WO2008069323A1 - 手術ナイフ、手術ナイフ用ブレード及びその製造方法、並びに手術ナイフ用ハンドル - Google Patents
手術ナイフ、手術ナイフ用ブレード及びその製造方法、並びに手術ナイフ用ハンドル Download PDFInfo
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- WO2008069323A1 WO2008069323A1 PCT/JP2007/073723 JP2007073723W WO2008069323A1 WO 2008069323 A1 WO2008069323 A1 WO 2008069323A1 JP 2007073723 W JP2007073723 W JP 2007073723W WO 2008069323 A1 WO2008069323 A1 WO 2008069323A1
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- WIPO (PCT)
- Prior art keywords
- blade
- edge
- surgical knife
- handle
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods
- A61B17/32—Surgical cutting instruments
- A61B17/3209—Incision instruments
- A61B17/3211—Surgical scalpels, knives; Accessories therefor
- A61B17/3213—Surgical scalpels, knives; Accessories therefor with detachable blades
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods
- A61B17/32—Surgical cutting instruments
- A61B17/3209—Incision instruments
- A61B17/3211—Surgical scalpels, knives; Accessories therefor
- A61B17/3215—Packages or dispensers for scalpel blades
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods
- A61B2017/00526—Methods of manufacturing
Definitions
- the present invention relates to a surgical knife used in ophthalmology, surgery and other medical departments, and in particular, a blade for a surgical knife manufactured by crystal anisotropic etching of a single crystal silicon wafer, a manufacturing method thereof, and the use of this blade And a handle for a surgical knife to which the blade is attached.
- Ophthalmic or surgical surgical knives are used to incise a body surface (skin, cornea, etc.) and need to have excellent sharpness. If the sharpness is excellent, the incision can be cut straight without damaging it more than necessary, and healing can be accelerated so that the scar does not remain or the scar does not stand out. In ophthalmic corneal surgery, postoperative astigmatism can be prevented. For this reason, there is a demand for the development of surgical knives that are sharp and lightly cut with a light force.
- Conventional surgical knives include those obtained by processing metal (stainless steel or the like), or those polished using the crystal structure of diamond.
- the metal knife is manufactured by a mechanical press, cutting or cutting method, an electrochemical forming or polishing method, and a combination thereof.
- metal knife has a problem in that the quality of the metal knife is not stable due to the variation in edge (cutting edge) and the sharpness is worse than that of a diamond knife.
- the edge is the edge of the blade.
- Etching includes dry etching and wet etching. Dry etching is a method of etching with a reactive gas or ion beam, and wet etching is a method of etching with ions in a liquid. Further, there are isotropic etching and anisotropic etching according to the direction in which etching proceeds. Isotropic etching is performed in the same direction in any direction, and can be performed by either wet etching or dry etching.
- anisotropic etching includes wet etching in which the etching rate varies depending on the direction of the crystal structure, and dry etching that depends on the irradiation direction of the ion beam.
- the anisotropic etching in wet etching is called crystal anisotropic etching because the etching direction depends on the crystal structure.
- the external knife using single crystal silicon described in Patent Document 1 forms a trench in a wafer by cutting, immerses the wafer in an isotropic etching solution, and removes the crystalline material uniformly. , Manufactured by the method of obtaining the blade.
- the blade described in Patent Document 2 uses ⁇ 100> single crystal silicon, and is formed between a top surface and a bottom surface made of ⁇ 100> planes parallel to each other, and between the top surface and the bottom surface. It has a 111> plane and a cutting edge consisting of a ⁇ 110> plane.
- This blade is formed by crystal anisotropic etching of a single crystal silicon wafer.
- an edge is formed only from basic surfaces such as the ⁇ 111> plane and the ⁇ 110> plane.
- the surface indicated by only 0 and 1 such as ⁇ 1 00>, ⁇ 110>, ⁇ 111> surface, etc. is the basic surface, and other surfaces ( ⁇ 21 0>, ⁇ 211>, ⁇ 321>, etc.) It is called higher order surface.
- the blade described in Patent Document 3 is formed into a sharp edge by milling the edge formed of a metal material using a focused ion beam (FIB).
- This FIB is a dry etching that depends on the beam direction.
- Patent Document 1 Japanese Translation of Special Publication 2005—519703
- Patent Document 2 US Patent US 7, 059, 054
- Patent Document 3 European Patent EP1092515A1 Disclosure of the invention
- Patent Document 1 uses a combination of machining and isotropic wet etching, so that the disadvantages of machining described above remain. That is, the technique of Patent Document 1 has a problem that the sharpness is good and the quality of the sharpness varies. Therefore, in Patent Document 1, since the crystal structure is not used, the shape and sharpness of the blade are limited to machining accuracy, and a practical knife shape and edge angle cannot be obtained.
- the method of forming a silicon blade by machining and isotropic etching in this way is disadvantageous in terms of production because the number of steps increases and the number of elements that vary in quality increases.
- the blade described in Patent Document 2 has a ⁇ 100> surface on both front and back surfaces, and edge slopes inclined with respect to this surface are basic surfaces such as the ⁇ 111> surface and the ⁇ 110> surface. Therefore, the angle between the surface and the slope of the wedge becomes 54 °. For this reason, I cannot expect a sharp edge with a large edge angle.
- the blade described in Patent Document 3 has an edge formed by FIB anisotropic etching (dry etching), and the edge is sharpened.
- the blade itself is machined in shape. Therefore, variations in shape cannot be avoided.
- Patent Document 1 the substrate is previously lined with tape and then etched to prevent blade dissipation and contact of the blade edge or cutting edge with a hard object.
- the blade itself is detached from the tape. Therefore, there is a high risk that the edge will come into contact with a gripping tool such as tweezers when it is assembled into the handle.
- Patent Document 2 discloses a method of making a blade, there is a risk that the edge may come into contact with a hard object and be damaged during assembly into the handle after forming the blade.
- Patent Document 3 discloses a table for fixing a blade, there is a possibility that the edge may come into contact with a hard object and be damaged in the operation of packaging the edge.
- the sharpness test is usually performed as a use test using a sample sample. Once used, the sharpness is reduced, so it is a destructive test. Therefore, the product will be the product of the quantity produced minus the sample quantity.
- the present invention has been made in view of power and problems, and uses single crystal silicon as a material, has a sharp sharpness, and suppresses variations in sharpness quality,
- An object of the present invention is to provide a practical surgical knife, a surgical knife handle, and a surgical knife blade that are low in cost and high in productivity.
- a slope inclined with respect to the polishing surface is formed by crystal anisotropic etching of a single crystal silicon wafer whose surface orientation is ⁇ 110> or ⁇ 100>. And an edge is formed between the inclined surface and the polishing surface of the wafer.
- the inclined surface constituting the edge is a higher-order surface formed by crystal anisotropic etching, for example, ⁇ 32
- the inclined surfaces constituting the edge are higher-order surfaces and basic surfaces formed by crystal anisotropic etching, such as ⁇ 122> and ⁇ 122 01
- the blade for a surgical knife according to the present invention is inclined with respect to the polishing surface by subjecting a single crystal silicon wafer having a polishing surface orientation of ⁇ 110> or ⁇ 100> to crystal anisotropic etching.
- a mask pattern including an inspection dummy portion in addition to a product blade is formed on the single crystal silicon wafer, and a crystal anisotropic etching is performed.
- the surgical knife is manufactured by etching the silicon wafer by using the mask pattern as a mask.
- the surgical knife handle according to the present invention is a surgical knife handle for separating the aforementioned surgical knife blade from the rib to obtain a surgical knife having a blade attached to the tip.
- known single crystal silicon is used as a semiconductor material.
- the shape of the blade, rim and rib, and dummy blade are transferred to the polished surface of the single crystal silicon wafer by photolithography, and the single crystal silicon wafer is processed by etching the crystal anisotropy. Therefore, normal semiconductor manufacturing technology can be applied to the manufacture of surgical knives, and it is possible to obtain high-precision, uniform sharp surgical knife at low cost.
- the surface orientation of the polished surface is ⁇ 110>, and the slopes constituting the edge are ⁇ 322> and ⁇ 311> as shown in FIG.
- the angle between the blade ⁇ 311> surface and the blade back surface (polished surface) is 34 °
- the blade side edge ⁇ 322> surface and blade back surface is 33 °. A sharp edge angle can be obtained.
- the surface orientation of the polished surface is ⁇ 100>, and the slopes constituting the edge are, for example, ⁇ 122> and ⁇ 011> as shown in FIG. Therefore, as shown in Fig. 14, the angle between the ⁇ 011> surface of the blade tip and the back surface (polished surface) of the blade is 45 °, The angle formed between the ⁇ 122> surface of the raid side edge and the back surface of the blade is 48 °, which is smaller than 54 ° of the blade described in Patent Document 2 and has a sharp blade edge angle.
- a mask pattern for a blade and, if necessary, a dummy blade is formed on a silicon wafer, and a mask pattern for a rim is formed around these blades.
- a mask pattern for ribs connecting the rim and the blades are formed on the silicon wafer by photolithography well known in the semiconductor manufacturing technology. Can be formed.
- the blade is inserted into the opening / closing portion of the opening / closing portion, and the opening / closing portion is closed, whereby the opening / closing portion clamps the blade, and the protrusion Force Since the S-rib is cleaved and cut, the blade can be separated from the rib and attached to the tip of the handle with a very simple operation. Also, when attaching this blade to the handle, it is not necessary for the operator to grasp or hold the blade, so that the operator does not touch the blade, so that the operator's finger touches the edge of the blade. It is possible to prevent the deterioration of the sharpness due to. In addition, it is possible to prevent the finger from being injured by the edge of the blade.
- FIG. 1 is a plan view showing a blade 1 using single crystal silicon with ⁇ 1 10> plane orientation according to an embodiment of the present invention.
- FIG. 2 (a) shows the mask pattern 5, (b) shows the relationship between the mask pattern and the blade, and (c) shows a perspective view of the blade.
- FIG. 3 is a view showing a surgical knife.
- FIG. 4 is a cross-sectional view showing a blade manufacturing method in the order of steps.
- FIG. 5 (a) shows a mask pattern of a blade with a rim, and (b) is a sectional view showing this mask pattern and etching results.
- FIG. 6 (a) is a perspective view of a blade with a rim, (b) is a plan view, (c) is a perspective view, and (d) is an enlarged view of a connection point between the rim and the blade, e) is a perspective view of the blade as seen from the rear.
- FIG. 7 is a perspective view showing a handle according to the embodiment of the present invention.
- FIG. 8 is a perspective view showing a method of attaching a blade to this handle.
- FIG. 9 is a plan view showing a mask pattern of one-side ribs in which a rib is provided on one side of a blade.
- Garden 10 [a) is a plan view showing a blade with a rim in the case of a one-side rib, (b) is a perspective view, and (C) is an enlarged plan view of a connecting portion between the rib and the blade.
- FIG. 11 is a perspective view showing a blade with a rim to which a handle is attached in advance.
- FIG. 12 (a) is a plan view showing a blade with a rim provided with a discarded blade in addition to the blade, and (b) is a sectional view.
- FIG. 15A is a plan view showing a mask pattern
- FIG. 15B is a view showing a relationship between the mask pattern and the blade
- FIG. 15C is a perspective view showing the blade.
- FIG. 16 (a) is a mask pattern of a blade with a rim, and (b) is a cross-sectional view showing a relationship between the mask pattern and an etching result.
- FIG. 17 (a) is a perspective view showing a blade with a rim, (b) is an enlarged view of a connecting portion between the blade and a rib, (c) is a plan view of the blade with a rim, and (d) is a view of the blade from the rear.
- FIG. 17 Explanation of symbols
- FIG. 1 is a plan view showing a blade 1 according to a first embodiment of the present invention.
- both the polished front and back surfaces of the single crystal silicon wafer have a ⁇ 110> plane orientation.
- a mask pattern 5 shown in FIG. 2 (a) is formed on this wafer, and crystal anisotropic etching is performed to obtain the blade 1 shown in the perspective view of FIG. 2 (c).
- FIG. 2 (b) silicon is eroded to the lower part of the edge of the mask pattern 5 by crystal anisotropic etching, and the side surface of the blade 1 is inclined. Furthermore, the tip of blade 1 is slightly retracted.
- the blade 1 is attached to the tip of the handle 4 to assemble the surgical knife 6.
- the blade 1 indicates a portion of the blade attached to the tip of the handle 4, the tip of the blade 1 is the cutting edge 3, and the inclined surface of the side edge of the blade 1 is an edge that cuts out the object.
- FIGS. 4A to 4J are cross-sectional views of a wafer showing a method for obtaining the blade 1 shown in FIG. 1 from a single crystal silicon wafer in the order of steps.
- oxide films 11 and 12 are formed on both front and back surfaces of a single crystal silicon wafer 10 polished on both sides, and as shown in FIG. 4 (b).
- a resist 13 is applied on the oxide film 11 on the surface of 10 by spin coating so that the thickness becomes about 1 m.
- a hard mask (or pattern film) 14 in which a blade pattern is formed in advance is overlaid on the resist 13.
- the entire surface is exposed to ultraviolet rays.
- the hard mask (or pattern film) 14 is removed, and the exposed wafer is developed and washed.
- the ultraviolet light is not exposed.
- the remaining resist 13 remains, and the exposed portion of the resist 13 is removed.
- FIG. 4 (e) when the hard mask (or pattern film) 14 is removed, a pattern of the resist 13 is formed.
- the single crystal silicon wafer 10 is subjected to crystal anisotropic etching.
- the wafer 10 is immersed in an etching solution whose concentration and temperature are controlled, and after the lapse of a predetermined time after the immersion, the wafer 10 is taken out and cleaned.
- this crystal anisotropic etching it is covered with the oxide film 11 in the single crystal silicon 10! /,! /, Etched from the part, and the etching progresses with the ⁇ 111) plane and time along the mask pattern. The next side appears.
- the etching proceeds as an inclined surface 15 inclined with respect to the front and back surfaces of the single crystal silicon wafer 10.
- the slope 15 reaches the oxide film 12, and the lower part of the upper oxide film 11 of the single crystal silicon wafer 10 is separated from the adjacent part. Thereafter, as shown in FIG. 4 (j), the oxide films 11 and 12 are removed and washed.
- the blade 1 shown in FIG. 1 is obtained.
- the relationship between the mask pattern (oxide film 11) and the molded blade 1 is as shown in FIG. 2 (b). That is, as shown in FIG. 1, the blade 1 has a polished surface on both front and back surfaces and a surface orientation of ⁇ 110>.
- the blades 1 are formed so as to intersect with each other, the width of the blade 1 increases from the cut edge 3 toward the rear, and an edge 2 is formed at the edge of the widened portion.
- a slope is also formed on the rear side edge and the rear end of the blade 1.
- the slope of edge 2 is the ⁇ 322> plane, the rear side edge is the ⁇ 111> plane, and the rear end is the ⁇ 100> plane
- the edge of blade 1 whose front and back surfaces are the ⁇ 110> plane, the ⁇ 311> plane at edge 3, the ⁇ 322> plane at edge 2, and the rear side edge A slope having a specific plane orientation is formed, such as the ⁇ 111> plane and the ⁇ 100> plane at the rear end.
- the ⁇ 31 1> surface of the cutting edge 3 forms an angle of 34 ° with respect to the front and back surfaces
- the ⁇ 322> surface of edge 2 forms an angle of 33 ° with respect to the front and back surfaces.
- the angle of the cutting edge 3 in the direction of the center line of the blade with respect to the front and back surfaces is 29 °.
- a sharp surgical knife having a very small angle formed by the blade portion of the blade 1 can be obtained.
- the angle formed by the ⁇ 111> plane at the rear side edge is 35 °, and the angle formed by the ⁇ 100> plane at the rear end is 45 °.
- Such a surface has a mask pattern as shown in Fig. 2 (a) according to the blade shape to be obtained (for example, the tip acute angle is 30 ° and the rear side edge is parallel to the ⁇ 100> surface).
- the etching solution for example, anisotropic etching with KOH aqueous solution and controlling the etching time, higher order surfaces such as ⁇ 311> surface and ⁇ 322> surface can be formed.
- blade 1 obtained are as follows: for example, when the wafer thickness is 150 m, the width is 2.4 mm, the width of ⁇ 311> 2 side is 0.4 mm, and the length of edge 2 in the blade center line direction Becomes 4.5 mm
- the approximate etching time is a time obtained by dividing the wafer thickness (for example, 150 m) by the etching rate of the ⁇ 110> plane.
- the etching rate of the ⁇ 110> plane is 10. 4 111 / hour when the etching solution is KOH, the mass concentration is 25%, and the temperature is 40 ° C. Since the edge is formed with a higher-order surface, strict time management is required.
- the higher-order surfaces constituting the edge and the inclined surface of the cut edge formed by crystal anisotropic etching are ⁇ 322> and ⁇ 311>.
- An example of the etching conditions is as follows.
- edge 2 is between the ⁇ 433> plane and the ⁇ 322> plane, and the edge angle is 31 to 32 °. This is expressed as ⁇ 322> in Fig. 1.
- the edge angle is 35.26 °, so a sharp edge is obtained by the higher-order plane.
- the force S can be changed by changing the plane orientation according to the angle of the mask pattern. Therefore, even if a ⁇ 110> wafer is used, its higher-order surface is not limited to ⁇ 311> and ⁇ 322>, and various higher-order surfaces can be used for edges or cutting edges.
- a surgical knife having an extremely sharp edge can be obtained by performing crystal anisotropic etching on a single crystal silicon wafer having a ⁇ 110> plane orientation using a predetermined mask pattern.
- Power S can be.
- the formation process can be performed using ordinary semiconductor manufacturing technology, is easy and low-cost, and variation in sharpness is small.
- FIG. 5 (a) is a plan view showing the mask pattern of this embodiment
- FIG. 5 (b) is a cross-sectional view taken along line AA in FIG. 5 (a).
- Fig. 6 (a) shows the obtained blade shape
- Fig. 6 (b) is a plan view
- (c) is a perspective view
- (d) is an enlarged view of the connecting portion between the blade and the rib.
- (E) is a perspective view seen from the rear of the blade.
- the mask pattern includes a portion 20 corresponding to the blade 30, a portion 21 corresponding to the rim 31 (not shown in FIG. 5, see FIG. 6), and a portion 22 corresponding to the rib 32.
- the blade portion 20 and the rib portion 22 are separated from each other at an appropriate interval.
- the blade 30, rib 31 and rim 32 having the shape shown in FIG. 6 are obtained.
- the side surfaces of the blade 30 and the rib 32 are inclined to form inclined surfaces, and the blade 30 and the rib 32 are connected with a slight thickness.
- the blade 30 shown in FIG. 6 is supported by the rib 32 and is disposed at a position where the cutting edge and the edge of the blade 30 are surrounded by the rim 31.
- the operator when handling the blade 30, the operator may inadvertently contact with the tip or edge of the blade 30 and be injured, or the blade edge and edge of the blade may come into contact with a hard object, and the tip and edge may be damaged. It is prevented from being deteriorated or deteriorated. Therefore, by providing the rim 31 and the rib 32, the blade 30 can be handled very easily. In addition, by supporting the blade 30 with the rib 32 in this manner, the blade can be easily attached to the handle as will be described later.
- FIG. 7 is a perspective view showing a surgical knife handle 40 according to an embodiment of the present invention
- FIG. 8 is a perspective view showing a blade attaching method thereof.
- the handle 40 shown in FIG. 7 is attached to the blade 30 formed so that the rim 31 and the rib 32 are connected to each other with a slight thickness portion by the touching without contacting the blade 30 with the operator.
- the handle 40 has a handle body 40a that is gripped by an operator.
- a fixed portion 41 constituting the lower half of the handle body 40a and a fixed portion 41 are provided at the tip of the handle body 40a.
- An opening / closing portion 42 is provided which constitutes the distal end portion of the handle body 40a and is supported so as to be rotatable with respect to the handle body 40a.
- a protrusion 44 force S is provided on both side edges of the opening / closing part 42, and a recessed part 43 into which the protrusion 44 is fitted is provided at a position matching the protrusion 44 on both side edges of the fixing part 41.
- at least a portion on the tip end side of the handle body 40a is hollow, and when the fixing portion 41 and the opening / closing portion 42 are overlapped with each other, a space is formed in the state where the side walls are in contact with each other. It is like that.
- the leading edge of the fixing portion 41 is U-shaped, and the blade 30 is placed on the inner bottom surface of the fixing portion 41.
- the opening / closing portion 42 is closed, the gap between the opening / closing portion 42 and the fixing portion 41 is reduced. Thus, the blade 30 is clamped.
- the handle 40 is brought close to the blade 30 with the opening / closing portion 42 opened, and the recess 43 of the fixing portion 41 is a rib. 3 Position the handle 40 so that it is aligned with the connection between 2 and blade 30. Then, when the opening / closing part 42 is closed so that the opening / closing part 42 overlaps the fixed part 41, the projection 44 of the opening / closing part 42 is fitted into the recess 43, whereby the connecting part between the rib 32 and the blade 30 is cut.
- the protrusion 44 of the opening / closing part 42 is fitted and locked in the recess 43 of the fixing part 41, so that the separated blade 30 that the opening / closing part 42 cannot be opened is fixed to the opening / closing part 42. Clamped between part 41. In this way, the blade 30 is attached to the handle 40 without the operator contacting the blade 30. Therefore, sebum adheres to the blade and the blade sharpness is prevented from deteriorating.
- FIG. 9 is a plan view showing the mask pattern of this blade.
- the mask pattern includes a portion 50 corresponding to the blade, a rim portion 51 extending in the longitudinal direction and the width direction of the blade portion 50, and extending from the rim portion 51 toward the blade portion 50.
- the rib part 52 is comprised.
- the breaker A rib portion 52 is disposed only in the vicinity of one side edge of the blade portion 50, and the rib portion 52 is patterned so as to be slightly separated from the blade portion 50.
- FIG. 11 is a perspective view showing a blade with a rim to which a handle 65 is attached in advance.
- a surgical knife like the handle 40 in Fig. 8 in addition to attaching a blade and attaching a force handle to the product.
- As a method for fixing the blade 60 to the handle 65 there are an adhesion method in which a gap between the handle 60 and the handle is filled and hardened, and welding using a thermoplastic material as a handle.
- the handle 65 is attached to the blade 60 in advance, the blade 60 can be easily separated from the rib 62 by rotating the handle 65 around its central axis.
- Fig. 12 (a) is a plan view showing a blade with a rim provided with a dummy blade (discard blade) for sharpness confirmation
- Fig. 12 (b) is a cross-sectional view taken along the line AA.
- a slope with a predetermined sharp angle is formed on the edge 33 and the cut edge 34 of the blade 30 by crystal anisotropic etching, and at the same time, a slope is also formed on the side edge of the rim 31.
- the slope formed on the side edge of the rim 31 is inclined at the same cross-sectional angle as the slope of the edge 33 of the blade 30, and becomes a dummy blade 35 formed on the rim 31.
- the dummy blade 35 can be used to check the sharpness.
- the quality of the manufacturing process including crystal anisotropic etching without wasting the blade 30 as a product can be confirmed and tested, and replaced with a product shipment inspection.
- the sharpness can be confirmed by using the rim that was removed during use.
- FIG. 13 is a plan view showing a modification of the present embodiment.
- a dummy blade 36 having the same shape as the tip of the product blade is formed outside the region where the product blade 30 is formed, and the sharpness is confirmed and tested by the dummy blade 36.
- the dummy blade 36 is attached to the handle and assembled into a surgical knife, and the sharpness can be confirmed and tested with this surgical knife, so that more realistic confirmation can be performed.
- the blade is manufactured using single crystal silicon whose front and back polished surfaces are ⁇ 100> planes.
- FIG. 14 is a plan view showing the blade 70 of the surgical knife of the present embodiment, FIG.
- FIG. 15 (a) is a plan view showing a mask pattern 80 for manufacturing the same
- FIG. 15 (b) is a diagram showing the blade 70 and the mask pattern 80
- FIG. 15 (c) is a perspective view of the blade 70.
- An edge 71 extending linearly from the cutting edge 72 toward the rear side to be inclined with respect to the blade center line is provided, and this edge 71 is a ⁇ 122> plane, and is 48 ° with respect to the blade back surface.
- the rear edge 73 of the blade 70 is a ⁇ 111> plane inclined at 55 ° with respect to the blade back surface, and the rear corner portion 74 is 45 with respect to the blade back surface. It is the ⁇ 101> plane inclined at.
- the blade trailing edge 75 is a ⁇ 111> plane inclined at 55 ° with respect to the blade back surface.
- FIG. 16 (a) is a plan view showing a mask pattern 81 of the rim portion when forming a blade with a rim using single crystal silicon having a plane orientation of ⁇ 100>
- FIG. 16 (b) FIG. 16 is a cross-sectional view taken along the line AA in FIG. 16 (a), and shows a result of etching single crystal silicon by the mask pattern 81.
- FIG. The mask pattern 81 includes a rim portion 82 surrounding the blade mask pattern 80 and a rib portion 83 extending from the rim portion 82 toward the blade mask pattern 80. Then, as shown in FIG. 16 (b), a slope ( ⁇ 111> plane) with an inclination angle of 55 ° is formed from the mask patterns 80 and 81.
- FIG. 17 is a view showing a blade with a rim formed by crystal anisotropic etching using the mask patterns 80 and 81, (a) is a perspective view, and (b) is a blade 70.
- FIG. 7 is an enlarged plan view showing a connecting portion with the rib 92, (c) is a plan view, and (d) is a perspective view seen from the rear part of the blade.
- the blade 70 is formed with an edge 71 having a slope inclined at a sharp angle and a cutting edge 72.
- the tip angle of the mask pattern is the same as described above.
- various higher-order surfaces can be formed by crystal anisotropic etching.
- the ⁇ 122> and ⁇ 011> planes are only examples.
- the present invention is suitable as a surgical knife for ophthalmology or surgery.
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Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07850301A EP2095780A4 (en) | 2006-12-08 | 2007-12-07 | SURGICAL SCALPEL, SURGICAL SCALE AND METHOD FOR THE PRODUCTION THEREOF AND SURGICAL SKALPELL HANDLE |
| US12/448,011 US20100023041A1 (en) | 2006-12-08 | 2007-12-07 | Surgical knife, blade for surgical knife, and method of manufacturing the same, and handle for surgical knife |
| JP2008548357A JP5107261B2 (ja) | 2006-12-08 | 2007-12-07 | 手術ナイフ、手術ナイフ用ブレード及びその製造方法、並びに手術ナイフ用ハンドル |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006332669 | 2006-12-08 | ||
| JP2006-332669 | 2006-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008069323A1 true WO2008069323A1 (ja) | 2008-06-12 |
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ID=39492198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/073723 Ceased WO2008069323A1 (ja) | 2006-12-08 | 2007-12-07 | 手術ナイフ、手術ナイフ用ブレード及びその製造方法、並びに手術ナイフ用ハンドル |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100023041A1 (ja) |
| EP (1) | EP2095780A4 (ja) |
| JP (1) | JP5107261B2 (ja) |
| CN (1) | CN101600395A (ja) |
| RU (1) | RU2009126138A (ja) |
| WO (1) | WO2008069323A1 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013150675A (ja) * | 2012-01-24 | 2013-08-08 | Kai R & D Center Co Ltd | 医療用ナイフ |
| JP2014516271A (ja) * | 2011-03-22 | 2014-07-10 | チャン へ バイオ−メディカル サイエンス(ヤンジョウ) カンパニー リミテッド | 医療器具及びその製造方法 |
| JP2018054326A (ja) * | 2016-09-26 | 2018-04-05 | セイコーインスツル株式会社 | ナイフ |
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| WO2021062295A1 (en) * | 2019-09-27 | 2021-04-01 | Mound Laser & Photonics Center, Inc. | Chemically sharpening blades |
| US12357341B2 (en) | 2020-09-30 | 2025-07-15 | Planatome, Llc | Cutting instrument with improved surface topography |
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- 2007-12-07 US US12/448,011 patent/US20100023041A1/en not_active Abandoned
- 2007-12-07 RU RU2009126138/14A patent/RU2009126138A/ru not_active Application Discontinuation
- 2007-12-07 EP EP07850301A patent/EP2095780A4/en not_active Withdrawn
- 2007-12-07 JP JP2008548357A patent/JP5107261B2/ja not_active Expired - Fee Related
- 2007-12-07 WO PCT/JP2007/073723 patent/WO2008069323A1/ja not_active Ceased
- 2007-12-07 CN CNA2007800453086A patent/CN101600395A/zh active Pending
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| EP1092515A1 (en) | 1999-10-15 | 2001-04-18 | NEWMAN, Martin H. | Atomically sharp edged cutting blades and methods for making same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014516271A (ja) * | 2011-03-22 | 2014-07-10 | チャン へ バイオ−メディカル サイエンス(ヤンジョウ) カンパニー リミテッド | 医療器具及びその製造方法 |
| JP2013150675A (ja) * | 2012-01-24 | 2013-08-08 | Kai R & D Center Co Ltd | 医療用ナイフ |
| JP2018054326A (ja) * | 2016-09-26 | 2018-04-05 | セイコーインスツル株式会社 | ナイフ |
| US20200138514A1 (en) * | 2018-11-02 | 2020-05-07 | Intuitive Surgical Operations, Inc. | Tissue penetrating device tips |
Also Published As
| Publication number | Publication date |
|---|---|
| RU2009126138A (ru) | 2011-01-20 |
| US20100023041A1 (en) | 2010-01-28 |
| EP2095780A4 (en) | 2010-01-13 |
| JP5107261B2 (ja) | 2012-12-26 |
| CN101600395A (zh) | 2009-12-09 |
| EP2095780A1 (en) | 2009-09-02 |
| JPWO2008069323A1 (ja) | 2010-03-25 |
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