WO2014007919A1 - Circuit assembly - Google Patents

Circuit assembly Download PDF

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Publication number
WO2014007919A1
WO2014007919A1 PCT/US2013/042574 US2013042574W WO2014007919A1 WO 2014007919 A1 WO2014007919 A1 WO 2014007919A1 US 2013042574 W US2013042574 W US 2013042574W WO 2014007919 A1 WO2014007919 A1 WO 2014007919A1
Authority
WO
WIPO (PCT)
Prior art keywords
side terminal
lead frame
thickness
assembly
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2013/042574
Other languages
French (fr)
Inventor
Andrew J. JOZWIAK
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Priority to KR1020147025130A priority Critical patent/KR101526834B1/en
Priority to CN201380024857.0A priority patent/CN104303296B/en
Priority to EP13813826.8A priority patent/EP2815428A4/en
Priority to JP2015520194A priority patent/JP5973070B2/en
Publication of WO2014007919A1 publication Critical patent/WO2014007919A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure

Definitions

  • This disclosure generally relates to circuit assemblies, and more particularly relates to a circuit assembly using a stamped metal lead frame with terminals inserted into holes in the lead frame.
  • Three-dimensional lead frames that form terminals from a two dimensional stamping by bending up or down portions of the stamping are known.
  • the thickness requirements for the vertically oriented terminals are greater than the thickness requirement for the horizontally oriented routing plane, and so the routing plane is unnecessarily thick.
  • a three-dimensional lead frame typically requires multiple stamping and forming dies, and so the tooling costs associated with three- dimensional lead frames is undesirable high.
  • a circuit assembly in accordance with one embodiment, includes a planar lead frame and a top-side terminal.
  • the planar lead frame is formed of electrically conductive material having a first thickness.
  • the lead frame is configured to define a routing plane and a plurality of coplanar sections in the routing plane.
  • the top-side terminal is formed of electrically conductive material having a second thickness independent of the first thickness.
  • the top-side terminal is configured to be inserted into a hole defined in a section and form an electrical connection to the section.
  • the top-side terminal protrudes from the routing plane.
  • FIG. 1 is a perspective view of a circuit assembly in accordance with one embodiment
  • FIG. 2 is a close-up perspective view of the circuit assembly of Fig. 1 in accordance with one embodiment.
  • FIG. 3 is a perspective view of the circuit assembly of Fig. 1 that includes a housing in accordance with one embodiment.
  • Fig. 1 illustrates a non-limiting example of a circuit assembly, hereafter the assembly 10.
  • the assembly 10 includes a lead frame 12 that is characterized as being planar.
  • the lead frame 12 is typically formed from a sheet of electrically conductive material, for example, a copper alloy that may include plating layers on the surface of the sheet to reduce corrosion or facilitate subsequent processing such as soldering.
  • the sheet is further processed to form various sections 14 by any of a number of known techniques such as stamping or die cutting, mechanical machining, laser or water-jet cutting, or photo-etching.
  • the sheet may be characterized as having a first thickness 16 that is selected based on, but not limited to, current carrying requirements of the sections 14, and any subsequent processing of the lead frame 12.
  • the lead frame 12 is generally handled and packaged so that the sections 14 are coplanar, and so define a routing plane 18 that corresponds to the plane of the lead frame 12.
  • top-side terminal 20 is formed of electrically conductive material having a second thickness 22 independent of the first thickness of the lead frame 12.
  • the composition of material used for the top-side terminal may be the same or different than the composition of material used for the lead frame 12.
  • the second thickness 22 of the top-side terminal 20 will be greater than the first thickness 16 as the top-side terminal 20 is expected to need more structural strength than the lead frame 12, and so the top side terminal thickness corresponds to mating terminal requirements.
  • the top-side terminal 20 may be formed using machining techniques known for forming such terminals including stamping and coining.
  • the top- side terminal 20 is configured to be inserted into a hole 24 defined in one of the sections 14.
  • the hole may be round, oval, square, rectangle, a slot, or any shape opening suitable for receiving the top-side terminal 20.
  • the top-side terminal 20 is also generally configured to form an electrical connection to the section having the hole 24 into which the top-side terminal 20 is inserted. After the top-side terminal 20 is inserted into the hole 24, it may be characterized as protruding from the routing plane 18. [0011]
  • the top-side terminal 20 may be formed to serve as a connector terminal 26 for making a subsequent connection to a mating connector (not shown).
  • the top-side terminal 20 may be formed to serve as a component lead fork 28 for receiving and securing a leaded electrical component (not shown) such as a fuse, a relay, a resistor or a capacitor.
  • a leaded electrical component such as a fuse, a relay, a resistor or a capacitor.
  • the leaded electrical component could be soldered to holes 24 in the lead frame 12.
  • the top-side terminal 20 is preferably attached to the section 14 by way of forced insertion or mechanical interference fitting so that the top-side terminal 20 is fixedly oriented for any subsequent processing. Subsequent processing may include soldering or welding of the top-side terminal 20 to the section 14, welding. Alternatively , the top-side terminal 20 may be loosely placed into the hole 24, and held in place by fixture (not shown) and then subsequently secured to and electrically connected to the section 14 by welding (e.g. laser welding) or soldering.
  • welding e.g. laser welding
  • Fig. 2 illustrates a non-limiting example of the lead frame 12 that includes webs 30 that interconnect the sections 14 of the lead frame 12 prior to inserting the top-side terminal 20. It is recognized that Fig. 1 appear to suggest that the sections 14 are somehow spontaneously suspended in space, but this only for the purpose of simplifying the illustration. The webs 30 help hold the section 14 coplanar while the lead frame 12 is being fabricated, and the top-side terminal 20 is being installed. Then after the various terminals are installed, the lead frame 12 with the terminals may be installed into a housing 32 (Fig. 3). In general, the housing 32 is configured to receive and support the lead frame 12.
  • the assembly 10 may also include a bottom-side terminal 34 so, for example, electrical connectors or electrical components can be located on both sides of the lead frame 12.
  • the bottom-side terminal 34 may be formed of electrically conductive material having third thickness 36 independent of the first thickness 16 and the second thickness 22. It should be recognized that each of the terminals on either side of the lead frame 12 may be made of different materials with different thickness so that each terminal is optimized for material composition and thickness.
  • the bottom-side terminal 34 is configured to be inserted into another hole 38 defined in a section 14 of the lead frame 12 from the opposite side as the top-side terminal 20. It follows that the bottom-side terminal 34 forms an electrical connection to the section 14 so that the bottom-side terminal 34 protrudes from the routing plane 18 in a direction opposite that of the topside terminal 20. It is also contemplated that the bottom-side terminal 34 may be coupled to the lead frame 12 using any technique including, but not necessarily the same, and those described above with regard to the top-side terminal 20
  • a circuit assembly (the assembly 10) is provided.
  • the assembly 10 defines a flat plane (i.e. the routing plane) of material that is stamped to form sections 14 within the routing layer with connections terminals inserted or stitched into the lead frame 12.
  • the stitched connections can be fixed by soldering, welding, or direct mechanical interference fit. Since there lead frame 12 does not use folded sections to form a three-dimensional lead frame, the percentage utilization of material is relatively high. Material thickness for the lead frame 12 can be optimized based on current carry capacity and not on standard terminal connection systems.
  • the terminals (20, 34) that are stitched into the sections 14 may be a standard thickness for the terminals.
  • the sections 14 may be supported by plastic insulating layers, upper or lower housings (32), or attached to a printed circuit board (PCB) to allow for more complicated routing, electronics, or PCB mounted relays.
  • PCB printed circuit board
  • Layer to layer connections or multilayer connectivity can be made through the same features. It is contemplated that PCB attachment would typically only be for more complex routing and electronics. However, it is recognized that leaded PCB components such as PCB relays could still be soldered to lead frame 12.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A circuit assembly (10) that includes a planar lead frame (12) formed of electrically conductive material having a first thickness (16). The lead frame (12) is configured to define a routing plane (18) and a plurality of coplanar sections (14) in the routing plane (18). The circuit assembly (10) also includes a top-side terminal (20) formed of electrically conductive material having a second thickness (22) independent of the first thickness (16). The top-side terminal (20) is configured to be inserted into a hole (24) defined in a section (14) and form an electrical connection to the section (14), wherein the top-side terminal (20) protrudes from the routing plane (18)

Description

CIRCUIT ASSEMBLY
TECHNICAL FIELD OF INVENTION
[0001] This disclosure generally relates to circuit assemblies, and more particularly relates to a circuit assembly using a stamped metal lead frame with terminals inserted into holes in the lead frame.
BACKGROUND OF INVENTION
[0002] Three-dimensional lead frames that form terminals from a two dimensional stamping by bending up or down portions of the stamping are known. Typically, the thickness requirements for the vertically oriented terminals are greater than the thickness requirement for the horizontally oriented routing plane, and so the routing plane is unnecessarily thick. Furthermore, a three-dimensional lead frame typically requires multiple stamping and forming dies, and so the tooling costs associated with three- dimensional lead frames is undesirable high.
SUMMARY OF THE INVENTION
[0003] In accordance with one embodiment, a circuit assembly is provided. The assembly includes a planar lead frame and a top-side terminal. The planar lead frame is formed of electrically conductive material having a first thickness. The lead frame is configured to define a routing plane and a plurality of coplanar sections in the routing plane. The top-side terminal is formed of electrically conductive material having a second thickness independent of the first thickness. The top-side terminal is configured to be inserted into a hole defined in a section and form an electrical connection to the section. The top-side terminal protrudes from the routing plane.
[0004] Further features and advantages will appear more clearly on a reading of the following detailed description of the preferred embodiment, which is given by way of non-limiting example only and with reference to the accompanying drawings.
BRIEF DESCRIPTION OF DRAWINGS
[0005] The present invention will now be described, by way of example with reference to the accompanying drawings, in which:
[0006] Fig. 1 is a perspective view of a circuit assembly in accordance with one embodiment;
[0007] Fig. 2 is a close-up perspective view of the circuit assembly of Fig. 1 in accordance with one embodiment; and
[0008] Fig. 3 is a perspective view of the circuit assembly of Fig. 1 that includes a housing in accordance with one embodiment.
DETAILED DESCRIPTION
[0009] Fig. 1 illustrates a non-limiting example of a circuit assembly, hereafter the assembly 10. The assembly 10 includes a lead frame 12 that is characterized as being planar. The lead frame 12 is typically formed from a sheet of electrically conductive material, for example, a copper alloy that may include plating layers on the surface of the sheet to reduce corrosion or facilitate subsequent processing such as soldering. The sheet is further processed to form various sections 14 by any of a number of known techniques such as stamping or die cutting, mechanical machining, laser or water-jet cutting, or photo-etching. The sheet may be characterized as having a first thickness 16 that is selected based on, but not limited to, current carrying requirements of the sections 14, and any subsequent processing of the lead frame 12. The lead frame 12 is generally handled and packaged so that the sections 14 are coplanar, and so define a routing plane 18 that corresponds to the plane of the lead frame 12.
[0010] Electrical connections to any of the sections 14 may be by way of a top- side terminal 20 attached to one of the sections 14. In general, the top-side terminal 20 is formed of electrically conductive material having a second thickness 22 independent of the first thickness of the lead frame 12. The composition of material used for the top-side terminal may be the same or different than the composition of material used for the lead frame 12. Typically the second thickness 22 of the top-side terminal 20 will be greater than the first thickness 16 as the top-side terminal 20 is expected to need more structural strength than the lead frame 12, and so the top side terminal thickness corresponds to mating terminal requirements. The top-side terminal 20 may be formed using machining techniques known for forming such terminals including stamping and coining. In general, the top- side terminal 20 is configured to be inserted into a hole 24 defined in one of the sections 14. As used herein, the hole may be round, oval, square, rectangle, a slot, or any shape opening suitable for receiving the top-side terminal 20. The top-side terminal 20 is also generally configured to form an electrical connection to the section having the hole 24 into which the top-side terminal 20 is inserted. After the top-side terminal 20 is inserted into the hole 24, it may be characterized as protruding from the routing plane 18. [0011] The top-side terminal 20 may be formed to serve as a connector terminal 26 for making a subsequent connection to a mating connector (not shown). Alternatively, the top-side terminal 20 may be formed to serve as a component lead fork 28 for receiving and securing a leaded electrical component (not shown) such as a fuse, a relay, a resistor or a capacitor. Alternatively, the leaded electrical component could be soldered to holes 24 in the lead frame 12.
[0012] The top-side terminal 20 is preferably attached to the section 14 by way of forced insertion or mechanical interference fitting so that the top-side terminal 20 is fixedly oriented for any subsequent processing. Subsequent processing may include soldering or welding of the top-side terminal 20 to the section 14, welding. Alternatively , the top-side terminal 20 may be loosely placed into the hole 24, and held in place by fixture (not shown) and then subsequently secured to and electrically connected to the section 14 by welding (e.g. laser welding) or soldering.
[0013] Fig. 2 illustrates a non-limiting example of the lead frame 12 that includes webs 30 that interconnect the sections 14 of the lead frame 12 prior to inserting the top-side terminal 20. It is recognized that Fig. 1 appear to suggest that the sections 14 are somehow miraculously suspended in space, but this only for the purpose of simplifying the illustration. The webs 30 help hold the section 14 coplanar while the lead frame 12 is being fabricated, and the top-side terminal 20 is being installed. Then after the various terminals are installed, the lead frame 12 with the terminals may be installed into a housing 32 (Fig. 3). In general, the housing 32 is configured to receive and support the lead frame 12. Typically, after the lead frame 12 is installed into the housing 33, the webs 30 are removed by any of several known techniques such as cutting or shearing. [0014] Referring again to Fig. 1, the assembly 10 may also include a bottom-side terminal 34 so, for example, electrical connectors or electrical components can be located on both sides of the lead frame 12. Like the top-side terminal 20, the bottom-side terminal 34 may be formed of electrically conductive material having third thickness 36 independent of the first thickness 16 and the second thickness 22. It should be recognized that each of the terminals on either side of the lead frame 12 may be made of different materials with different thickness so that each terminal is optimized for material composition and thickness. Like the top-side terminal 20, the bottom-side terminal 34 is configured to be inserted into another hole 38 defined in a section 14 of the lead frame 12 from the opposite side as the top-side terminal 20. It follows that the bottom-side terminal 34 forms an electrical connection to the section 14 so that the bottom-side terminal 34 protrudes from the routing plane 18 in a direction opposite that of the topside terminal 20. It is also contemplated that the bottom-side terminal 34 may be coupled to the lead frame 12 using any technique including, but not necessarily the same, and those described above with regard to the top-side terminal 20
[0015] Accordingly, a circuit assembly (the assembly 10) is provided. In one embodiment, the assembly 10 defines a flat plane (i.e. the routing plane) of material that is stamped to form sections 14 within the routing layer with connections terminals inserted or stitched into the lead frame 12. The stitched connections can be fixed by soldering, welding, or direct mechanical interference fit. Since there lead frame 12 does not use folded sections to form a three-dimensional lead frame, the percentage utilization of material is relatively high. Material thickness for the lead frame 12 can be optimized based on current carry capacity and not on standard terminal connection systems. The terminals (20, 34) that are stitched into the sections 14 may be a standard thickness for the terminals. The sections 14 may be supported by plastic insulating layers, upper or lower housings (32), or attached to a printed circuit board (PCB) to allow for more complicated routing, electronics, or PCB mounted relays. Layer to layer connections or multilayer connectivity can be made through the same features. It is contemplated that PCB attachment would typically only be for more complex routing and electronics. However, it is recognized that leaded PCB components such as PCB relays could still be soldered to lead frame 12.
[0016] While this invention has been described in terms of the preferred embodiments thereof, it is not intended to be so limited, but rather only to the extent set forth in the claims that follow.

Claims

WE CLAIM:
1. A circuit assembly (10) comprising:
a planar lead frame (12) formed of electrically conductive material having a first
thickness (16), said lead frame (12) configured to define a routing plane (18) and a plurality of coplanar sections (14) in the routing plane (18);
a top- side terminal (20) formed of electrically conductive material having a second
thickness (22) independent of the first thickness (16), said top-side terminal (20) configured to be inserted into a hole (24) defined in a section (14) and form an electrical connection to the section (14), wherein the top-side terminal (20) protrudes from the routing plane (18).
2. The assembly (10) in accordance with claim 1, wherein said top-side terminal (20) is characterized as one of a connector terminal (26) and a component lead fork (28).
3. The assembly (10) in accordance with claim 1, wherein said top-side terminal (20) is attached to the section (14) by way of one or more of soldering, welding, and mechanical interference fitting.
4. The assembly (10) in accordance with claim 1, wherein said lead frame (12) includes webs (30) that interconnect sections (14) of the lead frame (12) prior to inserting the top-side terminal (20), said assembly (10) further comprises a housing (32) configured to receive the lead frame (12), and said webs (30) are removed after the lead frame (12) is installed into a housing (32).
5. The assembly (10) in accordance with claim 1, wherein said assembly (10) further comprises a bottom- side terminal (34) formed of electrically conductive material having third thickness (36) independent of the first thickness (16) and the second thickness (22), said bottom-side terminal (34) configured to be inserted into another hole (24) defined in a section (14) of the lead frame (12) from the opposite side as the top-side terminal (20), and form an electrical connection to the section (14) that protrudes from the routing plane (18) in a direction opposite that of the top-side terminal (20).
PCT/US2013/042574 2012-07-02 2013-05-24 Circuit assembly Ceased WO2014007919A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020147025130A KR101526834B1 (en) 2012-07-02 2013-05-24 Circuit assembly
CN201380024857.0A CN104303296B (en) 2012-07-02 2013-05-24 Circuit unit
EP13813826.8A EP2815428A4 (en) 2012-07-02 2013-05-24 Circuit assembly
JP2015520194A JP5973070B2 (en) 2012-07-02 2013-05-24 Circuit assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/539,553 US8884169B2 (en) 2012-07-02 2012-07-02 Circuit assembly
US13/539,553 2012-07-02

Publications (1)

Publication Number Publication Date
WO2014007919A1 true WO2014007919A1 (en) 2014-01-09

Family

ID=49776969

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/042574 Ceased WO2014007919A1 (en) 2012-07-02 2013-05-24 Circuit assembly

Country Status (6)

Country Link
US (1) US8884169B2 (en)
EP (1) EP2815428A4 (en)
JP (1) JP5973070B2 (en)
KR (1) KR101526834B1 (en)
CN (1) CN104303296B (en)
WO (1) WO2014007919A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018101298A1 (en) 2016-11-30 2018-06-07 古河電気工業株式会社 Electrical connection cassette

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US20030203539A1 (en) * 2002-04-29 2003-10-30 Shafidul Islam Partially patterned lead frames and methods of making and using the same in semiconductor packaging
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US20030203539A1 (en) * 2002-04-29 2003-10-30 Shafidul Islam Partially patterned lead frames and methods of making and using the same in semiconductor packaging
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Also Published As

Publication number Publication date
EP2815428A4 (en) 2015-03-25
CN104303296B (en) 2017-07-28
CN104303296A (en) 2015-01-21
JP5973070B2 (en) 2016-08-23
US8884169B2 (en) 2014-11-11
KR20140116229A (en) 2014-10-01
JP2015522926A (en) 2015-08-06
KR101526834B1 (en) 2015-06-05
US20140000958A1 (en) 2014-01-02
EP2815428A1 (en) 2014-12-24

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