WO2008123237A1 - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物 Download PDF

Info

Publication number
WO2008123237A1
WO2008123237A1 PCT/JP2008/055553 JP2008055553W WO2008123237A1 WO 2008123237 A1 WO2008123237 A1 WO 2008123237A1 JP 2008055553 W JP2008055553 W JP 2008055553W WO 2008123237 A1 WO2008123237 A1 WO 2008123237A1
Authority
WO
WIPO (PCT)
Prior art keywords
carbon atoms
formula
alkyl group
resin composition
hydrogen atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055553
Other languages
English (en)
French (fr)
Inventor
Shinya Tanaka
Yoshitaka Takezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Sumitomo Chemical Co Ltd
Original Assignee
Hitachi Ltd
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Sumitomo Chemical Co Ltd filed Critical Hitachi Ltd
Priority to CN2008800172640A priority Critical patent/CN101772527B/zh
Priority to US12/450,425 priority patent/US20100144926A1/en
Priority to EP08722763A priority patent/EP2133379A1/en
Publication of WO2008123237A1 publication Critical patent/WO2008123237A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Compounds (AREA)

Abstract

 式(1) (式中、R1、R2、R3、R4およびR5は、水素原子または炭素数1~8のアルキル基を表わし、mおよびnは0から4の整数を表す。Arは下記式(a)で示されるいずれかの二価基を表わす。ここで、Rは水素原子または炭素数1~8のアルキル基を表わす。)で示されるエポキシ化合物と式(2) (式中、Qは炭素数1~8の直鎖状アルキレン基を表わし、該直鎖状アルキレン基を構成するメチレン基は、炭素数1~8のアルキル基で置換されていてもよく、また、該メチレン基の間に-O-またはN(R6)-が挿入されていてもよい。ここで、R6は、水素原子または炭素数1~8のアルキル基を表わす。)で示されるエポキシ化合物とを含む樹脂組成物。
PCT/JP2008/055553 2007-03-26 2008-03-25 エポキシ樹脂組成物 Ceased WO2008123237A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800172640A CN101772527B (zh) 2007-03-26 2008-03-25 环氧树脂组合物
US12/450,425 US20100144926A1 (en) 2007-03-26 2008-03-25 Epoxy resin composition
EP08722763A EP2133379A1 (en) 2007-03-26 2008-03-25 Epoxy resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007078665 2007-03-26
JP2007-078665 2007-03-26

Publications (1)

Publication Number Publication Date
WO2008123237A1 true WO2008123237A1 (ja) 2008-10-16

Family

ID=39830730

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055553 Ceased WO2008123237A1 (ja) 2007-03-26 2008-03-25 エポキシ樹脂組成物

Country Status (7)

Country Link
US (1) US20100144926A1 (ja)
EP (1) EP2133379A1 (ja)
JP (1) JP2008266594A (ja)
KR (1) KR20090129486A (ja)
CN (1) CN101772527B (ja)
TW (1) TW200914483A (ja)
WO (1) WO2008123237A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008285671A (ja) * 2007-04-19 2008-11-27 Sumitomo Chemical Co Ltd エポキシ樹脂組成物
WO2013039185A1 (ja) * 2011-09-15 2013-03-21 住友化学株式会社 ベンゾオキサジン化合物およびその製造方法
JP2013227451A (ja) * 2012-04-26 2013-11-07 Hitachi Chemical Co Ltd エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、及びプリント配線板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008239679A (ja) * 2007-03-26 2008-10-09 Sumitomo Chemical Co Ltd エポキシ樹脂組成物
WO2015001764A1 (ja) * 2013-07-04 2015-01-08 パナソニックIpマネジメント株式会社 樹脂組成物、プリプレグ及び積層板
JP6452133B2 (ja) * 2015-02-17 2019-01-16 田岡化学工業株式会社 環状炭化水素骨格を有するエポキシ樹脂
WO2017209210A1 (ja) * 2016-06-02 2017-12-07 日立化成株式会社 エポキシ樹脂組成物、bステージシート、硬化エポキシ樹脂組成物、樹脂シート、樹脂付金属箔、及び金属基板
JP7264050B2 (ja) * 2018-04-27 2023-04-25 東レ株式会社 プリプレグおよび炭素繊維強化複合材料
CN112135854B (zh) * 2018-08-27 2023-08-25 三菱瓦斯化学株式会社 环氧树脂、环氧树脂组合物和其固化物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811504A (en) 1995-08-03 1998-09-22 Cornell Research Foundation, Inc. Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins
WO2005061473A1 (ja) * 2003-12-24 2005-07-07 Sumitomo Chemical Company, Limited エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物
JP2006273989A (ja) * 2005-03-29 2006-10-12 Sumitomo Chemical Co Ltd エポキシ化合物およびエポキシ樹脂硬化物
JP2007078665A (ja) 2005-09-16 2007-03-29 Japan Science & Technology Agency 血液エンドトキシン測定方法
WO2007142262A1 (ja) * 2006-06-07 2007-12-13 Sumitomo Chemical Company, Limited エポキシ樹脂組成物およびエポキシ樹脂硬化物

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3461098A (en) * 1964-03-27 1969-08-12 Union Carbide Corp Polycarbonates of the bisphenol of cyclohexadiene
US5189117A (en) * 1990-08-03 1993-02-23 The Dow Chemical Company Polyurethane from epoxy compound adduct
US6229675B1 (en) * 1993-01-20 2001-05-08 Nippon Petrochemicals Co., Ltd Swing arm actuator for magnetic disk unit
LU88405A1 (de) * 1993-09-08 1995-04-05 Europ Communities Anisotrope Polymere sowie ein Verfahren zu deren Herstellung
DE19504224A1 (de) * 1994-02-23 1995-08-24 Merck Patent Gmbh Flüssigkristallines Material
TW324737B (en) * 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
US6096241A (en) * 1995-02-17 2000-08-01 Merck Patent Gesellschaft Mit Beschrankter Haftung Polymeric film
DE59609705D1 (de) * 1995-03-03 2002-10-31 Rolic Ag Zug Photovernetzbare Naphthylderivate
GB2299333B (en) * 1995-03-29 1998-11-25 Merck Patent Gmbh Reactive terphenyls
US5773178A (en) * 1996-09-13 1998-06-30 Japan Synthetic Rubber Co, Ltd. Process for producing a patterned anisotropic polymeric film
US5904984A (en) * 1996-10-17 1999-05-18 Siemens Westinghouse Power Corporation Electrical insulation using liquid crystal thermoset epoxy resins
DE19715993A1 (de) * 1997-04-17 1998-10-22 Clariant Gmbh Polymerlaminate mit erhöhtem Deckvermögen
DE69831186T2 (de) * 1997-04-30 2006-06-08 Jsr Corp. Orientierungsschicht für Flüssigkristall und Verfahren zu ihrer Herstellung
TW410534B (en) * 1997-07-16 2000-11-01 Matsushita Electric Industrial Co Ltd Wiring board and production process for the same
US6326555B1 (en) * 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
US6433317B1 (en) * 2000-04-07 2002-08-13 Watlow Polymer Technologies Molded assembly with heating element captured therein
JP3439726B2 (ja) * 2000-07-10 2003-08-25 住友ベークライト株式会社 被研磨物保持材及びその製造方法
US6539171B2 (en) * 2001-01-08 2003-03-25 Watlow Polymer Technologies Flexible spirally shaped heating element
EP1375461B1 (en) * 2001-02-08 2009-08-05 Honshu Chemical Industry Co. Ltd. Diphenol and process for producing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811504A (en) 1995-08-03 1998-09-22 Cornell Research Foundation, Inc. Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins
WO2005061473A1 (ja) * 2003-12-24 2005-07-07 Sumitomo Chemical Company, Limited エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物
EP1698625A1 (en) 2003-12-24 2006-09-06 Sumitomo Chemical Company, Limited Epoxy compounds and cured epoxy resins obtained by curing the compounds
JP2006273989A (ja) * 2005-03-29 2006-10-12 Sumitomo Chemical Co Ltd エポキシ化合物およびエポキシ樹脂硬化物
JP2007078665A (ja) 2005-09-16 2007-03-29 Japan Science & Technology Agency 血液エンドトキシン測定方法
WO2007142262A1 (ja) * 2006-06-07 2007-12-13 Sumitomo Chemical Company, Limited エポキシ樹脂組成物およびエポキシ樹脂硬化物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008285671A (ja) * 2007-04-19 2008-11-27 Sumitomo Chemical Co Ltd エポキシ樹脂組成物
WO2013039185A1 (ja) * 2011-09-15 2013-03-21 住友化学株式会社 ベンゾオキサジン化合物およびその製造方法
JP2013227451A (ja) * 2012-04-26 2013-11-07 Hitachi Chemical Co Ltd エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、及びプリント配線板

Also Published As

Publication number Publication date
KR20090129486A (ko) 2009-12-16
JP2008266594A (ja) 2008-11-06
TW200914483A (en) 2009-04-01
US20100144926A1 (en) 2010-06-10
CN101772527A (zh) 2010-07-07
CN101772527B (zh) 2012-10-10
EP2133379A1 (en) 2009-12-16

Similar Documents

Publication Publication Date Title
TW200704664A (en) Epoxy resin, epoxy resin composition, prepreg and laminated plate using same
WO2008123238A1 (ja) 樹脂組成物
WO2008133228A1 (ja) ケイ素含有化合物、硬化性組成物及び硬化物
TW200801074A (en) Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof
TN2010000091A1 (en) Substituted pyrazole derivative
SG157958A1 (en) Epoxy resin composition
WO2008126890A1 (ja) ヒドラジド化合物およびそれを含有する有害節足動物防除剤
MY148293A (en) Epoxy resin composition for encapsulating semiconductor and semiconductor device
MX2010001344A (es) Compuesto de acido fenilacetico.
WO2009005135A1 (ja) エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物
TW200626660A (en) Epoxy resin composition and semiconductor device
EP1698625A4 (en) Epoxy compounds and cured epoxy resins obtained by curing the compounds
TW200513508A (en) Epoxy compound, preparation method thereof, and use thereof
TW200609261A (en) A thermosetting resin composition and its article
WO2009035145A3 (en) Herbicidal composition comprising a pyridazinone compound with a specific herbicide and a specific safener
MY144113A (en) Resin composition for semiconductor encapsulation and semiconductor device
WO2008081878A1 (ja) 難燃性高耐熱樹脂組成物
WO2005023962A8 (en) Photorefractive composition
TW200706694A (en) Water-soluble preflux and use thereof
TW200734399A (en) Curable composition
TW200732366A (en) Thermosetting resin composition
WO2002081559A1 (en) Ultraviolet absorber for synthetic resin and synthetic resin composition containing the same
MY169359A (en) Epoxy resin composition and electronic component device
WO2008105398A1 (ja) Cbp化合物
TW200634432A (en) Photosensitive resin composition for interplayer insulating film

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880017264.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722763

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008722763

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20097022144

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12450425

Country of ref document: US