WO2012109441A3 - Wide process range library for metrology - Google Patents

Wide process range library for metrology Download PDF

Info

Publication number
WO2012109441A3
WO2012109441A3 PCT/US2012/024477 US2012024477W WO2012109441A3 WO 2012109441 A3 WO2012109441 A3 WO 2012109441A3 US 2012024477 W US2012024477 W US 2012024477W WO 2012109441 A3 WO2012109441 A3 WO 2012109441A3
Authority
WO
WIPO (PCT)
Prior art keywords
process range
library
metrology
wide process
parameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2012/024477
Other languages
French (fr)
Other versions
WO2012109441A2 (en
Inventor
John J. Hench
Wen Jin
Junwei Bao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
KLA Corp
Original Assignee
Tokyo Electron Ltd
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, KLA Tencor Corp filed Critical Tokyo Electron Ltd
Priority to CN201280008607.3A priority Critical patent/CN103443900B/en
Priority to KR1020137023309A priority patent/KR101919628B1/en
Priority to JP2013553563A priority patent/JP5969511B2/en
Priority to EP12744611.0A priority patent/EP2673797A2/en
Publication of WO2012109441A2 publication Critical patent/WO2012109441A2/en
Publication of WO2012109441A3 publication Critical patent/WO2012109441A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • General Factory Administration (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)

Abstract

Methods of generating wide process range libraries for metrology are described. For example, a method includes generating a first library having a first process range for a first parameter. A second library is generated having a second process range for the first parameter. The second process range is overlapping with the first process range. The second library is stitched to the first library to generate a third library having a third process range for the first parameter. The third process range is wider than each of the first and second process ranges.
PCT/US2012/024477 2011-02-11 2012-02-09 Wide process range library for metrology Ceased WO2012109441A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201280008607.3A CN103443900B (en) 2011-02-11 2012-02-09 Wide processing range library for metrology
KR1020137023309A KR101919628B1 (en) 2011-02-11 2012-02-09 Wide process range library for metrology
JP2013553563A JP5969511B2 (en) 2011-02-11 2012-02-09 Wide processing range measurement library
EP12744611.0A EP2673797A2 (en) 2011-02-11 2012-02-09 Wide process range library for metrology

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/025,654 US8381140B2 (en) 2011-02-11 2011-02-11 Wide process range library for metrology
US13/025,654 2011-02-11

Publications (2)

Publication Number Publication Date
WO2012109441A2 WO2012109441A2 (en) 2012-08-16
WO2012109441A3 true WO2012109441A3 (en) 2012-12-06

Family

ID=46637897

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/024477 Ceased WO2012109441A2 (en) 2011-02-11 2012-02-09 Wide process range library for metrology

Country Status (7)

Country Link
US (1) US8381140B2 (en)
EP (1) EP2673797A2 (en)
JP (1) JP5969511B2 (en)
KR (1) KR101919628B1 (en)
CN (1) CN103443900B (en)
TW (1) TWI525302B (en)
WO (1) WO2012109441A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8869081B2 (en) * 2013-01-15 2014-10-21 International Business Machines Corporation Automating integrated circuit device library generation in model based metrology
US20140242880A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Optical model with polarization direction effects for comparison to measured spectrum
US20150095679A1 (en) 2013-09-30 2015-04-02 Sonos, Inc. Transitioning A Networked Playback Device Between Operating Modes
US9553033B2 (en) * 2014-01-15 2017-01-24 Kla-Tencor Corporation Semiconductor device models including re-usable sub-structures
US10648793B2 (en) 2014-05-15 2020-05-12 Kla-Tencor Corporation Library expansion system, method, and computer program product for metrology
US10151986B2 (en) * 2014-07-07 2018-12-11 Kla-Tencor Corporation Signal response metrology based on measurements of proxy structures
US10190868B2 (en) * 2015-04-30 2019-01-29 Kla-Tencor Corporation Metrology system, method, and computer program product employing automatic transitioning between utilizing a library and utilizing regression for measurement processing
EP3480659A1 (en) * 2017-11-01 2019-05-08 ASML Netherlands B.V. Estimation of data in metrology
US20220357674A1 (en) * 2021-05-04 2022-11-10 Kla Corporation Oblique illumination for overlay metrology

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11311508A (en) * 1998-04-28 1999-11-09 Hitachi Ltd Inspection data creation method and apparatus, and component mounting board appearance inspection apparatus using the same
JP2004509341A (en) * 2000-09-15 2004-03-25 ティンバー　テクノロジーズ，インコーポレイティド Generating a library of periodic grating diffraction signals
US20050004778A1 (en) * 2003-06-17 2005-01-06 Koichi Sentoku Method for producing library
JP2005217161A (en) * 2004-01-29 2005-08-11 Toshiba Corp Structure inspection method, pattern formation method, process condition determination method, and semiconductor device manufacturing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7382447B2 (en) * 2001-06-26 2008-06-03 Kla-Tencor Technologies Corporation Method for determining lithographic focus and exposure
AT412032B (en) * 2001-12-19 2004-08-26 Riegl Laser Measurement Sys METHOD FOR RECORDING AN OBJECT SPACE
US6721691B2 (en) * 2002-03-26 2004-04-13 Timbre Technologies, Inc. Metrology hardware specification using a hardware simulator
US7310548B2 (en) * 2003-03-31 2007-12-18 Koninklijke Philips Electronics N.V. Method of magnetic resonance perfusion imaging
US20060187466A1 (en) * 2005-02-18 2006-08-24 Timbre Technologies, Inc. Selecting unit cell configuration for repeating structures in optical metrology
US7421414B2 (en) 2005-03-31 2008-09-02 Timbre Technologies, Inc. Split machine learning systems
US7467064B2 (en) * 2006-02-07 2008-12-16 Timbre Technologies, Inc. Transforming metrology data from a semiconductor treatment system using multivariate analysis
US7523021B2 (en) * 2006-03-08 2009-04-21 Tokyo Electron Limited Weighting function to enhance measured diffraction signals in optical metrology
US7623978B2 (en) * 2006-03-30 2009-11-24 Tokyo Electron Limited Damage assessment of a wafer using optical metrology
US20080077352A1 (en) * 2006-09-26 2008-03-27 Tokyo Electron Limited Methods and apparatus for using an optically tunable soft mask profile library
US8666703B2 (en) * 2010-07-22 2014-03-04 Tokyo Electron Limited Method for automated determination of an optimally parameterized scatterometry model

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11311508A (en) * 1998-04-28 1999-11-09 Hitachi Ltd Inspection data creation method and apparatus, and component mounting board appearance inspection apparatus using the same
JP2004509341A (en) * 2000-09-15 2004-03-25 ティンバー　テクノロジーズ，インコーポレイティド Generating a library of periodic grating diffraction signals
US20050004778A1 (en) * 2003-06-17 2005-01-06 Koichi Sentoku Method for producing library
JP2005217161A (en) * 2004-01-29 2005-08-11 Toshiba Corp Structure inspection method, pattern formation method, process condition determination method, and semiconductor device manufacturing method

Also Published As

Publication number Publication date
US20120210289A1 (en) 2012-08-16
TWI525302B (en) 2016-03-11
JP2014511565A (en) 2014-05-15
CN103443900A (en) 2013-12-11
WO2012109441A2 (en) 2012-08-16
KR101919628B1 (en) 2018-11-16
JP5969511B2 (en) 2016-08-17
US8381140B2 (en) 2013-02-19
TW201241400A (en) 2012-10-16
EP2673797A2 (en) 2013-12-18
KR20140045919A (en) 2014-04-17
CN103443900B (en) 2016-08-10

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