WO2009103706A3 - Method of thermocleaving a polymer layer - Google Patents
Method of thermocleaving a polymer layer Download PDFInfo
- Publication number
- WO2009103706A3 WO2009103706A3 PCT/EP2009/051866 EP2009051866W WO2009103706A3 WO 2009103706 A3 WO2009103706 A3 WO 2009103706A3 EP 2009051866 W EP2009051866 W EP 2009051866W WO 2009103706 A3 WO2009103706 A3 WO 2009103706A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polymer layer
- thermocleavable
- polymer
- thermocleaving
- heat sensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
- C08G61/126—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic materials
- B23K2103/42—Plastics other than composite materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/36—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used using a polymeric layer, which may be particulate and which is deformed or structurally changed with modification of its' properties, e.g. of its' optical hydrophobic-hydrophilic, solubility or permeability properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/10—Definition of the polymer structure
- C08G2261/12—Copolymers
- C08G2261/124—Copolymers alternating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/10—Definition of the polymer structure
- C08G2261/14—Side-groups
- C08G2261/142—Side-chains containing oxygen
- C08G2261/1426—Side-chains containing oxygen containing carboxy groups (COOH) and/or -C(=O)O-moieties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
- C08G2261/322—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed
- C08G2261/3223—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed containing one or more sulfur atoms as the only heteroatom, e.g. thiophene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
- C08G2261/324—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain condensed
- C08G2261/3246—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain condensed containing nitrogen and sulfur as heteroatoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/36—Oligomers, i.e. comprising up to 10 repeat units
- C08G2261/364—Oligomers, i.e. comprising up to 10 repeat units containing hetero atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/70—Post-treatment
- C08G2261/80—Functional group cleavage, e.g. removal of side-chains or protective groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/90—Applications
- C08G2261/92—TFT applications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/50—Photovoltaic [PV] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/114—Poly-phenylenevinylene; Derivatives thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
A method of thermocleaving a thermocleavable polymer layer which is in thermal contact with a heat sensitive component that is not tolerant of the temperature required for thermocleavage of the thermocleavable polymer layer, in which the thermocleavable polymer layer is illuminated with a light source having a wavelength range more strongly absorbed by the thermocleavable polymer and substantially less strongly absorbed by the heat sensitive component, such that the thermocleavable polymer layer reaches a temperature sufficient to cause thermocleavage of the polymer without causing detrimental heating to the heat sensitive component. Further provided is apparatus for carrying out the above method.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09713300A EP2254727A2 (en) | 2008-02-18 | 2009-02-17 | Method of thermocleaving a polymer layer |
| US12/918,296 US20110045628A1 (en) | 2008-02-18 | 2009-02-17 | Method of thermocleaving a polymer layer |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0802934.0A GB0802934D0 (en) | 2008-02-18 | 2008-02-18 | Air stable photovoltaic device |
| GB0802934.0 | 2008-02-18 | ||
| GB0807211.8 | 2008-04-21 | ||
| GBGB0807211.8A GB0807211D0 (en) | 2008-04-21 | 2008-04-21 | Photvolotaic device |
| GB0810379A GB0810379D0 (en) | 2008-06-06 | 2008-06-06 | method of thermocleaving a polymer layer |
| GB0810379.8 | 2008-06-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2009103706A2 WO2009103706A2 (en) | 2009-08-27 |
| WO2009103706A3 true WO2009103706A3 (en) | 2009-10-29 |
Family
ID=40627355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2009/051866 Ceased WO2009103706A2 (en) | 2008-02-18 | 2009-02-17 | Method of thermocleaving a polymer layer |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20110045628A1 (en) |
| EP (1) | EP2254727A2 (en) |
| WO (1) | WO2009103706A2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102884068A (en) * | 2010-03-15 | 2013-01-16 | 国立大学法人广岛大学 | Thienopyridine derivative, method for producing same and organic semiconductor device using same |
| WO2012041845A1 (en) | 2010-09-27 | 2012-04-05 | The Technical University Of Denmark | Method of making optoelectric devices |
| EP2621599A1 (en) | 2010-09-27 | 2013-08-07 | The Technical University of Denmark | Improved electron transport layer |
| WO2012041853A2 (en) | 2010-09-27 | 2012-04-05 | The Technical University Of Denmark | Improved adhesion of metal oxide layer |
| JP6576955B2 (en) * | 2014-02-20 | 2019-09-18 | イノベーションラブ、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングInnovationlab Gmbh | Conjugated polymer |
| EP3238284B1 (en) * | 2014-12-23 | 2021-10-06 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO | Method of making an array of interconnected solar cells |
| US10443941B2 (en) * | 2015-05-20 | 2019-10-15 | Illinois Tool Works Inc. | Light annealing in a cooling chamber of a firing furnace |
| EP3151297A1 (en) | 2015-09-30 | 2017-04-05 | InnovationLab GmbH | Conjugated polymers with thermally splittable oxalate side groups |
| KR102591880B1 (en) * | 2015-12-18 | 2023-10-24 | 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | Manufacturing method of solar cell |
| JP2024505385A (en) * | 2021-01-13 | 2024-02-06 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | Conductive polymers and electrode processing useful for lithium batteries |
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| US5663037A (en) * | 1994-03-14 | 1997-09-02 | Eastman Kodak Company | Radiation-sensitive composition containing a resole resin, a novolac resin an infrared absorber and a triazine and use thereof in lithographic printing plates |
| US20020144991A1 (en) * | 2001-04-04 | 2002-10-10 | Howard A. Fromson | Method and apparatus for heating printing plates |
| EP1273971A2 (en) * | 2001-07-05 | 2003-01-08 | Fuji Photo Film Co., Ltd. | Process for photopolymerization by exposure of a photosensitive lithographic printing plate |
| WO2005052694A2 (en) * | 2003-10-31 | 2005-06-09 | Heights (Uk) Limited | Improvements in and relating to printing plate ovens |
| WO2005057625A2 (en) * | 2003-12-04 | 2005-06-23 | Matsushita Electric Industrial Co., Ltd. | Method of differentially patterning layers of organic thin film material without damaging underlying layers |
| US20060019191A1 (en) * | 2002-10-15 | 2006-01-26 | Agfa-Gevaert | Polymer for heat-sensitive lithographic printing plate precursor |
| GB2424512A (en) * | 2005-03-22 | 2006-09-27 | Riso Nat Lab | Method of forming photovoltaic device |
| EP1859955A1 (en) * | 2005-03-14 | 2007-11-28 | Konica Minolta Medical & Graphic, Inc. | Lithographic printing plate making method and image exposing system |
| EP1887423A1 (en) * | 2006-08-11 | 2008-02-13 | FUJIFILM Corporation | Laser-decomposable resin composition and pattern-forming material using the same |
| EP1939687A2 (en) * | 2006-12-26 | 2008-07-02 | FUJIFILM Corporation | Polymerizable composition, lithographic printing plate precursor and lithographic printing method |
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| GB0802934D0 (en) * | 2008-02-18 | 2008-03-26 | Univ Denmark Tech Dtu | Air stable photovoltaic device |
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2009
- 2009-02-17 US US12/918,296 patent/US20110045628A1/en not_active Abandoned
- 2009-02-17 EP EP09713300A patent/EP2254727A2/en not_active Withdrawn
- 2009-02-17 WO PCT/EP2009/051866 patent/WO2009103706A2/en not_active Ceased
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| US5663037A (en) * | 1994-03-14 | 1997-09-02 | Eastman Kodak Company | Radiation-sensitive composition containing a resole resin, a novolac resin an infrared absorber and a triazine and use thereof in lithographic printing plates |
| US5506085A (en) * | 1994-10-13 | 1996-04-09 | Agfa-Gevaert N.V. | Thermal imaging element |
| US20020144991A1 (en) * | 2001-04-04 | 2002-10-10 | Howard A. Fromson | Method and apparatus for heating printing plates |
| EP1273971A2 (en) * | 2001-07-05 | 2003-01-08 | Fuji Photo Film Co., Ltd. | Process for photopolymerization by exposure of a photosensitive lithographic printing plate |
| US20060019191A1 (en) * | 2002-10-15 | 2006-01-26 | Agfa-Gevaert | Polymer for heat-sensitive lithographic printing plate precursor |
| WO2005052694A2 (en) * | 2003-10-31 | 2005-06-09 | Heights (Uk) Limited | Improvements in and relating to printing plate ovens |
| WO2005057625A2 (en) * | 2003-12-04 | 2005-06-23 | Matsushita Electric Industrial Co., Ltd. | Method of differentially patterning layers of organic thin film material without damaging underlying layers |
| EP1859955A1 (en) * | 2005-03-14 | 2007-11-28 | Konica Minolta Medical & Graphic, Inc. | Lithographic printing plate making method and image exposing system |
| GB2424512A (en) * | 2005-03-22 | 2006-09-27 | Riso Nat Lab | Method of forming photovoltaic device |
| EP1887423A1 (en) * | 2006-08-11 | 2008-02-13 | FUJIFILM Corporation | Laser-decomposable resin composition and pattern-forming material using the same |
| EP1939687A2 (en) * | 2006-12-26 | 2008-07-02 | FUJIFILM Corporation | Polymerizable composition, lithographic printing plate precursor and lithographic printing method |
Non-Patent Citations (5)
| Title |
|---|
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| KREBS, F.C.: "Design and applications of polymer solar cells with lifetimes longer than 10000 hours", PROCEEDINGS OF SPIE, vol. 5938, 4 August 2005 (2005-08-04), pages 1 - 11, XP002522599 * |
| ROTH H-K ET AL: "Laser-induced electrical conductivity in poly(bis-alkylthio-acetylene) and its applications", SYNTHETIC METALS, ELSEVIER SEQUOIA, LAUSANNE, CH, vol. 41, no. 1-2, 30 April 1991 (1991-04-30), pages 141 - 144, XP024170462, ISSN: 0379-6779, [retrieved on 19910430] * |
| VAN DYKE L S ET AL: "UV laser ablation of electronically conductive polymers", SYNTHETIC METALS, ELSEVIER SEQUOIA, LAUSANNE, CH, vol. 52, no. 3, 15 October 1992 (1992-10-15), pages 299 - 304, XP024171427, ISSN: 0379-6779, [retrieved on 19921015] * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110045628A1 (en) | 2011-02-24 |
| EP2254727A2 (en) | 2010-12-01 |
| WO2009103706A2 (en) | 2009-08-27 |
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