WO2009017200A1 - 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法 - Google Patents

回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法 Download PDF

Info

Publication number
WO2009017200A1
WO2009017200A1 PCT/JP2008/063781 JP2008063781W WO2009017200A1 WO 2009017200 A1 WO2009017200 A1 WO 2009017200A1 JP 2008063781 W JP2008063781 W JP 2008063781W WO 2009017200 A1 WO2009017200 A1 WO 2009017200A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
connection
connection material
circuit member
electroconductive particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063781
Other languages
English (en)
French (fr)
Inventor
Katsuhiko Tomisaka
Kouji Kobayashi
Jun Taketatsu
Motohiro Arifuku
Kazuyoshi Kojima
Nichiomi Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to US12/671,804 priority Critical patent/US20110267791A1/en
Priority to KR1020137016319A priority patent/KR20130088187A/ko
Priority to JP2009525451A priority patent/JP5316410B2/ja
Priority to KR1020107004375A priority patent/KR101302778B1/ko
Priority to EP08791996A priority patent/EP2178094A4/en
Priority to CN2008800220733A priority patent/CN101689410B/zh
Publication of WO2009017200A1 publication Critical patent/WO2009017200A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/355—Materials of die-attach connectors of outermost layers of multilayered die-attach connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

　接着剤組成物１１と導電粒子１２とを含有する回路接続材料１０であって、導電粒子１２は、核体２１上に１又は２以上の金属層２２を備えて成る、突起１４を有する導電粒子１２であり、少なくとも突起１４の表面には金属層２２が形成され、該金属層２２はニッケル又はニッケル合金から構成され、導電粒子１２の２０％圧縮時の圧縮弾性率は、１００～８００ｋｇｆ／ｍｍ２である、回路接続材料１０。
PCT/JP2008/063781 2007-08-02 2008-07-31 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法 Ceased WO2009017200A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/671,804 US20110267791A1 (en) 2007-08-02 2008-07-31 Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
KR1020137016319A KR20130088187A (ko) 2007-08-02 2008-07-31 회로 접속 재료, 그것을 이용한 회로 부재의 접속 구조체 및 회로 부재의 접속 방법
JP2009525451A JP5316410B2 (ja) 2007-08-02 2008-07-31 回路部材の接続構造
KR1020107004375A KR101302778B1 (ko) 2007-08-02 2008-07-31 회로 접속 재료, 그것을 이용한 회로 부재의 접속 구조체 및 회로 부재의 접속 방법
EP08791996A EP2178094A4 (en) 2007-08-02 2008-07-31 SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL
CN2008800220733A CN101689410B (zh) 2007-08-02 2008-07-31 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007201800 2007-08-02
JP2007-201800 2007-08-02

Publications (1)

Publication Number Publication Date
WO2009017200A1 true WO2009017200A1 (ja) 2009-02-05

Family

ID=40304428

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063781 Ceased WO2009017200A1 (ja) 2007-08-02 2008-07-31 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法

Country Status (7)

Country Link
US (1) US20110267791A1 (ja)
EP (1) EP2178094A4 (ja)
JP (2) JP5316410B2 (ja)
KR (2) KR20130088187A (ja)
CN (2) CN103484035A (ja)
TW (1) TWI396205B (ja)
WO (1) WO2009017200A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011012180A (ja) * 2009-07-02 2011-01-20 Hitachi Chem Co Ltd 回路接続材料及び回路接続構造体
WO2012137335A1 (ja) * 2011-04-07 2012-10-11 日立化成工業株式会社 回路接続材料及びその使用並びに接続構造体及びその製造方法
JP2015057757A (ja) * 2013-08-09 2015-03-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2017126463A (ja) * 2016-01-13 2017-07-20 株式会社山王 導電性微粒子及び導電性微粒子の製造方法
WO2017142086A1 (ja) * 2016-02-18 2017-08-24 積水化学工業株式会社 電気モジュール及び電気モジュールの製造方法
JP2021509526A (ja) * 2017-12-29 2021-03-25 ククド ケミカル カンパニー リミテッド 異方導電性フィルム、これを含むディスプレイ装置及び／又はこれを含む半導体装置
WO2025070422A1 (ja) * 2023-09-26 2025-04-03 株式会社レゾナック 接着剤組成物及び接続構造体

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4737177B2 (ja) * 2006-10-31 2011-07-27 日立化成工業株式会社 回路接続構造体
CN101632199B (zh) * 2007-05-15 2011-08-31 日立化成工业株式会社 电路连接材料和电路部件的连接结构
JP5293779B2 (ja) * 2010-07-20 2013-09-18 日立化成株式会社 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール
KR101151366B1 (ko) 2011-11-24 2012-06-08 한화케미칼 주식회사 도전성 입자 및 이의 제조방법
JP6044261B2 (ja) * 2012-10-22 2016-12-14 日立化成株式会社 異方導電性接着剤組成物
TWI495074B (zh) * 2012-11-30 2015-08-01 財團法人工業技術研究院 減能結構
US8815725B2 (en) 2013-01-18 2014-08-26 International Business Machines Corporation Low alpha particle emission electrically-conductive coating
KR101513642B1 (ko) * 2013-08-21 2015-04-20 엘지전자 주식회사 반도체 디바이스
US9490067B2 (en) * 2013-11-08 2016-11-08 Cooper Technologies Company Joining dissimilar materials using an epoxy resin composition
KR101388604B1 (ko) * 2013-11-25 2014-04-23 덕산하이메탈(주) 금속입자, 이를 이용하는 도전입자 및 그 제조방법
JP2016009087A (ja) * 2014-06-24 2016-01-18 セイコーエプソン株式会社 表示装置および表示装置の製造方法
KR101586340B1 (ko) * 2014-12-26 2016-01-18 주식회사 아이에스시 전기적 검사 소켓 및 전기적 검사 소켓용 도전성 입자의 제조방법
US20160343684A1 (en) * 2015-05-18 2016-11-24 Innovative Micro Technology Thermocompression bonding with raised feature
DE102015016702A1 (de) * 2015-12-22 2017-06-22 Man Truck & Bus Ag Partikelteilchen aufweisendes Klebemittel zur Verbindung zweier Fahrzeugteile
CN110546222A (zh) * 2017-04-28 2019-12-06 日立化成株式会社 粘接剂组合物及连接体的制造方法
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
KR20210033513A (ko) * 2018-10-03 2021-03-26 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 구조체, 접속 구조체의 제조 방법
CN113728402B (zh) * 2019-05-01 2024-01-09 迪睿合株式会社 连接结构体、连接结构体的制造方法、连接材料和被覆导电颗粒
CN115548204A (zh) * 2021-06-29 2022-12-30 成都辰显光电有限公司 显示面板和显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195339A (ja) * 1998-12-25 2000-07-14 Sony Chem Corp 異方導電性接着フィルム
JP2004164874A (ja) * 2002-11-08 2004-06-10 Osugi Kk 異方性導電接着剤用導電微粒子
JP2005166438A (ja) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd 回路接続材料、及びこれを用いた回路部材の接続構造
JP2005327509A (ja) * 2004-05-12 2005-11-24 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006107881A (ja) * 2004-10-04 2006-04-20 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006196411A (ja) * 2005-01-17 2006-07-27 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
WO2007058159A1 (ja) * 2005-11-18 2007-05-24 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3696429B2 (ja) * 1999-02-22 2005-09-21 日本化学工業株式会社 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP2004155957A (ja) * 2002-11-07 2004-06-03 Three M Innovative Properties Co 異方導電性接着剤及びフィルム
WO2005002002A1 (ja) * 2003-06-25 2005-01-06 Hitachi Chemical Co., Ltd. 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP4282417B2 (ja) * 2003-09-12 2009-06-24 ソニーケミカル＆インフォメーションデバイス株式会社 接続構造体
US20100025089A1 (en) * 2004-01-07 2010-02-04 Jun Taketatsu Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
KR101131229B1 (ko) * 2004-01-30 2012-03-28 세키스이가가쿠 고교가부시키가이샤 도전성 미립자 및 이방성 도전 재료
JP2005327510A (ja) * 2004-05-12 2005-11-24 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006339160A (ja) * 2006-06-02 2006-12-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195339A (ja) * 1998-12-25 2000-07-14 Sony Chem Corp 異方導電性接着フィルム
JP2004164874A (ja) * 2002-11-08 2004-06-10 Osugi Kk 異方性導電接着剤用導電微粒子
JP2005166438A (ja) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd 回路接続材料、及びこれを用いた回路部材の接続構造
JP2005327509A (ja) * 2004-05-12 2005-11-24 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006107881A (ja) * 2004-10-04 2006-04-20 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006196411A (ja) * 2005-01-17 2006-07-27 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
WO2007058159A1 (ja) * 2005-11-18 2007-05-24 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2178094A4 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011012180A (ja) * 2009-07-02 2011-01-20 Hitachi Chem Co Ltd 回路接続材料及び回路接続構造体
WO2012137335A1 (ja) * 2011-04-07 2012-10-11 日立化成工業株式会社 回路接続材料及びその使用並びに接続構造体及びその製造方法
JP2015057757A (ja) * 2013-08-09 2015-03-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2017126463A (ja) * 2016-01-13 2017-07-20 株式会社山王 導電性微粒子及び導電性微粒子の製造方法
WO2017122423A1 (ja) * 2016-01-13 2017-07-20 株式会社山王 導電性微粒子及び導電性微粒子の製造方法
WO2017142086A1 (ja) * 2016-02-18 2017-08-24 積水化学工業株式会社 電気モジュール及び電気モジュールの製造方法
CN108475583A (zh) * 2016-02-18 2018-08-31 积水化学工业株式会社 电组件及电组件的制造方法
JPWO2017142086A1 (ja) * 2016-02-18 2018-12-06 積水化学工業株式会社 電気モジュール及び電気モジュールの製造方法
JP2021509526A (ja) * 2017-12-29 2021-03-25 ククド ケミカル カンパニー リミテッド 異方導電性フィルム、これを含むディスプレイ装置及び／又はこれを含む半導体装置
WO2025070422A1 (ja) * 2023-09-26 2025-04-03 株式会社レゾナック 接着剤組成物及び接続構造体

Also Published As

Publication number Publication date
KR20130088187A (ko) 2013-08-07
JPWO2009017200A1 (ja) 2010-10-21
CN103484035A (zh) 2014-01-01
KR101302778B1 (ko) 2013-09-02
TW200929266A (en) 2009-07-01
EP2178094A1 (en) 2010-04-21
EP2178094A4 (en) 2013-02-20
JP5316410B2 (ja) 2013-10-16
JP2013209648A (ja) 2013-10-10
TWI396205B (zh) 2013-05-11
KR20100039894A (ko) 2010-04-16
CN101689410B (zh) 2013-10-16
CN101689410A (zh) 2010-03-31
US20110267791A1 (en) 2011-11-03

Similar Documents

Publication Publication Date Title
WO2009017200A1 (ja) 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法
WO2009063827A1 (ja) 回路接続材料、及び回路部材の接続構造
WO2009057707A1 (ja) 電子部品用Ｓｎめっき材
TW200725646A (en) Conductive particles for anisotropic conductive interconnection
WO2008140094A1 (ja) 回路接続材料及び回路部材の接続構造
TW200505312A (en) Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
EP2257141A3 (en) Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member
WO2005010598A3 (en) Electro-optic displays
WO2007024837A3 (en) Fluoropolymer-glass fabric for circuit substrates
MY158913A (en) Material for electric contact and method of producing the same
WO2005100021A3 (fr) Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
WO2009005042A1 (ja) 金属材料、その製造方法、及びそれを用いた電気電子部品
EP1926211A3 (en) Diamond enhanced thickness shear mode resonator
EP2043169A3 (en) Thermoelectric module substrate and thermoelectric module using such substrate
WO2006138110A3 (en) Controlled electrochemical polishing method
ATE476533T1 (de) Verbundwerkstoffe aus metallischem massivglas und graphit
TW200734429A (en) Isotropically conductive adhesive sheet and circuit board
WO2008005820A3 (en) Piezoelectric composite based on flexoelectric charge separation
WO2010049771A3 (de) Verbundmaterial, verfahren zum herstellen eines verbundmaterials sowie kleber oder bondmaterial
WO2009115192A3 (en) Ni-p layer system and process for its preparation
UA97799C2 (ru) ЗАЩИЩЕННЫЙ ПРОТИВ КОРРОЗИИ КОМПОНЕНТ из композитного материала с КЕРАМИЧЕСКОЙ матрицей, содержащий КРЕМНИЙ
WO2009078409A1 (ja) 回路接続材料及び回路部材の接続構造
WO2007140766A3 (de) Verfahren zum anordnen einer pulverschicht auf einem substrat sowie schichtaufbau mit mindestens einer pulverschicht auf einem substrat
WO2008146885A1 (ja) 電気電子部品用金属材料
WO2009008383A1 (ja) 導電性微粒子、異方性導電材料及び接続構造体

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880022073.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08791996

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009525451

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008791996

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20107004375

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12671804

Country of ref document: US