WO2012072610A1 - Security document and method of manufacturing security document - Google Patents

Security document and method of manufacturing security document Download PDF

Info

Publication number
WO2012072610A1
WO2012072610A1 PCT/EP2011/071237 EP2011071237W WO2012072610A1 WO 2012072610 A1 WO2012072610 A1 WO 2012072610A1 EP 2011071237 W EP2011071237 W EP 2011071237W WO 2012072610 A1 WO2012072610 A1 WO 2012072610A1
Authority
WO
WIPO (PCT)
Prior art keywords
base layer
patch
layer
security document
cover layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/071237
Other languages
French (fr)
Inventor
Mikko Lankinen
Taru SYRJÄNEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales DIS France SA
Original Assignee
Gemalto SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemalto SA filed Critical Gemalto SA
Priority to BR112013013611A priority Critical patent/BR112013013611A2/en
Priority to JP2013541319A priority patent/JP5941057B2/en
Priority to ES11788471.8T priority patent/ES2533651T3/en
Priority to EP11788471.8A priority patent/EP2646954B1/en
Priority to US13/991,167 priority patent/US9858522B2/en
Priority to DK11788471.8T priority patent/DK2646954T3/en
Priority to CN201180066769.8A priority patent/CN103339643B/en
Publication of WO2012072610A1 publication Critical patent/WO2012072610A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17—Dry transfer
    • B44C1/1712—Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
    • B44C1/1729—Hot stamping techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Definitions

  • This invention relates to a security document such as an identity card or driving licence, for instance.
  • Security documents comprising an electronic module are known in the art.
  • the electronic module is embedded into the material of the security document, in many cases in such a way that it can not be visually detected from a surface of the security document.
  • a problem with the above described prior art solution is that the material of the security document may crack in an area close to the electronic module. Such cracking is caused by internal stress in the material of the security document.
  • One reason for the internal stress is that the material of the security docu- ment and the material of the electronic module have different thermal expansion coefficients, in other words, the amount of expansion and shrinkage is different when temperature changes occur.
  • An object of the present invention is to solve the above mentioned prob- lem and to provide a security document which has improved properties in order to avoid cracking. This object is achieved with a security document according to independent claim 1 and a method of manufacturing according to independent claim 9. The preferred embodiments of the invention are disclosed in the dependent claims.
  • the invention is based on the idea of hot stamping a patch between a base layer comprising an electronic module and a cover layer covering the base layer and the electronic module.
  • the hot stamped patch is adapted to prevent the base layer and the cover layer from attaching to each other in a perimeter area around the electronic module.
  • An advantage of the invention is that internal stress and cracking of the security document can be avoided. Further, hot stamping method is free of solvents and other harmful substances.
  • Figure 1 shows a security document according to an embodiment of the invention
  • Figures 2a and 2b show a method for manufacturing the security docu- ment of Figure 1 ;
  • Figure 2c shows a detail of the security document of Figure 1 ; and Figures 3a and 3b show another method for manufacturing a security document.
  • Figure 1 shows a security document 1 comprising a photograph 2 of the holder, written data 3 with information about the holder, and an electronic module 4, which is embedded into the material of the security document 1 .
  • the security document 1 is seen from a direction perpendicular to the plane of the security document 1 .
  • Figure 2a shows a base layer 10, an electronic module 4, a first cover layer 1 1 and a second cover layer 12 seen from a direction parallel to the plane of the security document 1 .
  • the base layer 10 includes a through hole 15 extending from a first side of the base layer 10 to a second side of the base layer 10.
  • the electronic module 4 is inserted into the through hole 15.
  • the size and form of the electronic module 4 substantially correspond to the size and form of the through hole 15.
  • the first cover layer 1 1 has been positioned adjacent the first side of the base layer 10 and the second cover layer 12 has been positioned adjacent the second side of the base layer 10.
  • the first cover layer 1 1 comprises a first patch 21 , which has been hot stamped on the side of the first cover layer 1 1 facing the first side of the base layer 10.
  • the second cover layer 12 comprises a second patch 22, which has been hot stamped on the side of the second cover layer 12 facing the second side of the base layer 10.
  • the first patch 21 has been transferred from a carrier film to the first cover layer 1 1 using a heated hot stamping die.
  • the second patch 22 has been transferred from a carrier film to the second cover layer 12 in a similar way.
  • Hot stamping is a known dry printing method so details of the hot stamping process are not discussed herein.
  • Figure 2b shows a finished security document 1.
  • the first cover layer 1 1 has been attached on the first side of the base layer 10, and the second cover layer 12 has been attached on the second side of the base layer 10.
  • the first cover layer 1 1 and the second cover layer 12 are laminated together.
  • the electronic module 4 is interposed between the first cover layer 1 1 and the second cover layer 12.
  • the first patch 21 is dimensioned and located such that it surrounds the through hole 15 and covers a perimeter area around the through hole 15 on the first side of the base layer 10, thereby pre- venting attachment of the first side of the base layer 10 to the first cover layer 1 1 at the perimeter area.
  • the second patch 22 is dimensioned and located such that it surrounds the through hole 15 and covers a perimeter area around the through hole 15 on the second side of the base layer 10, thereby preventing attachment of the second side of the base layer 10 to the second cover layer 12 at the perimeter area.
  • Figure 2c shows the through hole 15 and the second patch 22 from a direction perpendicular to the plane of the second patch 22.
  • the area of the second patch 22 is larger than the area of the through hole 15, and the second patch 22 is located such that perimeter of the second patch 22 surrounds the through hole 15.
  • a perimeter area around the through hole 15 is denoted with reference sign 54, and the width of the perimeter area is denoted with w pa .
  • Figures 2a and 2b show that the area of the electronic module 4 is smaller on the first side of the base layer 10 than on the second side of the base layer 10. Also the area of the first patch 21 is smaller than the area of the second patch 22. In an alternative embodiment the areas of the first patch and the second patch are equal even though the area of the electronic module is smaller on the first side of the base layer than on the second side of the base layer. In said alter- native embodiment width of the perimeter area is greater on the first side of the base layer than on the second side of the base layer.
  • the first patch 21 is a thin foil made of polymethylmethacrylate, which is a transparent thermoplastic material. Thickness of the first patch 21 may be 1 to 5 pm. In alternative embodiments polyethylene terephthalate (PET) or other thermoplastic materials may be used. In further alternative embodiments the first patch may comprise a metal foil, such as an aluminium foil, a copper foil or a silver foil. It is also possible to combine above mentioned materials, for example by manufacturing the first patch from a laminate or composite comprising at least one thermo- plastic foil and at least one metallic foil.
  • PET polyethylene terephthalate
  • the first patch may comprise a metal foil, such as an aluminium foil, a copper foil or a silver foil. It is also possible to combine above mentioned materials, for example by manufacturing the first patch from a laminate or composite comprising at least one thermo- plastic foil and at least one metallic foil.
  • the thickness of the first patch may be much bigger than 5 pm.
  • a first patch having a thickness of 20 pm or even bigger is visually detectable which in many cases is a negative feature.
  • the material and the thickness of the second patch 22 may be identical to the material and the thickness of the first patch 21 .
  • the thickness of the second patch 22 may be different than the thickness of the first patch 21
  • the material of the second patch 22 may be different than the material of the first patch 21 .
  • FIGS 3a and 3b show an alternative method for manufacturing a security document.
  • the patches are not hot stamped on the cover layers but on the base layer comprising the electronic module.
  • Figure 3a shows a base layer 10', an electronic module 4', a first cover layer 1 1 ' and a second cover layer 12'.
  • the base layer 10' includes a through hole 15' extending from a first side of the base layer 10' to a second side of the base layer 10'.
  • the electronic module 4' has already been inserted into the through hole 15'.
  • the size and form of the electronic module 4' substantially correspond to the size and form of the through hole 15'.
  • the base layer 10' comprises a first patch 21 ', which has been hot stamped on the side of the base layer 10' facing the first cover layer 1 1 '.
  • the base layer 10' also comprises a second patch 22', which has been hot stamped on the side of the base layer 10' facing the second cover layer 12'.
  • the electronic module 4' is located between the first patch 21 ' and the second patch 22'.
  • the electronic module 4' comprises a protective layer 44' which extends both on a first side and a second side of the electronic module 4', the first side being the side facing the first cover layer 1 1 ' and the second side being the side facing the second cover layer 12'.
  • the protective layer 44' has been provided on the electronic module 4' prior to inserting the electronic module 4' into the through hole 15'.
  • the protective layer 44' is adapted to protect the electronic module 4' during the hot stamping process which is used to provide the first patch 21 ' and the second patch 22' on the base layer 10'.
  • the protective layer 44' may comprise polycarbonate.
  • the electronic module comprises a protective layer only on one side thereof.
  • One-sided protective layer may be used for example when one side of the electronic module can withstand less heat and/or pressure than the other side of the electronic module.
  • a protective layer may be a layer whose area is substantially bigger than the area of the first patch.
  • the area of the protective layer is the same as the area of the security document.
  • Expansion and shrinkage of an electronic module may cause some cracking in a protective layer in an area close to the electronic module.
  • a patch between the protective layer and a cover layer prevents the cracking from advancing towards an outer surface of the security document.
  • Figure 3b shows a finished security document 1 '.
  • the first cover layer 1 1 ' has been attached on the first side of the base layer 10', and the second cover layer 12' has been attached on the second side of the base layer 10'.
  • the electronic module 4' is interposed between the first cover layer 1 1 ' and the second cover layer 12'.
  • the first patch 21 ' is dimensioned and located such that it surrounds the through hole 15' and covers a perimeter area around the through hole 15' on the first side of the base layer 10', thereby preventing attachment of the first side of the base layer 10' to the first cover layer 1 1 ' at the perimeter area.
  • the second patch 22' is dimensioned and located such that it surrounds the through hole 15' and covers a perimeter area around the through hole 15' on the second side of the base layer 10', thereby preventing attachment of the second side of the base layer 10' to the second cover layer 12' at the perimeter area.
  • the surface area of the electronic module 4' on the first side of the base layer 10' is equal to the surface area of the electronic module 4' on the second side of the base layer 10'. Accordingly the area of the first patch 21 ' is equal to the area of the second patch 22'.
  • a patch is hot stamped on a base layer containing an electronic module with no protective layer.
  • this embodiment requires an electronic module which is sufficiently heat resistant and pressure proof.
  • Both the security document of Figure 2b and the security document of Figure 3b comprise a first patch on the first side of the base layer and a second patch on the second side of the base layer.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Packages (AREA)

Abstract

A security document (1, 1'), comprising :a base layer (10, 10')having a through hole (15, 15') extending from a first side of the base layer (10, 10') to a second side of the base layer (10, 10');a first cover layer (11, 11') attached on the first side of the base layer (10, 10');a second cover layer (12, 12') attached on the second side of the base layer (10, 10'); and an electronic module (4, 4')arranged in said through hole (15, 15').The security document (1, 1')further comprises a first patch (21, 21')attached to the security document (1, 1')by hot stamping and located be- tween the base layer(10, 10')and the first cover layer (11, 11'), the first patch (21, 21')surrounding the through hole (15, 15') and covering a perimeter area around the through hole (15, 15') on the first side of the base layer (10, 10'), thereby preventing attachment of the base layer (10, 10') to the first cover layer (11, 11') in the region of the perimeter area.

Description

SECURITY DOCUMENT AND METHOD OF MANUFACTURING
SECURITY DOCUMENT
FIELD OF THE INVENTION
This invention relates to a security document such as an identity card or driving licence, for instance.
BACKGROUND OF THE INVENTION
Security documents comprising an electronic module are known in the art. The electronic module is embedded into the material of the security document, in many cases in such a way that it can not be visually detected from a surface of the security document.
A problem with the above described prior art solution is that the material of the security document may crack in an area close to the electronic module. Such cracking is caused by internal stress in the material of the security document. One reason for the internal stress is that the material of the security docu- ment and the material of the electronic module have different thermal expansion coefficients, in other words, the amount of expansion and shrinkage is different when temperature changes occur.
BRIEF DESCRIPTION OF THE INVENTION
An object of the present invention is to solve the above mentioned prob- lem and to provide a security document which has improved properties in order to avoid cracking. This object is achieved with a security document according to independent claim 1 and a method of manufacturing according to independent claim 9. The preferred embodiments of the invention are disclosed in the dependent claims.
The invention is based on the idea of hot stamping a patch between a base layer comprising an electronic module and a cover layer covering the base layer and the electronic module. The hot stamped patch is adapted to prevent the base layer and the cover layer from attaching to each other in a perimeter area around the electronic module.
An advantage of the invention is that internal stress and cracking of the security document can be avoided. Further, hot stamping method is free of solvents and other harmful substances.
BRIEF DESCRIPTION OF THE DRAWINGS
In the following the invention will be described in greater detail by means of preferred embodiments with reference to the attached drawings, in which
Figure 1 shows a security document according to an embodiment of the invention;
Figures 2a and 2b show a method for manufacturing the security docu- ment of Figure 1 ;
Figure 2c shows a detail of the security document of Figure 1 ; and Figures 3a and 3b show another method for manufacturing a security document.
DETAILED DESCRIPTION OF THE INVENTION
Figure 1 shows a security document 1 comprising a photograph 2 of the holder, written data 3 with information about the holder, and an electronic module 4, which is embedded into the material of the security document 1 . In Figure 1 the security document 1 is seen from a direction perpendicular to the plane of the security document 1 .
Figure 2a shows a base layer 10, an electronic module 4, a first cover layer 1 1 and a second cover layer 12 seen from a direction parallel to the plane of the security document 1 . The base layer 10 includes a through hole 15 extending from a first side of the base layer 10 to a second side of the base layer 10. The electronic module 4 is inserted into the through hole 15. The size and form of the electronic module 4 substantially correspond to the size and form of the through hole 15. The first cover layer 1 1 has been positioned adjacent the first side of the base layer 10 and the second cover layer 12 has been positioned adjacent the second side of the base layer 10.
The first cover layer 1 1 comprises a first patch 21 , which has been hot stamped on the side of the first cover layer 1 1 facing the first side of the base layer 10. The second cover layer 12 comprises a second patch 22, which has been hot stamped on the side of the second cover layer 12 facing the second side of the base layer 10. In the hot stamping process the first patch 21 has been transferred from a carrier film to the first cover layer 1 1 using a heated hot stamping die. The second patch 22 has been transferred from a carrier film to the second cover layer 12 in a similar way. Hot stamping is a known dry printing method so details of the hot stamping process are not discussed herein.
Figure 2b shows a finished security document 1. The first cover layer 1 1 has been attached on the first side of the base layer 10, and the second cover layer 12 has been attached on the second side of the base layer 10. In an em- bodiment the base layer 10, the first cover layer 1 1 and the second cover layer 12 are laminated together. The electronic module 4 is interposed between the first cover layer 1 1 and the second cover layer 12. The first patch 21 is dimensioned and located such that it surrounds the through hole 15 and covers a perimeter area around the through hole 15 on the first side of the base layer 10, thereby pre- venting attachment of the first side of the base layer 10 to the first cover layer 1 1 at the perimeter area. The second patch 22 is dimensioned and located such that it surrounds the through hole 15 and covers a perimeter area around the through hole 15 on the second side of the base layer 10, thereby preventing attachment of the second side of the base layer 10 to the second cover layer 12 at the perimeter area.
Figure 2c shows the through hole 15 and the second patch 22 from a direction perpendicular to the plane of the second patch 22. The area of the second patch 22 is larger than the area of the through hole 15, and the second patch 22 is located such that perimeter of the second patch 22 surrounds the through hole 15. A perimeter area around the through hole 15 is denoted with reference sign 54, and the width of the perimeter area is denoted with wpa.
Figures 2a and 2b show that the area of the electronic module 4 is smaller on the first side of the base layer 10 than on the second side of the base layer 10. Also the area of the first patch 21 is smaller than the area of the second patch 22. In an alternative embodiment the areas of the first patch and the second patch are equal even though the area of the electronic module is smaller on the first side of the base layer than on the second side of the base layer. In said alter- native embodiment width of the perimeter area is greater on the first side of the base layer than on the second side of the base layer.
The first patch 21 is a thin foil made of polymethylmethacrylate, which is a transparent thermoplastic material. Thickness of the first patch 21 may be 1 to 5 pm. In alternative embodiments polyethylene terephthalate (PET) or other thermoplastic materials may be used. In further alternative embodiments the first patch may comprise a metal foil, such as an aluminium foil, a copper foil or a silver foil. It is also possible to combine above mentioned materials, for example by manufacturing the first patch from a laminate or composite comprising at least one thermo- plastic foil and at least one metallic foil.
In alternative embodiments the thickness of the first patch may be much bigger than 5 pm. Technically it is quite possible to use a first patch having a thickness of 20 pm or even bigger. However, a thick first patch is visually detectable which in many cases is a negative feature.
The material and the thickness of the second patch 22 may be identical to the material and the thickness of the first patch 21 . In an alternative embodiment the thickness of the second patch 22 may be different than the thickness of the first patch 21 , and/or the material of the second patch 22 may be different than the material of the first patch 21 .
Figures 3a and 3b show an alternative method for manufacturing a security document. In this alternative method the patches are not hot stamped on the cover layers but on the base layer comprising the electronic module.
Figure 3a shows a base layer 10', an electronic module 4', a first cover layer 1 1 ' and a second cover layer 12'. The base layer 10' includes a through hole 15' extending from a first side of the base layer 10' to a second side of the base layer 10'. The electronic module 4' has already been inserted into the through hole 15'. The size and form of the electronic module 4' substantially correspond to the size and form of the through hole 15'.
The base layer 10' comprises a first patch 21 ', which has been hot stamped on the side of the base layer 10' facing the first cover layer 1 1 '. The base layer 10' also comprises a second patch 22', which has been hot stamped on the side of the base layer 10' facing the second cover layer 12'. The electronic module 4' is located between the first patch 21 ' and the second patch 22'. The electronic module 4' comprises a protective layer 44' which extends both on a first side and a second side of the electronic module 4', the first side being the side facing the first cover layer 1 1 ' and the second side being the side facing the second cover layer 12'. The protective layer 44' has been provided on the electronic module 4' prior to inserting the electronic module 4' into the through hole 15'. Alternatively it is possible to provide the protective layer on the electronic module after the electronic module has been inserted into the through hole. The protective layer 44' is adapted to protect the electronic module 4' during the hot stamping process which is used to provide the first patch 21 ' and the second patch 22' on the base layer 10'. The protective layer 44' may comprise polycarbonate.
In an alternative embodiment the electronic module comprises a protective layer only on one side thereof. One-sided protective layer may be used for example when one side of the electronic module can withstand less heat and/or pressure than the other side of the electronic module.
A protective layer may be a layer whose area is substantially bigger than the area of the first patch. In an embodiment the area of the protective layer is the same as the area of the security document.
Expansion and shrinkage of an electronic module may cause some cracking in a protective layer in an area close to the electronic module. However, a patch between the protective layer and a cover layer prevents the cracking from advancing towards an outer surface of the security document.
Figure 3b shows a finished security document 1 '. The first cover layer 1 1 ' has been attached on the first side of the base layer 10', and the second cover layer 12' has been attached on the second side of the base layer 10'. The electronic module 4' is interposed between the first cover layer 1 1 ' and the second cover layer 12'. The first patch 21 ' is dimensioned and located such that it surrounds the through hole 15' and covers a perimeter area around the through hole 15' on the first side of the base layer 10', thereby preventing attachment of the first side of the base layer 10' to the first cover layer 1 1 ' at the perimeter area. The second patch 22' is dimensioned and located such that it surrounds the through hole 15' and covers a perimeter area around the through hole 15' on the second side of the base layer 10', thereby preventing attachment of the second side of the base layer 10' to the second cover layer 12' at the perimeter area.
The surface area of the electronic module 4' on the first side of the base layer 10' is equal to the surface area of the electronic module 4' on the second side of the base layer 10'. Accordingly the area of the first patch 21 ' is equal to the area of the second patch 22'.
In a further alternative embodiment a patch is hot stamped on a base layer containing an electronic module with no protective layer. Naturally this embodiment requires an electronic module which is sufficiently heat resistant and pressure proof.
Both the security document of Figure 2b and the security document of Figure 3b comprise a first patch on the first side of the base layer and a second patch on the second side of the base layer. Alternatively it is possible to provide a security document having a patch only on one side of the base layer.
It will be obvious to a person skilled in the art that the inventive concept can be implemented in various ways. The invention and its embodiments are not limited to the examples described above but may vary within the scope of the claims.

Claims

1. A security document (1 , 1 '), comprising:
a base layer (10, 10') having a through hole (15, 15') extending from a first side of the base layer (10, 10') to a second side of the base layer (10, 10');
a first cover layer (11, 11') attached on the first side of the base layer
(10, 10');
a second cover layer (12, 12') attached on the second side of the base layer (10, 10'); and
an electronic module (4, 4') arranged in said through hole (15, 15'), characterized in that
the security document (1, 1') further comprises a first patch (21, 21') attached to the security document (1, 1') by hot stamping and located between the base layer (10, 10') and the first cover layer (11, 11'), the first patch (21, 21') surrounding the through hole (15, 15') and covering a perimeter area around the through hole (15, 15') on the first side of the base layer (10, 10'), thereby preventing attachment of the base layer (10, 10') to the first cover layer (11, 11') in the region of the perimeter area.
2. A security document (1, 1') according to claim 1, characterized in that the first patch (21 , 21 ') is a thin foil having a thickness of 1 to 5 pm.
3. A security document (1, 1') according to claim 1 or 2, characterized in that the first patch (21 , 21') comprises a foil made of thermoplastic material.
4. A security document (1, 1') according to claim 3, characterized in that the thermoplastic material is polymethylmethacrylate.
5. A security document (1, 1') as claimed in any one of preceding claims, characterized in that the first patch (21 , 21 ') comprises an aluminium foil.
6. A security document (1, 1') according to claim 1 or 2, characterized in that the first patch (21 , 21') comprises a plurality of foils laminated together.
7. A security document (1') as claimed in any one of preceding claims, characterized in that there is a protective layer (44') on the electronic module (4'), the protective layer (44') being adapted to protect the electronic module (4') during a hot stamping process.
8. A security document (1, 1') as claimed in any one of preceding claims, characterized in that the security document (1 , 1 ') further com- prises a second patch (22, 22') attached to the security document (1, 1') by hot stamping and located between the base layer (10, 10') and the second cover layer (12, 12'), the second patch (22, 22') surrounding the through hole (15, 15') and covering a perimeter area around the through hole (15, 15') on the second side of the base layer (10, 10'), thereby preventing attachment of the base layer (10, 10') to the second cover layer (12, 12') in the region of the perimeter area.
9. A method of manufacturing a security document (1, 1'), comprising: providing a base layer (10, 10'), a first cover layer (11, 11'), a second cover layer (12, 12') and an electronic module (4, 4'), the base layer (10, 10') having a through hole (15, 15') extending from a first side of the base layer (10, 10') to a second side of the base layer (10, 10');
arranging the electronic module (4, 4') in said through hole (15, 15'); attaching the base layer (10, 10'), the first cover layer (11, 11') and the second cover layer (12, 12') to each other such that the base layer (10, 10') is interposed between the first cover layer (11, 11') and the second cover layer (12, 12');
characterized in that the method further comprises:
providing a first patch (21, 21');
attaching the first patch (21, 21') between the base layer (10, 10') and the first cover layer (11, 11') by hot stamping such that in a finished security docu- ment (1, 1') the first patch (21, 21') surrounds the through hole (15, 15') and covers a perimeter area around the through hole (15, 15') on the first side of the base layer (10, 10'), thereby preventing attachment of the base layer (10, 10') to the first cover layer (11, 11 ') in the region of the perimeter area.
10. A method according to claim 9, characterized in that the first patch (21 , 21') is hot stamped to the first cover layer (11, 11') before attaching the first cover layer (11, 11 ') to the base layer (10, 10').
11. A method according to claim 9, characterized in that the method further comprises: providing a protective layer (44') on the electronic module (4'), the protective layer (44') being adapted to protect the electronic module (4') during a hot stamping process, and subsequently inserting the electronic module (4') in the through hole (15');
wherein the first patch (21') is hot stamped to the base layer (10') while the electronic module (4') is in the through hole (15').
12. A method according to claim 11, characterized in that the protective layer (44') comprises polycarbonate.
13. A method as claimed in any one of claims 9 to 12, character- i zed in that the base layer (10, 10'), the first cover layer (11, 11'), and the second cover layer (12, 12') comprise polycarbonate.
PCT/EP2011/071237 2010-12-02 2011-11-29 Security document and method of manufacturing security document Ceased WO2012072610A1 (en)

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BR112013013611A BR112013013611A2 (en) 2010-12-02 2011-11-29 security document, and method for making a security document
JP2013541319A JP5941057B2 (en) 2010-12-02 2011-11-29 How to produce security documents
ES11788471.8T ES2533651T3 (en) 2010-12-02 2011-11-29 Security document and security document manufacturing procedure
EP11788471.8A EP2646954B1 (en) 2010-12-02 2011-11-29 Security document and method of manufacturing security document
US13/991,167 US9858522B2 (en) 2010-12-02 2011-11-29 Security document and method of manufacturing security document
DK11788471.8T DK2646954T3 (en) 2010-12-02 2011-11-29 Security document and method of producing security document
CN201180066769.8A CN103339643B (en) 2010-12-02 2011-11-29 Secure file and the method manufacturing secure file

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EP10306339A EP2461275A1 (en) 2010-12-02 2010-12-02 Security Document and method of manufacturing security document
EP10306339.2 2010-12-02

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CN103339643A (en) 2013-10-02
US20140175176A1 (en) 2014-06-26
PT2646954E (en) 2015-01-05
BR112013013611A2 (en) 2016-09-06
US9858522B2 (en) 2018-01-02
DK2646954T3 (en) 2014-12-15
EP2646954B1 (en) 2014-10-22
JP2014503386A (en) 2014-02-13
EP2646954A1 (en) 2013-10-09
ES2533651T3 (en) 2015-04-13
EP2461275A1 (en) 2012-06-06
CN103339643B (en) 2016-07-06

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