WO2008102687A1 - 圧電／電歪素子 - Google Patents

圧電／電歪素子 Download PDF

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Publication number
WO2008102687A1
WO2008102687A1 PCT/JP2008/052432 JP2008052432W WO2008102687A1 WO 2008102687 A1 WO2008102687 A1 WO 2008102687A1 JP 2008052432 W JP2008052432 W JP 2008052432W WO 2008102687 A1 WO2008102687 A1 WO 2008102687A1
Authority
WO
WIPO (PCT)
Prior art keywords
piezoelectric
electrode film
film
reduced
piezoelectric device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052432
Other languages
English (en)
French (fr)
Inventor
Hideki Shimizu
Takashi Ebigase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to EP08711274.4A priority Critical patent/EP2124269B1/en
Priority to JP2009500155A priority patent/JP5295945B2/ja
Publication of WO2008102687A1 publication Critical patent/WO2008102687A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8536—Alkaline earth metal based oxides, e.g. barium titanates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B41J2002/14258—Multi layer thin film type piezoelectric element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

　白金又は白金を主成分とする合金の電極膜であって膜厚が２．０μｍ以下のものと圧電／電歪膜とを積層した積層型の圧電／電歪素子の製造にあたって、電極膜又は圧電／電歪膜に酸化イットリウム(Y2O3)及び酸化セリウム(CeO2)の両方又は一方を添加しておき、電極膜と圧電／電歪膜とを同時焼成する。これにより、電極膜の膜厚を薄くすること、電極膜の耐熱性を向上すること及び圧電／電歪特性の経時変化を小さくすることを同時に実現することができ、初期圧電／電歪特性が良好で圧電／電歪特性の経時変化が小さい圧電／電歪素子を得ることができる。
PCT/JP2008/052432 2007-02-20 2008-02-14 圧電／電歪素子 Ceased WO2008102687A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08711274.4A EP2124269B1 (en) 2007-02-20 2008-02-14 Piezoelectric device
JP2009500155A JP5295945B2 (ja) 2007-02-20 2008-02-14 圧電／電歪素子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89063607P 2007-02-20 2007-02-20
US60/890,636 2007-02-20

Publications (1)

Publication Number Publication Date
WO2008102687A1 true WO2008102687A1 (ja) 2008-08-28

Family

ID=39709964

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052432 Ceased WO2008102687A1 (ja) 2007-02-20 2008-02-14 圧電／電歪素子

Country Status (4)

Country Link
US (2) US8742650B2 (ja)
EP (1) EP2124269B1 (ja)
JP (1) JP5295945B2 (ja)
WO (1) WO2008102687A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7545084B2 (en) * 2006-07-20 2009-06-09 Ngk Insulators, Ltd. Piezoelectric/electrostrictive ceramic composition, piezoelectric/electrostrictive device, and method of producing the same
KR101582392B1 (ko) * 2010-10-05 2016-01-04 모토로라 모빌리티 엘엘씨 신뢰할 수 있는 제어 채널 성능을 위한 방법 및 장치
JP2013197553A (ja) * 2012-03-22 2013-09-30 Hitachi Cable Ltd 圧電体膜付き基板、圧電体膜素子及びその製造方法
JP6460387B2 (ja) * 2015-01-26 2019-01-30 Tdk株式会社 圧電薄膜素子、圧電アクチュエータ、圧電センサ、並びにハードディスクドライブ、及びインクジェットプリンタ装置
JP6426061B2 (ja) * 2015-07-02 2018-11-21 富士フイルム株式会社 積層薄膜構造体の製造方法、積層薄膜構造体及びそれを備えた圧電素子

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002328319A (ja) * 2001-03-02 2002-11-15 Ngk Insulators Ltd 圧電／電歪デバイス及びその製造方法
JP2003152235A (ja) * 2001-08-31 2003-05-23 Ngk Insulators Ltd セラミック素子
JP2006121012A (ja) * 2004-10-25 2006-05-11 Ngk Insulators Ltd 圧電／電歪デバイス

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3419679B2 (ja) * 1998-02-12 2003-06-23 ティーディーケイ株式会社 圧電セラミックス
JP3931513B2 (ja) * 1999-02-08 2007-06-20 株式会社村田製作所 圧電磁器組成物およびそれを用いた圧電セラミック素子
US6518690B2 (en) * 2000-04-19 2003-02-11 Ngk Insulators, Ltd. Piezoelectric/electrostrictive film type elements and process for producing the same
JP3868285B2 (ja) 2001-12-20 2007-01-17 日本碍子株式会社 圧電素子、及びその製造方法
JP3512379B2 (ja) * 2000-09-20 2004-03-29 日本碍子株式会社 圧電体素子、及びその製造方法
JP3953806B2 (ja) 2001-12-20 2007-08-08 日本碍子株式会社 圧電素子、及びその製造方法
US6624549B2 (en) 2001-03-02 2003-09-23 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device and method of fabricating the same
JP3957528B2 (ja) * 2002-03-05 2007-08-15 日本碍子株式会社 圧電／電歪膜型素子
JP4208234B2 (ja) * 2003-03-24 2009-01-14 株式会社ノリタケカンパニーリミテド 圧電セラミック材用導体ペースト及びその利用
US7132057B2 (en) * 2003-10-15 2006-11-07 Piezotech, Llc Compositions for high power piezoelectric ceramics
JP4571009B2 (ja) 2005-04-25 2010-10-27 株式会社ノリタケカンパニーリミテド 白金ペースト
JP2006299385A (ja) 2005-04-25 2006-11-02 Noritake Co Ltd 白金粉末、その製造方法、および圧電セラミック材用白金ペースト
JP2006335576A (ja) * 2005-05-31 2006-12-14 Nissan Motor Co Ltd 圧電材料

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002328319A (ja) * 2001-03-02 2002-11-15 Ngk Insulators Ltd 圧電／電歪デバイス及びその製造方法
JP2003152235A (ja) * 2001-08-31 2003-05-23 Ngk Insulators Ltd セラミック素子
JP2006121012A (ja) * 2004-10-25 2006-05-11 Ngk Insulators Ltd 圧電／電歪デバイス

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2124269A4 *

Also Published As

Publication number Publication date
JP5295945B2 (ja) 2013-09-18
EP2124269A1 (en) 2009-11-25
US8742650B2 (en) 2014-06-03
US20140167567A1 (en) 2014-06-19
JPWO2008102687A1 (ja) 2010-05-27
EP2124269B1 (en) 2013-05-08
EP2124269A4 (en) 2010-11-10
US9178130B2 (en) 2015-11-03
US20080213575A1 (en) 2008-09-04

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