WO2009001748A1 - Carte de circuit imprimé flexible pour dispositif de disque dur - Google Patents

Carte de circuit imprimé flexible pour dispositif de disque dur Download PDF

Info

Publication number
WO2009001748A1
WO2009001748A1 PCT/JP2008/061221 JP2008061221W WO2009001748A1 WO 2009001748 A1 WO2009001748 A1 WO 2009001748A1 JP 2008061221 W JP2008061221 W JP 2008061221W WO 2009001748 A1 WO2009001748 A1 WO 2009001748A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible printed
hard disc
head
disc device
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/061221
Other languages
English (en)
Japanese (ja)
Inventor
Hiroyuki Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Manufacturing and Engineering Services Co Ltd
Original Assignee
International Manufacturing and Engineering Services Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Manufacturing and Engineering Services Co Ltd filed Critical International Manufacturing and Engineering Services Co Ltd
Publication of WO2009001748A1 publication Critical patent/WO2009001748A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4846—Constructional details of the electrical connection between arm and support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Moving Of Heads (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

L'invention propose une carte de circuit imprimé flexible (FPC) pour un dispositif de disque dur qui est flexible, qui rend possible un montage à densité élevée et qui élargit la bande passante de transmission. Une carte de circuit imprimé flexible connecte une tête et une carte de circuit imprimé dans le dispositif de disque dur. Dans la carte de circuit imprimé flexible, des lignes de signal d'écriture et des lignes de signal de lecture pour transmettre des signaux d'écriture/lecture mis en entrée et émis vers la tête et à partir de celle-ci sont agencées au même pas que le pas des bornes d'un connecteur de carte de circuit imprimé, au niveau d'une section de contact de substrat devant être connectée au connecteur. Les lignes menant à une section de contact de tête devant être connectée à la tête sont formées de façon linéaire parallèlement les unes aux autres.
PCT/JP2008/061221 2007-06-25 2008-06-19 Carte de circuit imprimé flexible pour dispositif de disque dur Ceased WO2009001748A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007166391A JP2009004053A (ja) 2007-06-25 2007-06-25 ハードディスク装置のフレキシブルプリント基板
JP2007-166391 2007-06-25

Publications (1)

Publication Number Publication Date
WO2009001748A1 true WO2009001748A1 (fr) 2008-12-31

Family

ID=40185566

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061221 Ceased WO2009001748A1 (fr) 2007-06-25 2008-06-19 Carte de circuit imprimé flexible pour dispositif de disque dur

Country Status (2)

Country Link
JP (1) JP2009004053A (fr)
WO (1) WO2009001748A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5134580B2 (ja) 2009-05-01 2013-01-30 日東電工株式会社 配線回路基板およびそれを備えた磁気ヘッド駆動装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188016A (ja) * 1986-02-13 1987-08-17 Yokogawa Electric Corp 磁気デイスクの配線接続装置
JPH0416696U (fr) * 1990-05-31 1992-02-12
JP2004174901A (ja) * 2002-11-27 2004-06-24 Toyo Kohan Co Ltd 基体層積層材および基体層積層材を用いた部品
JP2006040414A (ja) * 2004-07-27 2006-02-09 Nitto Denko Corp 配線回路基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188016A (ja) * 1986-02-13 1987-08-17 Yokogawa Electric Corp 磁気デイスクの配線接続装置
JPH0416696U (fr) * 1990-05-31 1992-02-12
JP2004174901A (ja) * 2002-11-27 2004-06-24 Toyo Kohan Co Ltd 基体層積層材および基体層積層材を用いた部品
JP2006040414A (ja) * 2004-07-27 2006-02-09 Nitto Denko Corp 配線回路基板

Also Published As

Publication number Publication date
JP2009004053A (ja) 2009-01-08

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