WO2010034239A1 - Electronic device and method of forming the same - Google Patents

Electronic device and method of forming the same Download PDF

Info

Publication number
WO2010034239A1
WO2010034239A1 PCT/CN2009/074165 CN2009074165W WO2010034239A1 WO 2010034239 A1 WO2010034239 A1 WO 2010034239A1 CN 2009074165 W CN2009074165 W CN 2009074165W WO 2010034239 A1 WO2010034239 A1 WO 2010034239A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal piece
piece
plastic
electronic device
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2009/074165
Other languages
French (fr)
Inventor
Guowen Wang
Jiali Deng
Junjie Yuan
Mingyu Li
Dou LI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BYD Co Ltd
Original Assignee
BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Priority to EP09815608A priority Critical patent/EP2326480A4/en
Priority to US13/062,101 priority patent/US20110165366A1/en
Publication of WO2010034239A1 publication Critical patent/WO2010034239A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B29K2705/02—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2715/00—Condition, form or state of preformed parts, e.g. inserts
    • B29K2715/006—Glues or adhesives, e.g. hot melts or thermofusible adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing

Definitions

  • the present invention relates to the field of electronic device, especially to an improvement of an electronic device and a method of forming the same.
  • Electronic device needs an excellent design as well as acceptable quality. It becomes more and more light and thin whereas apt to be fractured. Therefore, material with high strength and moderate plasticity is selected to manufacture the electronic devices. And if the structure of material is not strong enough, metal pieces are usually used to enhance the strength, such as insert molding with metal pieces or assembly metal pieces.
  • the method of prior art is Metal Adhesion Molding (MAM).
  • MAM Metal Adhesion Molding
  • the metal pieces are taken in mold and molded with the plastic directly.
  • This method need no buckling or other processing and has no more demands on the metal, which is simple and could reduce the production cost. But because of no buckling, the bonding force between metal surface and the plastic surface is not strong enough. Even if the metal is processed with texture, the result of dropping and pulling test are not satisfying. If a part of the metal piece is embedded into the plastic to enhance the bonding force, the structure of metal will be complicated, and the shape of electronic device will be hard to design.
  • the present invention is directed to solve at least one of the problems existing in the prior art. Accordingly, a method of forming an electronic device having a metal piece and a plastic piece adhered to the metal piece is needed, which may enhance the bonding force between the metal piece and the plastic piece with low cost. Accordingly, an electronic device manufactured therefrom is also needed.
  • a method of forming an electronic device having a metal piece and a plastic piece adhered to the metal piece is provided.
  • the method may comprise the steps of: forming an adhering part on a surface of the metal piece which at least partially covers the surface thereof; and forming the plastic piece by injection molding using plastic material which is adhered to the metal piece with the adhering part being connected between the plastic piece and the metal piece.
  • a method of forming an electronic device having a metal piece and a plastic piece adhered to the metal piece comprising the following steps: forming a texture on a surface of the metal piece; preheating the metal piece; forming an adhering part on the surface of the metal piece where the texture is formed, which at least partially covers the surface thereof; and forming the plastic piece by injection molding using plastic material which is attached to the metal piece with the adhering part being connected between the plastic piece and the metal piece.
  • an electronic device formed by the method mentioned above is provided accordingly.
  • Fig. 1 is a partial cross-sectional view of an electronic device during molding according to an embodiment of the present invention.
  • the method may comprise the steps of: adhering part on a surface of the metal piece 1 which at least partially covers the surface thereof; and forming the plastic piece 3 by injection molding using plastic material which is adhered to the metal piece 1 with the adhering part being connected between the plastic piece 3 and the metal piece 1.
  • the metal piece 1 may be configured as a metal shell for the electronic device.
  • the types of plastic piece 3 may include, without limitation to, polycarbonate (PC), polymethylmethacrylate (PMMA), or mixture thereof.
  • the weight average molecular weight of PC was about 20000-60000, and the weight average molecular weight of PMMA was about 20000-200000.
  • the types of metal piece 1 may include, without limitation to, iron, aluminum, aluminum alloy, copper, and stainless steel. The structure of the metal piece is designed according the device.
  • the adhering part 2 is used to attach the metal piece 1 to the plastic piece 3.
  • the thickness of the adhering part is determined by the dimension of the device. In an embodiment of the invention, it is about 0.10 - 0.15 mm.
  • the adhering part is formed by thermoplastic adhesive.
  • the thermoplastic adhesive is a no solvent solid meltable polymer without any water component. It is presented in a solid state at room temperature, and it may be transformed into a viscous liquid while heating at a given temperature.
  • the thermoplastic adhesive comprises base-resin, tackifier, viscosity modifier and antioxidant. To avoid the over-melt of adhesive spilled while molding, the thermoplastic adhesive has a certain thermal resistance.
  • the thermal resistant temperature of thermoplastic adhesive is more than 220 0 C.
  • the process of forming an adhering part 2 on the surface of metal pieces 1 is not limited in the present invention.
  • the metal piece 1 is preheated to the temperature of about 100 0 C- 150 0 C, then the thermoplastic adhesive is laminated to the metal piece by a laminated roller so that the thermoplastic adhesive on the surface of metal piece is molten and bonded on the metal piece firmly.
  • the laminating time is about 3 - 7 seconds. According to an embodiment of the invention, it is about 6 seconds.
  • the injection process of injection molding is not limited in the present invention.
  • the metal piece 1 is put into the mold and the plastic material is injected then.
  • the high temperature and high pressure injection molding is used to enhance the bonding force therebetween during which the high temperature is favorable for melting, and the high pressure is favorable for bonding.
  • the temperature may be about 250 0 C - 300 0 C and the pressure may be about 1250 - 1350 kg/cm 2 .
  • the method further comprises forming texture on the surface of metal piece 1.
  • the process of texture is not limited in the present invention, it aims to increase the roughness and enhance bonding force.
  • An aluminum alloy plate piece having a size of 100x200x2mm and a plastic piece are molded as following: A texture on a surface of aluminum alloy plate is formed. After the aluminum alloy plate is preheated to a temperature of 120 0 C, the thermoplastic adhesive (615ST/3M Co.) having a thickness of 0.12mm is laminated on the aluminum alloy plate for 6 seconds. The aluminum alloy plate is put in the mold and the plastic material is injected on the aluminum alloy plate at the temperature of 280 0 C under the pressure of 1350 kg/cm 2 . After curing, the electronic device is obtained which may be labeled as A.
  • An aluminum alloy plate having a size of 50x50x2mm and a plastic piece are molded as following:
  • a texture on a surface of the aluminum alloy plate is formed.
  • the thermoplastic adhesive (615ST/3M Co.) having a thickness of 0.10mm is laminated on the aluminum alloy plate for 6 seconds.
  • the aluminum alloy plate is put into the mold and the plastic material is injected on the aluminum alloy plate at a temperature of 280 0 C under a pressure of 1250 kg/cm 2 .
  • the electronic device is obtained which may be labeled as B.
  • THIRD EMBODIMENT An aluminum alloy plate having a size of 100xl00x2mm and a plastic piece are molding as following steps:
  • a texture on a surface of the aluminum alloy plate is formed.
  • the thermoplastic adhesive (615ST/3M Co.) having a thickness of 0.12mm is laminated on the aluminum alloy plate for 6 seconds.
  • the aluminum alloy plate is put into the mold and the plastic material is injected on the aluminum alloy plate at a temperature of 285°C under a pressure of 1350 kg/cm 2 .
  • the electronic device is obtained which may be labeled as C.
  • An aluminum alloy plate having a size of 100xl00x2mm and a plastic piece are molding as following:
  • a texture on a surface of the aluminum alloy plate is formed.
  • the thermoplastic adhesive (615ST/3M Co.) having a thickness of 0.12mm is laminated on the aluminum alloy plate for 6 seconds.
  • the aluminum alloy plate is put into the mold and the plastic material is injected on the aluminum alloy plate at a temperature of
  • the electronic device is obtained which may be labeled as D.
  • An aluminum alloy plate having a size of 100xl00x2mm and a plastic piece are molding as following steps: The aluminum alloy plate is put into the mold and the plastic material is injected on the aluminum alloy plate at a temperature of 295°C under a pressure of 1350 kg/cm 2 . After curing, the electronic device is obtained which may be labeled as E.
  • the pulling force test machine is used to peel the metal piece and the plastic piece of the electronic devices A-E respectively, with the peeling force being shown in Table 1.
  • the method provided by the embodiments of present invention can enhance the bonding force between the metal piece 1 and the plastic piece 3. And the service time of the electronic device is extended accordingly.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention discloses a method of forming an electronic device having a metal piece and a plastic piece adhered to the metal piece and an electronic device formed therefrom. The method comprises the following steps: An adhering part on a surface of the metal piece is formed which at least partially covers the surface thereof. The plastic piece is formed by injection molding using plastic material which is adhered to the metal piece with the adhering part being connected between the plastic piece and the metal piece. According to the method of the present invention, the bonding force between the metal piece and the plastic piece is improved accordingly, and the service time of the electronic device is extended accordingly.

Description

ELECTRONIC DEVICE AND METHOD OF FORMING THE
SAME
CROSS-REFERENCE TO RELATED APPLICATION This application claims priority and benefit to Chinese Patent Application No.
200810216557.3, filed September 25, 2008.
FIELD OF THE INVENTION
The present invention relates to the field of electronic device, especially to an improvement of an electronic device and a method of forming the same.
BACKGROUND OF THE INVENTION
Electronic device needs an excellent design as well as acceptable quality. It becomes more and more light and thin whereas apt to be fractured. Therefore, material with high strength and moderate plasticity is selected to manufacture the electronic devices. And if the structure of material is not strong enough, metal pieces are usually used to enhance the strength, such as insert molding with metal pieces or assembly metal pieces.
For the inlaying of large-area metal, it often needs special processes for slotting or buckling. The processes are complicated, and their yield rate is low. These cause a high cost. Moreover, because of the small bonding force between metal and plastic, there are too many limitations to design and material selection.
The method of prior art is Metal Adhesion Molding (MAM). The metal pieces are taken in mold and molded with the plastic directly. This method need no buckling or other processing and has no more demands on the metal, which is simple and could reduce the production cost. But because of no buckling, the bonding force between metal surface and the plastic surface is not strong enough. Even if the metal is processed with texture, the result of dropping and pulling test are not satisfying. If a part of the metal piece is embedded into the plastic to enhance the bonding force, the structure of metal will be complicated, and the shape of electronic device will be hard to design.
SUMMARY OF THE INVENTION In viewing thereof, the present invention is directed to solve at least one of the problems existing in the prior art. Accordingly, a method of forming an electronic device having a metal piece and a plastic piece adhered to the metal piece is needed, which may enhance the bonding force between the metal piece and the plastic piece with low cost. Accordingly, an electronic device manufactured therefrom is also needed.
According to an embodiment of the present invention, a method of forming an electronic device having a metal piece and a plastic piece adhered to the metal piece is provided. The method may comprise the steps of: forming an adhering part on a surface of the metal piece which at least partially covers the surface thereof; and forming the plastic piece by injection molding using plastic material which is adhered to the metal piece with the adhering part being connected between the plastic piece and the metal piece.
According to another embodiment of the present invention, a method of forming an electronic device having a metal piece and a plastic piece adhered to the metal piece is provided, comprising the following steps: forming a texture on a surface of the metal piece; preheating the metal piece; forming an adhering part on the surface of the metal piece where the texture is formed, which at least partially covers the surface thereof; and forming the plastic piece by injection molding using plastic material which is attached to the metal piece with the adhering part being connected between the plastic piece and the metal piece.
According to still another embodiment of the invention, an electronic device formed by the method mentioned above is provided accordingly. BRIEF DESCRIPTION OF THE DRAWINGS
These and other aspects and advantages of the invention will become apparent and more readily appreciated from the following descriptions taken in conjunction with the drawings in which: Fig. 1 is a partial cross-sectional view of an electronic device during molding according to an embodiment of the present invention.
DETAILED DESCRIPTION OF EMBODIMENTS
Reference will be made in detail to embodiments of the present invention. The embodiments described herein with reference to drawings are explanatory, illustrative, and used to generally understand the present invention. The embodiments shall not be construed to limit the present invention. The same or similar elements and the elements having same or similar functions are denoted by like reference numerals throughout the descriptions. According to an embodiment of the invention, a method of forming an electronic device having a metal piece 1 and a plastic piece 3 adhered to the metal piece 1 is provided. The method may comprise the steps of: adhering part on a surface of the metal piece 1 which at least partially covers the surface thereof; and forming the plastic piece 3 by injection molding using plastic material which is adhered to the metal piece 1 with the adhering part being connected between the plastic piece 3 and the metal piece 1.
According to an embodiment of the invention, the metal piece 1 may be configured as a metal shell for the electronic device.
The types of plastic piece 3 may include, without limitation to, polycarbonate (PC), polymethylmethacrylate (PMMA), or mixture thereof. The weight average molecular weight of PC was about 20000-60000, and the weight average molecular weight of PMMA was about 20000-200000. The types of metal piece 1 may include, without limitation to, iron, aluminum, aluminum alloy, copper, and stainless steel. The structure of the metal piece is designed according the device.
The adhering part 2 is used to attach the metal piece 1 to the plastic piece 3. The thickness of the adhering part is determined by the dimension of the device. In an embodiment of the invention, it is about 0.10 - 0.15 mm. In one example, the adhering part is formed by thermoplastic adhesive. The thermoplastic adhesive is a no solvent solid meltable polymer without any water component. It is presented in a solid state at room temperature, and it may be transformed into a viscous liquid while heating at a given temperature. In some embodiments, the thermoplastic adhesive comprises base-resin, tackifier, viscosity modifier and antioxidant. To avoid the over-melt of adhesive spilled while molding, the thermoplastic adhesive has a certain thermal resistance. According to an embodiment of the invention, the thermal resistant temperature of thermoplastic adhesive is more than 220 0C. The process of forming an adhering part 2 on the surface of metal pieces 1 is not limited in the present invention. In some embodiments, the metal piece 1 is preheated to the temperature of about 100 0C- 150 0C, then the thermoplastic adhesive is laminated to the metal piece by a laminated roller so that the thermoplastic adhesive on the surface of metal piece is molten and bonded on the metal piece firmly. The laminating time is about 3 - 7 seconds. According to an embodiment of the invention, it is about 6 seconds.
The injection process of injection molding is not limited in the present invention. In some embodiments, the metal piece 1 is put into the mold and the plastic material is injected then. In one example, the high temperature and high pressure injection molding is used to enhance the bonding force therebetween during which the high temperature is favorable for melting, and the high pressure is favorable for bonding. The temperature may be about 2500C - 300 0C and the pressure may be about 1250 - 1350 kg/cm2. In some embodiments, the method further comprises forming texture on the surface of metal piece 1. The process of texture is not limited in the present invention, it aims to increase the roughness and enhance bonding force.
The following provides additional details of the method of the present invention.
FIRST EMBODIMENT
An aluminum alloy plate piece having a size of 100x200x2mm and a plastic piece are molded as following: A texture on a surface of aluminum alloy plate is formed. After the aluminum alloy plate is preheated to a temperature of 1200C, the thermoplastic adhesive (615ST/3M Co.) having a thickness of 0.12mm is laminated on the aluminum alloy plate for 6 seconds. The aluminum alloy plate is put in the mold and the plastic material is injected on the aluminum alloy plate at the temperature of 2800C under the pressure of 1350 kg/cm2. After curing, the electronic device is obtained which may be labeled as A.
SECOND EMBODIMENT
An aluminum alloy plate having a size of 50x50x2mm and a plastic piece are molded as following:
A texture on a surface of the aluminum alloy plate is formed. After the aluminum alloy plate is preheated to a temperature of 1200C, the thermoplastic adhesive (615ST/3M Co.) having a thickness of 0.10mm is laminated on the aluminum alloy plate for 6 seconds. The aluminum alloy plate is put into the mold and the plastic material is injected on the aluminum alloy plate at a temperature of 2800C under a pressure of 1250 kg/cm2. After curing, the electronic device is obtained which may be labeled as B.
THIRD EMBODIMENT An aluminum alloy plate having a size of 100xl00x2mm and a plastic piece are molding as following steps:
A texture on a surface of the aluminum alloy plate is formed. After the aluminum alloy plate is preheated to a temperature of 1200C, the thermoplastic adhesive (615ST/3M Co.) having a thickness of 0.12mm is laminated on the aluminum alloy plate for 6 seconds. The aluminum alloy plate is put into the mold and the plastic material is injected on the aluminum alloy plate at a temperature of 285°C under a pressure of 1350 kg/cm2. After curing, the electronic device is obtained which may be labeled as C.
FOURTH EMBODIMENT
An aluminum alloy plate having a size of 100xl00x2mm and a plastic piece are molding as following:
A texture on a surface of the aluminum alloy plate is formed. After the aluminum alloy plate is preheated to a temperature of 1200C, the thermoplastic adhesive (615ST/3M Co.) having a thickness of 0.12mm is laminated on the aluminum alloy plate for 6 seconds. The aluminum alloy plate is put into the mold and the plastic material is injected on the aluminum alloy plate at a temperature of
295°C under a pressure of 1350 kg/cm2. After curing, the electronic device is obtained which may be labeled as D.
COMPARATIVE EMBODIMENT
An aluminum alloy plate having a size of 100xl00x2mm and a plastic piece are molding as following steps: The aluminum alloy plate is put into the mold and the plastic material is injected on the aluminum alloy plate at a temperature of 295°C under a pressure of 1350 kg/cm2. After curing, the electronic device is obtained which may be labeled as E.
TESTING The pulling force test machine is used to peel the metal piece and the plastic piece of the electronic devices A-E respectively, with the peeling force being shown in Table 1.
Figure imgf000009_0001
TABLE 1. PEELING FORCE OF ELECTRONIC DEVICES A-E.
Based on the results of Table 1, the method provided by the embodiments of present invention can enhance the bonding force between the metal piece 1 and the plastic piece 3. And the service time of the electronic device is extended accordingly.
Although explanatory embodiments have been shown and described, it would be appreciated by those skilled in the art that changes, alternatives, and modifications may be made in the embodiments without departing from spirit and principles of the invention. Such changes, alternatives, and modifications all fall into the scope of the claims and their equivalents.

Claims

WHAT IS CLAIMED IS:
1. A method of forming an electronic device having a metal piece and a plastic piece adhered to the metal piece, comprising the steps of: forming an adhering part on a surface of the metal piece which at least partially covers the surface thereof; and forming the plastic piece by injection molding using plastic material which is adhered to the metal piece with the adhering part being connected between the plastic piece and the metal piece.
2. The method according to claim 1, wherein the metal piece is made of any one of iron, aluminum, aluminum alloy, copper, and stainless steel.
3. The method according to claim 2, wherein material of the adhering part is thermoplastic adhesive.
4. The method according to claim 3, wherein the thermoplastic adhesive has a thermal resistance temperature of greater than 220 0C.
5. The method according to claim 1, further comprising: preheating the metal piece before forming the adhering part.
6. The method according to claim 5, wherein the preheating is performed under a temperature of about 1000C to 150 0C.
7. The method according to claim 1, further comprising the step of forming a texture on the surface of metal piece.
8. The method according to claim 2, wherein the metal piece is a metal shell for the electronic device.
9. The method according to claim 1, wherein the surface of the metal piece is entirely covered by the adhering part.
10. A method of forming an electronic device having a metal piece and a plastic piece adhered to the metal piece, comprising the following steps: forming a texture on a surface of the metal piece; preheating the metal piece; forming an adhering part on the surface of the metal piece where the texture is formed, which at least partially covers the surface thereof; and forming the plastic piece by injection molding using plastic material which is attached to the metal piece with the adhering part being connected between the plastic piece and the metal piece.
11. The method according to claim 10, wherein the metal piece is a metal shell for the electronic device.
12. The method according to claim 10, wherein the metal piece is made of any one of iron, aluminum, aluminum alloy, copper, and stainless steel.
13. The method according to claim 10, wherein the material of the adhering part is thermoplastic adhesive.
14. The method according to claim 13, wherein the thermoplastic adhesive has a thermal resistance temperature of greater than 220 0C.
15. The method according to claim 10, wherein the temperature of the preheating is about 1000C to 150 0C.
16. The method according to claim 10, wherein the surface of the metal piece is entirely covered by the adhering part.
17. An electronic device formed by the method according to claim 1 or 11.
PCT/CN2009/074165 2008-09-25 2009-09-23 Electronic device and method of forming the same Ceased WO2010034239A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP09815608A EP2326480A4 (en) 2008-09-25 2009-09-23 Electronic device and method of forming the same
US13/062,101 US20110165366A1 (en) 2008-09-25 2009-09-23 Electronic device and method of forming the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810216557A CN101683757A (en) 2008-09-25 2008-09-25 Forming method and product thereof
CN200810216557.3 2008-09-25

Publications (1)

Publication Number Publication Date
WO2010034239A1 true WO2010034239A1 (en) 2010-04-01

Family

ID=42047242

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2009/074165 Ceased WO2010034239A1 (en) 2008-09-25 2009-09-23 Electronic device and method of forming the same

Country Status (4)

Country Link
US (1) US20110165366A1 (en)
EP (1) EP2326480A4 (en)
CN (1) CN101683757A (en)
WO (1) WO2010034239A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102632584A (en) * 2011-02-15 2012-08-15 汉达精密电子(昆山)有限公司 Method for manufacturing appearance piece
GB2521918A (en) * 2013-11-25 2015-07-08 Motorola Solutions Inc Apparatus and method for providing a seal around a perimeter of a bi-material enclosure

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102234485B (en) * 2010-04-30 2014-02-12 深圳富泰宏精密工业有限公司 Method for bonding workpieces made of different materials
CN102336022A (en) * 2010-07-21 2012-02-01 汉达精密电子(昆山)有限公司 Method for combining heterogenic material and plastic injection molding
CN102049838A (en) * 2010-11-09 2011-05-11 深圳庆和胶粘制品有限公司 Method for molding metal piece with view window and plastic molding product and application thereof
CN102501376B (en) * 2011-11-02 2015-04-29 深圳创维－Rgb电子有限公司 Manufacturing method for large-size, ultra-thin and ultra-narrow shell
CN102615775A (en) * 2012-04-09 2012-08-01 昆山金利表面材料应用科技股份有限公司 Metal part with plastic structure and manufacturing method of metal part
JP5660088B2 (en) * 2012-08-20 2015-01-28 株式会社デンソー Liquid level detection device and method of manufacturing liquid level detection device
CN103802229B (en) * 2012-11-15 2017-02-08 苏州滕艺科技有限公司 Method for preparing electronic device shell with connected structure and structure
CN102962945A (en) * 2012-12-06 2013-03-13 天津市中环高科技有限公司 Plastic piece surface and metal ornament composite seamless primary injection molding and formation process
CN103522485A (en) * 2013-10-11 2014-01-22 上海瑞尔实业有限公司 Method for embedding metal tag into plastic pedestal of central decorative cover of automobile wheel
KR20150089311A (en) * 2014-01-27 2015-08-05 삼성에스디아이 주식회사 Secondary Battery
JP6264905B2 (en) * 2014-01-31 2018-01-24 住友電気工業株式会社 Composite member and method of manufacturing composite member
EP3370955A4 (en) 2015-11-04 2019-06-05 Hewlett-Packard Development Company, L.P. Forming metal composites
CN107647734A (en) * 2016-07-26 2018-02-02 葛锋 The production method of multiple layer metal cup
WO2018058516A1 (en) * 2016-09-30 2018-04-05 北京小米移动软件有限公司 Preparation method for metal housing, metal housing, electronic device
CN108995126A (en) * 2018-06-20 2018-12-14 北京航数车辆数据研究所有限公司 A kind of manufacturing method of metallo-plastic mixed structure
CN111478100A (en) * 2020-04-02 2020-07-31 立讯精密工业（滁州）有限公司 Electric connector and assembling method thereof
CN114523616A (en) * 2021-12-30 2022-05-24 深圳东金汽车电子有限公司 Glue-coated high-temperature terminal embedding injection molding method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1300304A (en) * 1999-04-02 2001-06-20 巴塞尔技术有限公司 Coupling metal parts with a plastic material
CN1575962A (en) * 2003-07-22 2005-02-09 马林远 Producing teahnology for high-polymer composite pipe and its special die
CN101056757A (en) * 2004-11-01 2007-10-17 纳幕尔杜邦公司 Joining of thermoplastics with other types of materials

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS543786A (en) * 1977-06-10 1979-01-12 Bridgestone Corp Wheels for running in conduit
SU1062235A1 (en) * 1977-12-12 1983-12-23 Феб Карл-Цейсс-Йена (Инопредприятие) Process for preparing polyurethane-metal high-strength compositions using cohesion activator
DE3116339C3 (en) * 1981-04-24 1995-03-23 Gert Mayer Method and device for producing profile strips or the like. with closed end areas
US5207961A (en) * 1986-06-06 1993-05-04 Bayer Aktiengesellschaft Injection-moulded article and process for the production thereof
JPH01165415A (en) * 1987-12-22 1989-06-29 Mitsubishi Cable Ind Ltd Preparation of ic card case
DE4109397A1 (en) * 1991-03-22 1992-09-24 Agrodur Grosalski & Co Encapsulating metal parts with thermoplastic by injection moulding - has metal part first coated with heat-reactivatable adhesive which is activated by heat and pressure of thermoplastic during moulding
JPH05261823A (en) * 1992-03-19 1993-10-12 Toshiba Chem Corp Shell casing
JPH05269787A (en) * 1992-03-26 1993-10-19 Toshiba Chem Corp Method for manufacturing electronic device housing
JPH06334377A (en) * 1993-05-19 1994-12-02 Toshiba Chem Corp Electronic equipment case body
JP3016331B2 (en) * 1993-09-07 2000-03-06 富士通株式会社 Manufacturing method of electronic equipment housing
US5554569A (en) * 1994-06-06 1996-09-10 Motorola, Inc. Method and apparatus for improving interfacial adhesion between a polymer and a metal
TW387843B (en) * 1998-02-05 2000-04-21 Juang Dung Han Method of producing EMI-shielding plastic product with one face of which clad with metal foil and the device thereof
TW496823B (en) * 1998-12-23 2002-08-01 Dung-Han Juang Process for manufacturing an electromagnetic interference shielding superplastic alloy foil cladded plastic outer shell product
JP2007524209A (en) * 2004-02-16 2007-08-23 ミート カンパニー リミテッド Foldable air battery
DE102005032421B4 (en) * 2005-07-12 2008-03-27 Erbslöh Ag Method for producing a decorative trim piece
JP4789670B2 (en) * 2006-03-27 2011-10-12 富士通株式会社 Resin molded product and manufacturing method thereof
DE102006050144A1 (en) * 2006-10-25 2008-04-30 Huntsman Advanced Materials (Switzerland) Gmbh Housing component e.g. oil pan, for passenger car, has plastic wall area connected to sealing flange, and connecting strip provided on flange in integral manner, where wall area is connected to both sides of strip in material fit manner

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1300304A (en) * 1999-04-02 2001-06-20 巴塞尔技术有限公司 Coupling metal parts with a plastic material
CN1575962A (en) * 2003-07-22 2005-02-09 马林远 Producing teahnology for high-polymer composite pipe and its special die
CN101056757A (en) * 2004-11-01 2007-10-17 纳幕尔杜邦公司 Joining of thermoplastics with other types of materials

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102632584A (en) * 2011-02-15 2012-08-15 汉达精密电子(昆山)有限公司 Method for manufacturing appearance piece
GB2521918A (en) * 2013-11-25 2015-07-08 Motorola Solutions Inc Apparatus and method for providing a seal around a perimeter of a bi-material enclosure
GB2521918B (en) * 2013-11-25 2016-03-23 Motorola Solutions Inc Apparatus and method for providing a seal around a perimeter of a bi-material enclosure

Also Published As

Publication number Publication date
EP2326480A1 (en) 2011-06-01
US20110165366A1 (en) 2011-07-07
CN101683757A (en) 2010-03-31
EP2326480A4 (en) 2012-07-18

Similar Documents

Publication Publication Date Title
WO2010034239A1 (en) Electronic device and method of forming the same
CN1234336A (en) Coating method using polymer thin film and method for producing laminate of polymer layer and metal foil
CN107484324B (en) Electromagnetic wave shielding film and printed wiring board with electromagnetic wave shielding film
US20110052864A1 (en) Thermal adhesive tape and manufacturing method of the same
CN103237646A (en) Method for producing metal composite, and chassis for electronic equipment
EP2142350A1 (en) Metal adhesive moulding method and the product made by the method
JP2016054259A (en) Electromagnetic wave shielding film and method for producing flexible printed wiring board with electromagnetic wave shielding film
TW201422705A (en) Coverlay film, flexible printed wiring board using the same, and method for manufacturing thereof
US6182486B1 (en) Superplastic alloy-containing conductive plastic article for shielding electromagnetic interference and process for manufacturing the same
WO2019117259A1 (en) Manufacturing method of mounting structure
US8597744B2 (en) Device housing and method for making the same
EP3181267B1 (en) Method for integrally forming non-metal part and metal part
US20110293924A1 (en) Housing structure for electronic device and manufacturing method thereof
WO2014139426A1 (en) Composite material, substrate, shell for an electronic device and method of preparing the same
JP5606169B2 (en) Electronic device casing and manufacturing method thereof
US8616875B2 (en) Light guide plate stamp and method of manufacturing the same
JP2010150390A (en) Metal foil laminated carbon fiber cloth prepreg for press working and carbon fiber cloth renforced plastic molded article
JP2014139003A (en) Method of manufacturing composite molding, and method of enhancing heat dissipation performance
EP1962231A3 (en) Production method of electronic apparatus, production method of electronic equipment in which electronic apparatus is packaged, and production method of article in which electronic apparatus is mounted
TW201628853A (en) Housing, method for manufacturing the housing and electronic device using the same
CN104072992A (en) Resin composition for insert molding, metal-resin composite molded body using the same, and method for producing the same
CN111028690B (en) Display screen and display screen processing method
CN105102200A (en) Method for producing resin molded body and graphite sheet laminate
US8343600B2 (en) Case module for portable terminal using thermal adhesive tape
JP2008192792A (en) Conductive sheet molding and molding method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09815608

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009815608

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE