WO2012092808A1 - 一种led模组及照明装置 - Google Patents

一种led模组及照明装置 Download PDF

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Publication number
WO2012092808A1
WO2012092808A1 PCT/CN2011/084164 CN2011084164W WO2012092808A1 WO 2012092808 A1 WO2012092808 A1 WO 2012092808A1 CN 2011084164 W CN2011084164 W CN 2011084164W WO 2012092808 A1 WO2012092808 A1 WO 2012092808A1
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Prior art keywords
led
light
led chip
led module
chip
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PCT/CN2011/084164
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English (en)
French (fr)
Inventor
周宇
赵西刚
薛信燊
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Civilight Shenzhen Semiconductor Lighting Co Ltd
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Civilight Shenzhen Semiconductor Lighting Co Ltd
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Application filed by Civilight Shenzhen Semiconductor Lighting Co Ltd filed Critical Civilight Shenzhen Semiconductor Lighting Co Ltd
Priority to JP2013547796A priority Critical patent/JP2014502030A/ja
Priority to US13/978,418 priority patent/US20140001499A1/en
Priority to EP11854737.1A priority patent/EP2662611A4/en
Publication of WO2012092808A1 publication Critical patent/WO2012092808A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention belongs to the field of illumination, and in particular relates to an LED module and a lighting device.
  • LED As the fourth-generation lighting source, LED has the advantages of low energy consumption, small size, environmental protection, strong resistance to harsh environments, long service life and good safety. It is known as the green light source of the 21st century. At present, the industry produces a large number of LED lights or LED modules of different powers and different color temperatures according to different market demands to meet various needs in production and life. However, the production of LED lamps or LED modules with different powers and different color temperatures requires different processes and processes, and different materials and production equipment are used. These different processes, materials and equipment cannot be used universally, resulting in serious waste of resources. low efficiency.
  • An object of the embodiments of the present invention is to provide an LED module, which aims to solve the problem of low production efficiency of the existing LED module.
  • An LED module includes a slidable LED bracket and a detachable driving circuit.
  • the LED bracket is provided with a plurality of LED lighting units of different powers and different color temperatures.
  • the LED lighting unit includes an LED chip and an encapsulation layer disposed outside the LED chip; the driving circuit is connected to the LED chip to drive any one or more LED chips to emit light.
  • Another object of the embodiments of the present invention is to provide a lighting device including a lighting assembly, which is the LED module described above.
  • a plurality of LED lighting units of different powers and different color temperatures are integrated on a slavable LED bracket, and any one or more LED lighting units can be illuminated by the detachable driving circuit to obtain the required power. , color and color temperature of the outgoing light; at the same time due to the cleavability of the LED bracket and the detachability of the drive circuit,
  • the LED module can be arbitrarily cut to obtain module units of different illuminating color temperature and power, and the degree of freedom of subsequent use is high.
  • the LED module is made by a process, which avoids the investment of various materials and production equipment, and does not need to adopt complicated and complicated process, thereby solving the problem of waste of resources in the production process and low production efficiency.
  • FIG. 1 is a schematic structural view of an LED module according to a second embodiment of the present invention.
  • FIG. 2 is a schematic structural view of an LED module according to a third embodiment of the present invention.
  • FIG 3 is a schematic structural view of an LED module according to a fourth embodiment of the present invention.
  • the embodiment of the invention adopts a cleavable LED bracket to carry a plurality of LED light-emitting units with different powers and different color temperatures, and illuminates any LED light-emitting unit through a detachable driving circuit, so that light of different power and color temperature can be obtained, and at the same time,
  • the cleavability of the bracket and the detachability of the drive circuit such that The LED module can be arbitrarily cut to obtain a module unit of desired illuminating color temperature and power.
  • the embodiment of the invention provides an LED module, comprising a cleavable LED bracket and a detachable driving circuit; the LED bracket is provided with a plurality of LED lighting units with different powers and different color temperatures, and the LED lighting unit comprises an LED chip and An encapsulation layer disposed outside the LED chip; the driving circuit is coupled to the LED chip to drive any one or more of the LED chips to emit light.
  • a plurality of LED lighting units of different powers and different color temperatures are integrated on a slavable LED bracket, and any one or more LED lighting units can be illuminated by the detachable driving circuit to obtain the required power. , color and color temperature of the outgoing light; at the same time due to the cleavability of the LED bracket and the detachability of the drive circuit,
  • the LED module can be arbitrarily cut to obtain module units of different illuminating color temperature and power, and the degree of freedom of subsequent use is high.
  • the LED module can be manufactured by a process, which avoids the investment of various materials and production equipment, and does not need to adopt complicated process, thereby solving the problem of waste of resources in the production process and low production efficiency.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the LED module provided in this embodiment includes an LED bracket and a driving circuit.
  • the LED bracket carries a plurality of LED chips, and an encapsulation layer is disposed outside the LED chip, and the plurality of LED chips may share an integral encapsulation layer, or each of the LED chips.
  • the LED chip corresponds to one encapsulation layer, and each LED chip and its corresponding encapsulation layer constitute an LED illumination unit, and the LED chip is driven by the driving circuit to emit light.
  • the LED bracket in this embodiment is designed as an arbitrarily cut support structure, and the drive circuit is designed to be arbitrarily split. Circuit structure.
  • the LED bracket carries a plurality of LED lighting units of various powers and multiple color temperatures, and the plurality of LED lighting units are independent of each other, and electrical connections are made between adjacent LED lighting units, and the driving circuit can drive any one or any of a plurality of The LED chips emit light, thereby obtaining a variety of power, a variety of colors and color temperature of the outgoing light.
  • the LED bracket may be a bracket structure with a groove or a boss for placing the LED chip, and also for dispensing the glue, and each groove or boss may be placed one or more. LED chips.
  • the LED bracket has a recess, the LED chip is placed in the recess, and an integral light transmissive layer, that is, an encapsulation layer, can be disposed on the entire surface of the LED bracket to cover all the LED chips; A package layer is disposed above a groove.
  • the LED bracket has a boss, the LED chip is placed on the boss, and each boss can be dispensed to form an encapsulation layer, or a plurality of bosses can share a large area of the encapsulation layer. According to the actual production process.
  • the LED bracket may also be a flat plate structure, and the LED chip is directly fixed on the flat plate bracket, and the corresponding encapsulation layer may also be a plurality of mutually independent light transmissive layers disposed one-to-one or one-to-many with the LED chip, or may be A one-piece structure covers a large area of the light-transmissive layer of the LED chip.
  • the LED module provided in this embodiment can illuminate any one or more LED lighting units according to actual needs, and obtain the outgoing light of the desired color, power and color temperature. It is also possible to arbitrarily cut the LED bracket to obtain the required module unit, and since the driving circuit can be arbitrarily split, the module unit after cutting can still work normally. For the module unit obtained after cutting, any one or more LED lighting units can be illuminated by the driving circuit to obtain the outgoing light of the required power, the desired color and the color temperature.
  • the single light-emitting unit obtained by cutting the LED module may be a single-core structure or a multi-core structure.
  • the LED module can be manufactured by a process, which avoids the investment of various materials and production equipment, and does not need to adopt complicated process, thereby solving the problem of waste of resources in the production process and low production efficiency.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • FIG. 1 is a schematic structural view of an LED module according to a second embodiment of the present invention. For convenience of description, only parts related to the embodiment are shown.
  • the surface of the LED chip in order to obtain a plurality of colors and color temperature of the emitted light, the surface of the LED chip may be coated with a phosphor, and specifically, the surface of the LED chip may be coated with a phosphor, or may be on the surface of all the LED chips. Coating the phosphor.
  • the light emitted by the LED chip excites the phosphor to fluoresce, and the excitation light and the fluorescent light are mixed to form an outgoing light of various colors and color temperatures.
  • the LED chips may all be blue LED chips, and the blue excitation light excites the phosphor to emit yellow fluorescence, and the blue light and the yellow light mix to form white light.
  • the surface of the blue LED chip is covered with two different phosphors to obtain two white LED lighting units of different color temperatures. Some of the LED chips emit blue light, and the white light (DW) light is obtained after the phosphor is excited, and the color temperature is 5000 ⁇ 10000K; the other part of the LED chip emits blue light, and the warm white (WW) light is obtained after the phosphor is excited, and the color temperature is 2400 ⁇ 3500K.
  • DW white light
  • WW warm white
  • the positive white light emitting unit and the warm white light emitting unit may be alternately arranged alternately.
  • the LED module can be used as a whole illumination component, and any illumination unit can be illuminated according to actual needs. It can also be cut into a single low-power positive white or warm white light source; it can also be cut in rows (1*3, 1*4, etc.) to obtain high-power positive white or warm white module units; Multi-column (2*3, 3*5, etc.) cutting, obtaining a module unit with a mixture of positive white light and warm white light. After multiple positive white light and warm white light emitting units are simultaneously illuminating and mixing light, the color temperature can be obtained as 3500 ⁇ 5000K of natural white (NW) light.
  • NW natural white
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • FIG. 2 is a schematic structural view of an LED module according to a third embodiment of the present invention. For convenience of description, only parts related to the embodiment are shown.
  • the LED chip may be a combination of a red LED chip, a green LED chip, and a blue LED chip.
  • the LED module as a whole of the light-emitting module can separately illuminate the LED light-emitting unit of a certain color to obtain monochromatic light; or can simultaneously illuminate three kinds of LED light-emitting units to mix three colors of red, green and blue light. Get white light.
  • the LED module can be cut as needed.
  • the LED lighting unit of a certain color light can be separately illuminated to obtain monochromatic light; or the LED lighting unit of three color lights can be simultaneously illuminated to obtain White light.
  • the red, green, and blue LED chips can be arranged in a triangular structure, and the three vertices of the triangle respectively correspond to the red, green, and blue LED chips, and the three colors of the LEDs are illuminated.
  • the unit lights up and mixes light to form white light.
  • the LED module can also be cut according to actual needs to obtain a module unit of desired illuminating color and color temperature.
  • Embodiment 4 is a diagrammatic representation of Embodiment 4:
  • FIG. 3 is a schematic structural view of an LED module according to a fourth embodiment of the present invention. For convenience of description, only parts related to the embodiment are shown.
  • the LED chip may be a combination of a blue LED chip and a red LED chip, wherein the surface of the blue LED chip covers the phosphor, and the color temperature of the LED is 3500 ⁇ 5000.
  • the white light emitting unit can separately illuminate the white light emitting unit to obtain natural white light, or can separately illuminate the red light emitting unit to obtain red light.
  • the LED module can also be cut according to actual needs to obtain a module unit of desired illuminating color and color temperature.
  • the white light and the red light emitting unit may be alternately arranged alternately, and the white light or the red light emitting unit may be separately illuminated to obtain the corresponding color light, and the white light and the red light may be simultaneously illuminated.
  • Light-emitting unit for warm white light The LED module can also be cut into a single low-power natural white light or red light-emitting source; or can be cut into a high-power natural white light or red light module unit according to one row and multiple columns. It can also be cut into a module unit containing a plurality of natural white light and red light emitting units in a plurality of rows and columns to obtain a color temperature of 2400 to 3500. K's warm white light. Moreover, the presence of the red light emitting unit makes the spectrum of the LED module more abundant, and can significantly improve the color rendering of the product.
  • the invention integrates a plurality of LED lighting units with different powers and different color temperatures on a slavable LED bracket, and can illuminate any one or more LED lighting units through a detachable driving circuit to obtain required power and color. And the color temperature of the outgoing light; at the same time due to the cleavability of the LED bracket and the detachability of the drive circuit,
  • the LED module can be arbitrarily cut to obtain module units of different illuminating color temperature and power.
  • the LED module can be manufactured by a process, which avoids the investment of various materials and production equipment, and does not need to adopt complicated process, thereby solving the problem of waste of resources in the production process and low production efficiency.
  • Phosphor powder is arranged on all or part of the LED chip, or a reasonable combination of red, green and blue LED light-emitting units can be used to obtain positive white light, warm white light and natural white light, and the LED module can be cut according to actual needs, and the required power can be obtained.
  • Module unit with color and color temperature.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

一种LED模组及照明装置 技术领域
本发明属于照明领域，尤其涉及一种LED模组及照明装置。
 背景技术
LED作为第四代照明光源，具有能耗低、体积小、绿色环保、抗恶劣环境能力强、使用寿命长并且安全性好等优点，被誉为21世纪的绿色光源。目前，业内根据市场需求的不同，生产大量不同功率、不同色温的LED灯或LED模组，以满足生产生活中的各种需求。但是生产不同功率、不同色温的LED灯或LED模组需要采用不同的工艺、制程，选用不同的物料和生产设备，而这些不同的工艺、物料和设备等又不能通用，导致资源浪费严重，生产效率低。
 技术问题
本发明实施例的目的在于提供一种LED模组，旨在解决现有LED模组的生产效率低的问题。
 技术解决方案
本发明实施例是这样实现的，一种LED模组，包括可切割的LED支架及可拆分的驱动电路；所述LED支架上设有多个不同功率、不同色温的LED发光单元，所述LED发光单元包括LED芯片及设置于所述LED芯片外部的封装层；所述驱动电路与所述LED芯片相连接，驱动任意一个或多个LED芯片发光。
本发明实施例的另一目的在于提供一种照明装置，包括发光组件，所述发光组件为上述的LED模组。
 有益效果
本发明实施例将多个不同功率、不同色温的LED发光单元集成于一个可切割的LED支架上，通过可拆分的驱动电路可以点亮任意一个或多个LED发光单元，以获取所需功率、颜色及色温的出射光；同时由于LED支架的可切割性与驱动电路的可拆分性，使得该 LED模组可任意切割，以获得不同发光色温及功率的模组单元，后续使用的自由度较高。该LED模组采用一种工艺制成，避免了多种物料及生产设备的投入，不需采用纷繁复杂的工艺制程，进而解决了生产过程中的资源浪费，及生产效率低的问题。
 附图说明
图1是本发明第二实施例提供的LED模组的结构示意图；
图2是本发明第三实施例提供的LED模组的结构示意图；
图3是本发明第四实施例提供的LED模组的结构示意图。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明实施例采用可切割的LED支架承载多个不同功率、不同色温的LED发光单元，通过可拆分的驱动电路点亮任意LED发光单元，可以获得不同功率及色温的出射光，同时由于LED支架的可切割性与驱动电路的可拆分性，使得该 LED模组可任意切割，以获得所需发光色温及功率的模组单元。
本发明实施例提供了一种LED模组，包括可切割的LED支架及可拆分的驱动电路；LED支架上设有多个不同功率、不同色温的LED发光单元，LED发光单元包括LED芯片及设置于LED芯片外部的封装层；驱动电路与LED芯片相连接，驱动任意一个或多个LED芯片发光。
本发明实施例将多个不同功率、不同色温的LED发光单元集成于一个可切割的LED支架上，通过可拆分的驱动电路可以点亮任意一个或多个LED发光单元，以获取所需功率、颜色及色温的出射光；同时由于LED支架的可切割性与驱动电路的可拆分性，使得该 LED模组可任意切割，以获得不同发光色温及功率的模组单元，后续使用的自由度较高。该LED模组可以采用一种工艺制成，避免了多种物料及生产设备的投入，不需采用纷繁复杂的工艺制程，进而解决了生产过程中的资源浪费，及生产效率低的问题。
以下结合具体实施例对本发明的具体实现进行详细描述：
实施例一：
本实施例提供的LED模组包括LED支架和驱动电路，LED支架上载有多颗LED芯片，在LED芯片的外部设有封装层，可以多个LED芯片共有一个整体的封装层，也可以每个LED芯片对应一个封装层，每个LED芯片和与其对应的封装层构成了一个LED发光单元，LED芯片由驱动电路驱动而发光。为了解决生产不同功率、不同色温的LED模组造成的资源浪费，以及生产效率低的问题，将本实施例中的LED支架设计为可任意切割的支架结构，将驱动电路设计为可任意拆分的电路结构。并且，LED支架上承载了多种功率、多种色温的LED发光单元，多个LED发光单元之间相互独立，并且相邻LED发光单元之间进行电连接，驱动电路可以驱动任意一个或者任意多个LED芯片发光，进而获得多种功率、多种颜色及色温的出射光。
在本实施例中，LED支架可以是带有凹槽或凸台的支架结构，凹槽或凸台用于放置LED芯片，同时也便于点胶，每个凹槽或凸台可以放置一个或多个LED芯片。当LED支架带有凹槽时，LED芯片放置于凹槽内，这时可以在整个LED支架表面设置一个整体的透光层，即封装层，使之覆盖全部的LED芯片；当然也可以在每一个凹槽上方对应设置一个封装层。当LED支架带有凸台时，LED芯片放置于凸台上，可以对每个凸台进行点胶，形成封装层，也可以使若干个凸台共有一个大面积的封装层，具体的封装方式依实际生产工艺而定。当然，LED支架也可以是平板结构，LED芯片直接固定于平板支架上，相应的封装层同样可以是与LED芯片一对一或一对多设置的若干个相互独立的透光层，也可以是一个一体结构的覆盖全部LED芯片的大面积透光层。
本实施例提供的LED模组，可以根据实际需要点亮任意一个或多个LED发光单元，获得所需颜色、功率及色温的出射光。也可以对LED支架进行任意切割，以获得所需的模组单元，并且由于驱动电路可以任意拆分，保证了切割后的模组单元仍可正常工作。对于切割后获得的模组单元，可通过驱动电路点亮任意一个或多个LED发光单元，以获取所需功率、所需颜色及色温的出射光。
并且，由于LED支架的一个凹槽或凸台可以放置多个LED芯片，因此对LED模组进行切割获得的单个发光单元可以是单芯结构，还可以是多芯结构。
该LED模组可以采用一种工艺制成，避免了多种物料及生产设备的投入，不需采用纷繁复杂的工艺制程，进而解决了生产过程中的资源浪费，及生产效率低的问题。
实施例二：
图1示出了本发明第二实施例提供的LED模组的结构示意图，为了便于说明，仅示出了与本实施例相关的部分。
在本发明实施例中，为了获得多种颜色及色温的出射光，可以在LED芯片的表面涂覆荧光粉，具体可以在部分LED芯片的表面涂覆荧光粉，也可以在全部LED芯片的表面涂覆荧光粉。LED芯片发出的光激发荧光粉发出荧光，激发光和荧光混合，可以形成多种颜色及色温的出射光。
结合附图1，作为本实施例的一种实现方式，该LED芯片可以全部是蓝光LED芯片，蓝色激发光激发荧光粉发出黄色荧光，蓝光与黄光混合后形成白光。蓝光LED芯片的表面覆盖有两种不同的荧光粉，以获得两种不同色温的白光LED发光单元。其中一部分LED芯片发出蓝光，激发荧光粉后获得正白(DW)光，其色温为5000~10000K；另一部分LED芯片发出蓝光，激发荧光粉后获得暖白(WW)光，其色温为2400~3500K。其中，正白光发光单元与暖白光发光单元可以隔行交替设置。该LED模组可以作为一个整体的发光组件使用，也可以根据实际需要点亮任意发光单元。还可以切割成单颗小功率的正白光或者暖白光发光源；也可以分行（1*3、1*4等）切割，获得大功率的正白光或暖白光模组单元；还可以按照多行多列（2*3、3*5等）的方式切割，获取正白光和暖白光混合的模组单元，多颗正白光和暖白光发光单元同时点亮混光后，可以获得色温为3500~5000K的自然白(NW)光。
实施例三：
图2示出了本发明第三实施例提供的LED模组的结构示意图，为了便于说明，仅示出了与本实施例相关的部分。
在本发明实施例中，LED芯片可以是红光LED芯片、绿光LED芯片与蓝光LED芯片的组合。该LED模组作为一个整体的发光模组，可以单独点亮某种颜色的LED发光单元，获得单色光；也可以同时点亮三种LED发光单元，使红、绿、蓝三种色光混合获得白光。当然，可以根据需要切割LED模组，对于切割后的模组单元，可以单独点亮某种色光的LED发光单元，获取单色光；也可以同时点亮三种色光的LED发光单元，以获取白光。
结合附图2，作为本实施例的一种实现方式，红、绿、蓝光LED芯片可以排列成三角形的结构，三角形的三个顶点分别对应红、绿、蓝光LED芯片，三种颜色的LED发光单元同时点亮混光后形成白光。也可以根据实际需要切割该LED模组，获取所需发光颜色及色温的模组单元。
实施例四：
图3示出了本发明第四实施例提供的LED模组的结构示意图，为了便于说明，仅示出了与本实施例相关的部分。
在本发明实施例中，LED芯片可以是蓝光LED芯片和红光LED芯片的组合，其中的蓝光LED芯片表面覆盖荧光粉，形成发光色温为3500~5000 K的 白光发光单元，可以单独点亮白光发光单元，获取自然白光，也可以单独点亮红光发光单元，获取红光。也可以根据实际需要切割该LED模组，获得所需发光颜色和色温的模组单元。
结合附图3，作为本实施例的一种实现方式，白光和红光发光单元可以隔行交替设置，可以单独点亮白光或红光发光单元，获取相应色光，也可以同时点亮白光和红光发光单元，获取暖白光。还可以将该LED模组切割成单颗小功率的自然白光或者红光发光源；也可以按照一行多列的方式切割成大功率自然白光或红光模组单元。还可以按照多行多列的方式切割成含有多个自然白光和红光发光单元的模组单元，以获得色温为2400~3500 K的暖白光。并且，红光发光单元的存在使得该LED模组的光谱更加丰富，能明显提升产品的显色性。
本发明将多个不同功率、不同色温的LED发光单元集成于一个可切割的LED支架上，通过可拆分的驱动电路可以点亮任意一个或多个LED发光单元，以获取所需功率、颜色及色温的出射光；同时由于LED支架的可切割性与驱动电路的可拆分性，使得该 LED模组可任意切割，以获得不同发光色温及功率的模组单元。该LED模组可以采用一种工艺制成，避免了多种物料及生产设备的投入，不需采用纷繁复杂的工艺制程，进而解决了生产过程中的资源浪费，及生产效率低的问题。在全部或部分LED芯片上设置荧光粉，或者采用红、绿、蓝光LED发光单元合理组合，可以获取正白光、暖白光及自然白光，根据实际需要对LED模组进行切割，可以获取所需功率、颜色及色温的模组单元。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种LED模组，其特征在于，所述LED模组包括可切割的LED支架及可拆分的驱动电路；所述LED支架上设有多个不同功率、不同色温的LED发光单元，所述LED发光单元包括LED芯片及设置于所述LED芯片外部的封装层；所述驱动电路与所述LED芯片相连接，驱动任意一个或多个LED芯片发光。
  2. 如权利要求1所述的LED模组，其特征在于，所述LED芯片为红光LED芯片、绿光LED芯片或蓝光LED芯片，或者该三种LED芯片的任意组合。
  3. 如权利要求1所述的LED模组，其特征在于，全部或部分LED芯片的表面覆盖有荧光粉；不同的LED芯片表面覆盖的荧光粉不同，以获得不同色温的出射光。
  4. 如权利要求3所述的LED模组，其特征在于，所述LED发光单元的出射光包括单色光、色温为5000K~10000K的正白光、色温为2400K~3500K的暖白光，以及色温为3500K~5000K的自然白光。
  5. 如权利要求1所述的LED模组，其特征在于，所述LED支架为平板支架。
  6. 如权利要求1所述的LED模组，其特征在于，所述LED支架带有用于放置LED芯片的凹槽或凸台，每个凹槽或凸台放置一个或多个LED芯片。
  7. 如权利要求6所述的LED模组，其特征在于，所述封装层为与所述凹槽或凸台一对一设置的透光层。
  8. 如权利要求1至6任一项所述的LED模组，其特征在于，所述封装层为覆盖全部LED芯片上方的一体结构的透光层。
  9. 如权利要求1至6任一项所述的LED模组，其特征在于，多个LED芯片之间以并联、串联，或并联与串联相结合的方式相连接。
  10. 一种照明装置，包括发光组件，其特征在于，所述发光组件为权利要求1至9任一项所述的LED模组。
PCT/CN2011/084164 2011-01-05 2011-12-16 一种led模组及照明装置 Ceased WO2012092808A1 (zh)

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