WO2011034555A1 - Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration - Google Patents

Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration Download PDF

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Publication number
WO2011034555A1
WO2011034555A1 PCT/US2010/000049 US2010000049W WO2011034555A1 WO 2011034555 A1 WO2011034555 A1 WO 2011034555A1 US 2010000049 W US2010000049 W US 2010000049W WO 2011034555 A1 WO2011034555 A1 WO 2011034555A1
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WO
WIPO (PCT)
Prior art keywords
board
adaptor
circuit board
main circuit
adaptor board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2010/000049
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French (fr)
Inventor
James V. Russell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
R&D Circuits Inc
Original Assignee
R&D Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R&D Circuits Inc filed Critical R&D Circuits Inc
Priority to CN201080051570.3A priority Critical patent/CN102648667B/en
Priority to SG2012017810A priority patent/SG179125A1/en
Priority to KR1020187004487A priority patent/KR20180020319A/en
Priority to JP2012529728A priority patent/JP2013504894A/en
Priority to EP10817530A priority patent/EP2478751A4/en
Priority to TW099128788A priority patent/TWI563752B/en
Publication of WO2011034555A1 publication Critical patent/WO2011034555A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • a method and apparatus that provides for close proximate placement of the capacitance or of the resistance, which shall be referred to as a power modification component, since it either dissipates power (resistance) or better distributes power (capacitance) to the electrical component on a PCB to provide better power distribution or power dissipation. It would be even more desirable to be able to accomplish these goals without the need for replacing the main circuit board should a different circuit be desired at another time.
  • the present disclosure provides for attaching and embedding a capacitance or a resistance directly in an adaptor board or an interposer board that is then connected to the main circuit board.
  • the adaptor board can be connected to the main circuit board by soldering, electrically connecting it by a conductive elastomer connection, spring pins or by any other way that is known in the art.
  • FIG. 1 is an exploded sectional view showing embedded components in an interposer board, which is located above for connection to the main circuit board in accordance with the present disclosure
  • FIG. 2 is another embodiment of the present disclosure showing the vias aligned vertically one on top of another for a finer pitch;
  • FIG. 3 is another embodiment of the present disclosure in which the embedded component is aligned vertically within the adaptor board;
  • FIG. 4 is an embodiment of the present disclosure showing an embedded resistance and an embedded capacitance within the adaptor board;
  • FIG. 5 is an exploded sectional view of another embodiment of the present disclosure.
  • FIG. 6A is an exploded sectional view of another embodiment of the present disclosure in which the number of pads is different from that of the embodiments of FIGS. 5, 8 and 9;
  • FIG.6 B illustrates the trace routing on one of either the interface sides of the main circuit board or of the adaptor board facing a side of the modified printed circuit board (modified pc board) where the trace routing is possible on the interface layers of the adaptor board and on the interface layers on the main circuit board in accordance with the embodiments of FIG.5, FIG 6A.FIG.8 and FIG. 9 of the present disclosure;
  • FIG. 7 is the modified PC board of the embodiment of FIG.5;
  • FIG.8 is another embodiment of the present disclosure in which there is no need for a modified PC board and the adaptor board has lands that are coated with conductive elastomeric material; and.
  • FIG.9 is another embodiment of the present disclosure in which there is no need for a modified PC board and the main circuit board has lands that are coated with conductive elastomeric material.
  • FIG.1 shows an embodiment of the present disclosure in which power modification component 5 is embedded in an adaptor board 10.
  • the embedded component 5 can be placed between vias 1 1 as shown in FIG. 1.
  • an embedded component 5 is placed between extended pads on the top of an adaptor board 10 with the component 5 embedded within the adaptor board 10.
  • Connective material 7 is conductive material such as but not limited to solder, conductive epoxy or traditional plating techniques such as copper, silver, etc.
  • vias 11 can be made through metallization by any traditional plating techniques such as copper, silver, etc., conductive epoxy, or solder.
  • the extended pads 9A are connected to the ends 8 of the component 5 by conductive material 7 and are offset from the vias
  • main circuit board 15 can be reused and does not have to be discarded when an embedded component 5 wears out or the main circuit board 15 is used for another circuit configuration.
  • Main circuit boards 15 are expensive and this is a practical way to reduce the power loss (dissipation) from a resistor (see FIGS. 3 and 4) or improve a power gain (distribution) for a capacitance by using embedded components 5 but still freeing the main circuit board 15 for future use at the same time.
  • the adaptor board 10 can be
  • FIG. 2 shows another embodiment of the present disclosure in which a finer pitch is possible by aligning blinds 11a on top of one another.
  • blinds 11a are vertically aligned with one set extending to permit the pads to make contact with the endpoints of the
  • Blinds 1 1a can be connected to the endpoints as described for connective material 7 for the embodiment in FIG. 1.
  • FIG.3 shows another embodiment of improved power dissipation by embedding a resistor 5a in an adaptor board 10.
  • Component 5a is located between pads 9a and 9b and in effect acts as a via for the adaptor board 10 so that the electrical connection is through the resistance 5a embedded in the adaptor board 10.
  • the pads 9 are connected to the resistance 5a through openings at the end points of resistance 5a and pads 9a and 9b respectively.
  • the openings can be filled with solder, metallic plating or conductive epoxy.
  • the adaptor board 10 can be a multilayer PC board.
  • FIG. 4 shows another embodiment of the present disclosure with the embedded component 5 of FIG.1 and the embedded resistance 5a of FIG.3 together in the same adaptor board 10. It is understood that the adaptor board 10 can be a multilayer PC board.
  • FIG. 5 illustrates the electrical connector of the present disclosure in which the connector has a mechanical compression structure 105, an adaptor board 106 (it is understood that the adaptor board has embedded components in it not shown in FIG. 5) with connecting lands or pads107, and a modified PC board 108 with conductive elastomer material 109 formed on lands 109a and 109 B respectively on both sides of the modified PC board 108; and a main circuit board 1 10 having connecting lands 1 11.
  • One non-limiting illustrative example of use of the compression structure 105 for the present disclosure includes a socket 105a in the compression structure 105 that is adapted to house a test circuit such as an integrated circuit (IC) chip 103.
  • IC integrated circuit
  • Pins 105b provide for making electrical connections to the IC chip 103 housed in socket 105a with pads 107 of the adaptor board 106.
  • the connecting lands or pads 107 of the adaptor board 106 and of the connecting lands 11 1 of the main circuit board 10 are placed into contact with elastomer material 109 located on the lands or pads 109a and 109 b of the modified PC board 108 when the adaptor board 106 and the modified PC board 108 and the main circuit board 1 10 are compressed together by the mechanical compression structure 105.
  • the elastomer material 109 can be either isotropic or anisotropic elastomer material.
  • the modified PC board 108 by placement of the elastomeric material 109 thereon serves as a pad defined connector 108.
  • the modified PC board 108 can be replaced with an anisotropic sheet elastomer.
  • the present disclosure also provides for rerouting the electrical connections from the pins105b1- 6 connected to the connection points 104 of the test circuit (such as an IC chip 103) housed in the socket 05a of the mechanical compression structure 05 to the pads 109 of the adaptor board 106 and to the pads 1 11 of the main circuit board 110 also known as pin map scrambling .
  • the adaptor board 106 can be rerouted so that its electrical pathway 112 does not have to connect to the corresponding land or pad 111 on the main circuit board 1 10 nor does it need to translate pitch.
  • pin 105b-1 on structure 105 can be connected to pad 107 - 1 on a first side 106a of the adaptor board 106 and pad 107-1 is rerouted via electrical pathway 112 to connect to the pad 107-6 rather than the first land 107- 5 on the second side 106b of the adaptor board 106.
  • the pad 107-6 is then connected to the pad 11 1 -2 on the opposing surface 1 10a of the main circuit board 1 10. Any possible re-routing can be effected in this way. In this way the present disclosure permits re-routing of circuitry as desired.
  • the numbers of pads for the adaptor board 106 and for the main circuit board 1 10 can vary as needed.
  • there is no need for a modified PC board 108 as in FIG. 5 as is also the case in the embodiment of FIG. 9.
  • FIG.6 B illustrates one possible illustration of an enhanced trace routing 112 of the present disclosure known as pin map scrambling.
  • trace routing 1 12 is possible in and around connecting land arrays on interface layers between the modified PC board 108 and the adaptor board 106 and between the modified PC board 108 and the main circuit board 110.
  • the modified PC board is not shown in the illustration of FIG. 6A. It is
  • FIG. 7 illustrates a possible embodiment according to the present disclosure of the modified PC board 108.
  • the PC board 108 is modified by placing lands with isotropic material on both surfaces of the PC board 108 as shown. While FIG. 7 shows one surface, it is understood that the other surface is similarly arranged.
  • the elastomeric material can be elastomeric paste placed on pads on both sides of the modified PC board 108.
  • FIG. 8 illustrates a second embodiment in which there is no need for a modified pc board 108 between the adaptor board 106 and the main circuit board 10.
  • the lands 107b on the surface of the adaptor board 106 facing the lands 111a of the main circuit board 110 are coated with a conductive elastomeric material 109.
  • the pads 109a and 109b respectively of a modified PC board 108 instead of coating the pads 109a and 109b respectively of a modified PC board 108, as was the case in FIG. 5 of the present disclosure, the lands 107b of the adaptor board 06 facing the lands 111a of the main circuit board 110 are coated with the elastomeric material 109.
  • FIG. 9 illustrates a third embodiment in which there is no need for a modified PC board 108 between the adaptor board 106 and the main circuit board 110.
  • the lands 111a on the surface of the main circuit board 110 facing the lands 107b of the adaptor board 106 are coated with a conductive elastomeric material 109.
  • the pads 109a and 109b respectively of a modified PC board 108 instead of coating the pads 109a and 109b respectively of a modified PC board 108, as was the case in FIG. 5 of the present disclosure, the lands 1 11a of the main circuit board 1 0 facing the lands 107b of the adaptor board 106 are coated with the elastomeric paste 109. While certain embodiments have been shown and described, it is distinctly understood that the invention is not limited thereto but may be otherwise embodied within the scope of the appended claims.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Geometry (AREA)

Abstract

The present disclosure provides for attaching and embedding a capacitance or a resistance directly in an adaptor board or an interposer board that is then connected to the main circuit board. The adaptor board can be connected to the main circuit board by soldering, electrically connecting it by a conductive elastomer connection, spring pins or by any other way that is known in the art.

Description

EMBEDDED COMPONENTS IN INTERPOSER BOARD FOR
IMPROVING POWER GAIN (DISTRIBUTION) AND POWER LOSS
(DISSIPATION) IN INTERCONNECT CONFIGURATION
RELATED APPLICATIONS This is a non provisional application of a provisional application serial number 61/276,661 by James V. Russell filed September 15, 2009.
BACKGROUND
1. Field
In attaching an electrical component to the bottom side and/or the top side of a printed circuit board (PCB), there is the problem of power loss due to the distance of the capacitance to the points on a corresponding IC for which it is intended. It is not possible to physically locate the capacitance directly to the contact pads on the printed circuit, which corresponds to the input output points of an integrated circuit or, in the case of a test board, the corresponding points of the test socket. Similarly, there is the problem of inadequate power dissipation due to the distance of a resistance to the electrical component. Again, it is not very likely to physically locate the resistance at the contact pads on the printed circuit board.
It would therefore be desirable to have a method and apparatus that provides for close proximate placement of the capacitance or of the resistance, which shall be referred to as a power modification component, since it either dissipates power (resistance) or better distributes power (capacitance) to the electrical component on a PCB to provide better power distribution or power dissipation. It would be even more desirable to be able to accomplish these goals without the need for replacing the main circuit board should a different circuit be desired at another time.
SUMMARY
The present disclosure provides for attaching and embedding a capacitance or a resistance directly in an adaptor board or an interposer board that is then connected to the main circuit board. The adaptor board can be connected to the main circuit board by soldering, electrically connecting it by a conductive elastomer connection, spring pins or by any other way that is known in the art.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded sectional view showing embedded components in an interposer board, which is located above for connection to the main circuit board in accordance with the present disclosure;
FIG. 2 is another embodiment of the present disclosure showing the vias aligned vertically one on top of another for a finer pitch;
FIG. 3 is another embodiment of the present disclosure in which the embedded component is aligned vertically within the adaptor board; FIG. 4 is an embodiment of the present disclosure showing an embedded resistance and an embedded capacitance within the adaptor board;
FIG. 5 is an exploded sectional view of another embodiment of the present disclosure;
FIG. 6A is an exploded sectional view of another embodiment of the present disclosure in which the number of pads is different from that of the embodiments of FIGS. 5, 8 and 9;
FIG.6 B illustrates the trace routing on one of either the interface sides of the main circuit board or of the adaptor board facing a side of the modified printed circuit board (modified pc board) where the trace routing is possible on the interface layers of the adaptor board and on the interface layers on the main circuit board in accordance with the embodiments of FIG.5, FIG 6A.FIG.8 and FIG. 9 of the present disclosure;
FIG. 7 is the modified PC board of the embodiment of FIG.5;
FIG.8 is another embodiment of the present disclosure in which there is no need for a modified PC board and the adaptor board has lands that are coated with conductive elastomeric material; and.
FIG.9 is another embodiment of the present disclosure in which there is no need for a modified PC board and the main circuit board has lands that are coated with conductive elastomeric material. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S) Referring to the drawings, FIG.1 shows an embodiment of the present disclosure in which power modification component 5 is embedded in an adaptor board 10. The embedded component 5 can be placed between vias 1 1 as shown in FIG. 1. In FIG. 1 , an embedded component 5 is placed between extended pads on the top of an adaptor board 10 with the component 5 embedded within the adaptor board 10. Connective material 7 is conductive material such as but not limited to solder, conductive epoxy or traditional plating techniques such as copper, silver, etc. connecting the ends 8 of the component n 5 to the underside of extended pads 9A. Similarly, vias 11 can be made through metallization by any traditional plating techniques such as copper, silver, etc., conductive epoxy, or solder. Thus the extended pads 9A are connected to the ends 8 of the component 5 by conductive material 7 and are offset from the vias
11 extending through the adaptor board 10 before making contact with the vias
12 of the main circuit board 15, which is attached or connected to the adaptor board 10. In this way, the main circuit board 15 can be reused and does not have to be discarded when an embedded component 5 wears out or the main circuit board 15 is used for another circuit configuration. Main circuit boards 15 are expensive and this is a practical way to reduce the power loss (dissipation) from a resistor (see FIGS. 3 and 4) or improve a power gain (distribution) for a capacitance by using embedded components 5 but still freeing the main circuit board 15 for future use at the same time. The adaptor board 10 can be
connected to the main circuit board 15 in any conventional way including soldering to it, connecting to it by use of a conductive elastomeric connection or spring pins or any other way that is know in the art.
FIG. 2 shows another embodiment of the present disclosure in which a finer pitch is possible by aligning blinds 11a on top of one another. In this embodiment, rather than have the pads of the interposer board extend and be offset from the vias 11 as in FIG.1 blinds 11a are vertically aligned with one set extending to permit the pads to make contact with the endpoints of the
embedded component 5 from the top of the adaptor board 10 and with another set extending upward from the pads at the bottom of the adaptor board 10. In this way a finer pitch is possible. Blinds 1 1a can be connected to the endpoints as described for connective material 7 for the embodiment in FIG. 1.
FIG.3 shows another embodiment of improved power dissipation by embedding a resistor 5a in an adaptor board 10. Component 5a is located between pads 9a and 9b and in effect acts as a via for the adaptor board 10 so that the electrical connection is through the resistance 5a embedded in the adaptor board 10. The pads 9 are connected to the resistance 5a through openings at the end points of resistance 5a and pads 9a and 9b respectively. The openings can be filled with solder, metallic plating or conductive epoxy. It is understood that the adaptor board 10 can be a multilayer PC board.
FIG. 4 shows another embodiment of the present disclosure with the embedded component 5 of FIG.1 and the embedded resistance 5a of FIG.3 together in the same adaptor board 10. It is understood that the adaptor board 10 can be a multilayer PC board.
FIG. 5 illustrates the electrical connector of the present disclosure in which the connector has a mechanical compression structure 105, an adaptor board 106 (it is understood that the adaptor board has embedded components in it not shown in FIG. 5) with connecting lands or pads107, and a modified PC board 108 with conductive elastomer material 109 formed on lands 109a and 109 B respectively on both sides of the modified PC board 108; and a main circuit board 1 10 having connecting lands 1 11. One non-limiting illustrative example of use of the compression structure 105 for the present disclosure includes a socket 105a in the compression structure 105 that is adapted to house a test circuit such as an integrated circuit (IC) chip 103. Pins 105b provide for making electrical connections to the IC chip 103 housed in socket 105a with pads 107 of the adaptor board 106. The connecting lands or pads 107 of the adaptor board 106 and of the connecting lands 11 1 of the main circuit board 10 are placed into contact with elastomer material 109 located on the lands or pads 109a and 109 b of the modified PC board 108 when the adaptor board 106 and the modified PC board 108 and the main circuit board 1 10 are compressed together by the mechanical compression structure 105. The elastomer material 109 can be either isotropic or anisotropic elastomer material. Thus the modified PC board 108 by placement of the elastomeric material 109 thereon serves as a pad defined connector 108. Alternatively, the modified PC board 108 can be replaced with an anisotropic sheet elastomer.
By compressing the boards together, it is possible to provide an electrical connection between the adaptor board 106 and the main circuit board 110 thereby adapting the pitch and/or footprint between the compression structure 105 and the main circuit board 110. By using lands on both sides of the modified PC board 108, a good connection is established be only placing conductive elastomeric material including but not limited to placing isotropic elastomeric material at pad locations or by placing anisotropic material throughout the entire surface of the connecting region as described in US Patent 6,854,985. An advantage of utilizing isotropic elastomeric material at pad locations is that great routing densities and low costs can be realized.
In addition to converting the pitch by connecting fine pads to coarse pads and vice verse, also known as pitch translation the present disclosure also provides for rerouting the electrical connections from the pins105b1- 6 connected to the connection points 104 of the test circuit (such as an IC chip 103) housed in the socket 05a of the mechanical compression structure 05 to the pads 109 of the adaptor board 106 and to the pads 1 11 of the main circuit board 110 also known as pin map scrambling . As shown in FIG. 6A , the adaptor board 106 can be rerouted so that its electrical pathway 112 does not have to connect to the corresponding land or pad 111 on the main circuit board 1 10 nor does it need to translate pitch. Thus pin 105b-1 on structure 105 can be connected to pad 107 - 1 on a first side 106a of the adaptor board 106 and pad 107-1 is rerouted via electrical pathway 112 to connect to the pad 107-6 rather than the first land 107- 5 on the second side 106b of the adaptor board 106. The pad 107-6 is then connected to the pad 11 1 -2 on the opposing surface 1 10a of the main circuit board 1 10. Any possible re-routing can be effected in this way. In this way the present disclosure permits re-routing of circuitry as desired. In addition the numbers of pads for the adaptor board 106 and for the main circuit board 1 10 can vary as needed. In addition, in this embodiment of FIG. 6A, there is no need for a modified PC board 108 as in FIG. 5 as is also the case in the embodiment of FIG. 9.
FIG.6 B illustrates one possible illustration of an enhanced trace routing 112 of the present disclosure known as pin map scrambling. As a result of the placement of the conductive elastomeric lands 109 on each side of the modified PC board 108 trace routing 1 12 is possible in and around connecting land arrays on interface layers between the modified PC board 108 and the adaptor board 106 and between the modified PC board 108 and the main circuit board 110. . The modified PC board is not shown in the illustration of FIG. 6A. It is
understood that this feature of the re-routing of the adaptor board 106 works for the embodiments of FIGS.5, 6a,8 and 9.
FIG. 7 illustrates a possible embodiment according to the present disclosure of the modified PC board 108. The PC board 108 is modified by placing lands with isotropic material on both surfaces of the PC board 108 as shown. While FIG. 7 shows one surface, it is understood that the other surface is similarly arranged. The elastomeric material can be elastomeric paste placed on pads on both sides of the modified PC board 108.
FIG. 8 illustrates a second embodiment in which there is no need for a modified pc board 108 between the adaptor board 106 and the main circuit board 10. Instead the lands 107b on the surface of the adaptor board 106 facing the lands 111a of the main circuit board 110 are coated with a conductive elastomeric material 109. Thus, instead of coating the pads 109a and 109b respectively of a modified PC board 108, as was the case in FIG. 5 of the present disclosure, the lands 107b of the adaptor board 06 facing the lands 111a of the main circuit board 110 are coated with the elastomeric material 109.
FIG. 9 illustrates a third embodiment in which there is no need for a modified PC board 108 between the adaptor board 106 and the main circuit board 110.
Instead the lands 111a on the surface of the main circuit board 110 facing the lands 107b of the adaptor board 106 are coated with a conductive elastomeric material 109. Thus, instead of coating the pads 109a and 109b respectively of a modified PC board 108, as was the case in FIG. 5 of the present disclosure, the lands 1 11a of the main circuit board 1 0 facing the lands 107b of the adaptor board 106 are coated with the elastomeric paste 109. While certain embodiments have been shown and described, it is distinctly understood that the invention is not limited thereto but may be otherwise embodied within the scope of the appended claims.

Claims

1. A method for providing improved power distribution or power
dissipation to an electrical component attached to a printed circuit board (PCB), the steps comprising:
embedding a power modification component inside of at least one adaptor board between vias of said adaptor board;
connecting or attaching said adaptor board to a main circuit board;
locating said one or more embedded components to extend over and beyond the vias or blinds of said main circuit board so that a portion of the adaptor board containing the embedded power modification component is located beyond where the via's or blinds are located to permit that via to conduct through the opening so that said power modification component will have a closer contact point to said electrical component thereby increasing power distribution or power dissipation, respectively.
2. The method according to claim 1 wherein said power modification component is a capacitance.
3. The method according to claim 1 wherein said power modification component is a resistance.
4. The method according to claim 1 wherein said vias are vertically aligned on top of one another to provide for a finer pitch.
5. An apparatus for improved power distribution or power dissipation to an electrical component attached to a main circuit board, comprising:
a power modification component embedded inside of at least one adaptor board between vias of said interposer board; said adaptor board being located between an electrical component and a main circuit board and said adaptor board being connected or attached to a main circuit board;
locating said one or more embedded components to extend over and beyond the vias or blinds of said main circuit board so that a portion of the adaptor board containing the embedded power modification component is located beyond where the vias or blinds are located to permit that via to conduct through the opening so that said power modification component will have a closer contact point to said electrical component thereby increasing power distribution or power dissipation, respectively.
6. The apparatus according to claim 5 wherein said power modification component is a capacitance.
7. The apparatus according to claim 5 wherein said power modification component is a resistance.
8. The apparatus according to claim 5 wherein instead of vias or blinds an opening exist within said adaptor board, said power modification component is a resistance and it is located and vertically aligned within said opening between the effected layers of said adaptor board, and said resistance is connected to a pad on said top surface and a pad on said bottom surface of said adaptor board
9. The apparatus according to claim 8 wherein said opening is filled with solder, copper plating or conductive epoxy.
10. The apparatus according to claim 5 wherein said blinds are vertically aligned on top of one another to provide for a finer pitch.
11. The apparatus according to claim 5 wherein said apparatus changes its pitch configuration by pitch translation.
12. The apparatus according to claim 11 wherein there is no pitch translation so that the vias of the adaptor board and the main circuit board are aligned with each other.
13. The apparatus according to claim 5 wherein said apparatus changes its pin configuration by pin map scrambling.
14. The apparatus according to claim 5 wherein a conductive elastomer provides an electrical connection between said adaptor board and said main circuit board wherein said elastomer is located on at least one surface of said main circuit board.
15. The apparatus according to claim 5 wherein a conductive elastomer provides an electrical connection between said adaptor board and said main circuit board wherein said elastomer is located on at least one surface of said adaptor board.
16. The apparatus according to claim 5 wherein a conductive elastomer provides an electrical connection between said adaptor board and said main circuit board wherein said elastomer is located on at least both surfaces of a printed circuit board disposed between said adaptor board and said main circuitboard. 7. The apparatus according to claim 5 wherein said embedded adaptor board is soldered to the main circuit board.
18. The apparatus according to claim 5 further comprising spring pins for electrically connecting said adaptor board to said main circuit board.
19. The apparatus according to claim 5 further comprising an electrical connector for providing an electrical connection between the adaptor board and the main circuit board, wherein
an interconnect medium having a conductive elastomer sheet provides an electrical connection between said adaptor board and said main circuit board and said elastomer sheet is located in between said adaptor board and said main circuit board.
20. The apparatus according to claim 5 wherein the electrical component is an IC test socket housing an IC.
21. The apparatus according to claim 5 wherein said adaptor board is a multilayer pc board.
22. The apparatus according to claim 5 wherein said adaptor board is a two sided pc board.
PCT/US2010/000049 2009-09-15 2010-01-08 Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration Ceased WO2011034555A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201080051570.3A CN102648667B (en) 2009-09-15 2010-01-08 Embedded components in interposer for improved power gain and loss in interconnect configurations
SG2012017810A SG179125A1 (en) 2009-09-15 2010-01-08 Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
KR1020187004487A KR20180020319A (en) 2009-09-15 2010-01-08 Embedded components in interposer board for improving power gain(distribution) and power loss(dissipation) in interconnect configuration
JP2012529728A JP2013504894A (en) 2009-09-15 2010-01-08 Built-in components on interposer boards that improve power gain (power supply) and power loss (power consumption) in interconnect structures
EP10817530A EP2478751A4 (en) 2009-09-15 2010-01-08 COMPONENTS INSERTED IN AN INTERCONNECT CARD FOR ENHANCED POWER GAIN (DISTRIBUTION) AND LOSS OF POWER (DISSIPATION) IN AN INTERCONNECTION CONFIGURATION
TW099128788A TWI563752B (en) 2009-09-15 2010-08-27 Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27666109P 2009-09-15 2009-09-15
US61/276,661 2009-09-15

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US (2) US9107330B2 (en)
EP (1) EP2478751A4 (en)
JP (3) JP2013504894A (en)
KR (2) KR20120068908A (en)
CN (2) CN102648667B (en)
MY (1) MY165331A (en)
SG (2) SG179125A1 (en)
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JP2016026385A (en) 2016-02-12
KR20180020319A (en) 2018-02-27
KR20120068908A (en) 2012-06-27
CN102648667A (en) 2012-08-22
MY165331A (en) 2018-03-21
US9107330B2 (en) 2015-08-11
TWI563752B (en) 2016-12-21
TW201112545A (en) 2011-04-01
JP2018093215A (en) 2018-06-14
CN106449589A (en) 2017-02-22
JP2013504894A (en) 2013-02-07
US20140268613A1 (en) 2014-09-18
EP2478751A1 (en) 2012-07-25
SG10201405623QA (en) 2014-11-27
CN102648667B (en) 2016-09-07
US20140283379A1 (en) 2014-09-25
SG179125A1 (en) 2012-04-27
EP2478751A4 (en) 2013-01-23

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