WO2008126690A1 - 電磁波シールドシート及びｒｆｉｄプレート - Google Patents

電磁波シールドシート及びｒｆｉｄプレート Download PDF

Info

Publication number
WO2008126690A1
WO2008126690A1 PCT/JP2008/055877 JP2008055877W WO2008126690A1 WO 2008126690 A1 WO2008126690 A1 WO 2008126690A1 JP 2008055877 W JP2008055877 W JP 2008055877W WO 2008126690 A1 WO2008126690 A1 WO 2008126690A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetic shield
shield sheet
sheet
electromagnetic
rfid plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055877
Other languages
English (en)
French (fr)
Inventor
Munetomo Nakamura
Yuji Koyamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fine Rubber Kenkyusho KK
Asahi Rubber Inc
Original Assignee
Fine Rubber Kenkyusho KK
Asahi Rubber Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fine Rubber Kenkyusho KK, Asahi Rubber Inc filed Critical Fine Rubber Kenkyusho KK
Priority to EP08722916A priority Critical patent/EP2131642A1/en
Priority to JP2009509164A priority patent/JPWO2008126690A1/ja
Priority to US12/528,107 priority patent/US20100096181A1/en
Publication of WO2008126690A1 publication Critical patent/WO2008126690A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/042—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/41—Opaque
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)

Abstract

　電磁波遮蔽効果に優れ、厚さを薄くしても十分な遮蔽効果を奏し、軽量化も可能であり、更に、優れた成形性、可撓性、柔軟性を付与することも可能で、異なる形状の電源ボックスや内壁、あるいは空間に対しても所望する形状で遮蔽することも可能で、種々の形状の電子機器などに用いて電磁波を遮蔽することも可能な電磁波シールドシート及びこれを利用したＲＦＩＤプレートを提供する。 　高分子物質に導電性物質を配合した高分子組成物層を備えた電磁波シールドシートであって、誘電率の異なる高分子組成物層１、２、３を二層以上積層した電磁波シールドシートＡ及びこれとＩＣ、アンテナ回路とを積層したＲＦＩＤプレート。
PCT/JP2008/055877 2007-03-29 2008-03-27 電磁波シールドシート及びｒｆｉｄプレート Ceased WO2008126690A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08722916A EP2131642A1 (en) 2007-03-29 2008-03-27 Electromagnetic shield sheet and rfid plate
JP2009509164A JPWO2008126690A1 (ja) 2007-03-29 2008-03-27 電磁波シールドシート及びｒｆｉｄプレート
US12/528,107 US20100096181A1 (en) 2007-03-29 2008-03-27 Electromagnetic shield sheet and rfid plate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-087118 2007-03-29
JP2007087118 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008126690A1 true WO2008126690A1 (ja) 2008-10-23

Family

ID=39863797

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055877 Ceased WO2008126690A1 (ja) 2007-03-29 2008-03-27 電磁波シールドシート及びｒｆｉｄプレート

Country Status (4)

Country Link
US (1) US20100096181A1 (ja)
EP (1) EP2131642A1 (ja)
JP (1) JPWO2008126690A1 (ja)
WO (1) WO2008126690A1 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077592A (ja) * 2011-09-29 2013-04-25 Shachihata Inc 電波抑制体とこの電波抑制体を具備した電子機器及び電波抑制用部品
JP2013245329A (ja) * 2012-05-29 2013-12-09 Dow Corning Toray Co Ltd 導電性室温硬化型フルオロシリコーンゴム組成物
JP2014165363A (ja) * 2013-02-26 2014-09-08 Nitto Denko Corp 軟磁性熱硬化性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP2016086133A (ja) * 2014-10-28 2016-05-19 シヤチハタ株式会社 電波吸収材、並びにその電波吸収材を具備する電子機器、自動料金収受システム、及び車載レーダー装置
JP2017501590A (ja) * 2013-11-13 2017-01-12 アーク・テクノロジーズ・インコーポレーテツド 多−層吸収材
WO2017110096A1 (ja) * 2015-12-25 2017-06-29 日本ゼオン株式会社 電磁波吸収材料及び電磁波吸収体
WO2017111122A1 (ja) * 2015-12-25 2017-06-29 日本ゼオン株式会社 電磁波吸収材料及び電磁波吸収体、並びにこれらの製造方法
JP2017152583A (ja) * 2016-02-25 2017-08-31 シヤチハタ株式会社 電波吸収材
WO2017169672A1 (ja) * 2016-03-30 2017-10-05 株式会社巴川製紙所 電波吸収用粘着シート
WO2018100975A1 (ja) * 2016-11-29 2018-06-07 パナソニックＩｐマネジメント株式会社 複合コイルモジュールおよび磁性シート
JP2019176143A (ja) * 2018-03-26 2019-10-10 積水テクノ成型株式会社 樹脂成形体
JP2020111679A (ja) * 2019-01-11 2020-07-27 株式会社巴川製紙所 両面粘着シート
WO2021010439A1 (ja) * 2019-07-17 2021-01-21 株式会社クラウドナイン 非接触型ｉｃタグを用いたコンテンツ提供物
JP2021018814A (ja) * 2020-07-06 2021-02-15 株式会社クラウドナイン 非接触型ｉｃタグを用いたコンテンツ提供物
WO2021085508A1 (ja) * 2019-10-31 2021-05-06 関西ペイント株式会社 ミリ波吸収性を有する構造体

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1833289A1 (en) 2004-12-17 2007-09-12 Kabushiki Kaisha Fine Rubber Kenkyuusho Dielectric raw material, antenna device, portable phone and electromagnetic wave shielding body
WO2006064783A1 (ja) * 2004-12-17 2006-06-22 Kabushiki Kaisha Fine Rubber Kenkyuusho 比誘電率の制御方法、誘電体、携帯電話機及び人体ファントムモデル
US7881693B2 (en) * 2006-10-17 2011-02-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2008165744A (ja) * 2006-12-07 2008-07-17 Semiconductor Energy Lab Co Ltd 半導体装置
JP2008246104A (ja) * 2007-03-30 2008-10-16 Angel Shoji Kk Ｒｆｉｄを内蔵したゲームカードおよびその製造方法
TWI423519B (zh) * 2007-09-04 2014-01-11 Mitsubishi Electric Corp Radio frequency identification tag
CN101466252B (zh) * 2007-12-21 2011-11-30 清华大学 电磁屏蔽层及其制备方法
KR100903687B1 (ko) * 2008-12-30 2009-06-18 두성산업 주식회사 정보유출 방지 및 인식율 향상을 위한 전자여권 케이스
CN102484911B (zh) * 2009-08-20 2015-04-08 松下电器产业株式会社 电磁波加热装置
US8833664B2 (en) * 2009-12-18 2014-09-16 Yu Yung Choi Enhanced performance and security RFID device
WO2012058131A2 (en) * 2010-10-26 2012-05-03 Henkel Corporation Composite film for board level emi shielding
US9484123B2 (en) 2011-09-16 2016-11-01 Prc-Desoto International, Inc. Conductive sealant compositions
KR101337959B1 (ko) * 2012-03-19 2013-12-09 현대자동차주식회사 전자파차폐용 복합재
KR101349029B1 (ko) * 2012-04-04 2014-01-10 현대자동차주식회사 광대역 전자파차폐용 복합재
US9174413B2 (en) 2012-06-14 2015-11-03 International Business Machines Corporation Graphene based structures and methods for shielding electromagnetic radiation
US9413075B2 (en) * 2012-06-14 2016-08-09 Globalfoundries Inc. Graphene based structures and methods for broadband electromagnetic radiation absorption at the microwave and terahertz frequencies
WO2014084860A1 (en) * 2012-11-30 2014-06-05 Empire Technology Development, Llc Graphene membrane laminated to porous woven or nonwoven support
WO2014088832A1 (en) 2012-12-03 2014-06-12 Illinois Tool Works Inc. Insulation film and method for making insulation film
US9252496B2 (en) 2013-01-11 2016-02-02 Sabic Global Technologies B.V. Methods and compositions for energy dissipation
US9356357B2 (en) 2013-01-11 2016-05-31 Sabic Global Technologies B.V. Methods and compositions for destructive interference
US11907791B2 (en) * 2013-01-18 2024-02-20 Amatech Group Lijited Smart cards with metal layer(s) and methods of manufacture
MX2015010931A (es) 2013-02-22 2016-07-19 Interface Performance Materials Inc Protector termica de peso ligero.
JP6073035B2 (ja) * 2013-05-07 2017-02-01 エンパイア テクノロジー ディベロップメント エルエルシー テラヘルツ周波数タグおよびそれらの作製および使用方法
US9942989B2 (en) 2013-11-21 2018-04-10 Illinois Tool Works Inc. Insulation film and method for making insulation film
US10070547B2 (en) * 2014-02-26 2018-09-04 Sparton Corporation Control of electric field effects in a printed circuit board assembly using embedded nickel-metal composite materials
CN113844117A (zh) * 2014-06-23 2021-12-28 伊利诺斯工具制品有限公司 绝缘薄膜及其生产方法
FR3029386A1 (fr) * 2014-11-28 2016-06-03 Commissariat Energie Atomique Blindage magnetique ameliore
BR112017013095A2 (pt) 2014-12-22 2018-02-20 Bridgestone Americas Tire Operations Llc composições de borracha para dispositivos de rádio em pneus
JP6278922B2 (ja) * 2015-03-30 2018-02-14 Ｊｘ金属株式会社 電磁波シールド材
JP6681468B2 (ja) 2015-11-09 2020-04-15 ブリヂストン アメリカズ タイヤ オペレーションズ、 エルエルシー 電子通信モジュール用のゴムコーティング、同一のものを含む電子モジュール、及び関連方法
KR20170092238A (ko) * 2016-02-03 2017-08-11 엘지이노텍 주식회사 무선 전력 충전을 위한 자성 차폐재 및 무선 전력 수신 장치
US11003978B2 (en) 2016-12-14 2021-05-11 Ajay Khoche Programmable network node roles in hierarchical communications network
US10885420B2 (en) * 2016-12-14 2021-01-05 Ajay Khoche Package sealing tape types with varied transducer sampling densities
US11138490B2 (en) 2016-12-14 2021-10-05 Ajay Khoche Hierarchical combination of distributed statistics in a monitoring network
US10445634B2 (en) 2016-12-14 2019-10-15 Trackonomy Systems, Inc. Fabricating multifunction adhesive product for ubiquitous realtime tracking
US10902310B2 (en) 2016-12-14 2021-01-26 Trackonomy Systems, Inc. Wireless communications and transducer based event detection platform
KR102405258B1 (ko) * 2018-02-14 2022-06-03 삼성디스플레이 주식회사 표시 장치
KR102036993B1 (ko) * 2018-04-10 2019-10-25 (주)시스템케이 고내열성 및 방수성을 갖는 rfid 태그
KR102661722B1 (ko) * 2018-08-21 2024-04-26 라이르드 테크놀로지스, 아이엔씨 패턴화된 재료 및 필름과 이를 제조하기 위한 시스템 및 방법
DE102018121826A1 (de) * 2018-09-07 2020-03-12 Airbus Defence and Space GmbH Vorrichtung zum Filtern von elektromagnetischer Strahlung, Luft- und Raumfahrzeug und Verfahren zum Herstellen der Vorrichtung
CN109996431B (zh) * 2019-05-05 2023-11-10 江苏铁锚玻璃股份有限公司 高性能屏蔽玻璃及其制备方法
WO2020247354A1 (en) 2019-06-05 2020-12-10 Trackonomy Systems, Inc. Temperature monitoring in cold supply chains
MX2022003135A (es) 2019-09-13 2022-08-04 Trackonomy Systems Inc Método y dispositivo de fabricación de aditivo rollo a rollo.
US11553630B2 (en) * 2020-01-03 2023-01-10 Nanotech Energy, Inc. Electromagnetic interference shielding materials, devices, and methods of manufacture thereof
AU2021262806A1 (en) 2020-05-01 2022-12-22 Aeras, LLC Electrostatic quadcopter sanitation device and delivery system
US11864058B1 (en) 2020-10-04 2024-01-02 Trackonomy Systems, Inc. Flexible tracking device for cables and equipment
CN111967547B (zh) * 2020-07-06 2021-11-05 深圳市成为信息技术有限公司 多标签盘点方法、电子设备及存储介质
TWI766320B (zh) * 2020-07-23 2022-06-01 南亞塑膠工業股份有限公司 預浸片及金屬積層板
WO2022026931A1 (en) 2020-07-31 2022-02-03 Trackonomy Systems, Inc. System and methods of electronics sampling to optimize system performance, cost, and confidence levels
US12124904B2 (en) 2020-09-05 2024-10-22 Trackonomy Systems, Inc. Wireless sensor device with an attachable external sensor probe
US12047841B2 (en) 2020-09-21 2024-07-23 Trackonomy Systems, Inc. Detecting special events and strategically important areas in an IoT tracking system
WO2022072948A1 (en) 2020-10-03 2022-04-07 Trackonomy Systems, Inc. System and method of generating environmental profiles for determining logistics of assets
US11527148B1 (en) 2020-10-04 2022-12-13 Trackonomy Systems, Inc. Augmented reality for guiding users to assets in IOT applications
US12051916B1 (en) 2020-10-05 2024-07-30 Trackonomy Systems, Inc. Method for recharging wireless IOT devices and system thereof
US11869994B2 (en) 2020-12-12 2024-01-09 Trackonomy Systems, Inc. Flexible solar-powered wireless communication device
KR102873907B1 (ko) * 2025-05-29 2025-10-28 주식회사 신성이엔지 Rfid 태그를 포함하는 태양광 모듈 및 이를 위한 rfid 태그

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031686A (ja) 1998-07-09 2000-01-28 Daido Steel Co Ltd 積層型電磁波吸収体およびその製造方法
JP2002043792A (ja) 2000-07-25 2002-02-08 Nishizaki:Kk 電磁波遮蔽シート
JP2002309107A (ja) 2001-04-13 2002-10-23 Jsr Corp 導電性ゴム組成物及びそれを用いた電磁波シールド材
JP2003243878A (ja) * 2002-02-15 2003-08-29 Hitachi Ltd 電磁波吸収材料及びそれを用いた各種製品
JP2005080023A (ja) * 2003-09-01 2005-03-24 Sony Corp 磁芯部材、アンテナモジュール及びこれを備えた携帯型通信端末
WO2006064782A1 (ja) * 2004-12-17 2006-06-22 Kabushiki Kaisha Fine Rubber Kenkyuusho 誘電性素材、アンテナ装置、携帯電話機及び電磁波遮蔽体
JP2006344570A (ja) * 2004-08-06 2006-12-21 Mitsubishi Gas Chem Co Inc 絶縁化超微粉末および高誘電率樹脂複合材料

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003276809A1 (en) * 2002-06-14 2003-12-31 Laird Technologies, Inc. Composite emi shield

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031686A (ja) 1998-07-09 2000-01-28 Daido Steel Co Ltd 積層型電磁波吸収体およびその製造方法
JP2002043792A (ja) 2000-07-25 2002-02-08 Nishizaki:Kk 電磁波遮蔽シート
JP2002309107A (ja) 2001-04-13 2002-10-23 Jsr Corp 導電性ゴム組成物及びそれを用いた電磁波シールド材
JP2003243878A (ja) * 2002-02-15 2003-08-29 Hitachi Ltd 電磁波吸収材料及びそれを用いた各種製品
JP2005080023A (ja) * 2003-09-01 2005-03-24 Sony Corp 磁芯部材、アンテナモジュール及びこれを備えた携帯型通信端末
JP2006344570A (ja) * 2004-08-06 2006-12-21 Mitsubishi Gas Chem Co Inc 絶縁化超微粉末および高誘電率樹脂複合材料
WO2006064782A1 (ja) * 2004-12-17 2006-06-22 Kabushiki Kaisha Fine Rubber Kenkyuusho 誘電性素材、アンテナ装置、携帯電話機及び電磁波遮蔽体

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077592A (ja) * 2011-09-29 2013-04-25 Shachihata Inc 電波抑制体とこの電波抑制体を具備した電子機器及び電波抑制用部品
US9704614B2 (en) 2012-05-29 2017-07-11 Dow Corning Toray Co., Ltd. Room temperature-curable electrically conductive fluorosilicone rubber composition
JP2013245329A (ja) * 2012-05-29 2013-12-09 Dow Corning Toray Co Ltd 導電性室温硬化型フルオロシリコーンゴム組成物
JP2014165363A (ja) * 2013-02-26 2014-09-08 Nitto Denko Corp 軟磁性熱硬化性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP2017501590A (ja) * 2013-11-13 2017-01-12 アーク・テクノロジーズ・インコーポレーテツド 多−層吸収材
JP2016086133A (ja) * 2014-10-28 2016-05-19 シヤチハタ株式会社 電波吸収材、並びにその電波吸収材を具備する電子機器、自動料金収受システム、及び車載レーダー装置
US20180375215A1 (en) * 2015-12-25 2018-12-27 Zeon Corporation Electromagnetic wave absorption material, electromagnetic wave absorber, and production methods therefor
KR102575899B1 (ko) * 2015-12-25 2023-09-06 니폰 제온 가부시키가이샤 전자파 흡수 재료 및 전자파 흡수체
TWI726963B (zh) * 2015-12-25 2021-05-11 日商日本瑞翁股份有限公司 電磁波吸收材料及電磁波吸收體
CN108370654A (zh) * 2015-12-25 2018-08-03 日本瑞翁株式会社 电磁波吸收材料及电磁波吸收体
KR20180098547A (ko) * 2015-12-25 2018-09-04 니폰 제온 가부시키가이샤 전자파 흡수 재료 및 전자파 흡수체
JPWO2017110096A1 (ja) * 2015-12-25 2018-10-11 日本ゼオン株式会社 電磁波吸収材料及び電磁波吸収体
WO2017110096A1 (ja) * 2015-12-25 2017-06-29 日本ゼオン株式会社 電磁波吸収材料及び電磁波吸収体
US11235560B2 (en) 2015-12-25 2022-02-01 Zeon Corporation Electromagnetic wave absorption material and electromagnetic wave absorber
WO2017111122A1 (ja) * 2015-12-25 2017-06-29 日本ゼオン株式会社 電磁波吸収材料及び電磁波吸収体、並びにこれらの製造方法
CN108370654B (zh) * 2015-12-25 2020-02-07 日本瑞翁株式会社 电磁波吸收材料及电磁波吸收体
JP2017152583A (ja) * 2016-02-25 2017-08-31 シヤチハタ株式会社 電波吸収材
WO2017169672A1 (ja) * 2016-03-30 2017-10-05 株式会社巴川製紙所 電波吸収用粘着シート
JPWO2017169672A1 (ja) * 2016-03-30 2019-02-07 株式会社巴川製紙所 電波吸収用粘着シート
WO2018100975A1 (ja) * 2016-11-29 2018-06-07 パナソニックＩｐマネジメント株式会社 複合コイルモジュールおよび磁性シート
CN109997205A (zh) * 2016-11-29 2019-07-09 松下知识产权经营株式会社 复合线圈模块以及磁性片
JP2019176143A (ja) * 2018-03-26 2019-10-10 積水テクノ成型株式会社 樹脂成形体
JP7279994B2 (ja) 2018-03-26 2023-05-23 積水テクノ成型株式会社 樹脂成形体
JP7264645B2 (ja) 2019-01-11 2023-04-25 株式会社巴川製紙所 両面粘着シート
JP2020111679A (ja) * 2019-01-11 2020-07-27 株式会社巴川製紙所 両面粘着シート
JP2021018493A (ja) * 2019-07-17 2021-02-15 株式会社クラウドナイン 非接触型ｉｃタグを用いたコンテンツ提供物
WO2021010439A1 (ja) * 2019-07-17 2021-01-21 株式会社クラウドナイン 非接触型ｉｃタグを用いたコンテンツ提供物
WO2021085508A1 (ja) * 2019-10-31 2021-05-06 関西ペイント株式会社 ミリ波吸収性を有する構造体
JP2021018814A (ja) * 2020-07-06 2021-02-15 株式会社クラウドナイン 非接触型ｉｃタグを用いたコンテンツ提供物

Also Published As

Publication number Publication date
US20100096181A1 (en) 2010-04-22
EP2131642A1 (en) 2009-12-09
JPWO2008126690A1 (ja) 2010-07-22

Similar Documents

Publication Publication Date Title
WO2008126690A1 (ja) 電磁波シールドシート及びｒｆｉｄプレート
US11285645B2 (en) Method for manufacturing an electronic assembly and an electronic assembly
TWI278278B (en) Electromagnetic waves absorber
GB2473982A (en) Circuit materials, circuits laminates and method of manufacture thereof
RU2716184C2 (ru) Декоративные многослойные облицовочные материалы, содержащие внедренные проводящие материалы, изготовленные из них твердые поверхности, способы изготовления таких облицовочных материалов и их применения
WO2009017520A3 (en) Radar camouflage fabric
TW201129475A (en) Multilayer resin sheet and method of producing the same, method of producing cured multilayer resin sheet, and high heat conducting resin sheet laminate and method of producing the same
WO2014153391A3 (en) Dielectric waveguide and method of manufacture
WO2011022188A3 (en) Formation of high electrical conductivity polymer composites with multiple fillers
TW200614084A (en) RFID device with content insensitivity and position insensitivity
PH12015500899B1 (en) Coverplay film, flexible printed circuit board using same, and production method therefor
AR063797A1 (es) Cable de energia
WO2009152120A8 (en) Microwave energy interactive structure with microapertures
MY169978A (en) Low dielectric loss thermoset resin system at high frequency for use in electrical components
EP2578613B8 (en) Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition
WO2009008471A1 (ja) 誘電層付銅箔
TW200705463A (en) Electrically conductive polymer resin and method for making same
WO2010065494A3 (en) Anode for an organic electronic device
EP2662395A3 (en) Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
WO2012162250A3 (en) Surface modified materials for tailoring responses to electromagnetic fields
EP3290453A4 (en) Epoxy resin composition, thermoconductive material precursor, b-stage sheet, prepreg, heat-dissipating material, laminated plate, metal substrate, and printed circuit board
MY169238A (en) Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
TW200709740A (en) Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same
WO2011046809A3 (en) Ic package with non-uniform dielectric layer thickness
EP2698400A3 (en) Epoxy resin compound and radiant heat circuit board Using the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722916

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009509164

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 12528107

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2008722916

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE