUNGTAEK JU Y ET AL: "Study of interface effects in thermoelectric microrefrigerators", JOURNAL OF APPLIED PHYSICS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 88, no. 7, 1 October 2000 (2000-10-01), pages 4135 - 4139, XP012051707, ISSN: 0021-8979 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5078908B2 (en) | 2012-11-21 |
| EP1961051B1 (en) | 2015-11-11 |
| EP1961051A2 (en) | 2008-08-27 |
| JP2009520361A (en) | 2009-05-21 |
| CN101366128B (en) | 2011-01-05 |
| CN101366128A (en) | 2009-02-11 |
| WO2007081483A2 (en) | 2007-07-19 |
| US20070137687A1 (en) | 2007-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2007081483A3 (en) | Thermoelectric tunnelling device | |
| WO2007006001A3 (en) | Iii-nitride enhancement mode devices | |
| WO2009072421A1 (en) | Cmos semiconductor device and method for manufacturing the same | |
| WO2010080279A3 (en) | Bulk-processed, enhanced figure-of-merit thermoelectric materials | |
| WO2007124209A3 (en) | Stressor integration and method thereof | |
| TWI371782B (en) | Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same | |
| TW200723521A (en) | Metal oxide semiconductor devices and film structures and methods | |
| EP2320485A4 (en) | NEW THERMOELECTRIC MATERIAL, MANUFACTURING METHOD, AND THERMOELECTRIC COMPONENT USING THE SAME | |
| WO2008051674A3 (en) | Electrical fuse and method of making the same | |
| TW200729570A (en) | Transistor, organic semiconductor device, and method for manufacturing the transistor or device | |
| WO2015079334A8 (en) | A method for controlling rust | |
| WO2010018162A3 (en) | Thermoelectric device | |
| WO2005112983A3 (en) | Modulation of immunoglobulin production and atopic disorders | |
| WO2010114766A3 (en) | Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems | |
| TW200615501A (en) | Thermal interface incorporating nanotubes | |
| WO2007092867A3 (en) | Semiconductor device fabricated using a raised layer to silicide the gate | |
| WO2009029883A3 (en) | Methods and compositions for modulating t cells | |
| WO2006132640A3 (en) | Light-driven microfluidic devices and amplification of stimulus-induced wetting | |
| TWI316293B (en) | Semiconductor device and method for manufacturing the same | |
| WO2008031981A3 (en) | Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other | |
| WO2009109409A3 (en) | Potential-free wire heating during welding and device therefor | |
| WO2005107476A3 (en) | Berry oils and products | |
| WO2010007044A3 (en) | Channel closure means for a defrosting water channel of a refrigerating device, defrosting water channel of a refrigerating device and refrigerating device | |
| WO2007024730A3 (en) | Wafer level hermetic bond using metal alloy | |
| DE602005021220D1 (en) | SEMICONDUCTOR ON INSULATOR SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 200680047424.7 Country of ref document: CN |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| WWE | Wipo information: entry into national phase |
Ref document number: 2006849248 Country of ref document: EP |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2008545773 Country of ref document: JP |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |