WO2007115241A3 - Low cost boiling coolers utilizing liquid boiling - Google Patents

Low cost boiling coolers utilizing liquid boiling Download PDF

Info

Publication number
WO2007115241A3
WO2007115241A3 PCT/US2007/065743 US2007065743W WO2007115241A3 WO 2007115241 A3 WO2007115241 A3 WO 2007115241A3 US 2007065743 W US2007065743 W US 2007065743W WO 2007115241 A3 WO2007115241 A3 WO 2007115241A3
Authority
WO
WIPO (PCT)
Prior art keywords
boiling
low cost
shell
utilizing liquid
liquid coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/065743
Other languages
French (fr)
Other versions
WO2007115241A2 (en
Inventor
Jesse Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vapro Inc
Original Assignee
Vapro Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vapro Inc filed Critical Vapro Inc
Priority to JP2009503330A priority Critical patent/JP2009532886A/en
Priority to EP07759921A priority patent/EP2002194A2/en
Publication of WO2007115241A2 publication Critical patent/WO2007115241A2/en
Publication of WO2007115241A3 publication Critical patent/WO2007115241A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B1/00—Methods of steam generation characterised by form of heating method
    • F22B1/28—Methods of steam generation characterised by form of heating method in boilers heated electrically
    • F22B1/284—Methods of steam generation characterised by form of heating method in boilers heated electrically with water in reservoirs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A low cost boiling cooler that utilizes boiling two-phase cooling is presented. As boiling vaporization becomes primary means of spreading heat in a boiling cooler utilizing a boiling enhancement surface to significantly augment nucleate boiling heat transfer within a vessel containing a liquid coolant, the body-shell of the vessel at least partially can be made of inexpensive materials with reduced manufacture costs. The body-shell can also be electrically non-conductive to meet requirement for certain electronics cooling applications. The liquid coolant can use low cost medium such as water.
PCT/US2007/065743 2006-03-31 2007-03-31 Low cost boiling coolers utilizing liquid boiling Ceased WO2007115241A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009503330A JP2009532886A (en) 2006-03-31 2007-03-31 Low cost boiling cooler using liquid boiling
EP07759921A EP2002194A2 (en) 2006-03-31 2007-03-31 Low cost boiling coolers utilizing liquid boiling

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39471806A 2006-03-31 2006-03-31
US11/394,718 2006-03-31

Publications (2)

Publication Number Publication Date
WO2007115241A2 WO2007115241A2 (en) 2007-10-11
WO2007115241A3 true WO2007115241A3 (en) 2008-07-10

Family

ID=38564280

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/065743 Ceased WO2007115241A2 (en) 2006-03-31 2007-03-31 Low cost boiling coolers utilizing liquid boiling

Country Status (4)

Country Link
EP (1) EP2002194A2 (en)
JP (1) JP2009532886A (en)
CN (1) CN101568791A (en)
WO (1) WO2007115241A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130056178A1 (en) * 2010-05-19 2013-03-07 Nec Corporation Ebullient cooling device
JP6163968B2 (en) * 2013-08-26 2017-07-19 三浦工業株式会社 Steam generator
JP6582114B1 (en) * 2018-11-30 2019-09-25 古河電気工業株式会社 heatsink
CN114475036B (en) * 2022-02-17 2023-03-03 北京航空航天大学 A Method for Improving Inkjet Printing Quality Based on Droplet Boiling

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3990862A (en) * 1975-01-31 1976-11-09 The Gates Rubber Company Liquid heat exchanger interface and method
US5613552A (en) * 1994-07-13 1997-03-25 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3990862A (en) * 1975-01-31 1976-11-09 The Gates Rubber Company Liquid heat exchanger interface and method
US5613552A (en) * 1994-07-13 1997-03-25 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant

Also Published As

Publication number Publication date
CN101568791A (en) 2009-10-28
WO2007115241A2 (en) 2007-10-11
JP2009532886A (en) 2009-09-10
EP2002194A2 (en) 2008-12-17

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