WO2009057018A3 - Rf-ic packaging method and circuits obtained thereby - Google Patents

Rf-ic packaging method and circuits obtained thereby Download PDF

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Publication number
WO2009057018A3
WO2009057018A3 PCT/IB2008/054374 IB2008054374W WO2009057018A3 WO 2009057018 A3 WO2009057018 A3 WO 2009057018A3 IB 2008054374 W IB2008054374 W IB 2008054374W WO 2009057018 A3 WO2009057018 A3 WO 2009057018A3
Authority
WO
WIPO (PCT)
Prior art keywords
inductors
packaging method
chips
circuits
circuits obtained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2008/054374
Other languages
French (fr)
Other versions
WO2009057018A2 (en
Inventor
Lukas Frederik Tiemeijer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
NXP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP BV filed Critical NXP BV
Priority to CN200880113803A priority Critical patent/CN101842895A/en
Priority to US12/739,380 priority patent/US20100224958A1/en
Priority to EP08845585A priority patent/EP2206148A2/en
Publication of WO2009057018A2 publication Critical patent/WO2009057018A2/en
Publication of WO2009057018A3 publication Critical patent/WO2009057018A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/008—Electric or magnetic shielding of printed inductances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

Typically, chips nowadays comprise a number of circuits as well as a number of inductors, often RF-inductors. These IC inductors are essential to realize the voltage controlled oscillators needed in the many fully integrated transceiver chips, serving a multitude of wireless communication protocols, that are provided to the market today. The present invention relates to an RF-IC packaging method, which virtually eliminates the long-range electromagnetic crosstalk between inductors and transmission lines of different parts of the circuitry.
PCT/IB2008/054374 2007-10-30 2008-10-23 Rf-ic packaging method and circuits obtained thereby Ceased WO2009057018A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880113803A CN101842895A (en) 2007-10-30 2008-10-23 RF-IC packaging method and circuits obtained thereby
US12/739,380 US20100224958A1 (en) 2007-10-30 2008-10-23 Rf-ic packaging method and circuits obtained thereby
EP08845585A EP2206148A2 (en) 2007-10-30 2008-10-23 Rf-ic packaging method and circuits obtained thereby

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07119575 2007-10-30
EP07119575.4 2007-10-30

Publications (2)

Publication Number Publication Date
WO2009057018A2 WO2009057018A2 (en) 2009-05-07
WO2009057018A3 true WO2009057018A3 (en) 2009-07-09

Family

ID=40527564

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/054374 Ceased WO2009057018A2 (en) 2007-10-30 2008-10-23 Rf-ic packaging method and circuits obtained thereby

Country Status (4)

Country Link
US (1) US20100224958A1 (en)
EP (1) EP2206148A2 (en)
CN (1) CN101842895A (en)
WO (1) WO2009057018A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5045727B2 (en) 2009-10-21 2012-10-10 ソニー株式会社 High frequency module and receiver
US9219298B2 (en) 2013-03-15 2015-12-22 International Business Machines Corporation Removal of spurious microwave modes via flip-chip crossover
US9520547B2 (en) 2013-03-15 2016-12-13 International Business Machines Corporation Chip mode isolation and cross-talk reduction through buried metal layers and through-vias
US9342710B2 (en) 2013-11-21 2016-05-17 Nxp B.V. Electronic tamper detection
CN105099005B (en) * 2015-08-16 2017-11-24 中国科学院电工研究所 A kind of magnetic field shielding device of wireless energy transfer system
US20240006466A1 (en) * 2022-06-30 2024-01-04 Texas Instruments Incorporated Shielding integrated inductors

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998050956A1 (en) * 1997-05-02 1998-11-12 The Board Of Trustees Of The Leland Stanford Junior University Patterned ground shields for integrated circuit inductors
US20030202331A1 (en) * 2002-04-24 2003-10-30 Darryl Jessie Integrated circuit with low-loss primary conductor strapped by lossy secondary conductor
US20050275061A1 (en) * 2004-06-11 2005-12-15 Kabushiki Kaisha Toshiba Semiconductor device having inductor
WO2006105184A1 (en) * 2005-03-30 2006-10-05 Silicon Laboratories Inc. Magnetically differential inductors and associated methods

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6635949B2 (en) * 2002-01-04 2003-10-21 Intersil Americas Inc. Symmetric inducting device for an integrated circuit having a ground shield
US7262680B2 (en) * 2004-02-27 2007-08-28 Illinois Institute Of Technology Compact inductor with stacked via magnetic cores for integrated circuits
DE102004022139B4 (en) * 2004-05-05 2007-10-18 Atmel Germany Gmbh A method for producing a spiral inductance on a substrate and a device produced by such a method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998050956A1 (en) * 1997-05-02 1998-11-12 The Board Of Trustees Of The Leland Stanford Junior University Patterned ground shields for integrated circuit inductors
US20030202331A1 (en) * 2002-04-24 2003-10-30 Darryl Jessie Integrated circuit with low-loss primary conductor strapped by lossy secondary conductor
US20050275061A1 (en) * 2004-06-11 2005-12-15 Kabushiki Kaisha Toshiba Semiconductor device having inductor
WO2006105184A1 (en) * 2005-03-30 2006-10-05 Silicon Laboratories Inc. Magnetically differential inductors and associated methods

Also Published As

Publication number Publication date
US20100224958A1 (en) 2010-09-09
WO2009057018A2 (en) 2009-05-07
CN101842895A (en) 2010-09-22
EP2206148A2 (en) 2010-07-14

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