WO2009093176A3 - Clean and hermetic sealing of a package cavity - Google Patents

Clean and hermetic sealing of a package cavity Download PDF

Info

Publication number
WO2009093176A3
WO2009093176A3 PCT/IB2009/050207 IB2009050207W WO2009093176A3 WO 2009093176 A3 WO2009093176 A3 WO 2009093176A3 IB 2009050207 W IB2009050207 W IB 2009050207W WO 2009093176 A3 WO2009093176 A3 WO 2009093176A3
Authority
WO
WIPO (PCT)
Prior art keywords
ring
cavity
bonding
bonding material
gaseous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2009/050207
Other languages
French (fr)
Other versions
WO2009093176A2 (en
Inventor
Eric Cadalen
Stephane Bellenger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
NXP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP BV filed Critical NXP BV
Priority to CN2009801025272A priority Critical patent/CN101918304A/en
Priority to EP09703642A priority patent/EP2244968A2/en
Publication of WO2009093176A2 publication Critical patent/WO2009093176A2/en
Publication of WO2009093176A3 publication Critical patent/WO2009093176A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The present invention relates to a method for sealing a package cavity. A first ring of first bonding material is deposited onto the surface of a first component. The first ring has a predetermined shape outlining a circumference of the cavity and a predetermined thickness. A second ring of second bonding material is deposited onto the surface of a second component. The second ring has a predetermined shape corresponding to the shape of the first ring and a predetermined thickness. The second ring further comprises a predetermined raised pattern such that an exchange of gaseous material between an atmosphere inside the cavity and an atmosphere outside the cavity is enabled prior to reflow of the second bonding material. A gaseous desoxydizing material is provided during temporary bonding of the first and the second ring. The gaseous desoxydizing material is then substantially removed inside and outside the cavity prior to reflowing of the second bonding material for bonding with the first bonding material.
PCT/IB2009/050207 2008-01-21 2009-01-21 Clean and hermetic sealing of a package cavity Ceased WO2009093176A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009801025272A CN101918304A (en) 2008-01-21 2009-01-21 Cleaning and sealing of package cavities
EP09703642A EP2244968A2 (en) 2008-01-21 2009-01-21 Clean and hermetic sealing of a package cavity

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08290045.7 2008-01-21
EP08290045 2008-01-21

Publications (2)

Publication Number Publication Date
WO2009093176A2 WO2009093176A2 (en) 2009-07-30
WO2009093176A3 true WO2009093176A3 (en) 2010-02-25

Family

ID=40901492

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2009/050207 Ceased WO2009093176A2 (en) 2008-01-21 2009-01-21 Clean and hermetic sealing of a package cavity

Country Status (3)

Country Link
EP (1) EP2244968A2 (en)
CN (1) CN101918304A (en)
WO (1) WO2009093176A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105197872A (en) * 2014-05-29 2015-12-30 上海矽睿科技有限公司 Al-Ge eutectic bonding pretreatment method and bonding method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0951068A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
US6036872A (en) * 1998-03-31 2000-03-14 Honeywell Inc. Method for making a wafer-pair having sealed chambers
US20060208326A1 (en) * 2005-03-18 2006-09-21 Nasiri Steven S Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom
WO2007119206A2 (en) * 2006-04-13 2007-10-25 Nxp B.V. A method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6036872A (en) * 1998-03-31 2000-03-14 Honeywell Inc. Method for making a wafer-pair having sealed chambers
EP0951068A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
US20060208326A1 (en) * 2005-03-18 2006-09-21 Nasiri Steven S Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom
WO2007119206A2 (en) * 2006-04-13 2007-10-25 Nxp B.V. A method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate

Also Published As

Publication number Publication date
WO2009093176A2 (en) 2009-07-30
EP2244968A2 (en) 2010-11-03
CN101918304A (en) 2010-12-15

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