WO2008025182A3 - Sensoreinheit - Google Patents

Sensoreinheit Download PDF

Info

Publication number
WO2008025182A3
WO2008025182A3 PCT/CH2007/000421 CH2007000421W WO2008025182A3 WO 2008025182 A3 WO2008025182 A3 WO 2008025182A3 CH 2007000421 W CH2007000421 W CH 2007000421W WO 2008025182 A3 WO2008025182 A3 WO 2008025182A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
measurement
base body
electronics
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CH2007/000421
Other languages
English (en)
French (fr)
Other versions
WO2008025182A2 (de
Inventor
Ernst Obermeier
Biswajit Mukhopadhyay
Berg Jochen Von
Ulrich Albicker
Marco Gnielka
Claudio Cavalloni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kistler Holding AG
Original Assignee
Kistler Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kistler Holding AG filed Critical Kistler Holding AG
Priority to JP2009525889A priority Critical patent/JP2010501865A/ja
Priority to EP07785111A priority patent/EP2057452A2/de
Priority to US12/439,273 priority patent/US7963154B2/en
Publication of WO2008025182A2 publication Critical patent/WO2008025182A2/de
Publication of WO2008025182A3 publication Critical patent/WO2008025182A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Pressure Sensors (AREA)

Abstract

Die Erfindung betrifft eine Sensoreinheit zur Messung einer Messgrösse in einem Medium (2), insbesondere in einem aggressiven flüssigen oder gasförmigem Medium (2), umfassend einen in einer Sensorkapsel (3) angeordneten Sensor (4), mit einem an einem Grundkörper (5) angeordneten Sensorbereich (6), wobei zur Erfassung der Messgrösse im Sensorbereich (6) in der Sensorkapsel (3) eine Messöffnung (7) vorgesehen ist. Der Sensorbereich (6) weist auf einer der Messöffnung (7) zugewandten Seite eine mit einer Messelektronik (8) versehene Messfläche (9) auf, wobei zur Übertragung eines von der Messelektronik (8) generierten Sensorsignals am Sensor (4) eine elektrische Zuleitung (10) vorgesehen ist. Erfindungsgemäss ist im Grundkörper (5) eine Durchkontaktierung (11) vorgesehen, über die die Messelektronik (8) durch den Grundkörper (5) hindurch mit der elektrischen Zuleitung (10) auf einer von der Messöffnung (7) abgewandten Basisseite (12) des Sensors (4) signalverbunden ist.
PCT/CH2007/000421 2006-08-30 2007-08-28 Sensoreinheit Ceased WO2008025182A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009525889A JP2010501865A (ja) 2006-08-30 2007-08-28 センサ・ユニット
EP07785111A EP2057452A2 (de) 2006-08-30 2007-08-28 Sensoreinheit
US12/439,273 US7963154B2 (en) 2006-08-30 2007-08-28 Sensor unit for the measurment of a variable in a medium

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH13912006 2006-08-30
CH1391/06 2006-08-30

Publications (2)

Publication Number Publication Date
WO2008025182A2 WO2008025182A2 (de) 2008-03-06
WO2008025182A3 true WO2008025182A3 (de) 2008-05-29

Family

ID=38006624

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH2007/000421 Ceased WO2008025182A2 (de) 2006-08-30 2007-08-28 Sensoreinheit

Country Status (4)

Country Link
US (1) US7963154B2 (de)
EP (1) EP2057452A2 (de)
JP (1) JP2010501865A (de)
WO (1) WO2008025182A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110301569A1 (en) 2001-01-20 2011-12-08 Gordon Wayne Dyer Methods and apparatus for the CVCS
FR2919942B1 (fr) * 2007-08-08 2009-12-25 Prospection Et D Inventsions T Procede et systeme de tracabilite de la charge vibratoire d'un outil et l'outil du systeme
US9046426B1 (en) 2012-06-15 2015-06-02 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration Modular apparatus and method for attaching multiple devices
US9341536B2 (en) * 2014-02-24 2016-05-17 Kulite Semiconductor Products, Inc. Pressure sensor having a front seal
US9964460B2 (en) 2014-02-24 2018-05-08 Kulite Semiconductor Products, Inc. Pressure sensor having a front seal
DE102015116648A1 (de) * 2015-10-01 2017-04-06 Biotronik Se & Co. Kg Implantierbare Drucksensorvorrichtung
KR101782535B1 (ko) * 2016-01-28 2017-10-24 대모 엔지니어링 주식회사 유압브레이커
US11092083B2 (en) 2017-02-10 2021-08-17 General Electric Company Pressure sensor assembly for a turbine engine
WO2018155915A1 (ko) * 2017-02-22 2018-08-30 타이코에이엠피 주식회사 압력 센서
CN111819121B (zh) * 2018-02-23 2023-07-28 大陆汽车科技有限公司 电动驻车制动器致动器安装组件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19716521A1 (de) * 1997-04-19 1998-10-22 Bosch Gmbh Robert Kraftsensor in LTCC-Technologie
EP1144977A1 (de) * 1998-12-15 2001-10-17 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Verfahren zum erzeugen eines mikro-elektromechanischen elements
US6845664B1 (en) * 2002-10-03 2005-01-25 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration MEMS direct chip attach packaging methodologies and apparatuses for harsh environments
DE102004013073A1 (de) * 2004-03-11 2005-09-29 Ab Elektronik Sachsen Gmbh Verfahren zur Herstellung von Druckmesselementen und Druckmesselemente

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
GB8615305D0 (en) 1986-06-23 1986-07-30 Stc Plc Pressure sensor
JPH0534225A (ja) * 1991-07-31 1993-02-09 Casio Comput Co Ltd センサ装置
JPH0575637U (ja) * 1992-03-16 1993-10-15 横河電機株式会社 圧力センサ
CH683718A5 (de) * 1992-05-15 1994-04-29 Kk Holding Ag Kombinierter Kraft-, Dehnungs- und Schallemissionsaufnehmer.
DE19509188B4 (de) 1994-03-14 2004-04-29 Denso Corp., Kariya Druckdetektor
JP3136087B2 (ja) * 1995-10-26 2001-02-19 松下電工株式会社 半導体圧力センサ
JPH118270A (ja) 1997-06-16 1999-01-12 Tokai Rika Co Ltd 半導体チップの搭載方法、チップオンチップ構造体の製造方法及びチップオンボード構造体の製造方法
US5973590A (en) * 1998-03-12 1999-10-26 Kulite Semiconductor Products, Inc. Ultra thin surface mount wafer sensor structures and methods for fabricating same
JP2001304996A (ja) * 2000-04-25 2001-10-31 Matsushita Electric Works Ltd 集積型半導体圧力センサおよびその製造方法
JP2002082009A (ja) 2000-06-30 2002-03-22 Denso Corp 圧力センサ
JP2002071491A (ja) * 2000-08-25 2002-03-08 Denso Corp 圧力センサ
JP2003322573A (ja) * 2002-04-30 2003-11-14 Fujikura Ltd 電子デバイスの取付構造
JP2005043159A (ja) * 2003-07-25 2005-02-17 Hitachi Unisia Automotive Ltd 圧力センサ
JP2009501910A (ja) * 2005-07-20 2009-01-22 キストラー ホールディング アクチエンゲゼルシャフト センサ・ユニット
JP5050392B2 (ja) * 2006-04-13 2012-10-17 株式会社デンソー 圧力センサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19716521A1 (de) * 1997-04-19 1998-10-22 Bosch Gmbh Robert Kraftsensor in LTCC-Technologie
EP1144977A1 (de) * 1998-12-15 2001-10-17 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Verfahren zum erzeugen eines mikro-elektromechanischen elements
US6845664B1 (en) * 2002-10-03 2005-01-25 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration MEMS direct chip attach packaging methodologies and apparatuses for harsh environments
DE102004013073A1 (de) * 2004-03-11 2005-09-29 Ab Elektronik Sachsen Gmbh Verfahren zur Herstellung von Druckmesselementen und Druckmesselemente

Also Published As

Publication number Publication date
US7963154B2 (en) 2011-06-21
US20100018494A1 (en) 2010-01-28
EP2057452A2 (de) 2009-05-13
JP2010501865A (ja) 2010-01-21
WO2008025182A2 (de) 2008-03-06

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