WO2008117382A1 - 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法 - Google Patents

電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法 Download PDF

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Publication number
WO2008117382A1
WO2008117382A1 PCT/JP2007/056077 JP2007056077W WO2008117382A1 WO 2008117382 A1 WO2008117382 A1 WO 2008117382A1 JP 2007056077 W JP2007056077 W JP 2007056077W WO 2008117382 A1 WO2008117382 A1 WO 2008117382A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
circuit chip
base
manufacturing
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/056077
Other languages
English (en)
French (fr)
Inventor
Hiroshi Kobayashi
Kenji Kobae
Shuichi Takeuchi
Hidehiko Kira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to KR1020097019373A priority Critical patent/KR101032069B1/ko
Priority to JP2009506098A priority patent/JP4962563B2/ja
Priority to CN2007800522391A priority patent/CN101663750B/zh
Priority to EP07739518A priority patent/EP2131392A4/en
Priority to PCT/JP2007/056077 priority patent/WO2008117382A1/ja
Publication of WO2008117382A1 publication Critical patent/WO2008117382A1/ja
Priority to US12/559,234 priority patent/US7982295B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

　本発明は、回路チップへの曲げ応力が低減され、かつ、導体パターンの断線も回避された電子装置等を提供することを目的とし、ベース１１と、ベース上に配線された導体パターン１２と、導体パターン１２に電気的に接続された回路チップ１３と、ベース１１上に回路チップ１３を囲んで配置された、環状の外形を有する、内部構造として、互いに同心の複数の環１６ａ，１６ｂを有する補強体１６と、補強体１６の内側を埋めて回路チップ１３上部を覆い、回路チップ１３をベース１１上で封止した封止体１５ａとを備えた。
PCT/JP2007/056077 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法 Ceased WO2008117382A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020097019373A KR101032069B1 (ko) 2007-03-23 2007-03-23 전자 장치, 전자 장치가 실장된 전자 기기, 전자 장치가 장착된 물품, 및 전자 장치의 제조 방법
JP2009506098A JP4962563B2 (ja) 2007-03-23 2007-03-23 電子装置
CN2007800522391A CN101663750B (zh) 2007-03-23 2007-03-23 Rfid标签及其制造方法
EP07739518A EP2131392A4 (en) 2007-03-23 2007-03-23 ELECTRONIC ARRANGEMENT, ELECTRONIC ARRANGEMENT ATTACHING ELECTRONIC DEVICE, ELECTRONIC ARRANGEMENT ATTACHING ITEM AND METHOD FOR PRODUCING AN ELECTRONIC ARRANGEMENT
PCT/JP2007/056077 WO2008117382A1 (ja) 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法
US12/559,234 US7982295B2 (en) 2007-03-23 2009-09-14 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056077 WO2008117382A1 (ja) 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/559,234 Continuation US7982295B2 (en) 2007-03-23 2009-09-14 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device

Publications (1)

Publication Number Publication Date
WO2008117382A1 true WO2008117382A1 (ja) 2008-10-02

Family

ID=39788126

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056077 Ceased WO2008117382A1 (ja) 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法

Country Status (6)

Country Link
US (1) US7982295B2 (ja)
EP (1) EP2131392A4 (ja)
JP (1) JP4962563B2 (ja)
KR (1) KR101032069B1 (ja)
CN (1) CN101663750B (ja)
WO (1) WO2008117382A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9741633B2 (en) 2015-06-02 2017-08-22 Samsung Electronics Co., Ltd. Semiconductor package including barrier members and method of manufacturing the same

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Publication number Priority date Publication date Assignee Title
TWI421982B (zh) * 2008-11-21 2014-01-01 先進封裝技術私人有限公司 半導體導線元件及其製造方法
JP5358489B2 (ja) * 2010-03-11 2013-12-04 株式会社日立製作所 Ｒｆｉｄタグ及びその製造方法
US8671772B2 (en) * 2011-09-22 2014-03-18 Hana Micron America, Inc. Quality assurance and reliability testing apparatus for RFID tags
KR101326194B1 (ko) * 2012-10-19 2013-11-20 이진재 Ｒｆｉｄ 태그 조립체 및 이를 구비한 전자 보호대
CN204650569U (zh) * 2014-04-22 2015-09-16 株式会社村田制作所 无线通信标签
CN105514080B (zh) * 2014-10-11 2018-12-04 意法半导体有限公司 具有再分布层和加强件的电子器件及相关方法
CN104916593A (zh) * 2015-06-02 2015-09-16 三星半导体(中国)研究开发有限公司 封装件和制造封装件的方法
JP7534969B2 (ja) 2021-01-20 2024-08-15 Nok株式会社 Ｉｃタグ

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JPS5921049A (ja) * 1982-07-27 1984-02-02 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置
JPS59152741U (ja) 1983-03-31 1984-10-13 松下電器産業株式会社 半導体素子の基板上における樹脂モ−ルド構造
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Publication number Priority date Publication date Assignee Title
JPS5921049A (ja) * 1982-07-27 1984-02-02 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置
JPS59152741U (ja) 1983-03-31 1984-10-13 松下電器産業株式会社 半導体素子の基板上における樹脂モ−ルド構造
DE3924439A1 (de) 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
US5682296A (en) 1994-02-14 1997-10-28 Us3, Inc. Plastic integrated circuit card with reinforcement structure located over integrated circuit module for protecting same
JP2001014442A (ja) 1999-06-29 2001-01-19 Miyota Kk Ｉｃタグ構造
JP2001217352A (ja) * 2000-01-31 2001-08-10 Optrex Corp 回路基板

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Title
See also references of EP2131392A4

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9741633B2 (en) 2015-06-02 2017-08-22 Samsung Electronics Co., Ltd. Semiconductor package including barrier members and method of manufacturing the same

Also Published As

Publication number Publication date
KR20100005029A (ko) 2010-01-13
EP2131392A4 (en) 2011-08-24
EP2131392A1 (en) 2009-12-09
JPWO2008117382A1 (ja) 2010-07-08
CN101663750B (zh) 2011-06-29
KR101032069B1 (ko) 2011-05-02
CN101663750A (zh) 2010-03-03
US20100001388A1 (en) 2010-01-07
US7982295B2 (en) 2011-07-19
JP4962563B2 (ja) 2012-06-27

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