WO2008084843A1 - 電子部品用接着剤 - Google Patents

電子部品用接着剤 Download PDF

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Publication number
WO2008084843A1
WO2008084843A1 PCT/JP2008/050243 JP2008050243W WO2008084843A1 WO 2008084843 A1 WO2008084843 A1 WO 2008084843A1 JP 2008050243 W JP2008050243 W JP 2008050243W WO 2008084843 A1 WO2008084843 A1 WO 2008084843A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
adhesive
bonding
viscosity
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050243
Other languages
English (en)
French (fr)
Inventor
Hideaki Ishizawa
Akinobu Hayakawa
Kohei Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to EP08703107A priority Critical patent/EP2108688A4/en
Priority to US12/522,755 priority patent/US20100076119A1/en
Priority to JP2008518534A priority patent/JP4213767B2/ja
Publication of WO2008084843A1 publication Critical patent/WO2008084843A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Epoxy Resins (AREA)

Abstract

本発明は、電子部品の間隔を一定に保って接合する際に用いられる電子部品用接着剤に関し、接合した電子部品間の距離を高精度に保ち、信頼性の高い電気装置を得ることができるとともに、ジェットディスペンス装置を用いた塗布を連続して安定的に行うことが可能な電子部品用接着剤を提供することを目的とする。 本発明は、電子部品を接合するための電子部品用接着剤であって、ＣＶ値が１０％以下であるスペーサー粒子と、繰り返し単位中に芳香環を有する１０量体以下の分子構造を持ち、２５°Cで結晶性固体であり、かつ、５０～８０°Cの温度においてＥ型粘度計で測定した場合の粘度が１Ｐａ・ｓ以下であるエポキシ化合物（Ａ）と、硬化剤とを含有する電子部品用接着剤である。
PCT/JP2008/050243 2007-01-12 2008-01-11 電子部品用接着剤 Ceased WO2008084843A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08703107A EP2108688A4 (en) 2007-01-12 2008-01-11 ADHESIVE FOR ELECTRONIC COMPONENTS
US12/522,755 US20100076119A1 (en) 2007-01-12 2008-01-11 Adhesive for electronic components
JP2008518534A JP4213767B2 (ja) 2007-01-12 2008-01-11 電子部品用接着剤

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007005092 2007-01-12
JP2007-005092 2007-01-12
JP2007-148146 2007-06-04
JP2007148146 2007-06-04

Publications (1)

Publication Number Publication Date
WO2008084843A1 true WO2008084843A1 (ja) 2008-07-17

Family

ID=39608730

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050243 Ceased WO2008084843A1 (ja) 2007-01-12 2008-01-11 電子部品用接着剤

Country Status (6)

Country Link
US (1) US20100076119A1 (ja)
EP (1) EP2108688A4 (ja)
JP (1) JP4213767B2 (ja)
KR (1) KR100946606B1 (ja)
TW (1) TW200831627A (ja)
WO (1) WO2008084843A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158712A (ja) * 2007-12-26 2009-07-16 Sekisui Chem Co Ltd 電子部品用接着剤
EP2045839A4 (en) * 2006-07-20 2009-08-05 Sekisui Chemical Co Ltd GLUE FOR ELECTRONIC COMPONENTS, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP LAMINATE AND SEMICONDUCTOR ARRANGEMENT
JP2010212630A (ja) * 2009-03-12 2010-09-24 Sekisui Chem Co Ltd バックコンタクト型太陽電池用非導電性ペースト
WO2010070355A3 (en) * 2008-12-18 2010-10-21 Bostik S.A. Sealant tape comprising offsetting particles
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
WO2012005079A1 (ja) * 2010-07-09 2012-01-12 東レ株式会社 感光性接着剤組成物、感光性接着剤フィルムおよびこれらを用いた半導体装置
WO2013047643A1 (ja) 2011-09-27 2013-04-04 積水化成品工業株式会社 樹脂組成物層用スペーサー粒子およびその用途
JP2018031019A (ja) * 2016-03-30 2018-03-01 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP2018172695A (ja) * 2016-06-02 2018-11-08 日立化成株式会社 樹脂組成物及び積層体の製造方法
JP2020089208A (ja) * 2018-11-30 2020-06-04 コネクトオール株式会社 積層コアの製造方法、接着剤塗布装置及び積層コアの製造装置
JP2022122992A (ja) * 2017-03-28 2022-08-23 積水化学工業株式会社 樹脂組成物及びインダクタ
JP2023541506A (ja) * 2020-07-13 2023-10-03 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 銅結合のための導電性エポキシ樹脂組成物

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295968A (ja) * 2008-05-08 2009-12-17 Panasonic Corp 表面実装用接着剤およびそれを含む実装構造体、ならびに実装構造体の製造方法
US8863388B2 (en) 2011-03-21 2014-10-21 Hewlett-Packard Development Company, L.P. Stacked adhesive lines
KR101375297B1 (ko) * 2011-12-22 2014-03-17 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름
JP2013155363A (ja) * 2012-02-01 2013-08-15 Shin-Etsu Chemical Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP6469356B2 (ja) * 2013-07-29 2019-02-13 昭和電工パッケージング株式会社 電池ケース
KR101536895B1 (ko) * 2013-12-05 2015-07-15 한국생산기술연구원 마이크로파 경화용 접착제
JP2016018431A (ja) * 2014-07-09 2016-02-01 Ｄｏｗａエレクトロニクス株式会社 紙基材を用いたｒｆｉｄタグ基材およびｒｆｉｄタグ
CN105575590B (zh) * 2014-10-15 2018-04-17 台达电子工业股份有限公司 一种磁芯组件及用于磁芯组件的间隙控制方法
JP7076234B2 (ja) * 2018-03-14 2022-05-27 株式会社村田製作所 コイル部品およびその製造方法
KR102687767B1 (ko) * 2018-07-27 2024-07-23 린텍 가부시키가이샤 경화성 필름상 접착제 및 디바이스의 제조 방법
CN115910550A (zh) * 2022-11-18 2023-04-04 厦门艾申迪电子有限公司 新型电感器

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JPS62161816A (ja) * 1986-01-10 1987-07-17 Sumitomo Chem Co Ltd エポキシ樹脂組成物
JP2698541B2 (ja) 1993-11-17 1998-01-19 株式会社日本触媒 液晶表示板用スペーサーおよびこれを用いた液晶表示板
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JP2002284845A (ja) * 2001-03-28 2002-10-03 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及び半導体装置
JP2003165826A (ja) * 2001-11-30 2003-06-10 Mitsui Chemicals Inc 回路接続用ペースト樹脂組成物およびその使用方法
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JP2001019928A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
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See also references of EP2108688A4

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2045839A4 (en) * 2006-07-20 2009-08-05 Sekisui Chemical Co Ltd GLUE FOR ELECTRONIC COMPONENTS, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP LAMINATE AND SEMICONDUCTOR ARRANGEMENT
US7915743B2 (en) 2006-07-20 2011-03-29 Sekisui Chemical Co., Ltd. Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device
JP2009158712A (ja) * 2007-12-26 2009-07-16 Sekisui Chem Co Ltd 電子部品用接着剤
CN102325849B (zh) * 2008-12-18 2014-04-30 博斯蒂克股份公司 包括偏置颗粒的密封剂带
WO2010070355A3 (en) * 2008-12-18 2010-10-21 Bostik S.A. Sealant tape comprising offsetting particles
JP2010212630A (ja) * 2009-03-12 2010-09-24 Sekisui Chem Co Ltd バックコンタクト型太陽電池用非導電性ペースト
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
US8759989B2 (en) 2010-07-09 2014-06-24 Toray Industries, Inc. Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each
JPWO2012005079A1 (ja) * 2010-07-09 2013-09-02 東レ株式会社 感光性接着剤組成物、感光性接着剤フィルムおよびこれらを用いた半導体装置
WO2012005079A1 (ja) * 2010-07-09 2012-01-12 東レ株式会社 感光性接着剤組成物、感光性接着剤フィルムおよびこれらを用いた半導体装置
WO2013047643A1 (ja) 2011-09-27 2013-04-04 積水化成品工業株式会社 樹脂組成物層用スペーサー粒子およびその用途
US9975970B2 (en) 2011-09-27 2018-05-22 Sekisui Plastics Co., Ltd. Spacer particle for resin composition layer and use thereof
JP2018031019A (ja) * 2016-03-30 2018-03-01 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP2018172695A (ja) * 2016-06-02 2018-11-08 日立化成株式会社 樹脂組成物及び積層体の製造方法
JP2022122992A (ja) * 2017-03-28 2022-08-23 積水化学工業株式会社 樹脂組成物及びインダクタ
JP2020089208A (ja) * 2018-11-30 2020-06-04 コネクトオール株式会社 積層コアの製造方法、接着剤塗布装置及び積層コアの製造装置
WO2020110358A1 (ja) * 2018-11-30 2020-06-04 コネクトオール株式会社 積層コアの製造方法、接着剤塗布装置及び積層コアの製造装置
JP2023541506A (ja) * 2020-07-13 2023-10-03 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 銅結合のための導電性エポキシ樹脂組成物
US12344739B2 (en) 2020-07-13 2025-07-01 Henkel Ag & Co. Kgaa Conductive epoxy resin composition for copper bonding
JP7761628B2 (ja) 2020-07-13 2025-10-28 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 銅結合のための導電性エポキシ樹脂組成物

Also Published As

Publication number Publication date
TW200831627A (en) 2008-08-01
JPWO2008084843A1 (ja) 2010-05-06
EP2108688A4 (en) 2011-09-07
TWI312363B (ja) 2009-07-21
KR100946606B1 (ko) 2010-03-09
US20100076119A1 (en) 2010-03-25
EP2108688A1 (en) 2009-10-14
KR20090081034A (ko) 2009-07-27
JP4213767B2 (ja) 2009-01-21

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