WO2007086064A3 - Diced wafer adaptor and a method for transferring a diced wafer - Google Patents

Diced wafer adaptor and a method for transferring a diced wafer Download PDF

Info

Publication number
WO2007086064A3
WO2007086064A3 PCT/IL2007/000102 IL2007000102W WO2007086064A3 WO 2007086064 A3 WO2007086064 A3 WO 2007086064A3 IL 2007000102 W IL2007000102 W IL 2007000102W WO 2007086064 A3 WO2007086064 A3 WO 2007086064A3
Authority
WO
WIPO (PCT)
Prior art keywords
diced wafer
adaptor
membrane
transferring
outer portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IL2007/000102
Other languages
French (fr)
Other versions
WO2007086064A2 (en
Inventor
Uri Vekstein
Itzik Nissany
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Camtek Ltd
Original Assignee
Camtek Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Camtek Ltd filed Critical Camtek Ltd
Priority to EP07706045A priority Critical patent/EP2004366A2/en
Priority to US12/161,698 priority patent/US20120087774A1/en
Publication of WO2007086064A2 publication Critical patent/WO2007086064A2/en
Anticipated expiration legal-status Critical
Publication of WO2007086064A3 publication Critical patent/WO2007086064A3/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A diced wafer adaptor that includes: a cylindrical shaped inner portion, adapted to support and hold an annular frame and a membrane suspended within the annular frame and to apply vacuum to an outer portion of the membrane; wherein an inner portion of the membrane supports a diced wafer and is surrounded by the outer portion of the membrane; and an outer portion having a perimeter shaped substantially as a perimeter of a non-diced wafer.
PCT/IL2007/000102 2006-01-27 2007-01-25 Diced wafer adaptor and a method for transferring a diced wafer Ceased WO2007086064A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP07706045A EP2004366A2 (en) 2006-01-27 2007-01-25 Diced wafer adaptor and a method for transferring a diced wafer
US12/161,698 US20120087774A1 (en) 2006-01-27 2007-01-25 Diced Wafer Adaptor and a Method for Transferring a Diced Wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US76253006P 2006-01-27 2006-01-27
US60/762,530 2006-01-27

Publications (2)

Publication Number Publication Date
WO2007086064A2 WO2007086064A2 (en) 2007-08-02
WO2007086064A3 true WO2007086064A3 (en) 2009-04-16

Family

ID=38309602

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2007/000102 Ceased WO2007086064A2 (en) 2006-01-27 2007-01-25 Diced wafer adaptor and a method for transferring a diced wafer

Country Status (4)

Country Link
US (1) US20120087774A1 (en)
EP (1) EP2004366A2 (en)
TW (1) TWI451516B (en)
WO (1) WO2007086064A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9761468B2 (en) * 2014-02-17 2017-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. Device and method for wafer taping
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning

Citations (3)

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US5148103A (en) * 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits
US5589781A (en) * 1990-09-20 1996-12-31 Higgins; H. Dan Die carrier apparatus
US7119559B2 (en) * 2003-06-19 2006-10-10 Rematek Inc. Vacuum-actuated test fixture for testing printed circuit boards

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US3851758A (en) * 1972-04-26 1974-12-03 Ibm Semiconductor chip fixture
DE69133413D1 (en) * 1990-05-07 2004-10-21 Canon Kk Vacuum type substrate support
US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
US6278600B1 (en) * 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
TW281795B (en) * 1994-11-30 1996-07-21 Sharp Kk
JPH09219383A (en) * 1996-02-13 1997-08-19 Fujitsu Ltd Semiconductor device manufacturing method and manufacturing apparatus
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
JPH10270535A (en) * 1997-03-25 1998-10-09 Nikon Corp Moving stage device and circuit device manufacturing method using the stage device
TW524873B (en) * 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
US6073681A (en) * 1997-12-31 2000-06-13 Temptronic Corporation Workpiece chuck
JP3560823B2 (en) * 1998-08-18 2004-09-02 リンテック株式会社 Wafer transfer device
US6202292B1 (en) * 1998-08-26 2001-03-20 Micron Technology, Inc. Apparatus for removing carrier film from a semiconductor die
US6688300B2 (en) * 1999-04-08 2004-02-10 Intercon Technologies, Inc. Techniques for dicing substrates during integrated circuit fabrication
US6283693B1 (en) * 1999-11-12 2001-09-04 General Semiconductor, Inc. Method and apparatus for semiconductor chip handling
US6543513B1 (en) * 2000-11-27 2003-04-08 Asm Assembly Automation Ltd. Wafer table for die bonding apparatus
US6513796B2 (en) * 2001-02-23 2003-02-04 International Business Machines Corporation Wafer chuck having a removable insert
US6830990B1 (en) * 2001-07-06 2004-12-14 Lightconnect, Inc. Method and apparatus for dicing released MEMS wafers
US6746022B2 (en) * 2001-12-26 2004-06-08 Asm Assembly Automation Ltd. Chuck for holding a workpiece
US6636313B2 (en) * 2002-01-12 2003-10-21 Taiwan Semiconductor Manufacturing Co. Ltd Method of measuring photoresist and bump misalignment
AU2003236002A1 (en) * 2002-04-11 2003-10-20 Disco Corporation Method for manufacturing semiconductor chip
US6913165B2 (en) * 2002-10-07 2005-07-05 Kerry Linz Cocktail shaker
JP2004146727A (en) * 2002-10-28 2004-05-20 Tokyo Seimitsu Co Ltd Wafer transfer method
JP2004207606A (en) * 2002-12-26 2004-07-22 Disco Abrasive Syst Ltd Wafer support plate
US6752287B1 (en) * 2003-04-08 2004-06-22 Shin-Shuoh Lin Splash-proof beverage lid slide closure
JP4574251B2 (en) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
JP4744855B2 (en) * 2003-12-26 2011-08-10 日本碍子株式会社 Electrostatic chuck
US7055229B2 (en) * 2003-12-31 2006-06-06 Intel Corporation Support system for semiconductor wafers and methods thereof
US8525418B2 (en) * 2005-03-31 2013-09-03 Ngk Spark Plug Co., Ltd. Electrostatic chuck
US20060249859A1 (en) * 2005-05-05 2006-11-09 Eiles Travis M Metrology system and method for stacked wafer alignment
US8281674B2 (en) * 2005-08-26 2012-10-09 Camtek Ltd. Wafer inspection system and a method for translating wafers [PD]
JP4749851B2 (en) * 2005-11-29 2011-08-17 株式会社ディスコ Wafer dividing method
JP5054933B2 (en) * 2006-05-23 2012-10-24 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
TWD125773S1 (en) * 2006-08-01 2008-11-01 東京威力科創股份有限公司 Attracting plate of electrostatic chuck for semiconductor manufacturing
WO2008065645A1 (en) * 2006-11-27 2008-06-05 Camtek Ltd. A supporting system and a method for supporting an object
US8690135B2 (en) * 2006-12-18 2014-04-08 Camtek Ltd. Chuck and a method for supporting an object
TWI533394B (en) * 2007-06-21 2016-05-11 尼康股份有限公司 Conveying method and conveying device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5589781A (en) * 1990-09-20 1996-12-31 Higgins; H. Dan Die carrier apparatus
US5148103A (en) * 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits
US7119559B2 (en) * 2003-06-19 2006-10-10 Rematek Inc. Vacuum-actuated test fixture for testing printed circuit boards

Also Published As

Publication number Publication date
EP2004366A2 (en) 2008-12-24
TW200802670A (en) 2008-01-01
WO2007086064A2 (en) 2007-08-02
TWI451516B (en) 2014-09-01
US20120087774A1 (en) 2012-04-12

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