WO2008142759A1 - アーク放電装置 - Google Patents

アーク放電装置 Download PDF

Info

Publication number
WO2008142759A1
WO2008142759A1 PCT/JP2007/060251 JP2007060251W WO2008142759A1 WO 2008142759 A1 WO2008142759 A1 WO 2008142759A1 JP 2007060251 W JP2007060251 W JP 2007060251W WO 2008142759 A1 WO2008142759 A1 WO 2008142759A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
semiconductor
discharge device
arc discharge
plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/060251
Other languages
English (en)
French (fr)
Inventor
Osamu Soda
Yuji Ohnishi
Kazunori Inami
Toshio Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sansha Electric Manufacturing Co Ltd
Original Assignee
Sansha Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sansha Electric Manufacturing Co Ltd filed Critical Sansha Electric Manufacturing Co Ltd
Priority to KR1020097014564A priority Critical patent/KR101081622B1/ko
Priority to KR1020117019494A priority patent/KR101081724B1/ko
Priority to JP2009515028A priority patent/JP5240863B2/ja
Priority to EP07743686.3A priority patent/EP2149902B1/en
Priority to PCT/JP2007/060251 priority patent/WO2008142759A1/ja
Priority to SI200732088T priority patent/SI2149902T1/sl
Priority to CN2007800511876A priority patent/CN101681905B/zh
Priority to US12/451,155 priority patent/US8223496B2/en
Publication of WO2008142759A1 publication Critical patent/WO2008142759A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
  • Arc Welding Control (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

　アーク放電装置に備えられた小型軽量の電力用半導体モジュール内により多くの半導体素子を内蔵する。 　アーク放電装置の電源装置が、半導体モジュール１及び半導体モジュール１に取り付けられる放熱器からなる。半導体モジュール１は、モジュール筐体２と、モジュール筐体２によって保持される共通ユニット３ａ～３ｃからなる。共通ユニット３ａ～３ｃは、半導体素子５４が配設された回路面及びその反対側の放熱面を有するセラミック基板５０と、上記放熱面を露出させ回路面を耐熱性樹脂によって封止するパッケージ３５とを有する。放電器は、モジュール筐体２に取り付けられることにより、共通ユニット３ａ～３ｃの全ての放熱面に当接する。この様な構成により、小型軽量の電力用半導体モジュール内に多くの半導体素子を内蔵することができる。
PCT/JP2007/060251 2007-05-18 2007-05-18 アーク放電装置 Ceased WO2008142759A1 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020097014564A KR101081622B1 (ko) 2007-05-18 2007-05-18 아크방전장치
KR1020117019494A KR101081724B1 (ko) 2007-05-18 2007-05-18 아크방전장치
JP2009515028A JP5240863B2 (ja) 2007-05-18 2007-05-18 電力用半導体モジュール及びアーク放電装置
EP07743686.3A EP2149902B1 (en) 2007-05-18 2007-05-18 Power semiconductor module and arc discharge device using the same
PCT/JP2007/060251 WO2008142759A1 (ja) 2007-05-18 2007-05-18 アーク放電装置
SI200732088T SI2149902T1 (sl) 2007-05-18 2007-05-18 Močnostni polprevodniški moduli in naprava za električni oblok, ki le-tega uporablja
CN2007800511876A CN101681905B (zh) 2007-05-18 2007-05-18 电弧放电装置
US12/451,155 US8223496B2 (en) 2007-05-18 2007-05-18 Arc discharge device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/060251 WO2008142759A1 (ja) 2007-05-18 2007-05-18 アーク放電装置

Publications (1)

Publication Number Publication Date
WO2008142759A1 true WO2008142759A1 (ja) 2008-11-27

Family

ID=40031486

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/060251 Ceased WO2008142759A1 (ja) 2007-05-18 2007-05-18 アーク放電装置

Country Status (7)

Country Link
US (1) US8223496B2 (ja)
EP (1) EP2149902B1 (ja)
JP (1) JP5240863B2 (ja)
KR (2) KR101081622B1 (ja)
CN (1) CN101681905B (ja)
SI (1) SI2149902T1 (ja)
WO (1) WO2008142759A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102024803A (zh) * 2009-09-18 2011-04-20 株式会社东芝 功率模块
US8637971B2 (en) 2012-04-20 2014-01-28 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing semiconductor device

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009111615A2 (en) 2008-03-05 2009-09-11 Thrombovision, Inc. Systems for measuring properties of a physiological fluid suspension
WO2013145619A1 (ja) 2012-03-28 2013-10-03 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP5835466B2 (ja) * 2012-03-28 2015-12-24 富士電機株式会社 半導体装置
EP2833405A4 (en) 2012-03-28 2016-01-13 Fuji Electric Co Ltd SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
US9433075B2 (en) * 2012-08-27 2016-08-30 Mitsubishi Electric Corporation Electric power semiconductor device
WO2014175062A1 (ja) * 2013-04-24 2014-10-30 富士電機株式会社 パワー半導体モジュールおよびその製造方法、電力変換器
WO2014177289A1 (en) * 2013-04-29 2014-11-06 Abb Technology Ag Module arrangement for power semiconductor devices
JP6171586B2 (ja) 2013-06-04 2017-08-02 富士電機株式会社 半導体装置
CN105742252B (zh) * 2014-12-09 2019-05-07 台达电子工业股份有限公司 一种功率模块及其制造方法
US9663096B2 (en) 2015-02-20 2017-05-30 Ford Global Technologies, Llc Methods and systems for mitigating fuel injector leak
US20210134510A1 (en) * 2019-10-31 2021-05-06 Analog Devices International Unlimited Company Electronic device
WO2022066250A1 (en) * 2020-09-24 2022-03-31 Hrl Laboratories, Llc Wafer-level integrated micro-structured heat spreaders
JP7395010B2 (ja) * 2020-10-12 2023-12-08 三菱電機株式会社 半導体モジュール
US12315776B2 (en) 2021-11-08 2025-05-27 Analog Devices, Inc. Integrated device package with an integrated heat sink

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550239A (ja) * 1991-08-23 1993-03-02 Daihen Corp 交流アーク溶接用電源装置
JPH09237869A (ja) 1996-02-29 1997-09-09 Hitachi Ltd 樹脂封止型パワーモジュール装置及びその製造方法
JPH10146068A (ja) * 1996-11-05 1998-05-29 Sansha Electric Mfg Co Ltd 直流アークスタート補助回路
JP2001036005A (ja) * 1999-07-23 2001-02-09 Fuji Electric Co Ltd 半導体装置
JP2006332291A (ja) * 2005-05-25 2006-12-07 Keihin Corp パワードライブユニット

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DE4112022A1 (de) * 1991-04-12 1992-10-15 Telefunken Electronic Gmbh Gehaeuse fuer den einbau in kraftfahrzeuge zur aufnahme von elektronikbauteilen
TW283274B (ja) * 1994-11-08 1996-08-11 Sansha Denki Seisakusho Co Ltd
JP3225457B2 (ja) * 1995-02-28 2001-11-05 株式会社日立製作所 半導体装置
JP3168901B2 (ja) * 1996-02-22 2001-05-21 株式会社日立製作所 パワー半導体モジュール
TW408453B (en) * 1997-12-08 2000-10-11 Toshiba Kk Package for semiconductor power device and method for assembling the same
JP3919398B2 (ja) * 1999-10-27 2007-05-23 三菱電機株式会社 半導体モジュール
US6549409B1 (en) * 2000-08-21 2003-04-15 Vlt Corporation Power converter assembly
JP4151209B2 (ja) 2000-08-29 2008-09-17 三菱電機株式会社 電力用半導体装置
US6307749B1 (en) * 2000-10-23 2001-10-23 Delphi Technologies, Inc. Overmolded electronic module with underfilled surface-mount components
JP2002203942A (ja) * 2000-12-28 2002-07-19 Fuji Electric Co Ltd パワー半導体モジュール
US6727585B2 (en) * 2001-05-04 2004-04-27 Ixys Corporation Power device with a plastic molded package and direct bonded substrate
DE10213648B4 (de) * 2002-03-27 2011-12-15 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
JP4114497B2 (ja) * 2003-02-14 2008-07-09 住友電装株式会社 回路構成体用ケース及び回路構成体の製造方法
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US7149088B2 (en) * 2004-06-18 2006-12-12 International Rectifier Corporation Half-bridge power module with insert molded heatsinks
JP4760585B2 (ja) * 2006-07-18 2011-08-31 三菱電機株式会社 電力用半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550239A (ja) * 1991-08-23 1993-03-02 Daihen Corp 交流アーク溶接用電源装置
JPH09237869A (ja) 1996-02-29 1997-09-09 Hitachi Ltd 樹脂封止型パワーモジュール装置及びその製造方法
JPH10146068A (ja) * 1996-11-05 1998-05-29 Sansha Electric Mfg Co Ltd 直流アークスタート補助回路
JP2001036005A (ja) * 1999-07-23 2001-02-09 Fuji Electric Co Ltd 半導体装置
JP2006332291A (ja) * 2005-05-25 2006-12-07 Keihin Corp パワードライブユニット

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102024803A (zh) * 2009-09-18 2011-04-20 株式会社东芝 功率模块
CN102024803B (zh) * 2009-09-18 2013-06-19 株式会社东芝 功率模块
US8637971B2 (en) 2012-04-20 2014-01-28 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
US20100128441A1 (en) 2010-05-27
CN101681905A (zh) 2010-03-24
KR101081622B1 (ko) 2011-11-10
KR20090092318A (ko) 2009-08-31
JP5240863B2 (ja) 2013-07-17
JPWO2008142759A1 (ja) 2010-08-05
EP2149902A4 (en) 2011-11-09
EP2149902B1 (en) 2018-11-28
KR101081724B1 (ko) 2011-11-08
CN101681905B (zh) 2012-06-13
US8223496B2 (en) 2012-07-17
EP2149902A1 (en) 2010-02-03
SI2149902T1 (sl) 2019-03-29
KR20110098866A (ko) 2011-09-01

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