WO2007104854A3 - Machine de marquage laser à haute cadence - Google Patents

Machine de marquage laser à haute cadence Download PDF

Info

Publication number
WO2007104854A3
WO2007104854A3 PCT/FR2007/000423 FR2007000423W WO2007104854A3 WO 2007104854 A3 WO2007104854 A3 WO 2007104854A3 FR 2007000423 W FR2007000423 W FR 2007000423W WO 2007104854 A3 WO2007104854 A3 WO 2007104854A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser
marking
media
locations
towards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FR2007/000423
Other languages
English (en)
Other versions
WO2007104854A2 (fr
Inventor
Patrick Baudron
Frederic Beulet
Benoit Berthe
Dominique Perdoux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entrust Corp
Original Assignee
Datacard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacard Corp filed Critical Datacard Corp
Priority to EP07731120A priority Critical patent/EP1996366A2/fr
Publication of WO2007104854A2 publication Critical patent/WO2007104854A2/fr
Publication of WO2007104854A3 publication Critical patent/WO2007104854A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/0342—Observing magnetic fields related to the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/0344—Observing the speed of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multi-focusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
    • B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/41—Marking using electromagnetic radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention concerne une machine de marquage laser (5) de supports (81), consistant en particulier en des cartes (8) plastiques comportant éventuellement des circuits intégrés (80), caractérisée en ce qu'elle comprend : une chambre laser (59) recouvrant au moins deux emplacements (52a, 52b, 52a', 52b') de marquage de supports (81) sur un dispositif de transfert interne, ce dernier déplaçant les supports (81) dans la chambre laser d'un premier emplacement (52a, 52a') vers un deuxième emplacement (52b, 52b'), un codeur de position (9) détectant le déplacement de chaque support (81) et générant des données de position par rapport aux emplacements (52a, 52b, 52a', 52b') de la chambre et un moyen de marquage laser (50) générant un rayon laser (509) et comportant des moyens optiques permettant de dévier le rayon (509) en fonction de données d'orientation, vers une zone de marquage mobile se déplaçant entre les deux emplacements (52a, 52b, 52a', 52b') et comportant le support (81) en cours de marquage; un dispositif de transfert (2) externe à la chambre laser transportant les supports (81) vers ou hors de la chambre laser (59).
PCT/FR2007/000423 2006-03-14 2007-03-09 Machine de marquage laser à haute cadence Ceased WO2007104854A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07731120A EP1996366A2 (fr) 2006-03-14 2007-03-09 Machine de marquage laser à haute cadence

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0602209A FR2898528B1 (fr) 2006-03-14 2006-03-14 Machine de marquage laser a haute cadence
FR0602209 2006-03-14

Publications (2)

Publication Number Publication Date
WO2007104854A2 WO2007104854A2 (fr) 2007-09-20
WO2007104854A3 true WO2007104854A3 (fr) 2007-11-22

Family

ID=37428601

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2007/000423 Ceased WO2007104854A2 (fr) 2006-03-14 2007-03-09 Machine de marquage laser à haute cadence

Country Status (4)

Country Link
EP (1) EP1996366A2 (fr)
FR (1) FR2898528B1 (fr)
TW (1) TW200800631A (fr)
WO (1) WO2007104854A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103121326B (zh) * 2013-01-21 2014-12-10 深圳市大族激光科技股份有限公司 一种利用工业相机对物品进行定位的运动打标装置和方法
CN103260895B (zh) * 2010-07-23 2015-11-25 咨询卡有限公司 适用于个性化一系列便携式物件的方法和装置
CN105447531A (zh) * 2014-09-09 2016-03-30 北京爱创科技股份有限公司 一种激光标识定位装置、方法及产品

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8786650B1 (en) * 2012-03-07 2014-07-22 Express Scripts, Inc. Systems and methods for pharmacy messaging
TWI607814B (zh) * 2015-10-28 2017-12-11 新代科技股份有限公司 即時三維建模之雷射飛行打標系統及其方法
CN107570883A (zh) * 2017-10-17 2018-01-12 深圳华创兆业科技股份有限公司 激光铣切装置
CN108890142A (zh) * 2018-09-12 2018-11-27 苏州新火花机床有限公司 一种网络控激光打标装置
WO2020187453A1 (fr) * 2019-03-20 2020-09-24 Bobst Mex Sa Procédé et système de caractérisation pour une machine de traitement au laser avec une feuille ou une bande en mouvement
DE102019205872A1 (de) * 2019-04-24 2020-10-29 Mühlbauer Gmbh & Co. Kg Vorrichtung und verfahren zum personalisieren von dokumenten
CN112828444A (zh) * 2019-11-22 2021-05-25 大族激光科技产业集团股份有限公司 在线式试管激光标记装置和方法
FR3103404B1 (fr) * 2019-11-26 2024-02-23 Antonio Alves Dispositif de traitement de plusieurs faces d’objets, et procédé de traitement correspondant
EP4279291A1 (fr) * 2022-05-19 2023-11-22 MB Automation GmbH & Co. KG Dispositif de traitement de documents
DE102022128658A1 (de) * 2022-10-28 2024-05-08 Sommer Gmbh Laserbeschriftbare Folie, Verfahren zur Laserbeschriftung und damit hergestellte Etiketten
CN116944691B (zh) * 2023-09-20 2023-11-28 北京紫英轩文化传播有限公司 一种电子产品的激光打标装置
WO2026033347A1 (fr) * 2024-08-06 2026-02-12 G.D S.P.A. Système et procédé de traitement d'un article dans une zone prédéterminée de l'article

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5986235A (en) * 1996-01-24 1999-11-16 Micron Electronics, Inc. Method of efficiently laser marking singulated semiconductor devices
US6262388B1 (en) * 1998-12-21 2001-07-17 Micron Electronics, Inc. Laser marking station with enclosure and method of operation
US6359253B1 (en) * 2000-07-12 2002-03-19 Advanced Micro Devices, Inc. Unit-in-tray pocket checker
EP1705600A2 (fr) * 2005-03-23 2006-09-27 Datacard Corporation Machine de marquage laser à haute cadence

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5986235A (en) * 1996-01-24 1999-11-16 Micron Electronics, Inc. Method of efficiently laser marking singulated semiconductor devices
US6262388B1 (en) * 1998-12-21 2001-07-17 Micron Electronics, Inc. Laser marking station with enclosure and method of operation
US6359253B1 (en) * 2000-07-12 2002-03-19 Advanced Micro Devices, Inc. Unit-in-tray pocket checker
EP1705600A2 (fr) * 2005-03-23 2006-09-27 Datacard Corporation Machine de marquage laser à haute cadence

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103260895B (zh) * 2010-07-23 2015-11-25 咨询卡有限公司 适用于个性化一系列便携式物件的方法和装置
CN103121326B (zh) * 2013-01-21 2014-12-10 深圳市大族激光科技股份有限公司 一种利用工业相机对物品进行定位的运动打标装置和方法
CN105447531A (zh) * 2014-09-09 2016-03-30 北京爱创科技股份有限公司 一种激光标识定位装置、方法及产品

Also Published As

Publication number Publication date
WO2007104854A2 (fr) 2007-09-20
EP1996366A2 (fr) 2008-12-03
FR2898528A1 (fr) 2007-09-21
FR2898528B1 (fr) 2008-05-30
TWI346048B (fr) 2011-08-01
TW200800631A (en) 2008-01-01

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