WO2008105169A1 - 半導体用接着フィルムおよびそれを用いた半導体装置 - Google Patents

半導体用接着フィルムおよびそれを用いた半導体装置 Download PDF

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Publication number
WO2008105169A1
WO2008105169A1 PCT/JP2008/000343 JP2008000343W WO2008105169A1 WO 2008105169 A1 WO2008105169 A1 WO 2008105169A1 JP 2008000343 W JP2008000343 W JP 2008000343W WO 2008105169 A1 WO2008105169 A1 WO 2008105169A1
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WIPO (PCT)
Prior art keywords
adhesive film
semiconductor
meth
semiconductor device
acrylic ester
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Ceased
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PCT/JP2008/000343
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English (en)
French (fr)
Inventor
Hiroyuki Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to CN2008800065475A priority Critical patent/CN101627465B/zh
Priority to JP2009501132A priority patent/JPWO2008105169A1/ja
Priority to EP08710496A priority patent/EP2117041A4/en
Priority to US12/526,265 priority patent/US8008124B2/en
Publication of WO2008105169A1 publication Critical patent/WO2008105169A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
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    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H10W72/01336—Manufacture or treatment of die-attach connectors using blanket deposition in solid form, e.g. by using a powder or by laminating a foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
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    • H10W90/24—Configurations of stacked chips at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
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    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

　（Ａ）（メタ）アクリル酸エステル共重合体と、（Ｂ）（メタ）アクリル酸エステル共重合体と異なる熱可塑性樹脂とを、含む半導体用接着フィルムにおいて、直径２０ｍｍの平行プレートにて、１７５°C、周波数１Ｈｚ、剪断応力３０００Ｐａをかけた際に発生する剪断ひずみ量をγとした場合、測定開始後１０分から２時間まで、下記式（１）を満たす、半導体用接着フィルムを提供することにより、半導体素子が多段に積層された半導体装置においてもワイヤーボンディング工程に費やす熱履歴が長時間になっても、モールド材封入工程において、基板表面凹凸への埋め込み性を良好にする。 ０．１０≦γ≦０．３０（１）
PCT/JP2008/000343 2007-02-28 2008-02-26 半導体用接着フィルムおよびそれを用いた半導体装置 Ceased WO2008105169A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800065475A CN101627465B (zh) 2007-02-28 2008-02-26 用于半导体的粘合膜和使用该粘合膜的半导体器件
JP2009501132A JPWO2008105169A1 (ja) 2007-02-28 2008-02-26 半導体用接着フィルムおよびそれを用いた半導体装置
EP08710496A EP2117041A4 (en) 2007-02-28 2008-02-26 ADHESIVE FILM FOR SEMICONDUCTORS AND THE ADHESIVE SEMICONDUCTOR ASSEMBLY
US12/526,265 US8008124B2 (en) 2007-02-28 2008-02-26 Adhesive film for semiconductor and semiconductor device using the adhesive film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007048497 2007-02-28
JP2007-048497 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105169A1 true WO2008105169A1 (ja) 2008-09-04

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PCT/JP2008/000343 Ceased WO2008105169A1 (ja) 2007-02-28 2008-02-26 半導体用接着フィルムおよびそれを用いた半導体装置

Country Status (7)

Country Link
US (1) US8008124B2 (ja)
EP (1) EP2117041A4 (ja)
JP (1) JPWO2008105169A1 (ja)
KR (1) KR20090128400A (ja)
CN (1) CN101627465B (ja)
TW (1) TW200844203A (ja)
WO (1) WO2008105169A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009113296A1 (ja) * 2008-03-14 2009-09-17 住友ベークライト株式会社 半導体素子接着フィルム形成用樹脂ワニス、半導体素子接着フィルム、および半導体装置
JP2011077199A (ja) * 2009-09-29 2011-04-14 Sumitomo Bakelite Co Ltd 半導体パッケージおよび半導体装置
WO2012008491A1 (ja) * 2010-07-13 2012-01-19 日立化成工業株式会社 ダイシング・ダイボンディング一体型フィルム、ダイシング・ダイボンディング一体型フィルムの製造方法、及び半導体チップの製造方法

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US8247895B2 (en) * 2010-01-08 2012-08-21 International Business Machines Corporation 4D device process and structure
US20130289166A1 (en) * 2011-01-31 2013-10-31 Sumitomo Bakelite Co., Ltd. Resin composition and semiconductor device
US8796049B2 (en) * 2012-07-30 2014-08-05 International Business Machines Corporation Underfill adhesion measurements at a microscopic scale
US9299688B2 (en) * 2013-12-10 2016-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Packaged semiconductor devices and methods of packaging semiconductor devices
KR101709689B1 (ko) 2013-12-19 2017-02-23 주식회사 엘지화학 다이싱 필름 점착층 형성용 조성물 및 다이싱 필름
US20160137888A1 (en) * 2014-11-18 2016-05-19 E I Du Pont De Nemours And Company Bondply adhesive composition
CN109790428B (zh) * 2016-08-12 2022-01-21 陶氏环球技术有限责任公司 水基压敏粘着剂组合物及其制备方法
SG11202004755QA (en) * 2018-01-30 2020-06-29 Hitachi Chemical Co Ltd Semiconductor device production method and film-shaped adhesive

Citations (9)

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EP2117041A4 (en) 2010-06-02
US20100320620A1 (en) 2010-12-23
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