WO2013104274A1 - 一种电路板的制作方法、电路板和电子设备 - Google Patents

一种电路板的制作方法、电路板和电子设备 Download PDF

Info

Publication number
WO2013104274A1
WO2013104274A1 PCT/CN2013/070060 CN2013070060W WO2013104274A1 WO 2013104274 A1 WO2013104274 A1 WO 2013104274A1 CN 2013070060 W CN2013070060 W CN 2013070060W WO 2013104274 A1 WO2013104274 A1 WO 2013104274A1
Authority
WO
WIPO (PCT)
Prior art keywords
shielding frame
circuit board
functional modules
conductive material
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2013/070060
Other languages
English (en)
French (fr)
Inventor
高春禹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Device Co Ltd
Original Assignee
Huawei Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Device Co Ltd filed Critical Huawei Device Co Ltd
Priority to EP13736430.3A priority Critical patent/EP2713683A4/en
Priority to JP2014521941A priority patent/JP2014522108A/ja
Publication of WO2013104274A1 publication Critical patent/WO2013104274A1/zh
Priority to US14/139,253 priority patent/US9426935B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0045—Casings being rigid plastic containers having a coating of shielding material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/273—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being between laterally adjacent chips, e.g. walls between chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Definitions

  • the invention relates to a circuit board manufacturing method, a circuit board and an electronic device.
  • the application is submitted to the Chinese Patent Office on January 9, 2012, and the application number is CN 201210004654. 2.
  • the invention name is "a circuit board manufacturing method, a circuit board”
  • the priority of the Chinese Patent Application the entire disclosure of which is incorporated herein by reference.
  • TECHNICAL FIELD The present invention relates to a method of fabricating a circuit board, a circuit board, and an electronic device. BACKGROUND OF THE INVENTION As electronic components and transistors become smaller and smaller, the size of modules, modules, and chips is becoming smaller and smaller. In many package formats, high-integration modules, modules, and chips often integrate baseband circuits, RF circuits, and antennas. In order to ensure that the digital signal and the RF signal and the antenna are not interfered with each other, it is necessary to perform a cavity shielding process for each functional module.
  • the embodiment of the invention provides a method for manufacturing a circuit board and a circuit board, which can reduce the height of the cutting plastic material.
  • a method of fabricating a circuit board is provided, the method comprising:
  • the at least two functional modules and the shielding frame are molded by using a plastic sealing material to cover the at least two functional modules and the shielding frame;
  • circuit board fabricated using the above method, the circuit board comprising:
  • a substrate at least two functional modules, and a shielding frame
  • the at least two functional modules and the shielding frame are fixed to the substrate, the shielding frame is located between the at least two functional modules, the shielding
  • the side of the frame and the at least two functional modules are covered by a plastic material, and the outer surface of the shielding frame and the outer side of the plastic material are covered with a conductive material, and the outer surface of the conductive material is covered with an insulating material.
  • At least two functional modules and a shielding frame are respectively fixed on the circuit board, the shielding frame is located between the at least two functional modules, and the at least two are used by using a plastic sealing material.
  • the function module and the shielding frame are plastically encapsulated to cover the at least two functional modules and the shielding frame; the corresponding molding material above the shielding frame is cut and cut to the surface of the shielding frame;
  • the outer side of the uncut portion of the plastic material and the upper surface of the shielding frame are covered with a conductive material, and the outer surface of the conductive material is covered with an insulating material.
  • Figure la-Id is a flow chart of manufacturing a circuit board in the prior art
  • FIG. 2 is a flow chart showing a method of fabricating a circuit board according to Embodiment 1 of the present invention
  • FIG. 3a-3d are schematic diagrams of a product corresponding to a manufacturing process of a circuit board according to Embodiment 1 of the present invention
  • FIG. 4 is a flow chart of a method for manufacturing a circuit board provided in Embodiment 2 of the present invention.
  • the embodiment provides a method for manufacturing a circuit board, including: Step 101: Fix at least two function modules and a shielding frame on a substrate of a circuit board, where the shielding A box is located between the at least two functional modules.
  • the function module 21, the function module 22 and the shield frame 23 are fixed on the substrate 24 of the circuit board, and the shield frame 23 is located between the function modules 21 and 22.
  • Step 102 Molding the at least two functional modules and the shielding frame with a plastic sealing material to cover the at least two functional modules and the shielding frame.
  • the functional modules 21, 22 and the shield frame 23 are molded with a molding material 25 to cover the functional modules 21, 22 and the shield frame 23.
  • Step 103 Cut a portion of the corresponding plastic material above the shielding frame and cut it to the surface of the shielding frame.
  • the corresponding molding material 25 above the shielding frame 23 is cut until it is cut to the surface of the shielding frame 23, and the cutting height is H1.
  • Step 104 covering the outer side of the uncut portion of the molding material and the shielding frame with a conductive material, and covering the outer surface of the conductive material with an insulating material.
  • the outer surface of the molding material 25 and the shielding frame 23 are covered with a conductive material 26, and the outer surface of the conductive material 26 is covered with an insulating material 27.
  • the function modules are all functional modules on the PCB, which may be baseband circuits, radio frequency circuits, antennas, etc., which are not specifically limited in this embodiment, wherein the PCB may be a PCB of a mobile phone or a data card.
  • the PCB may be a PCB of a tablet or a microprocessor, which is not specifically limited in this embodiment.
  • the material of the shielding frame includes iron.
  • the conductive material comprises copper.
  • the cutting of the corresponding plastic sealing material above the shielding frame includes: Laser cutting the corresponding molding material above the shielding frame.
  • At least two function modules and a shielding frame are respectively fixed on the circuit board, the shielding frame is located between the at least two functional modules; and the at least two functional modules and the The shielding frame is plastically encapsulated to cover the at least two functional modules and the shielding frame; the corresponding molding material above the shielding frame is cut and cut to the surface of the shielding frame; the plastic sealing material is not cut
  • the outer side of the portion and the shielding frame are covered with a conductive material, and the outer surface of the conductive material is covered with an insulating material.
  • the shielding frame is used in the sub-chamber portion, and the cutting height is directly cut to the surface of the PCB, and the cutting surface is directly cut to the surface of the shielding frame, the cutting height is reduced, and the processing time is short, and the manufacturability is good.
  • Example 2
  • a method for manufacturing a circuit board provided in Embodiment 1 is used to fabricate a mobile phone circuit board.
  • the method flow includes:
  • Step 201 Solder the baseband circuit, the RF circuit, and the shielding frame respectively on the substrate of the circuit board, wherein the shielding frame is located between the baseband circuit and the RF circuit.
  • the baseband circuit is used as the first functional module, and the radio frequency circuit is the second functional module as an example.
  • the baseband circuit and the radio frequency circuit can be soldered to the substrate of the PCB by using, for example, SMT.
  • a shielding frame is soldered between the baseband circuit and the radio frequency circuit, and the shielding frame separates the baseband circuit from the radio frequency circuit, and
  • the height of the shielding frame needs to be slightly higher than the height of the baseband circuit and the radio frequency circuit.
  • the shielding frame needs to be higher than the height of the baseband circuit. If the highest height of the RF circuit is higher than the highest height of the baseband circuit, the shielding frame needs to be higher than the height of the RF circuit.
  • the specific height of the shielding frame is not specifically limited in this embodiment, and may be specifically designed according to the size of the mobile phone.
  • the material of the shielding frame is preferably iron, but is not limited thereto.
  • the position of the shielding frame can be determined according to the position of the baseband circuit and the RF circuit, which are known in advance.
  • the PCB is soldered by the SMT, the baseband circuit, the RF circuit, and the shielding frame are simultaneously soldered to the substrate of the PCB, or
  • the present invention is not limited in this embodiment, and is soldered to the substrate of the PCB in a certain order.
  • Step 202 Mold the baseband circuit, the RF circuit, and the shielding frame by using a plastic sealing material, and cover the baseband circuit, the RF circuit, and the shielding frame.
  • the circuit board is plastically sealed, wherein
  • the height of the plastic package is higher than the height of the shielding frame, so as to achieve the purpose of the cavity, but the height of the plastic sealing is not specifically limited in this embodiment.
  • plastic sealing materials There are many kinds of plastic sealing materials, which are not specifically limited in this embodiment.
  • Step 203 Perform laser cutting on the corresponding plastic material part above the shielding frame, and cut to the surface of the shielding frame.
  • cutting the plastic sealing material on the shielding frame comprises: laser cutting the plastic sealing material on the shielding frame, but is not limited to laser cutting.
  • the method is not specifically limited in this embodiment.
  • the plastic sealing material that is molded to the surface of the shielding frame is cut, and the cutting height is H ', and the surface of the shielding frame is cut, which is compared with the surface of the PCB substrate that needs to be cut in the prior art, thereby greatly reducing the cutting height.
  • the wear on the laser head is also small, thereby reducing the cost.
  • Step 204 covering the outer side of the uncut portion of the molding material and the shielding frame with a conductive material, and covering the outer surface of the conductive material with an insulating material.
  • the shielding frame exposed on the outside of the plastic sealing material and after the cutting is covered with a conductive material.
  • the conductive material is preferably copper. It is also possible to use other materials that can achieve the shielding effect, which is not specifically limited in this embodiment.
  • the thickness of the conductive material on the shielding frame is at least 0.1 (mm) in order to ensure the shielding effect.
  • the surface of the conductive material is covered with a layer. Insulating material to achieve shielding effect on the whole machine.
  • the baseband circuit, the radio frequency circuit and the shielding frame are respectively fixed on the substrate of the circuit board, the shielding frame is located between the baseband circuit and the radio frequency circuit; and the baseband circuit and the radio frequency circuit are used by using a plastic sealing material.
  • the upper surface is covered with a conductive material, and the outer surface of the conductive material is covered with an insulating material.
  • the shielding frame is used in the sub-chamber portion, and the cutting height is directly cut to the surface of the PCB, and the surface is cut directly to the surface of the shielding frame, the cutting height is reduced, and the processing time is short, and the manufacturability is good.
  • This embodiment provides a circuit board fabricated by using the method provided in Embodiment 1, and referring to FIG. 3d, the circuit board
  • the method includes: a substrate 24, at least two functional modules 21, 22, and a shielding frame 23, wherein the at least two functional modules 21, 22, and the shielding frame 23 are fixed to the substrate 24, and the shielding frame 23 Located between the at least two functional modules 21, 22, the side of the shielding frame 23 and the at least two functional modules 21, 22 are covered by a molding material 25, the shielding frame 23 above and the plastic sealing The outer side of the material 25 is covered with a conductive material 26, and the outer surface of the conductive material 26 is covered with an insulating material 27.
  • the function modules are all functional modules on the PCB, which may be baseband circuits, radio frequency circuits, antennas, etc., which are not specifically limited in this embodiment, wherein the PCB may be a PCB of a mobile phone or a data card.
  • the PCB may be a PCB of a tablet or a microprocessor, which is not specifically limited in this embodiment.
  • the material of the shielding frame comprises: iron.
  • the conductive material comprises: copper.
  • Also provided in this embodiment is an electronic device including the circuit board as described above.
  • the electronic device includes a mobile phone, a data card, a tablet computer or a microprocessor.
  • the circuit board includes: a substrate, at least two functional modules, and a shielding frame, wherein the at least two functional modules and the shielding frame are fixed to the substrate, and the shielding frame is located at the Between the at least two functional modules, the side portion of the shielding frame and the at least two functional modules are covered by a molding material, and the conductive material is covered on the outer side of the shielding frame and the outer side of the plastic sealing material. The outer surface is covered with an insulating material.
  • the cutting height of such a circuit board needs to be directly cut to the surface of the PCB, and is directly cut to the surface of the shielding frame, the height is greatly reduced, the processing time is short, and the manufacturability is good.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

提供了一种电路板的制作方法和电路板。该方法包括：将至少两个功能模块（21，22）和屏蔽框（23）分别固定在电路板（24）上，屏蔽框（23）位于两个功能模块（21，22）之间；使用塑封材质（25）对至少两个功能模块（21，22）和屏蔽框（23）进行塑封；对屏蔽框（23）上的塑封材质（25）进行切割，切割到屏蔽框（23）的表面；在塑封材质（25）的外面和屏蔽框（23）上覆盖导电材质（26），并在导电材质（26）表面覆盖绝缘材质（27）。其中，在分腔部分使用屏蔽框，其余部分均采用导电材质进行屏蔽，对尺寸影响较小，且切割高度大幅度减小，加工时间短。

Description

一种电路板的制作方法、 电路板和电子设备 本申请要求于 2012年 1月 9日提交中国专利局、 申请号为 CN 201210004654. 2、 发 明名称为 "一种电路板的制作方法、 电路板和电子设备"的中国专利申请的优先权， 其 全部内容通过引用结合在本申请中。 技术领域 本发明涉及一种电路板的制作方法、 电路板和电子设备。 背景技术 由于电子元器件、 晶体管的尺寸越来越小， 使得模组、 模块、 芯片的尺寸也随之越 来越小。 在很多封装形式中， 高集成度的模组、 模块、 芯片中往往集成了基带电路、 射 频电路、 天线等部分。 为了保证数字信号与射频信号、 天线之间彼此不受到干扰， 需要 对各个功能模块进行分腔屏蔽处理。
如图 la-Id所示， 现有技术中， 采用比如激光切割与金属喷涂的方式进行分腔屏蔽 的加工流程如下：
a)采用比如 SMT ( Surface Mounted Technology, 表面组装技术） 将器件 11、 器件 12固定 (比如焊接) 在 PCB ( Printed Circuit Board, 印制电路板） 的基板 13上， 然 后对器件使用塑封材质 15进行塑封。
b) 采用比如激光对需要分腔的部分进行激光切割，从塑封材质 15的上表面切割到 PCB的基板 13表面， 切割高度为 H。
c) 使用导电材质 14对塑封材质 15表面与切割的缝隙 （需要分腔的部分） 进行喷 涂、 填充处理， 以达到分腔屏蔽的目的。
d) 在导电材质 14外侧表面再覆盖绝缘材质 16进行绝缘化处理。
现有技术的方案由于需要激光切割分腔， 激光需要切割的 H过高， 导致激光头磨损 严重， 加工成本过高。 发明内容
本发明实施例提供了一种电路板的制作方法和电路板， 可以减小切割塑封材质的高 度。 一方面， 提供了一种电路板的制作方法， 所述方法包括：
将至少两个功能模块和屏蔽框分别固定在电路板上， 其中， 所述屏蔽框位于所述至 少两个功能模块之间；
使用塑封材质对所述至少两个功能模块和所述屏蔽框进行塑封，包覆所述至少两个 功能模块和所述屏蔽框；
对所述屏蔽框上方对应的塑封材质部分进行切割， 切割至所述屏蔽框的表面； 在所述塑封材质未切割部分的外侧和所述屏蔽框上方覆盖导电材质， 并在所述导电 材质外侧表面覆盖绝缘材质。
另一方面， 提供了一种使用上述方法制作的电路板， 所述电路板包括：
基板、 至少两个功能模块、 以及屏蔽框， 其中， 所述至少两个功能模块以及屏蔽框 被固定至所述基板上， 所述屏蔽框位于所述至少两个功能模块之间， 所述屏蔽框的侧部 和所述至少两个功能模块被塑封材质包覆，所述屏蔽框上方和所述塑封材质外侧覆盖有 导电材质， 所述导电材质外侧表面覆盖有绝缘材质。
本发明实施例提供的技术方案中： 将至少两个功能模块和屏蔽框分别固定在电路板 上， 所述屏蔽框位于所述至少两个功能模块之间； 使用塑封材质对所述至少两个功能模 块和所述屏蔽框进行塑封， 包覆所述至少两个功能模块和所述屏蔽框； 对所述屏蔽框上 方对应的塑封材质进行切割， 切割至所述屏蔽框的表面； 在所述塑封材质未切割部分的 外侧和所述屏蔽框上方覆盖导电材质， 并在所述导电材质外侧表面覆盖绝缘材质。 这样 在分腔部分使用屏蔽框， 切割高度由原来需要直接切割到 PCB表面， 改为直接切割到屏 蔽框表面， 切割高度减小。 附图说明 为了更清楚地说明本发明实施例中的技术方案， 下面将对实施例描述中所需要使用 的附图作简单地介绍， 显而易见地， 下面描述中的附图仅仅是本发明的一些实施例， 对 于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以根据这些附图获得 其他的附图。
图 la-Id是现有技术中的一种电路板的制作流程图；
图 2是本发明实施例 1中提供的一种电路板的制作的方法的流程图；
图 3a-3d是本发明实施例 1中提供的一种电路板的制作流程对应的的产品示意图； 图 4是本发明实施例 2中提供的一种电路板的制作方法的流程图。 具体实 Itt式 下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整 地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是全部的实施例。 基 于本发明中的实施例， 本领域技术人员所获得的所有其他实施例， 都属于本发明保护的 范围。
实施例 1
参见图 2以及图 3a— 3d， 本实施例提供了一种电路板的制作方法， 包括： 步骤 101、 将至少两个功能模块和屏蔽框分别固定在电路板的基板上， 其中， 所述 屏蔽框位于所述至少两个功能模块之间。
以两个功能模块为例， 参见图 3a所示， 功能模块 21、 功能模块 22和屏蔽框 23固 定在电路板的基板 24上， 屏蔽框 23位于功能模块 21和 22之间。
步骤 102、 使用塑封材质对所述至少两个功能模块和所述屏蔽框进行塑封， 包覆所 述至少两个功能模块和所述屏蔽框。
参见图 3b所示， 将功能模块 21、 22和屏蔽框 23用塑封材质 25进行塑封， 包覆功 能模块 21、 22和屏蔽框 23。
步骤 103、 对所述屏蔽框上方对应的塑封材质部分进行切割， 切割至所述屏蔽框的 表面。
参见图 3c所示， 对屏蔽框 23上方对应的塑封材质 25进行切割， 直到切割到屏蔽 框 23的表面， 切割高度为 Hl。
步骤 104、 在所述塑封材质未切割部分的外侧和所述屏蔽框上方覆盖导电材质， 并 在所述导电材质外侧表面覆盖绝缘材质。
参见图 3d所示， 在塑封材质 25外面和屏蔽框 23上覆盖导电材质 26， 并在导电材 质 26外侧表面覆盖绝缘材质 27。
本实施例中， 功能模块均是 PCB上的功能模块， 其中可以是基带电路、 射频电路、 天线等， 对此本实施例不做具体限定， 其中 PCB可以是手机的 PCB, 也可以是数据卡的 PCB, 也可以是平板电脑或是微处理器的 PCB, 对此本实施例不作具体限定。
本实施例中， 优选地， 所述屏蔽框的材质包括铁。
本实施例中， 优选地， 所述导电材质包括铜。
本实施例中， 所述对所述屏蔽框上方对应的塑封材质进行切割， 包括： 对所述屏蔽框上方对应的塑封材质进行激光切割。
本发明实施例中， 将至少两个功能模块和屏蔽框分别固定在电路板上， 所述屏蔽框 位于所述至少两个功能模块之间； 使用塑封材质对所述至少两个功能模块和所述屏蔽框 进行塑封， 包覆所述至少两个功能模块和所述屏蔽框； 对所述屏蔽框上方对应的塑封材 质进行切割， 切割至所述屏蔽框的表面； 在所述塑封材质未切割部分的外侧和所述屏蔽 框上方覆盖导电材质， 并在所述导电材质外侧表面覆盖绝缘材质。 这样在分腔部分使用 屏蔽框， 切割高度由原来需要直接切割到 PCB表面， 改为直接切割到屏蔽框表面， 切割 高度减小， 并且加工时间短， 具有良好的可制造性。 实施例 2
参见图 4， 本实施例中使用实施例 1中提供的一种电路板的制作方法制作手机电路 板， 其方法流程包括：
步骤 201、 将基带电路、 射频电路和屏蔽框分别焊接在电路板的基板上， 其中， 所 述屏蔽框位于所述基带电路、 射频电路之间。
本实施例中，以基带电路为第一功能模块、射频电路为第二功能模块为例进行说明， 但是第一功能模块和第二功能模块并不局限由此。可以采用比如 SMT将基带电路和射频 电路焊接到 PCB的基板上， 本实施例中， 在基带电路和射频电路之间焊接一个屏蔽框， 该屏蔽框将基带电路和射频电路隔开， 且为了达到基带电路和射频电路分腔的目的， 优 选地， 屏蔽框的高度需要比基带电路和射频电路的高度都要稍高， 具体实施过程中， 如 果基带电路的最高高度高于射频电路的最高高度， 则屏蔽框需要高于基带电路的高度， 如果射频电路的最高高度高于基带电路的最高高度， 则屏蔽框需要高于射频电路的高 度。但是本实施例中对屏蔽框的具体高度不做具体限定，具体可以根据手机的尺寸设计。
为了达到更好的分腔效果， 优选地本实施例中屏蔽框的材质可以铁， 但也不局限于 此， 本实施例对此不做具体限定。
本实施例中， 可以根据预先获知的基带电路和射频电路的位置， 确定出屏蔽框的位 置， 在 SMT焊接 PCB时， 同时将基带电路、 射频电路和屏蔽框焊接到 PCB的基板上， 或 是以一定的顺序分别焊接到 PCB的基板上， 对此本实施例不做具体限定。
步骤 202、 使用塑封材质对基带电路、 射频电路和屏蔽框进行塑封， 包覆所述基带 电路、 射频电路和所述屏蔽框。
本实施例中， 在焊接基带电路、 射频电路和屏蔽框后， 对电路板进行塑封， 其中优 选地， 塑封的高度要高于屏蔽框的高度， 以便达到分腔的目的， 但本实施例中对塑封高 度不做具体限定。 其中， 塑封材质有很多种， 本实施例对此不做具体限定。
步骤 203、 对所述屏蔽框上方对应的塑封材质部分进行激光切割， 切割到所述屏蔽 框的表面。
本实施例中， 为了达到分腔的效果， 优选地， 对所述屏蔽框上的塑封材质进行切割 包括：对所述屏蔽框上的塑封材质进行激光切割，但是也不局限于激光切割这一种方法， 对此本实施例不做具体限定。
本实施例中， 对塑封到屏蔽框表面的塑封材质进行切割， 切割高度为 H '， 切到屏蔽 框的表面， 对比现有技术中需要切割到 PCB基板的表面， 大大减少了切割高度， 同时对 激光头的磨损也较小， 从而降低了成本。
步骤 204、 在所述塑封材质未切割部分的外侧和所述屏蔽框上方覆盖导电材质， 并 在所述导电材质外侧表面覆盖绝缘材质。
本实施例中为实现分腔， 以达到屏蔽的效果， 在塑封材质外面和切割后裸露出的屏 蔽框上覆盖一层导电材质， 为了使屏蔽效果好， 优选地， 该导电材质为铜， 当然也可以 为其它能过实现屏蔽效果的材质， 对此本实施例不做具体限定。
本实施例中， 覆盖完导电材质后， 为了保证屏蔽效果， 屏蔽框上导电材质的厚度为 至少为 0. 1 （毫米）。
本实施例中， 为了保证整机的 EMC ( Electro Magnet ic Compat ibi l ity, 电磁兼容 性）， 需要对整机也进行屏蔽处理， 本实施例中， 优选地， 在导电材质表面再覆盖一层 绝缘材质， 以达到对整机进行屏蔽的效果。
本发明实施例中， 将基带电路、 射频电路和屏蔽框分别固定在电路板的基板上， 所 述屏蔽框位于所述基带电路、 射频电路之间； 使用塑封材质对所述基带电路、 射频电路 进行塑封，包覆所述基带电路、射频电路；对所述屏蔽框上方对应的塑封材质进行切割， 切割至所述屏蔽框的表面； 在所述塑封材质未切割部分的外侧和所述屏蔽框上方覆盖导 电材质， 并在所述导电材质外侧表面覆盖绝缘材质。 这样在分腔部分使用屏蔽框， 切割 高度由原来需要直接切割到 PCB表面， 改为直接切割到屏蔽框表面， 切割高度减小， 并 且加工时间短， 具有良好的可制造性。 实施例 3
本实施例提供了一种使用实施例 1提供的方法制作的电路板，参考图 3d，该电路板 包括： 基板 24、 至少两个功能模块 21， 22、 以及屏蔽框 23， 其中， 所述至少两个功能 模块 21， 22、 以及屏蔽框 23被固定至所述基板 24上， 所述屏蔽框 23位于所述至少两 个功能模块 21， 22之间， 所述屏蔽框 23的侧部和所述至少两个功能模块 21， 22被塑 封材质 25包覆， 所述屏蔽框 23上方和所述塑封材质 25的外侧覆盖有导电材质 26， 所 述导电材质 26外侧表面覆盖有绝缘材质 27。
本实施例中， 功能模块均是 PCB上的功能模块， 其中可以是基带电路、 射频电路、 天线等， 对此本实施例不做具体限定， 其中 PCB可以是手机的 PCB, 也可以是数据卡的 PCB, 也可以是平板电脑或是微处理器的 PCB, 对此本实施例不作具体限定。
本实施例中， 优选地， 所述屏蔽框的材质包括： 铁。
优选地， 导电材质包括： 铜。
本实施例中还提供了一种电子设备， 包括如上所述的电路板。
其中该电子设备包括手机、 数据卡、 平板电脑或微处理器等。
本发明实施例中， 所述电路板包括： 基板、至少两个功能模块、 以及屏蔽框， 其中， 所述至少两个功能模块以及屏蔽框被固定至所述基板上，所述屏蔽框位于所述至少两个 功能模块之间， 所述屏蔽框的侧部和所述至少两个功能模块被塑封材质包覆， 所述屏蔽 框上方和所述塑封材质外侧覆盖有导电材质， 所述导电材质外侧表面覆盖有绝缘材质。 这样的电路板的切割高度由原来需要直接切割到 PCB表面，改为直接切割到屏蔽框表面， 高度大幅度减小， 加工时间短， 具有良好的可制造性。
以上所述仅为本发明的较佳实施例， 并不用以限制本发明，凡在本发明的精神和原 则之内， 所作的任何修改、 等同替换、 改进等， 均应包含在本发明的保护范围之内

Claims

权利要求
1、 一种电路板的制作方法， 其特征在于， 所述方法包括：
将至少两个功能模块和屏蔽框分别固定在电路板的基板上， 其中， 所述屏蔽框位于 所述至少两个功能模块之间；
使用塑封材质对所述至少两个功能模块和所述屏蔽框进行塑封，包覆所述至少两个 功能模块和所述屏蔽框；
对所述屏蔽框上方对应的塑封材质进行切割， 切割至所述屏蔽框的表面； 在所述塑封材质未切割部分的外侧和所述屏蔽框上方覆盖导电材质， 并在所述导电 材质外侧表面覆盖绝缘材质。
2、 根据权利要求 1所述的方法， 其特征在于， 所述屏蔽框的材质包括铁。
3、 根据权利要求 1或 2所述的方法， 其特征在于， 所述导电材质包括铜。
4、 根据权利要求 1-3任一项所述的方法， 其特征在于， 所述对所述屏蔽框上方对 应的塑封材质进行切割包括： 对所述屏蔽框上方对应的塑封材质进行激光切割。
5、 一种使用权利要求 1所述的方法制作的电路板， 其特征在于， 所述电路板包括: 基板、 至少两个功能模块、 以及屏蔽框， 其中， 所述至少两个功能模块以及屏蔽框固定 至所述基板上， 所述屏蔽框位于所述至少两个功能模块之间， 所述屏蔽框的侧部和所述 至少两个功能模块被塑封材质包覆，所述屏蔽框上方和所述塑封材质外侧覆盖有导电材 质， 所述导电材质外侧表面覆盖有绝缘材质。
6、 根据权利要求 5所述的电路板， 其特征在于， 所述屏蔽框的材质包括铁。
7、 根据权利要求 5或 6所述的电路板， 其特征在于， 所述导电材质包括铜。
8、 一种电子设备， 其特征在于， 包括如权利要求 5-7任一项所述的电路板。
9、 如权利要求 8所述的电子设备， 其特征在于， 所述电子设备包括： 手机、 数据 卡、 平板电脑或微处理器。
PCT/CN2013/070060 2012-01-09 2013-01-05 一种电路板的制作方法、电路板和电子设备 Ceased WO2013104274A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP13736430.3A EP2713683A4 (en) 2012-01-09 2013-01-05 METHOD FOR PRODUCING A CONDUCTOR PLATE, PCB AND ELECTRONIC DEVICE
JP2014521941A JP2014522108A (ja) 2012-01-09 2013-01-05 回路基板を製造する方法、回路基板、および電子装置
US14/139,253 US9426935B2 (en) 2012-01-09 2013-12-23 Method for manufacturing circuit board, circuit board, and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210004654.2 2012-01-09
CN2012100046542A CN102548239A (zh) 2012-01-09 2012-01-09 一种电路板的制作方法、电路板和电子设备

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/139,253 Continuation US9426935B2 (en) 2012-01-09 2013-12-23 Method for manufacturing circuit board, circuit board, and electronic device

Publications (1)

Publication Number Publication Date
WO2013104274A1 true WO2013104274A1 (zh) 2013-07-18

Family

ID=46353858

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2013/070060 Ceased WO2013104274A1 (zh) 2012-01-09 2013-01-05 一种电路板的制作方法、电路板和电子设备

Country Status (5)

Country Link
US (1) US9426935B2 (zh)
EP (1) EP2713683A4 (zh)
JP (1) JP2014522108A (zh)
CN (1) CN102548239A (zh)
WO (1) WO2013104274A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015142427A1 (en) * 2014-03-18 2015-09-24 Apple Inc. Shielding structures for system-in-package assemblies in portable electronic devices
WO2015142426A1 (en) * 2014-03-18 2015-09-24 Apple Inc. Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
US9820373B2 (en) 2014-06-26 2017-11-14 Apple Inc. Thermal solutions for system-in-package assemblies in portable electronic devices

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102548239A (zh) * 2012-01-09 2012-07-04 华为终端有限公司 一种电路板的制作方法、电路板和电子设备
CN104797124B (zh) * 2014-01-20 2018-07-03 联想(北京)有限公司 一种屏蔽方法及电子设备
US9635789B2 (en) * 2015-01-30 2017-04-25 Laird Technologies, Inc. Board level electromagnetic interference (EMI) shields with increased under-shield space
CN107710406B (zh) * 2015-06-04 2020-10-16 株式会社村田制作所 高频模块
US10204883B2 (en) * 2016-02-02 2019-02-12 Taiwan Semidonductor Manufacturing Company Ltd. Semiconductor device and manufacturing method thereof
US20180184550A1 (en) * 2016-12-28 2018-06-28 Microsoft Technology Licensing, Llc Metal additive structures on printed circuit boards
US10497650B2 (en) * 2017-04-13 2019-12-03 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
WO2018207773A1 (ja) * 2017-05-11 2018-11-15 株式会社村田製作所 回路モジュール
CN109561644B (zh) * 2018-11-28 2020-10-30 维沃移动通信有限公司 电路板组件的制备方法、电路板组件及移动终端
KR102447684B1 (ko) * 2019-06-27 2022-09-27 주식회사 노바텍 단독 자석 부품을 포함하는 회로기판 및 smt 장비를 이용한 자석 장착 방법
CN112040632B (zh) * 2020-08-11 2022-10-18 青岛歌尔微电子研究院有限公司 电磁屏蔽结构的制作方法
CN113993366B (zh) * 2021-11-02 2023-03-21 西安电子科技大学 磁控可重构的银纳米线电磁屏蔽膜及制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101098584A (zh) * 2006-06-30 2008-01-02 三星电机株式会社 印刷电路板及其制造方法
US20080055878A1 (en) * 2006-08-29 2008-03-06 Texas Instruments Incorporated Radiofrequency and electromagnetic interference shielding
CN101887860A (zh) * 2009-05-14 2010-11-17 群登科技股份有限公司 电子元件制造方法及其封装结构
CN102548239A (zh) * 2012-01-09 2012-07-04 华为终端有限公司 一种电路板的制作方法、电路板和电子设备
CN102610590A (zh) * 2011-01-24 2012-07-25 群成科技股份有限公司 具电磁干扰屏蔽的封装模块

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252491A (ja) * 2000-12-21 2002-09-06 Toshiba Corp シールドケース、その製造方法、及び電子機器
CN100563404C (zh) * 2002-08-23 2009-11-25 日本瑞翁株式会社 电路衬底、使用电路衬底的电子设备及电路衬底的制造方法
JP4662324B2 (ja) * 2002-11-18 2011-03-30 太陽誘電株式会社 回路モジュール
CN1774965A (zh) * 2004-03-30 2006-05-17 松下电器产业株式会社 模块元件及其制造方法
JP2005317935A (ja) * 2004-03-30 2005-11-10 Matsushita Electric Ind Co Ltd モジュール部品およびその製造方法
DE102005037869B4 (de) * 2005-08-10 2007-05-31 Siemens Ag Anordnung zur hermetischen Abdichtung von Bauelementen und Verfahren zu deren Herstellung
JP2008288610A (ja) * 2008-07-17 2008-11-27 Taiyo Yuden Co Ltd 回路モジュールの製造方法
US8276268B2 (en) * 2008-11-03 2012-10-02 General Electric Company System and method of forming a patterned conformal structure
JP2010205869A (ja) * 2009-03-03 2010-09-16 Sae Magnetics (Hk) Ltd 電子回路モジュールの製造方法
CN102142403A (zh) * 2010-01-28 2011-08-03 矽品精密工业股份有限公司 具有电磁屏蔽的封装结构及其制造方法
JP2011187677A (ja) 2010-03-09 2011-09-22 Panasonic Corp モジュール
JP5756500B2 (ja) * 2013-08-07 2015-07-29 太陽誘電株式会社 回路モジュール
JP5517379B1 (ja) * 2013-08-19 2014-06-11 太陽誘電株式会社 回路モジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101098584A (zh) * 2006-06-30 2008-01-02 三星电机株式会社 印刷电路板及其制造方法
US20080055878A1 (en) * 2006-08-29 2008-03-06 Texas Instruments Incorporated Radiofrequency and electromagnetic interference shielding
CN101887860A (zh) * 2009-05-14 2010-11-17 群登科技股份有限公司 电子元件制造方法及其封装结构
CN102610590A (zh) * 2011-01-24 2012-07-25 群成科技股份有限公司 具电磁干扰屏蔽的封装模块
CN102548239A (zh) * 2012-01-09 2012-07-04 华为终端有限公司 一种电路板的制作方法、电路板和电子设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2713683A4 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015142427A1 (en) * 2014-03-18 2015-09-24 Apple Inc. Shielding structures for system-in-package assemblies in portable electronic devices
WO2015142426A1 (en) * 2014-03-18 2015-09-24 Apple Inc. Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
KR20160114715A (ko) * 2014-03-18 2016-10-05 애플 인크. 휴대용 전자 디바이스의 시스템-인-패키지 어셈블리용 차폐 구조체
KR20160117539A (ko) * 2014-03-18 2016-10-10 애플 인크. 휴대용 전자 디바이스의 시스템-인-패키지 어셈블리용 다층 박막 코팅
US9913412B2 (en) 2014-03-18 2018-03-06 Apple Inc. Shielding structures for system-in-package assemblies in portable electronic devices
US9949359B2 (en) 2014-03-18 2018-04-17 Apple Inc. Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
KR101886545B1 (ko) 2014-03-18 2018-08-07 애플 인크. 휴대용 전자 디바이스의 시스템-인-패키지 어셈블리용 다층 박막 코팅
KR101900583B1 (ko) 2014-03-18 2018-09-19 애플 인크. 휴대용 전자 디바이스의 시스템-인-패키지 어셈블리용 차폐 구조체
US11266010B2 (en) 2014-03-18 2022-03-01 Apple Inc. Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
US9820373B2 (en) 2014-06-26 2017-11-14 Apple Inc. Thermal solutions for system-in-package assemblies in portable electronic devices

Also Published As

Publication number Publication date
US20140111949A1 (en) 2014-04-24
JP2014522108A (ja) 2014-08-28
EP2713683A1 (en) 2014-04-02
US9426935B2 (en) 2016-08-23
CN102548239A (zh) 2012-07-04
EP2713683A4 (en) 2014-06-11

Similar Documents

Publication Publication Date Title
WO2013104274A1 (zh) 一种电路板的制作方法、电路板和电子设备
CN105409060B (zh) 天线一体型无线模块以及该模块的制造方法
US8178956B2 (en) Integrated circuit package system for shielding electromagnetic interference
KR101616625B1 (ko) 반도체 패키지 및 그 제조방법
JP5884903B2 (ja) 基板上の構成部品を遮蔽するための電磁遮蔽構造
US20120008288A1 (en) Module and portable terminal
US8897019B1 (en) Circuit module
EP1126522A1 (en) Packaged integrated circuit with radio frequency antenna
CN105321933A (zh) 具有顺形电磁屏蔽结构的半导体封装件及其制造方法
US20080272469A1 (en) Semiconductor die package and integrated circuit package and fabricating method thereof
TWI605564B (zh) 封裝結構及其製法
US20180061726A1 (en) Air-cavity package with dual signal-transition sides
TWI618156B (zh) 電子封裝件及其製法
US10939556B1 (en) Electronic component embedded substrate
US8847371B2 (en) Electronic component module including a lead frame and an insulating resin having a thickness less than or equal to a thickness of the lead frame and method for producing same
US20120248585A1 (en) Electromagnetic interference shielding structure for integrated circuit substrate and method for fabricating the same
CN102709274B (zh) 集成电路基板的电磁干扰屏蔽结构与其制造方法
US20130300614A1 (en) High frequency module
CN109561644B (zh) 电路板组件的制备方法、电路板组件及移动终端
US20160081234A1 (en) Package structure
US11552403B2 (en) Slot antenna on a printed circuit board (PCB)
CN104576617B (zh) 模块集成电路封装结构及其制作方法
JP5884278B2 (ja) 回路モジュールの構造及びその製造方法
CN206412336U (zh) 半导体封装件
US12021063B2 (en) Circular bond finger pad

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13736430

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2013736430

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2014521941

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE