WO2010129002A1 - Method and apparatus for improving power and loss for interconect configurations - Google Patents

Method and apparatus for improving power and loss for interconect configurations Download PDF

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Publication number
WO2010129002A1
WO2010129002A1 PCT/US2010/000043 US2010000043W WO2010129002A1 WO 2010129002 A1 WO2010129002 A1 WO 2010129002A1 US 2010000043 W US2010000043 W US 2010000043W WO 2010129002 A1 WO2010129002 A1 WO 2010129002A1
Authority
WO
WIPO (PCT)
Prior art keywords
power
pads
vias
blinds
capacitance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2010/000043
Other languages
French (fr)
Inventor
James V. Russell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
R&D Circuits Inc
Original Assignee
R&D Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R&D Circuits Inc filed Critical R&D Circuits Inc
Priority to JP2012509780A priority Critical patent/JP2012526380A/en
Priority to EP10772351.2A priority patent/EP2428105A4/en
Priority to SG2012005781A priority patent/SG178121A1/en
Priority to CN2010800197895A priority patent/CN102415224A/en
Publication of WO2010129002A1 publication Critical patent/WO2010129002A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure provides for attaching and embedding a capacitance or a resistance directly to the bottom side of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded power modification component (capacitance or resistance) is located beyond where the visa are located.
  • Each of the pads will be connected to the endpoints of the power modification component located underneath it through an opening in the dielectric material under the pads to permit conduction through the opening. In this way the capacitance and the resistance will have a closer contact point with the electrical component.
  • FIG.1 is a an illustration of standard interconnect configuration showing placement of a capacitance or resistance
  • FIG.2 A is illustrates the interconnect configuration with placement of the capacitance or resistance in accordance with the present disclosure
  • FIG 2B is another embodiment of the present disclosure showing the vias aligned vertically one on top of another for a finer pitch;
  • FIG. 3 is another embodiment of the present disclosure in which the embedded component is a component aligned vertically within the board;
  • FIG. 4 is an embodiment of the present disclosure showing an embedded resistance and an embedded capacitance within the board aligned vertically and horizontally.
  • FIG.1 illustrates the typical interconnect configuration where the capacitance or resistance is placed a considerable distance away from the electrical test structure housing of an IC chip (not shown).
  • FIG.2 illustrates the interconnect configuration of the present disclosure.
  • the power modification component 5 which can be, but is not limited to, either the capacitance 5c (FIG. 4) or the resistance 5a (FIG. 3) is embedded under pads 7 within the footprint of the electrical test structure housing of an IC chip (not shown).
  • the pads 7 are located with the embedded portion not covering the vias or blinds 11 but placed in proximity of the electrical component.
  • the placement can provide for better power distribution by being close to the electrical component so that there is little power dissipation and the capacitance does not become inductive. Similarly by the same close proximity of the resistance to the electrical component power dissipation is provided when required. Distant placement of the resistance from the electrical component results in a reduction of the power dissipation, a problem addressed and resolved by the present disclosure as shown in FIG. 3 of the drawings.
  • FIG.2A illustrates an embodiment of the present disclosure showing an interconnect configuration in which a power modification component 5 e.g. resistance 5a (FIG. 3) or capacitance 5c (FIG. 4) is attached to the bottom sides of the pads 7 formed by preferably a copper layer of a printed circuit board (PCB).
  • the embedded power modification component 5 (such as but not limited to a capacitance or resistance) is located below a layer of copper foil followed by dielectric layer.
  • the power modification component 5 is surrounded on its sides by Prepreg material e.g. fiber reinforced or unreinforced epoxy or plastic material.
  • the power modification component 5 is attached to the pads 7 layer by solder paste, conductive epoxy, or metallic plating 14.
  • the present disclosure also is not limited to the particular materials of copper foil, dielectric layer and Prepreg material described herein.
  • the power modification component 5 is embedded so as to be near but not block the vias or blinds 11 for the PCB 8.
  • the capacitance 5c will be a 0201 cap. However any desired capacitance value or size that can be accommodated can be used.
  • the capacitance 5c is attached by a conductive epoxy, solder paste, or metallic plating 14.
  • FIG.3 shows another embodiment of improved power dissipation by embedding a resistor 5a in a pc board 8.
  • An opening is created beneath the pad 7a at the top of the interposer board and the pad 7b at the bottom of the pc board 10 and a resistor 5a is vertically positioned within the opening in-between the top and bottom pads 7 a and 7b, respectively, and in effect acts as a via for the effected layers of the pc board 10, which it is assumed can be a multilayer pc board, so that the electrical connection is through the resistance 5a embedded in the pc board 10.
  • the pads 7a and 7b, respectively, are connected to the resistance 5a. Openings between the ends points of the resistance 5a and the pads 7a and 7b, respectively, in the pc board 8 can be filled with solder, metallic plating or conductive epoxy 14.
  • FIG. 4 shows another embodiment of the present disclosure with an embedded capacitance 5c and the embedded resistance 5a of FIG.3 together in the same pc board 8.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The present disclosure relates to embedding a power modification component such as a capacitance or a resistance inside of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded capacitance or resistance is located beyond where the vias or blinds are located. Each of the pads will include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening. In this way the capacitance and the resistance will have a closer contact point the electrical component.

Description

METHOD AND APPARATUS FOR IMPROVING POWER GAIN AND LOSS FOR INTERCONECT CONFIGURATIONS
RELATED APPLICATIONS
This is a non provisional application of a provisional application serial number 61/215,369 by James V. Russell filed May 4, 2009
BACKGROUND 1. Field
In attaching an electrical component to the bottom side and/or the top side of a printed circuit board (PCB)1 there is the problem of power loss or due to the distance of the capacitance to the points on a corresponding integrated circuit (IC) for which it is intended. It is not possible to physically locate the capacitance directly to the contact pads on the printed circuit which correspond to the input output points of an integrated circuit or in the case of a test board the corresponding points of the test socket. Similarly there is the problem of inadequate dissipation due to the distance of a resistance to the electrical component. Again, it is not very likely to physically locate the resistance at the contact pads on the printed circuit board.
It would therefore be desirable to have a method and apparatus that provides for close proximate placement of the capacitance or of the resistance which shall be referred to as a power modification component since it either better dissipates power (power loss) (resistance) or better distributes power (power gain) (capacitance) to the IC or other electrical component on a PCB to provide better power gain or distribution or power loss or dissipation. SUMMARY
The present disclosure provides for attaching and embedding a capacitance or a resistance directly to the bottom side of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded power modification component (capacitance or resistance) is located beyond where the visa are located. Each of the pads will be connected to the endpoints of the power modification component located underneath it through an opening in the dielectric material under the pads to permit conduction through the opening. In this way the capacitance and the resistance will have a closer contact point with the electrical component.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG.1 is a an illustration of standard interconnect configuration showing placement of a capacitance or resistance;
FIG.2 A is illustrates the interconnect configuration with placement of the capacitance or resistance in accordance with the present disclosure;
FIG 2B is another embodiment of the present disclosure showing the vias aligned vertically one on top of another for a finer pitch;
FIG. 3 is another embodiment of the present disclosure in which the embedded component is a component aligned vertically within the board; and
FIG. 4 is an embodiment of the present disclosure showing an embedded resistance and an embedded capacitance within the board aligned vertically and horizontally. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)
Referring now to the drawings, FIG.1 illustrates the typical interconnect configuration where the capacitance or resistance is placed a considerable distance away from the electrical test structure housing of an IC chip (not shown). FIG.2 illustrates the interconnect configuration of the present disclosure. In this configuration, the power modification component 5 which can be, but is not limited to, either the capacitance 5c (FIG. 4) or the resistance 5a (FIG. 3) is embedded under pads 7 within the footprint of the electrical test structure housing of an IC chip (not shown). The pads 7 are located with the embedded portion not covering the vias or blinds 11 but placed in proximity of the electrical component. In this way the placement can provide for better power distribution by being close to the electrical component so that there is little power dissipation and the capacitance does not become inductive. Similarly by the same close proximity of the resistance to the electrical component power dissipation is provided when required. Distant placement of the resistance from the electrical component results in a reduction of the power dissipation, a problem addressed and resolved by the present disclosure as shown in FIG. 3 of the drawings.
FIG.2A illustrates an embodiment of the present disclosure showing an interconnect configuration in which a power modification component 5 e.g. resistance 5a (FIG. 3) or capacitance 5c (FIG. 4) is attached to the bottom sides of the pads 7 formed by preferably a copper layer of a printed circuit board (PCB). The embedded power modification component 5 (such as but not limited to a capacitance or resistance) is located below a layer of copper foil followed by dielectric layer. The power modification component 5 is surrounded on its sides by Prepreg material e.g. fiber reinforced or unreinforced epoxy or plastic material. The power modification component 5 is attached to the pads 7 layer by solder paste, conductive epoxy, or metallic plating 14. It is understood that any other known means of attachment can be used as well and that the present disclosure also is not limited to the particular materials of copper foil, dielectric layer and Prepreg material described herein. As shown in FIG. 2A the power modification component 5 is embedded so as to be near but not block the vias or blinds 11 for the PCB 8. Preferably the capacitance 5c will be a 0201 cap. However any desired capacitance value or size that can be accommodated can be used. As seen in FIG. 4, the capacitance 5c is attached by a conductive epoxy, solder paste, or metallic plating 14.
FIG.3 shows another embodiment of improved power dissipation by embedding a resistor 5a in a pc board 8. An opening is created beneath the pad 7a at the top of the interposer board and the pad 7b at the bottom of the pc board 10 and a resistor 5a is vertically positioned within the opening in-between the top and bottom pads 7 a and 7b, respectively, and in effect acts as a via for the effected layers of the pc board 10, which it is assumed can be a multilayer pc board, so that the electrical connection is through the resistance 5a embedded in the pc board 10. The pads 7a and 7b, respectively, are connected to the resistance 5a. Openings between the ends points of the resistance 5a and the pads 7a and 7b, respectively, in the pc board 8 can be filled with solder, metallic plating or conductive epoxy 14.
FIG. 4 shows another embodiment of the present disclosure with an embedded capacitance 5c and the embedded resistance 5a of FIG.3 together in the same pc board 8.
While certain embodiments have been shown and described, it is distinctly understood that the present disclosure is not limited thereto but may be otherwise embodied within the scope of the appended claims.

Claims

1. A method for providing improved power distribution or power dissipation to an electrical component on a printed circuit board (PCB), the steps comprising: embedding a power modification component inside of one or more pads; locating said one or more embedded pads to extend over and beyond the vias or blinds of said PCB so that a portion of the pad containing the embedded power modification component is located beyond where the visa or blinds are located, said one or more pads include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening so that said power modification component will have a closer contact point to said electrical component thereby increasing power distribution or power dissipation, respectively.
2. The method according to claimi wherein said power modification component is a capacitance.
3. The method according to claimi wherein said power modification component is a resistance.
4. An apparatus for improved power distribution or power dissipation to an electrical component on a printed circuit board (PCB), comprising: a power modification component embedded inside of one or more pads; a PCB having one or more vias or blinds, said one or more embedded pads being located to extend over and beyond the vias or blinds of said PCB so that a portion of the pad containing the embedded power modification is located beyond where the vias or blinds are located, said one or more pads include an opening that is located over a given one of the vias or blinds to permit that via or blind to conduct through the opening so that said power modification component will have a closer contact point to said electrical component thereby increasing power distribution or power dissipation, respectively.
5. The apparatus according to claim 4 wherein said power modification component is a capacitance.
6. The apparatus according to claim 4 wherein said power modification component is a resistance.
PCT/US2010/000043 2009-05-04 2010-01-08 Method and apparatus for improving power and loss for interconect configurations Ceased WO2010129002A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012509780A JP2012526380A (en) 2009-05-04 2010-01-08 Method and apparatus for improving power gain and loss for interlayer connection configurations
EP10772351.2A EP2428105A4 (en) 2009-05-04 2010-01-08 Method and apparatus for improving power and loss for interconect configurations
SG2012005781A SG178121A1 (en) 2009-05-04 2010-01-08 Method and apparatus for improving power and loss for interconect configurations
CN2010800197895A CN102415224A (en) 2009-05-04 2010-01-08 Method and apparatus for improving power gain and loss of interconnect structures

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21536909P 2009-05-04 2009-05-04
US61/215,369 2009-05-04

Publications (1)

Publication Number Publication Date
WO2010129002A1 true WO2010129002A1 (en) 2010-11-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/000043 Ceased WO2010129002A1 (en) 2009-05-04 2010-01-08 Method and apparatus for improving power and loss for interconect configurations

Country Status (6)

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EP (1) EP2428105A4 (en)
JP (1) JP2012526380A (en)
KR (1) KR20120007521A (en)
CN (1) CN102415224A (en)
SG (1) SG178121A1 (en)
WO (1) WO2010129002A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9406462B2 (en) * 2013-06-28 2016-08-02 The Boeing Company Truss interconnect
WO2018044788A1 (en) * 2016-09-02 2018-03-08 R&D Circuits, Inc. Method and structure for a 3d wire block
CN107255784A (en) * 2017-07-10 2017-10-17 深圳崇达多层线路板有限公司 The many physical quantity systems and measuring method of a kind of wiring board
CN109669059B (en) * 2017-10-17 2021-03-16 中华精测科技股份有限公司 Circuit structure for adjusting power signal impedance and its semiconductor test interface system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11103170A (en) * 1997-09-29 1999-04-13 Kyocera Corp Multilayer ceramic circuit board with built-in resistor
JP2001217337A (en) * 2000-01-31 2001-08-10 Shinko Electric Ind Co Ltd Semiconductor device and manufacturing method thereof
JP2002100875A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring boards and capacitors
JP2002359319A (en) * 2001-05-31 2002-12-13 Kyocera Corp Wiring board with built-in electric element and manufacturing method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000063970A1 (en) * 1999-04-16 2000-10-26 Matsushita Electric Industrial Co., Ltd. Module component and method of manufacturing the same
JP4854345B2 (en) * 2006-03-16 2012-01-18 富士通株式会社 Capacitor sheet and electronic circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11103170A (en) * 1997-09-29 1999-04-13 Kyocera Corp Multilayer ceramic circuit board with built-in resistor
JP2002100875A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring boards and capacitors
JP2001217337A (en) * 2000-01-31 2001-08-10 Shinko Electric Ind Co Ltd Semiconductor device and manufacturing method thereof
JP2002359319A (en) * 2001-05-31 2002-12-13 Kyocera Corp Wiring board with built-in electric element and manufacturing method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2428105A4 *

Also Published As

Publication number Publication date
EP2428105A4 (en) 2013-05-29
EP2428105A1 (en) 2012-03-14
JP2012526380A (en) 2012-10-25
CN102415224A (en) 2012-04-11
KR20120007521A (en) 2012-01-20
SG178121A1 (en) 2012-03-29

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