WO2014089934A1 - 一种无卤阻燃树脂组合物及其用途 - Google Patents

一种无卤阻燃树脂组合物及其用途 Download PDF

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Publication number
WO2014089934A1
WO2014089934A1 PCT/CN2013/071513 CN2013071513W WO2014089934A1 WO 2014089934 A1 WO2014089934 A1 WO 2014089934A1 CN 2013071513 W CN2013071513 W CN 2013071513W WO 2014089934 A1 WO2014089934 A1 WO 2014089934A1
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weight
parts
halogen
compound
resin
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English (en)
French (fr)
Inventor
何岳山
苏世国
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Shengyi Technology Co Ltd
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Shengyi Technology Co Ltd
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Priority to KR1020157017348A priority Critical patent/KR101681442B1/ko
Priority to EP13863595.8A priority patent/EP2933293B1/en
Priority to US14/652,065 priority patent/US9745464B2/en
Publication of WO2014089934A1 publication Critical patent/WO2014089934A1/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/16—Layered products comprising a layer of metal next to a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/025—Particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Definitions

  • Halogen-free flame retardant resin composition and use thereof
  • the present invention relates to a halogen-free flame retardant resin composition and use thereof, and in particular, the present invention relates to a halogen-free flame retardant resin composition and a prepreg, a laminate and a laminate for printed circuit board produced therefrom .
  • the flame retardancy is greatly improved by synergistic flame retardancy of a phenoxyphosphazene compound with a compound having a dihydrobenzoxazine ring.
  • the cured product has a high glass transition temperature (T g ), relatively good heat resistance, high modulus of elasticity, low dielectric loss, and excellent flame retardancy and machinability.
  • T g glass transition temperature
  • the heat resistance of the scheme is limited, and the processability is not completely satisfactory.
  • CN 101643570 A discloses a halogen-free flame-retardant resin composition and a laminate for a prepreg, a laminate and a printed circuit board produced therefrom, the halogen-free flame-retardant resin composition comprising: (A) a phenoxyphosphazene compound (a mixture of AO and a compound (A 2 ) having a dihydrobenzoxazine ring, 40 to 80 parts by weight, and a phenoxyphosphazene compound (AO with dihydrobenzoxazine) The weight ratio of the compound (A 2 ) of the ring is between 1:10 and 1:2; (B) the polyepoxy compound, 15 to 45 parts by weight; (C) the phenolic resin-based curing agent, 5 to 25 parts by weight; And D) an imidazole compound as a curing accelerator, 0.1 to 1 part by weight.
  • a phenoxyphosphazene compound a mixture of AO and a compound (A 2 ) having
  • One of the objects of the present invention is to provide a halogen-free flame retardant resin composition which can satisfy the halogen-free flame retardant requirement, has excellent heat resistance, and is added with a large amount of dihydrobenzoxazine.
  • the brittleness of the cured product of the dihydrobenzoxazine ring is improved, the processing property of the cured product is greatly improved, and mass production is made possible.
  • a halogen-free flame retardant resin composition comprising, by weight:
  • the weight ratio of the compound (A 2 ) of the azine ring is 1:25 to 1:2
  • a halogen-free flame retardant resin composition comprises, by weight:
  • the weight ratio of the compound (A 2 ) of the azine ring is 1:20 to 1:5;
  • a halogen-free flame retardant resin composition comprises, by weight:
  • the weight ratio of the substance (A 2 ) is 1:15 to 1:5;
  • the parts by weight of the mixture of the phenoxyphosphazene compound (A and the compound (A 2 ) having a dihydrobenzoxazine ring are 45 to 90 parts by weight, for example, 53 parts by weight, 57 parts by weight, 62 parts by weight. 68 parts by weight, 72 parts by weight, 78 parts by weight, 82 parts by weight, 87 parts by weight, and 89 parts by weight.
  • the weight ratio of the phenoxyphosphazene compound (A to the compound (A 2 ) having a dihydrobenzoxazine ring is 1:25 to 1:2, for example, 1:24, 1:22, 1:20, 1:18, 1:16, 1:14, 1:12, 1:10, 1:8, 1:6, 1:4, 1:3.
  • the component (A) is preferably used in an amount of 45 to 90 parts by weight, and the phenoxyphosphazene compound (A and the compound having a dihydrobenzoxazine ring (A 2 ) have a good synergistic flame retarding effect. And avoiding the negative effect of the phenoxyphosphazene compound (A, the weight ratio of the phenoxyphosphazene compound (A to the compound (A 2 ) having a dihydrobenzoxazine ring is 1:25 to 1:2). .
  • the (B) epoxy resin having an epoxy equivalent of 500 2000 is 10 to 45 parts by weight, for example, 13 parts by weight, 16 parts by weight, 19 parts by weight, 22 parts by weight, 28 parts by weight, and 32 parts by weight. , 38 parts by weight, 43 parts by weight.
  • the (C) phenol resin is used in an amount of 10 to 25 parts by weight, for example, 12 parts by weight, 14 parts by weight, 16 parts by weight, 18 parts by weight, 20 parts by weight, 22 parts by weight, or 23 parts by weight.
  • the (C) component is preferably used in an amount of 10 to 25 parts by weight, less than 10 parts by weight, the glass transition temperature of the cured product is not increased much, and the heat resistance of the cured product exceeding 25 parts by weight is deteriorated.
  • the (D) amine curing agent is used in an amount of 0.5 to 10 parts by weight, for example, 1.2 parts by weight, 2.5 parts by weight, 4 parts by weight, 6 parts by weight, 7 parts by weight, or 9 parts by weight.
  • the invention adopts synergistic curing, synergistically solidifies with a phenolic resin and an amine curing agent, and utilizes a synergistic flame retardant effect of a phenoxyphosphazene compound (A and a compound (A 2 ) having a dihydrobenzoxazine ring).
  • An epoxy resin having an epoxy equivalent of 500 2000 is added to improve the Tg , heat resistance and mechanical processing properties of the cured product of the resin while satisfying the halogen-free flame retardant.
  • the phenoxyphosphazene compound (A is a nitrogen-containing, phosphorus-containing flame retardant, and the flame retardant mechanism thereof comprises a gas phase flame retardant and a solid phase flame retardant, but if used alone, the flame retardant substance is released slowly. That is, the flame retardant efficiency is not high.
  • the phenoxyphosphazene compound (A is too low to achieve the flame retardant effect, and when the amount is too large, it will affect other properties of the cured product: if the cured product is in a high temperature condition Next, the phenoxyphosphazene compound ( ) may migrate or bleed out and the physical properties such as flexural modulus may drastically decrease.
  • a compound having a dihydrobenzoxazine ring which is inherently flame resistant is used ( A 2 )
  • a phenoxyphosphazene compound (A) it can synergistically accelerate the initiation of a phenoxyphosphazene compound (A releases a flame retardant substance, so its flame retardant efficiency can be greatly improved.
  • the present invention utilizes a synergistic flame retardant effect of a phenoxyphosphazene compound (A with a compound (A 2 ) having a dihydrobenzoxazine ring, and adjusts a phenoxyphosphazene compound (A with dihydrobenzoxazine)
  • the weight ratio of the ring compound (A 2 ) is between 1:25 and 1:2, which is greater than the weight ratio disclosed in CN 101643570A: 1:10-1:2. the amount of triazine ring compound (a 2) a.
  • an epoxy resin having an epoxy equivalent of 500 2000 is added to the resin composition.
  • an epoxy resin having an epoxy equivalent of 500 to 2000 improves the brittleness and lowers the Tg and heat resistance of the cured product of the resin.
  • the invention adopts synergistic curing, and is synergistically cured by a phenolic resin and an amine curing agent.
  • the amine curing agent relies on -NH 2 , -NH and a small amount of free amine groups to cure the resin.
  • the amine value is low and the activity is small, so it is solid.
  • the reaction is very mild; while the phenolic resin contains a large amount of phenolic hydroxyl groups, which is highly active and can promote curing, so the curing time is short.
  • the phenolic resin and the amine curing agent are synergistically cured, and the compound (A 2 ) having a dihydrobenzoxazine ring can be effectively overcome to increase the amount of the phenoxyphosphazene compound (the migration and epoxy equivalent of A).
  • the disadvantage of the decrease in Tg and heat resistance of the resin cured product after the addition of the epoxy resin of 500 2000 improves the Tg , heat resistance and mechanical processing properties of the cured product of the resin while satisfying the halogen-free flame retardant.
  • the resin and the amine-based curing agent can function as a synergistic curing resin to maximize the Tg and heat resistance of the cured product of the resin.
  • the phenoxyphosphazene compound ( ) in the component (A) described in the present invention has a softening point of 60 to 150 ° C and is a cyclic phenoxyphosphazene compound selected from the formula ( ⁇ ) and A chain phenoxyphosphazene compound represented by the formula ( ⁇ ):
  • the weight percentage is based on the weight sum of 1, 2 and 3;
  • the phenoxyphosphazene compound (A is soluble in an organic solvent compared with the conventional condensed phosphate flame retardant, and is easily dispersed uniformly in the resin composition, and has a high thermal decomposition temperature, low water absorption, It is not easy to be hydrolyzed, etc. If all of the cyclic phenoxyphosphazene compounds are used, their solubility in organic solvents is poor, so it is necessary to contain a certain amount of chain phenoxyphosphazene compounds to promote their dissolution, but the chain The amount of the phenoxyphosphazene compound should be moderate, otherwise the phenoxyphosphazene compound (A softening point is low.
  • the compound (A 2 ) having a dihydrobenzoxazine ring in the component (A) described in the present invention can be produced from a compound having a phenolic hydroxyl group, a primary amine and formaldehyde, and the preparation method is technology, the skilled person is fully capable to provide compound (a 2) having a dihydrobenzoxazine ring according to the method disclosed in the prior art.
  • An exemplary compound (A 2 ) having a dihydrobenzoxazine ring is selected from the group consisting of The bisphenol A type benzoxazine resin shown, the bisphenol F type benzoxazine resin represented by the formula ( ⁇ ), the phenolphthalein type benzoxazine resin or the 4,4'-diaminobenzophenone type Any one or a mixture of at least two of benzoxazine resins, for example, a mixture of a 4,4'-diaminodibenzopyrene-type benzoxazine resin and a phenolphthalein-type benzoxazine resin, structural formula a mixture of a bisphenol F type benzoxazine resin represented by ( ⁇ ) and a bisphenol hydrazine type benzoxazine resin represented by the formula ( ⁇ ), 4,4'-diaminobenzophenone type benzoxazole Mixture of azine resin, phenolphthalein type benzoxazine resin and
  • R is -C(C3 ⁇ 4) 2 -, -CH 2 -, or any of them;
  • the skeleton maintains a certain rigidity while having relatively good toughness, and the phenolphthalein type benzoxazine resin and the MDA type benzoxazine resin are resistant. Better heat.
  • the epoxy resin is selected from a bisphenol A type epoxy resin having an epoxy equivalent of 500 1500, a carboxylated nitrile rubber modified epoxy resin having an epoxy equivalent of 700 2000, and a ring. Any one or a mixture of at least two of halogen-free epoxy resins having an oxazolone ring having an oxygen equivalent of 600 to 1600 a bisphenol A type epoxy resin having an epoxy equivalent of 500 1500, a 10 to 30 wt% carboxylated nitrile rubber modified epoxy resin having an epoxy equivalent of 700 2000, and an oxazole having an epoxy equivalent of 600 1600. Any one or a mixture of at least two of the halogen-free epoxy resins of the anthrone ring.
  • the mixture for example, a mixture of a halogen-free epoxy resin having an oxazolone ring having an epoxy equivalent of 600 1600 and a carboxylated nitrile rubber-modified epoxy resin having an epoxy equivalent of 700 to 2000 and 10 to 30% by weight, epoxy a mixture of 10 to 30 wt% carboxylated nitrile rubber modified epoxy resin having an equivalent weight of 700 2000 and a bisphenol A epoxy resin having an epoxy equivalent of 500 1500, and an oxazolone ring having an epoxy equivalent of 600 1600 a mixture of a halogen-free epoxy resin and a bisphenol A epoxy resin having an epoxy equivalent of 500 1500, a halogen-free epoxy resin having an oxazolone ring having an epoxy equivalent of 600 1600, and an epoxy equivalent of 700 2000 A mixture of 10 to 30 wt% carboxylated nitrile rubber modified epoxy resin and bisphenol A epoxy resin having an epoxy equivalent of 500 1500.
  • 10 ⁇ 30wt% carboxylated nitrile rubber modified epoxy resin refers to 10
  • the component (C) described in the present invention is selected from any one or a mixture of at least two of a phenol novolac resin, a bisphenol A phenol resin, a nitrogen-containing phenol resin, or a phosphorus-containing phenol resin; a mixture such as a mixture of a phosphorus-containing phenolic resin and a nitrogen-containing phenolic resin, a mixture of a nitrogen-containing phenolic resin and a bisphenol A type phenolic resin, a mixture of a bisphenol A type phenol resin and a phenol phenol resin, a phosphorus-containing phenol resin, a nitrogen-containing phenolic resin A mixture of a resin and a bisphenol A type phenol resin, a mixture of a nitrogen-containing phenol resin, a bisphenol A type phenol resin, a mixture of a nitrogen-containing phenol resin, a bisphenol A type phenol resin, a phenol novolac resin, and a phosphorus-containing phenol resin, preferably a phenol novolac
  • the ring in the phenol novolac resin and the nitrogen-containing phenol resin belongs to an aromatic ring and has a phenolic skeleton structure, which can remarkably improve the heat resistance of the cured product of the resin.
  • the nitrogen-containing phenolic resin improves the flame retardancy of the cured product of the resin on the basis of improving heat resistance.
  • the amine curing agent is preferably an aromatic amine curing agent, and further preferably diaminodiphenyl ether, diaminodiphenyl sulfone, diamino group.
  • Diphenyl Any one or a mixture of at least two of formazan, m-xylylenediamine or benzidine.
  • the mixture is, for example, a mixture of benzidine and m-xylylenediamine, a mixture of diaminodiphenylformamidine and diaminodiphenylsulfone, a mixture of diaminodiphenyl ether and m-xylylenediamine, benzidine, m-phenylene a mixture of dimethylamine and diaminodiphenyl sulfone, a mixture of m-xylylenediamine, diaminodiphenylformamidine, diaminodiphenyl sulfone and diaminodiphenyl ether, benzidine, m-xylylenediamine, two A mixture of aminodiphenylformamidine, diaminodiphenyl sulfone and diaminodiphenyl ether.
  • the phenolic resin is selected from a phenol novolac resin or/and a nitrogen-containing phenolic resin, and an amine curing agent is selected as an aromatic amine curing agent
  • an aromatic amine curing agent is selected as an aromatic amine curing agent
  • the ring in the phenol novolac resin and the nitrogen-containing phenol resin belongs to an aromatic ring, it has a phenolic skeleton structure, and
  • the aromatic amine curing agent also has an aromatic ring, and the phenolic resin and the aromatic amine curing agent are synergistically cured, which can significantly improve the Tg and heat resistance of the cured product of the resin, and significantly improve the addition of the epoxy resin having an epoxy equivalent of 500 to 2000.
  • the nitrogen-containing phenolic resin improves the flame retardancy of the cured product of the resin on the basis of improving the heat resistance.
  • the resin composition of the present invention further comprises (E) a curing accelerator.
  • the (E) component described in the present invention that is, as a curing accelerator of the resin composition, the curing accelerator is preferably an imidazole compound, and further preferably 2-methylimidazole, 2-ethyl-4-methyl Any one or a mixture of at least two of imidazole, 2-phenylimidazole or 2- ⁇ -mercaptoimidazole.
  • the mixture is, for example, a mixture of 2- ⁇ i ⁇ -mercaptopimidazole and 2-phenylimidazole, a mixture of 2-ethyl-4-methylimidazole and 2-methylimidazole, 2-undecyl imidazole, 2 a mixture of phenylimidazole and 2-ethyl-4-methylimidazole, a mixture of 2-ethyl-4-methylimidazole, 2-methylimidazole and 2- ⁇ -mercaptoimidazole, 2- ⁇ - ⁇ A mixture of imidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole and 2-methylimidazole.
  • the curing accelerator has a weight fraction of 0.01 to 1 part by weight, for example, 0.08 parts by weight, 0.15 parts by weight, 0.25 parts by weight, 0.3 parts by weight, 0.45 parts by weight, 0.55 parts by weight, 0.65 parts by weight, 0.8% by weight.
  • the resin composition further comprises (F) an inorganic filler, which is mainly used to adjust some physical effects of the composition.
  • the inorganic filler is selected from the group consisting of aluminum hydroxide, boehmite Y- A100H, silica, talc, mica, barium sulfate, lithopone, calcium carbonate, wollastonite, kaolin, brucite, silicon Any one or a mixture of at least two of algae, bentonite, or pumice powder, such as a mixture of aluminum hydroxide and boehmite, a mixture of silica and talc, a mixture of mica and barium sulfate, a mixture of powder and talc, a mixture of calcium carbonate and wollastonite, a mixture of kaolin and brucite, a mixture of diatomaceous earth and bentonite, a mixture of bentonite and talc, silica, aluminum hydroxide and talc a mixture of mica, bar
  • the inorganic filler is 6 to 300 parts by weight, for example, 14 parts by weight, 45 parts by weight, 70 parts by weight, 98 parts by weight, 125 parts by weight, 149 parts by weight, 178 parts by weight, 194 parts by weight, and 215 parts by weight. Parts, 265 parts by weight, 285 parts by weight, preferably 10 100 parts by weight, further preferably 20 to 80 parts by weight.
  • a halogen-free flame retardant resin composition comprising, by weight:
  • the weight ratio of the compound (A 2 ) of the azine ring is 1:25 to 1:2
  • a halogen-free flame retardant resin composition comprising, by weight:
  • the weight ratio of the compound (A 2 ) of the azine ring is 1:25 to 1:2
  • the halogen-free flame-retardant resin composition of the present invention has a phosphorus content of 0.5 to 3% by weight, a nitrogen content of 1 to 10% by weight, and a halogen content of 0.09% by weight or less.
  • the halogen-free flame-retardant resin composition of the present invention may be added with a thermosetting resin.
  • a thermosetting resin include a cyanate resin, a urethane resin, a melamine resin, and the like, and a curing agent of these thermosetting resins may be added or Curing agent accelerator.
  • the halogen-free flame-retardant resin composition may further contain various additives, and specific examples thereof include a silicon germanium coupling agent, a titanate coupling agent, an antioxidant, a heat stabilizer, and an antistatic agent. UV absorbers, pigments, colorants, lubricants, etc. These thermosetting resins and various additives may be used singly or in combination of two or more.
  • the preparation method of one of the halogen-free flame-retardant resin compositions of the present invention can be prepared by mixing, stirring, and mixing the various components in the resin composition formulation by a known method.
  • a second object of the present invention is to provide a prepreg made of a halogen-free flame-retardant resin composition, comprising a base material and a halogen-free flame-retardant resin composition as described above adhered to the base material after impregnation and drying.
  • the prepreg has excellent flame retardant properties while also having a high glass transition temperature (T g ), high Heat resistance, high flexural strength, high reliability, low dielectric loss factor, low water absorption, low CTE and excellent chemical and mechanical properties.
  • the prepreg of the present invention is obtained by heat-drying using the above-mentioned halogen-free flame-retardant resin composition, which is based on a nonwoven fabric or other fabrics, such as natural fibers, organic synthetic fibers, and inorganic fibers. use.
  • the preparation method of the prepreg according to the present invention is as follows: according to the formulation of the above halogen-free flame retardant resin composition, the solid materials are mixed, then the liquid solvent is added, stirred until completely dissolved, and then the liquid resin and the curing accelerator are added. Continue to stir evenly and equilibrate. Finally, use PM (propylene glycol methyl ether) solvent to adjust the solid content of the solution by 65% ⁇ 75% to make a glue.
  • the glue to impregnate the base material, such as inorganic fabric or organic fabric such as glass cloth.
  • the impregnated glass cloth was dried by heating in an oven at 160 ° C for 4 minutes.
  • the solvent include alcohols such as methanol, ethanol, and butanol, ethers such as ethyl cellosolve, butyl cellosolve, ethylene glycol-methyl ether, carbitol, and butyl carbitol.
  • acetone butanone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and other ketones
  • aromatic hydrocarbons such as toluene, xylene, mesitylene, ethoxyethyl acetate, acetic acid
  • An ester such as ethyl ester, a nitrogen-containing solvent such as hydrazine, hydrazine-dimethylformamide, hydrazine, hydrazine-dimethylacetamide or hydrazine-methyl-2-pyrrolidone.
  • solvents may be used singly or in combination of two or more.
  • aromatic hydrocarbon solvents such as toluene, xylene, and mesitylene, and acetone, butanone, methyl ethyl ketone, and methyl group.
  • a ketone flux such as butyl ketone or cyclohexanone is used in combination.
  • a third object of the present invention is to provide a laminate comprising at least one prepreg as described above.
  • a fourth object of the present invention is to provide a printed circuit board which is prepared from at least one laminate as described above.
  • the laminate of the present invention comprises one or more prepregs bonded together by heat and pressure, without being laminated or laminated on one or both sides of the prepreg, and hot pressed; Circuit board One laminate is not laminated, or the prepreg, metal foil is laminated on one side or both sides of the laminate, and hot pressed.
  • the lamination must meet the following requirements: 1 The heating rate of the lamination should be controlled at 1.52.5 °C/min at a material temperature of 80-140 °C; 2 the pressure setting of the lamination, and the temperature of the outer layer is 80 ⁇ The full pressure is applied at 100 ° C, and the full pressure is about 350 psi. 3 When curing, the temperature of the control material is 185 ° C, and the temperature is kept for 60 minutes.
  • the metal foil is copper foil, nickel foil, aluminum foil, SUS foil, etc., and the material thereof is not limited.
  • the present invention has the following beneficial effects:
  • the halogen-free flame-retardant resin composition according to the present invention uses a phenoxyphosphazene compound as a flame retardant, which has a strong synergistic flame retarding effect with a compound having a dihydrobenzoxazine ring, and thus When the amount of the phenoxyphosphazene compound is greatly reduced, the flame retardant can also be achieved, that is, the flame retarding efficiency is greatly improved, and the phenoxyphosphazene compound migrates or even oozes out without the plate being exposed to high temperature (Bleed)
  • the halogen-free flame-retardant resin composition according to the present invention uses a flame retardant as a phenoxyphosphazene compound, which has good chemical resistance and is not easily hydrolyzed.
  • the metal foil-clad laminate for printed circuit has excellent chemical resistance and anti-CAF performance, that is, high reliability;
  • the halogen-free flame-retardant resin composition of the present invention uses a benzoxazine resin as a main resin. thus a prepreg, laminate the resin composition, a printed circuit having a high glass transition temperature (T g) copper-clad laminate with high heat resistance, low dielectric loss, low water absorption And low CTE and the like;
  • the halogen-free flame-retardant resin composition of the present invention uses an epoxy resin modified resin having an epoxy equivalent of 500 2000, and an epoxy resin having an epoxy equivalent of 500 2000 has excellent toughness.
  • the mechanical friability of the benzoxazine cured product can be greatly improved;
  • the amine curing agent according to the present invention is preferably an aromatic amine curing agent, which can greatly improve the Tg of the cured product while improving the Tg thereof. Heat resistance.
  • Embodiment 7 Embodiment 8 Embodiment 9 Embodiment 10 Embodiment 11 Embodiment 12
  • a halogen-free flame retardant resin composition comprising, by weight:
  • the weight ratio of the compound (A 2 ) is 1:25;
  • the softening point (100 to 110 ° C) is a mixture of a cyclic phenoxyphosphazene compound and a chain phenoxyphosphazene compound represented by the following structural formula:
  • n is an integer from 3 to 100
  • a 2 is a bisphenol A type benzoxazine resin as described in the following structural formula:
  • R is -C(C3 ⁇ 4) 2 -, for Example 14
  • a halogen-free flame retardant resin composition comprising, by weight:
  • the weight ratio of the compound (A 2 ) is 1:2;
  • the softening point (100 to 110 ° C) is a mixture of a cyclic phenoxyphosphazene compound and a chain phenoxyphosphazene compound represented by the following structural formula:
  • n 3-100
  • a 2 is a bisphenol F type benzoxazine resin as described in the following structural formula:
  • a halogen-free flame retardant resin composition comprising, by weight:
  • the weight ratio of the compound (A 2 ) is 1:10;
  • Softening point (100 ⁇ 110 ° C), which is a cyclic phenoxyphosphazene compound represented by the following structural formula and Mixture of chain phenoxyphosphazene compounds
  • n is 3-100 The integer.
  • a 2 is a 4,4'-diaminodibenzoyl benzoxazine resin.
  • the weight ratio of the compound (A 2 ) is 1:2;
  • Bomstone 150 parts by weight.
  • the softening point (100 to 110 ° C) is a mixture of a cyclic phenoxyphosphazene compound represented by the structural formula ( ⁇ ) and a chain phenoxyphosphazene compound represented by the structural formula ( ⁇ ), and the specific composition is as follows:
  • the weight percentage of the 1 hexaphenoxycyclotriphosphazene compound is 90%
  • the weight percentage of the @5 5 cyclic phenoxyphosphazene compound and the chain phenoxyphosphazene compound is
  • the weight percentage is based on the weight sum of 1, 2 and 3;
  • n 3-100
  • a 2 is a 4,4'-diaminodibenzoyl benzoxazine resin.
  • the softening point (100 to 110 ° C) is a mixture of a cyclic phenoxyphosphazene compound represented by the structural formula ( ⁇ ) and a chain phenoxyphosphazene compound represented by the structural formula ( ⁇ ), and the specific composition is as follows:
  • the weight percentage of the 1 hexaphenoxycyclotriphosphazene compound is 70%
  • the weight percentage of the cyclic phenoxyphosphazene compound and the chain phenoxyphosphazene compound of @m 5 is the weight percentage based on the weight of 1, 2 and 3;
  • n is an integer from 3 to 100.
  • a 2 is a phenolphthalein type benzoxazine resin.
  • the weight ratio of the compound (A 2 ) is 1:12;
  • the softening point (65-75 ° C) is a mixture of a cyclic phenoxyphosphazene compound represented by the structural formula (a) and a chain phenoxyphosphazene compound represented by the formula ( ⁇ ). as follows: The weight percentage of the 1 hexaphenoxycyclotriphosphazene compound is 75%;
  • the weight percentage of the cyclic phenoxyphosphazene compound and the chain phenoxyphosphazene compound of @m 5 is the weight percentage based on the weight of 1, 2 and 3;
  • n 3-100
  • a 2 is a phenolphthalein type benzoxazine resin.
  • the weight ratio of the compound (A 2 ) is 1:12;
  • the softening point (140 to 150 ° C) is a mixture of a cyclic phenoxyphosphazene compound represented by the structural formula (a) and a chain phenoxyphosphazene compound represented by the structural formula ( ⁇ ), and the specific composition is as follows:
  • the weight percentage of the 1 hexaphenoxycyclotriphosphazene compound is 80%;
  • the weight percentage of the @5 5 cyclic phenoxyphosphazene compound and the chain phenoxyphosphazene compound is 0; The weight percentage is based on the weight sum of 1, 2 and 3;
  • n 3-100
  • a 2 is a phenolphthalein type benzoxazine resin.
  • Comparative Example 7 is Example 1 disclosed in CN 101643570A.
  • the preparation method of the prepreg is as follows: according to the formulation of the above halogen-free flame retardant resin composition, the solid materials are mixed, and then the liquid solvent is added, stirred until completely dissolved, and then the liquid resin and the curing accelerator are added, and the stirring is evenly balanced. Finally, PM (propylene glycol methyl ether) solvent is used to adjust the solid content of the solution by 65% ⁇ 75% to make a glue. The glue is impregnated with the base glass cloth, and the impregnated glass cloth is clothed at 160 °C. It was made by heating and drying in an oven for 4 minutes.
  • the laminate for a printed circuit board comprises a laminate obtained by bonding two or more prepregs together by heat and pressure, and a metal foil adhered to one or both sides of the laminate.
  • the laminate was laminated by using the above-mentioned prepreg 8 sheets and 2 sheets of one ounce (35 ⁇ m thick) metal foil, laminated by a hot press, and pressed into a double-sided metal foil laminate.
  • the lamination shall meet the following requirements: 1
  • the heating rate of the lamination shall be controlled at 1.5 ⁇ 2.5 °C/min at a material temperature of 80-140 °C ; 2 the pressure setting of the lamination, the temperature of the outer layer is 80 Full pressure is applied to ⁇ 100 °C, the full pressure is about 350 psi; 3
  • the temperature of the control material is 185 ° C, and the temperature is kept 60 mm.
  • the metal foil is copper foil, nickel foil, aluminum foil, SUS foil, etc., and the material thereof is not limited.
  • Halogen content (%) 0.03 0.03 0.03 0.03 0.03 0.03 0.03 Mobility resistance oo ⁇ ⁇ oo
  • test method for the above performance is as follows: Determine the DSC method for measurement.
  • Dielectric loss factor According to the resonance method using the strip line, the dielectric loss factor at 1 GHz is measured in accordance with IPC-TM-650 2.5.5.5.
  • Halogen content The halogen content of the copper clad laminate was measured by oxygen cylinder combustion method and ion chromatography according to JPCA-ES-01-2003 "Halogen-free copper-clad test method".
  • Alkali resistance The 50x50mm substrate was immersed in a 10% sodium hydroxide solution at 80 ° C for 60 minutes, visually observed ( ) without white spots, (h 2 ) point white spots, ( h 3 ) flaky white spots, (h4) white spots throughout the board.
  • the table is represented by ⁇ , ⁇ , ⁇ , and X, respectively.
  • the effects of high glass transition temperature, high peel strength, high bending strength, high reliability, flame resistance, immersion resistance, chemical resistance, water absorption, and low dielectric loss can be achieved.
  • the mechanical processing performance is good, the halogen content can reach the V-0 standard in the flame retardancy test UL94 within the requirements of the JPCA halogen-free standard; the invention fully utilizes the synergistic flame retardant of the phenoxyphosphazene compound and the benzoxazine resin.
  • the halogen content is below 0.09% by weight, so as to achieve environmental protection.

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Abstract

一种无卤阻燃树脂组合物，所述树脂组合物按重量份数包括：（A）苯氧基磷腈化合物（A1）与具有二氢苯并噁嗪环的化合物（A2）的混合物：45-90重量份，A1与A2的重量比为1:25~1:2；（B）环氧当量为500-2000的环氧树脂：10~45重量份；（C）酚醛树脂：10~25重量份，和（D）胺类固化剂：0.5~10重量份。采用该组合物制备得到的预浸料、层压板、印制电路用覆金属箔层压板具有高玻璃化转变温度（Tg）、高耐热性、低介电损耗因素、低吸水性以及低C.T.E等性能。

Description

一种无卤阻燃树脂组合物及其用途 技术领域
本发明涉及一种无卤阻燃树脂组合物及其用途， 具体地， 本发明涉及一种 无卤阻燃树脂组合物及用其制成的预浸料、 层压板与印制电路用层压板。
背景技术
近些年来， 人们对环保电子产品的呼声越来越高， 这也使得无卤技术取得 了长足的发展。 另一方面， 伴随着无铅时代的到来， 对于印制电路板除了无卤 阻燃性以外， 能配合无铅软悍条的作用也变得重要。 因此， 对印制电路用层压 板也要求比以前具有更高的耐热性及可靠性。 目前主要技术集中在磷改性环氧 树脂及苯并噁嗪树脂。 众所周知， 与普通环氧树脂相比， 磷改性环氧树脂会导 致印制电路用层压板的吸水性大增， 耐湿热性能下降。
为解决上述问题， CN101691449A中报道了通过将苯氧基磷腈化合物与具有 二氢苯并噁嗪环的化合物的协同阻燃， 极大提高了阻燃性能。 该固化物具有高 的玻璃化转变温度 （Tg)、 比较好的耐热性、 高弹性率、 低介电损耗并具有优良 的难燃性及机械加工性。 但是该方案的耐热性比较有限， 另外加工性也不是完 全尽人意。 此外， CN 101643570A公开了一种无卤阻燃型树脂组合物及用其制 成的预浸料、 层压板与印制电路用层压板， 该无卤阻燃型树脂组合物包含： （A) 苯氧基磷腈化合物 (AO与具有二氢苯并噁嗪环的化合物 (A2)的混合物， 40 至 80 重量份， 且， 苯氧基磷腈化合物 (AO与具有二氢苯并噁嗪环的化合物 (A2)的重量 比在 1 :10至 1 :2之间； （B)聚环氧化合物， 15至 45重量份； （C)酚醛树脂类固化 剂， 5至 25重量份； 以及D)作为固化促进剂的咪唑类化合物， 0.1至 1重量份。 但是， 该技术方案中， 由于加入了较多的具有二氢苯并噁嗪环的化合物， 该化 合物的用量越大， 固化物的脆性越大， 因此， 其用量不能过大。 另外该技术方 案对于辅助固化剂的作用予以忽视， 使得该方案得到的树脂固化产物的性能很 难进一歩提升。 因此， 如何加入大量的具有二氢苯并噁嗪环的化合物， 并使树 脂组合物获得更好的综合性能是业界的难点。
发明内容
本发明的目的之一在于提供一种无卤阻燃树脂组合物， 所述树脂组合物既 能满足无卤阻燃要求， 具有优异的耐热性能， 又在加入大量的二氢苯并噁嗪环 固化产物的情况下， 改良二氢苯并噁嗪环固化产物的脆性， 大大提高了固化产 物的加工性能， 使得批量化生产成为可能。
为实现上述目的， 本发明采用了如下技术方案：
一种无卤阻燃树脂组合物， 按重量份数包括：
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 45~90重量份， 苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物 (A2) 的重量比为 1 :25~1 :2； (B) 环氧当量为 500 2000的环氧树脂： 10~45重 量份； （C) 酚醛树脂： 10~25重量份， 和 （D) 胺类固化剂： 0.5~10重量份。
优选地， 一种无卤阻燃树脂组合物， 按重量份数包括：
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 50~90重量份， 苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物 (A2) 的重量比为 1 :20~1 :5； (B) 环氧当量为 500 2000的环氧树脂： 10-40 量份； （C) 酚醛树脂： 15~25重量份， 和 （D) 胺类固化剂： 1~8重量份。
优选地， 一种无卤阻燃树脂组合物， 按重量份数包括：
(A) 苯氧基磷腈化合物 （A1 ) 与具有二氢苯并噁嗪环的化合物 （A2) 的 混合物： 60~90重量份， 苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合 物 （A2) 的重量比为 1 :15~1 :5； (B) 环氧当量为 500 2000的环氧树脂： 10~35 重量份； （C) 酚醛树脂： 15~25重量份， 和 （D) 胺类固化剂： 2~7重量份。
所述苯氧基磷腈化合物 （A 与具有二氢苯并噁嗪环的化合物 （A2) 的混 合物的重量份数为 45~90重量份， 例如 53重量份、 57重量份、 62重量份、 68 重量份、 72重量份、 78重量份、 82重量份、 87重量份、 89重量份。
所述苯氧基磷腈化合物 （A 与具有二氢苯并噁嗪环的化合物 （A2) 的重 量比为 1 :25~1 :2， 例如 1 :24、 1 :22、 1 :20、 1 :18、 1 :16、 1 :14、 1 :12、 1 :10、 1 :8、 1:6、 1 :4、 1 :3。
组分（A)的用量以 45~90重量份为宜，并且，为保证苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物 （A2) 具有良好的协同阻燃效应以及避免苯氧 基磷腈化合物 （A 的负面作用， 苯氧基磷腈化合物 （A 与具有二氢苯并噁 嗪环的化合物 （A2) 的重量比为 1 :25~1 :2为宜。
所述 （B) 环氧当量为 500 2000的环氧树脂的重量份数为 10~45重量份， 例如 13重量份、 16重量份、 19重量份、 22重量份、 28重量份、 32重量份、 38 重量份、 43重量份。
所述 （C) 酚醛树脂的重量份数为 10~25重量份， 例如 12重量份、 14重量 份、 16重量份、 18重量份、 20重量份、 22重量份、 23重量份。 该（C)组分用 量以 10至 25重量份为宜， 低于 10重量份， 固化物玻璃化转变温度提高不多， 超过 25重量份固化物耐热性变差。
所述 （D) 胺类固化剂的重量份数为 0.5~10重量份， 例如 1.2重量份、 2.5 重量份、 4重量份、 6重量份、 7重量份、 9重量份。
本发明采用协同固化， 用酚醛树脂和胺类固化剂协同固化， 利用苯氧基磷 腈化合物 （A 与具有二氢苯并噁嗪环的化合物 （A2) 的协同阻燃作用， 并添 加环氧当量为 500 2000的环氧树脂， 在满足无卤阻燃的同时， 提高了树脂固化 产物的 Tg、 耐热性以及机械加工性能。
以下为本发明的原理性的解释：
本发明所述的苯氧基磷腈化合物 （A 为含氮、 含磷阻燃剂， 其阻燃机理 包括气相阻燃和固相阻燃， 但若单独使用， 则其阻燃物质释放较慢， 即阻燃效 率不高。 同时， 苯氧基磷腈化合物 （A 使用量过少时达不到阻燃效果， 使用 量过大时则会影响到固化物的其它性能： 如固化物处于高温条件下， 苯氧基磷 腈化合物（ ）可能会迁移或渗出 （Bleed out) 以及弯曲模量等物理性能会急剧 下降。 而采用本身就具有耐燃性的具有二氢苯并噁嗪环的化合物 （A2) 与苯氧 基磷腈化合物 （A 复合， 可协同加快引发苯氧基磷腈化合物 （A 释放阻燃 物质， 因此其阻燃效率可大大提高。
本发明利用苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的协同阻燃作用， 并调整苯氧基磷腈化合物 （A 与具有二氢苯并噁嗪环的化 合物 （A2) 的重量比在 1 :25至 1 :2之间， 比 CN 101643570A中所公开的重量比 为 1:10-1 :2 相比， 加大了具有二氢苯并噁嗪环的化合物 （A2) 的用量。 加大具 有二氢苯并噁嗪环的化合物 （A2) 的用量可以降低树脂组合物成本， 提高苯氧 基磷腈化合物 （A 的阻燃效率， 另外还会使得苯氧基磷腈化合物 （A 迁移 甚至渗出 （Bleed out) 以及弯曲强度等物理性能急剧下降等问题得到解决。
为了改善二氢苯并噁嗪环固化产物的脆性， 提高树脂固化产物的加工性能， 在树脂组合物中添加有环氧当量为 500 2000 的环氧树脂。 但是环氧当量为 500-2000的环氧树脂在改善脆性的同时， 会降低树脂固化产物的 Tg和耐热性。
本发明采用协同固化， 用酚醛树脂和胺类固化剂协同固化。 胺类固化剂固 化树脂时依靠的是 -NH2、 -NH 以及少量游离的胺基， 胺值低， 活性小， 因而固 化反应很温和； 而酚醛树脂中含有大量的酚羟基， 活性大， 能促进固化， 因而 固化时间很短。 因而， 酚醛树脂和胺类固化剂协同固化， 可以有效地克服具有 二氢苯并噁嗪环的化合物 （A2) 使用量加大后苯氧基磷腈化合物 （A 的迁移 以及环氧当量为 500 2000 的环氧树脂的加入后树脂固化产物的 Tg和耐热性降 低的缺点， 在满足无卤阻燃的同时， 提高了树脂固化产物的 Tg、 耐热性以及机 械加工性能。 酚醛树脂和胺类固化剂在上述配比的情况下， 可以发挥协同固化 树脂的作用， 最大程度地提高树脂固化产物的 Tg和耐热性能。
本发明中所述的 （A ) 组分中的苯氧基磷腈化合物 （ ） 的软化点为 60-150 °C , 是选自结构式 （α) 所示的环状苯氧基磷腈化合物和结构式 （β) 所 示的链状苯氧基磷腈化合物：
Figure imgf000006_0001
式中， X为 -N=P(OC6¾)3或 -N=P(0)C6¾ Y为 -P(OC6¾)4或 -P(0)(C6¾)2; n为 3-100的整数。 ®m 5的环状苯氧基磷腈化合物及链状苯氧基磷腈化合物的重量百分比为
1-10%；
所述重量百分比以①、 ②和③的重量和为基准;
Figure imgf000007_0001
式中， X为 -N=P(OC6¾)3或 -N=P(0)C6¾ Y为 -P(OC6¾)4或 -P(0)(C6¾)2; n为 3-100的整数。
苯氧基磷腈化合物 （A 与常用的缩合磷酸酯阻燃剂相比， 可采用有机溶 剂溶解， 极易均匀分散于树脂组合物中， 且其具有较高的热分解温度、 低吸水 性、 不易水解等优势。 若全部采用环状苯氧基磷腈化合物， 则其在有机溶剂中 的溶解性欠佳， 因此需含有一定量的链状苯氧基磷腈化合物以促进其溶解， 但 链状苯氧基磷腈化合物的量需适中， 否则会导致苯氧基磷腈化合物 （A 软化 点偏低。 此外， 苯氧基磷腈化合物 （A 软化点小于 60°C， 会降低固化物的玻 璃化转变温度； 软化点高于 150°C， 则苯氧基磷腈化合物（A 与其它组份的相 容性变差。
本发明中所述的 （A) 组分中的具有二氢苯并噁嗪环的化合物 （A2)， 可由 具有酚类羟基的化合物、 伯胺和甲醛制备得到， 所述制备方法为已有技术， 所 属领域技术人员完全有能力根据现有技术中所公开的方法制备得到具有二氢苯 并噁嗪环的化合物 （A2)。 示例性的具有二氢苯并噁嗪环的化合物 （A2)选自结 所示的双酚 A型苯并噁嗪树脂、 结构式 （δ) 所示的双酚 F型苯并噁 嗪树脂、 酚酞型苯并噁嗪树脂或 4,4'-二氨基二苯甲垸型苯并噁嗪树脂中的任意 一种或者至少两种的混合物， 所述混合物例如 4,4'-二氨基二苯甲垸型苯并噁嗪 树脂和酚酞型苯并噁嗪树脂的混合物， 结构式 （δ)所示的双酚 F型苯并噁嗪树 脂和结构式（γ)所示的双酚 Α型苯并噁嗪树脂的混合物， 4,4'-二氨基二苯甲垸 型苯并噁嗪树脂、 酚酞型苯并噁嗪树脂和结构式 （δ)所示的双酚 F型苯并噁嗪 树脂的混合物， 结构式 （γ)所示的双酚 Α型苯并噁嗪树脂、 4,4'-二氨基二苯甲 烧型苯并噁嗪树脂和结构式 （δ)所示的双酚 F型苯并噁嗪树脂的混合物， 优选 酚酞 /和 4,4'-二氨基二苯甲垸型苯并噁嗪树脂。
式
Figure imgf000008_0001
中： R为 -C(C¾)2-、 -CH2-、 或 中的任意一种； 为
4,4'-二氨基二苯甲垸型苯并噁嗪树脂， 即 MDA型苯并噁嗪树脂。
上述的双酚 F型苯并噁嗪树脂由于分子结构中存在亚甲基， 所以骨架在保 持一定的刚性同时韧性相对较好，而酚酞型苯并噁嗪树脂和 MDA型苯并噁嗪树 脂耐热性更佳。
本发明中的 （B) 组分， 所述环氧树脂选自环氧当量为 500 1500的双酚 A 型环氧树脂、 环氧当量为 700 2000的羧基丁腈橡胶改性环氧树脂、 环氧当量为 600-1600的具有噁唑垸酮环的无卤环氧树脂中的任意一种或者至少两种的混合 物， 优选环氧当量为 500 1500的双酚 A型环氧树脂、 环氧当量为 700 2000的 10~30wt%的羧基丁腈橡胶改性环氧树脂、环氧当量为 600 1600的具有噁唑垸酮 环的无卤环氧树脂中的任意一种或者至少两种的混合物。 所述混合物例如环氧 当量为 600 1600的具有噁唑垸酮环的无卤环氧树脂和环氧当量为 700 2000的 10~30wt%的羧基丁腈橡胶改性环氧树脂的混合物， 环氧当量为 700 2000 的 10~30wt%的羧基丁腈橡胶改性环氧树脂和环氧当量为 500 1500的双酚 A型环 氧树脂的混合物， 环氧当量为 600 1600的具有噁唑垸酮环的无卤环氧树脂和环 氧当量为 500 1500的双酚 A型环氧树脂的混合物， 环氧当量为 600 1600的具 有噁唑垸酮环的无卤环氧树脂、 环氧当量为 700 2000的 10~30wt%的羧基丁腈 橡胶改性环氧树脂和环氧当量为 500 1500 的双酚 A 型环氧树脂的混合物。 10~30wt%的羧基丁腈橡胶改性环氧树脂： 是指以羧基丁基橡胶和环氧树脂的重 量和为 100%计， 采用 10~30wt%的羧基丁腈橡胶改性环氧树脂。
本发明中所述的（C)组分， 即酚醛树脂选自苯酚酚醛树脂、 双酚 A型酚醛 树脂、 含氮酚醛树脂或含磷酚醛树脂中的任意一种或者至少两种的混合物， 所 述混合物例如含磷酚醛树脂和含氮酚醛树脂的混合物， 含氮酚醛树脂和双酚 A 型酚醛树脂的混合物， 双酚 A型酚醛树脂和苯酚酚醛树脂的混合物， 含磷酚醛 树脂、 含氮酚醛树脂和双酚 A型酚醛树脂的混合物， 含氮酚醛树脂、 双酚 A型 酚醛树脂、 苯酚酚醛树脂和含磷酚醛树脂的混合物， 优选苯酚酚醛树脂和 /或含 氮酚醛树脂。 苯酚酚醛树脂和含氮酚醛树脂中的环属于芳香环， 带有酚醛骨架 结构， 可以显著提高树脂固化产物的耐热性。 同时， 含氮酚醛树脂在提高耐热 性的基础上， 更好地提高了树脂固化产物的阻燃性能。
本发明中所述的 （D)组分， 即作为树脂组合物的固化剂， 所述胺类固化剂 优选芳香胺固化剂， 进一歩优选二氨基二苯醚、 二氨基二苯砜、 二氨基二苯基 甲垸、 间苯二甲胺或联苯胺中任意一种或者至少两种的混合物。 所述混合物例 如联苯胺和间苯二甲胺的混合物， 二氨基二苯基甲垸和二氨基二苯砜的混合物， 二氨基二苯醚和间苯二甲胺的混合物， 联苯胺、 间苯二甲胺和二氨基二苯砜的 混合物， 间苯二甲胺、 二氨基二苯基甲垸、 二氨基二苯砜和二氨基二苯醚的混 合物， 联苯胺、 间苯二甲胺、 二氨基二苯基甲垸、 二氨基二苯砜和二氨基二苯 醚的混合物。
当酚醛树脂选择苯酚酚醛树脂或 /和含氮酚醛树脂， 胺类固化剂选择芳香胺 固化剂时， 由于苯酚酚醛树脂和含氮酚醛树脂中的环属于芳香环， 带有酚醛骨 架结构， 而且， 芳香胺固化剂中也有芳香环， 酚醛树脂和芳香胺固化剂协同固 化， 可以显著提高树脂固化产物的 Tg和耐热性， 显著地改善了环氧当量为 500~2000的环氧树脂的加入导致 Tg和耐热性降低的问题。 同时， 含氮酚醛树脂 在提高耐热性的基础上， 更好地提高了树脂固化产物的阻燃性能。
优选地， 本发明所述树脂组合物还包括有 （E) 固化促进剂。
本发明中所述的 （E) 组分， 即作为树脂组合物的固化促进剂， 所述固化促 进剂优选咪唑类化合物，进一歩优选 2-甲基咪唑、 2-乙基 -4-甲基咪唑、 2-苯基咪 唑或 2- ^—垸基咪唑中的任意一种或者至少两种的混合物。 所述混合物例如 2- ~i ^一垸基咪唑和 2-苯基咪唑的混合物， 2-乙基 -4-甲基咪唑和 2-甲基咪唑的混合 物， 2-十一垸基咪唑、 2-苯基咪唑和 2-乙基 -4-甲基咪唑的混合物， 2-乙基 -4-甲基 咪唑、 2-甲基咪唑和 2- ^—垸基咪唑的混合物， 2- ^—垸基咪唑、 2-苯基咪唑、 2-乙基 -4-甲基咪唑和 2-甲基咪唑的混合物。
优选地， 所述固化促进剂的重量份数为 0.01~1重量份， 例如 0.08重量份、 0.15重量份、 0.25重量份、 0.3重量份、 0.45重量份、 0.55重量份、 0.65重量份、 0.8重量份、 0.9重量份、 0.95重量份，优选 0.05-0.9重量份，进一歩优选 0.1-0.8 重量份。
优选地， 所述树脂组合物还包括有含有 （F) 无机填料， 主要用来调整组合 物的一些物性效果。所述无机填料选自氢氧化铝、博姆石（boehmite Y-A100H)、 二氧化硅、 滑石粉、 云母、 硫酸钡、 立德粉、 碳酸钙、 硅灰石、 高岭土、 水镁 石、 硅藻土、 膨润土、 或浮石粉中的任意一种或者至少两种的混合物， 所述混 合物例如氢氧化铝和博姆石的混合物， 二氧化硅和滑石粉的混合物， 云母和硫 酸钡的混合物， 立德粉和滑石粉的混合物， 碳酸钙和硅灰石的混合物， 高岭土 和水镁石的混合物， 硅藻土和膨润土的混合物， 膨润土和滑石粉的混合物， 二 氧化硅、 氢氧化铝和滑石粉的混合物， 云母、 硫酸钡、 立德粉和碳酸钙的混合 物，高岭土、水镁石、硅藻土和膨润土的混合物，优选氢氧化铝、博姆石（boehmite γ-Α100Η)、 二氧化硅、 滑石粉或云母中的任意一种或者至少两种的混合物， 进 一歩优选氢氧化铝、 博姆石或二氧化硅中的任意一种或者至少两种的混合物。 该无机填料可随使用目的而作适当选择。 氢氧化铝、 博姆石和二氧化硅既可以 作为填料使用， 又可作为苯氧基磷腈化合物 （A 的阻燃助剂。
所述无机填料的重量份数为 6~300重量份， 例如 14重量份、 45重量份、 70 重量份、 98重量份、 125重量份、 149重量份、 178重量份、 194重量份、 215 重量份、 265重量份、 285重量份， 优选 10 100重量份， 进一歩优选 20~80重 量份。
一种无卤阻燃树脂组合物， 所述树脂组合物按重量份数包括：
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 45~90重量份， 苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物 (A2) 的重量比为 1 :25~1 :2； (B) 环氧当量为 500 2000的环氧树脂： 10~45重 量份； （C) 酚醛树脂： 10~25重量份； （D) 芳香胺固化剂： 0.5~10重量份， 和 (E) 固化促进剂： 0.01~1重量份。
一种无卤阻燃树脂组合物， 所述树脂组合物按重量份数包括：
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 45~90重量份， 苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物 (A2) 的重量比为 1 :25~1 :2； (B) 环氧当量为 500 2000的环氧树脂： 10~45重 量份； （C) 酚醛树脂： 10~25 重量份； （D) 芳香胺类固化剂： 0.5~10 重量份; (E) 固化促进剂： 0.01~1重量份， 和 （F) 填料： 6~300重量份。
本发明所述无卤阻燃型树脂组合物的磷含量为 0.5~3重量％，氮含量为 1~10 重量％， 卤素含量为 0.09重量％以下。
本发明所述的 "包括"， 意指其除所述组分外， 还可以包括其他组分， 这些 其他组分赋予所述树脂组合物不同的特性。 除此之外， 本发明所述的 "包括"， 还可以替换为封闭式的 "为"或 "由……组成"。
例如， 本发明所述无卤阻燃树脂组合物可以添加配合的热固性树脂， 作为 具体例， 可以举出氰酸酯树脂、 聚氨酯树脂、 蜜胺树脂等， 也可以添加这些热 固性树脂的固化剂或者固化剂促进剂。 另外， 所述无卤阻燃树脂组合物还可以 含有各种添加剂， 作为具体例， 可以举出硅垸偶联剂、 钛酸酯偶联剂、 抗氧剂、 热稳定剂、 抗静电剂、 紫外线吸收剂、 颜料、 着色剂、 润滑剂等。 这些热固性 树脂以及各种添加剂可以单独使用， 也可以两种或者两种以上混合使用。
作为本发明无卤阻燃树脂组合物之一的制备方法， 可以通过公知的方法配 合、 搅拌、 混合所述树脂组合物配方中的各种组分， 来制备。
本发明的目的之二在于提供一种用无卤阻燃型树脂组合物制成的预浸料， 包括基料及通过含浸干燥之后附着在基料上的如上所述的无卤阻燃树脂组合 物。 所述预浸料具有优异的阻燃性能， 同时还具有高玻璃化转变温度 （Tg)、 高 耐热性、 高弯曲强度、 高可靠性、 低介电损耗因素、 低吸水性、 低 C.T.E并具有 优良的耐化学性及机械加工性能。
作为本发明的预浸料为使用上述的无卤阻燃型树脂组合物加热干燥而制 得， 其使用无纺织物或其它织物为基料， 例如天然纤维、 有机合成纤维以及无 机纤维均可供采用。 本发明所述预浸料的制备方法为： 按照上述无卤阻燃树脂 组合物的配方， 将各固形物混合， 然后加入液态溶剂， 搅拌直至完全溶解后， 再加入液态树脂和固化促进剂， 继续搅拌均匀平衡即可， 最后用 PM (丙二醇甲 醚）溶剂适当调整溶液的固体含量 65%~75%而制成胶液，使用该胶液含浸基料， 如玻璃布等无机织物或有机织物，将含浸好的玻璃布在 160°C的烘箱中加热干燥 4分钟制成。 所述溶剂， 作为具体例， 可以举出甲醇、 乙醇、 丁醇等醇类， 乙基 溶纤剂、 丁基溶纤剂、 乙二醇-甲醚、 卡必醇、 丁基卡必醇等醚类， 丙酮、 丁酮、 甲基乙基甲酮、 甲基异丁基甲酮、 环己酮等酮类， 甲苯、 二甲苯、 均三甲苯等 芳香族烃类， 乙氧基乙基乙酸酯、 醋酸乙酯等酯类， Ν,Ν-二甲基甲酰胺、 Ν,Ν- 二甲基乙酰胺、 Ν-甲基 -2-吡咯垸酮等含氮类溶剂。上述溶剂可以单独使用一种， 也可以两种或者两种以上混合使用， 优选甲苯、 二甲苯、 均三甲苯等芳香族烃 类溶剂与丙酮、 丁酮、 甲基乙基甲酮、 甲基异丁基甲酮、 环己酮等酮类熔剂混 合使用。
本发明的目的之三在于提供一种层压板， 所述层压板包括至少一个如上所 述的预浸料。
本发明的目的之四在于提供一种印制电路板， 所述印制电路板由至少一个 如上所述的层压板制备。
本发明的层压板包括通过加热和加压使一片或一片以上的预浸料粘合在一 起， 不叠合或在预浸料的一侧或两侧叠合金属箔， 热压而成； 印制电路板由至 少一个层压板， 不叠合或在层压板的一侧或两侧依次叠合预浸料、 金属箔， 热 压而成。 所述的层压须满足以下要求： ①层压的升温速率通常在料温 80~140°C 时应控制在 1.5 2.5 °C/min;②层压的压力设置，外层料温在 80~100°C施加满压， 满压压力为 350psi左右； ③固化时， 控制料温在 185°C， 并保温 60min。 所述的 金属箔为铜箔、 镍箔、 铝箔及 SUS箔等， 其材质不限。
与现有技术相比， 本发明具有如下有益效果：
( 1 )本发明涉及的无卤阻燃型树脂组合物采用苯氧基磷腈化合物作为阻燃 剂， 其与具有二氢苯并噁嗪环的化合物具有极强的协同阻燃效应， 因而在大大 减少苯氧基磷腈化合物的使用量情况下， 同样可实现阻燃， 即其阻燃效率大大 提高，且不会出现板材处于高温条件下，苯氧基磷腈化合物迁移甚至渗出（Bleed out) 以及弯曲强度等物理性能急剧下降等问题； （2) 本发明涉及的无卤阻燃型 树脂组合物采用阻燃剂为苯氧基磷腈化合物， 其耐化学性佳， 不易水解， 制备 的印制电路用覆金属箔层压板耐化学性、 Anti-CAF性能优越， 即可靠性高； （3 ) 本发明涉及的无卤阻燃型树脂组合物采用苯并噁嗪树脂为主体树脂， 因而使用 该树脂组合物的预浸料、 层压板、 印制电路用覆铜箔层压板具有高玻璃化转变 温度 （Tg)、 高耐热性、 低介电损耗因素、 低吸水性以及低 C.T.E等特性； （4) 本发明涉及的无卤阻燃型树脂组合物采用环氧当量为 500 2000的环氧树脂改性 树脂， 环氧当量为 500 2000的环氧树脂具有优异的韧性， 可以大大改善苯并噁 嗪固化物的机械脆性； （5 ) 本发明涉及的胺类固化剂优选芳香胺类固化剂， 该 固化剂在提高固化物 Tg的同时， 也能大幅度提高其耐热性。
具体实施方式
为更好地说明本发明， 便于理解本发明的技术方案， 本发明的典型但非限 制性的实施例如下： 本发明实施例详细说明如下。 但本发明并非局限在实施例范围。 下文中无 别说明， 其份代表重量份， 其％代表 "重量％"。
(Aj ) 苯氧基磷腈化合物： SPB-100 (日本大塚化学株式会社商品名）；
(A2) 具有二氢苯并噁嗪环的化合物
(A2-l ) LZ 8280 (美国亨斯迈先进材料公司商品名）
(A2-2) D125 (四川东材科技集团股份有限公司商品名）
(B) 环氧当量为 500 2000的环氧树脂
(B-1 ) BE503 (长春人造树脂厂商品名）
(B-2) NP-20/B2 (美国 AC Catalysts公司商品名）
(B-3 ) XZ 92566 (美国陶氏化学公司商品名）
(C) 酚醛树脂
(C-1 ) PHL6635M65 (美国翰森特种化学公司商品名）
(C-2) PS 6313 (日本群荣化学工业株式会社商品名）
(C-3 ) XZ 92741 (美国陶氏化学公司商品名）
(D) 芳香胺固化剂
(D-1 ) DDS (工业品）
(D-2) DDE (工业品）
(E) 固化促进剂： 2-苯基咪唑 （日本四国化成株式会社）
(F) 无机填料
(F-1 ) 氢氧化铝 （纯度 99%以上）
(F-2) 博姆石 （Nabaltec AOH60)
(F-3 ) 二氧化硅 （纯度 99%以上）
表 1、 组合物的配方 （一） （重量份） 实施例 1 实施例 2 实施例 3 实施例 4 实施例 5 实施例 6
10 10 10 10 18 18
A2-l 35 45 55 65
A2-2 45 45
B-l 15 15 25
B-2 15 15 25
B-3
C-l 7 7 7 7 7 4
C-2 7 7 7 7 4 7
C-3
D-l 1.0 1.0 1.0 1.0 1.0
D-2 1.0
E 0.8 0.9 1.5 2.6 3.5 4.3
F-l 10 20
F-2 10 20
F-3 20 10 20 10
表 2、 组合物的配方 （二） （重量份)
实施例 7 实施例 8 实施例 9 实施例 10实施例 11 实施例 12
10 6 6 6 15 15
A2-l 35 65 65 26
A2-2 30 65 46 20 B-2 15 26 26
B-3 15 15
C-l 10 8 4 8 4 4
C-2 2 4 8 4 8 8
C-3 5 5 5
D-l 1.0 1.0 1.0 1.0 1.0
D-2 2.0
E 3.6 3.7 4.8 5.6 8.1 7.2
F-l 10 30 30
F-2 30 10 30
F-3 20 20
表 3、 组合物的配方 （三） （重量份)
Figure imgf000017_0001
D-l 2.0 2.0 1.0 1.0
D-2
E 1.2 2.5 2.3 3.8 4.6 7.5
F-l 10 10 10 10 20 20
F-2
F-3 20 20 20 20
实施例 13
一种无卤阻燃树脂组合物， 按重量份数包括：
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2 ) 的混 合物： 45重量份，苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的重量比为 1 :25 ; (B )环氧当量为 1500的双酚 A型环氧树脂： 45重量份； （C) 含氮酚醛树脂： 10重量份， 和 （D ) 二氨基二苯醚： 0.5重量份。
的软化点 （100~110 °C )， 为如下结构式所示的环状苯氧基磷腈化合物和 链状苯氧基磷腈化合物的混合物：
Figure imgf000018_0001
m为 3~25的整数； X为 -N=P(OC6¾)3 ; Y为 -P(OC6¾)4 ; n为 3-100的整数 (
A2为如下结构式所述的双酚 A型苯并噁嗪树脂：
Figure imgf000018_0002
R为 -C(C¾)2-， 为 实施例 14
一种无卤阻燃树脂组合物， 按重量份数包括：
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 90重量份，苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的重量比为 1 :2; (B) 环氧当量为 500的双酚 A型环氧树脂： 30重量份； （C) 苯酚酚醛树脂： 20重量份， 和 （D) 二氨基二苯砜： 10重量份。
的软化点 （100~110°C )， 为如下结构式所示的环状苯氧基磷腈化合物和 链状苯氧基磷腈化合物的混合物：
Figure imgf000019_0001
m为 3~25的整数； X为 -N=P(0)C6H5 ; Y为 -P(0)(C6¾)2; n为 3-100的整
A2为如下结构式所述的双酚 F型苯并噁嗪树脂:
Figure imgf000019_0002
实施例 15
一种无卤阻燃树脂组合物， 按重量份数包括：
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 65重量份，苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的重量比为 1 :10; (B)环氧当量为 1000的双酚 A型环氧树脂： 10重量份； （C) 双酚 A型酚醛树脂： 25重量份， 和 （D) 间苯二甲胺： 5重量份。
的软化点 （100~110°C )， 为如下结构式所示的环状苯氧基磷腈化合物和 链状苯氧基磷腈化合物的混合
Figure imgf000020_0001
式中， m为 3~25的整数； X为 -N=P(OC6¾)3 ; Y为 -P(OC6¾)4; n为 3-100 的整数。 A2为 4,4'-二氨基二苯甲垸型苯并噁嗪树脂。
实施例 17
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 90重量份，苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的重量比为 1 :2; (B)环氧当量为 2000的 30wt%的羧基丁腈橡胶改性环氧树脂: 10重量份； （C)含氮酚醛树脂： 25重量份； （D)二氨基二苯砜： 10重量份； （E) 2-十一垸基咪唑： 1重量份， 和 （F) 博姆石： 150重量份。
的软化点（100~110°C )， 为结构式（α)所示的环状苯氧基磷腈化合物和 结构式 （β) 所示的链状苯氧基磷腈化合物的混合物， 具体组成如下：
①六苯氧基环三磷腈化合物的重量百分比为 90%;
②八苯氧基环四磷腈化合物的重量比百分比 3%;
@m 5的环状苯氧基磷腈化合物和链状苯氧基磷腈化合物的重量百分比为
0；
所述重量百分比以①、 ②和③的重量和为基准;
Figure imgf000021_0001
式中， m为 3~25的整数； X为 -N=P(OC6¾)3 ; Y为 -P(OC6¾)4; n为 3-100
A2为 4,4'-二氨基二苯甲垸型苯并噁嗪树脂。
实施例 18
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 60重量份，苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的重量比为 1 :12; (B)环氧当量为 1500的 20wt%的羧基丁腈橡胶改性环氧树脂: 45重量份； （C) 双酚 A型酚醛树脂： 15重量份； （D) 联苯胺： 5重量份； （E)
2-苯基咪唑： 0.5重量份， 和 （F) 化硅： 6重量份
的软化点（100~110°C )， 为结构式（α)所示的环状苯氧基磷腈化合物和 结构式 （β) 所示的链状苯氧基磷腈化合物的混合物， 具体组成如下：
①六苯氧基环三磷腈化合物的重量百分比为 70%;
②八苯氧基环四磷腈化合物的重量比百分比 20%;
@m 5的环状苯氧基磷腈化合物和链状苯氧基磷腈化合物的重量百分比为 所述重量百分比以①、 ②和③的重量和为基准;
Figure imgf000022_0001
式中， m为 3~25的整数； X为 -N=P(OC6¾)3 ; Y为 -P(OC6¾)4; n为 3-100 的整数。 A2为酚酞型苯并噁嗪树脂。
实施例 19
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 60重量份，苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的重量比为 1 :12; (B)环氧当量为 1500的 20wt%的羧基丁腈橡胶改性环氧树脂： 45重量份； （C) 双酚 A型酚醛树脂： 15重量份； （D) 联苯胺： 5重量份； （E) 2-苯基咪唑： 0.5重量份， 和 （F) 二氧化硅： 6重量份
的软化点（65~75°C )， 为结构式（a)所示的环状苯氧基磷腈化合物和结 抅式 （β) 所示的链状苯氧基磷腈化合物的混合物， 具体组成如下： ①六苯氧基环三磷腈化合物的重量百分比为 75%;
:D八苯氧基环四磷腈化合物的重量比百分比 15%;
@m 5的环状苯氧基磷腈化合物和链状苯氧基磷腈化合物的重量百分比为 所述重量百分比以①、 ②和③的重量和为基准;
Figure imgf000023_0001
式中， m为 3~25的整数； X为 -N=P(OC6¾)3 ; Y为 -P(OC6¾)4; n为 3-100
A2为酚酞型苯并噁嗪树脂。
实施例 20
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 60重量份，苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的重量比为 1 :12; (B)环氧当量为 1500的 20wt%的羧基丁腈橡胶改性环氧树脂: 45重量份； （C) 双酚 A型酚醛树脂： 15重量份； （D) 联苯胺： 5重量份； （E) 2-苯基咪唑： 0.5重量份， 和 （F) 二氧化硅： 6重量份
的软化点（140~150°C )， 为结构式（a)所示的环状苯氧基磷腈化合物和 结构式 （β) 所示的链状苯氧基磷腈化合物的混合物， 具体组成如下：
①六苯氧基环三磷腈化合物的重量百分比为 80%;
②八苯氧基环四磷腈化合物的重量比百分比 15%;
@m 5的环状苯氧基磷腈化合物和链状苯氧基磷腈化合物的重量百分比为 0； 所述重量百分比以①、 ②和③的重量和为基准;
Figure imgf000024_0001
式中， m为 3~25的整数； X为 -N=P(OC6¾)3 ; Y为 -P(OC6¾)4 ; n为 3-100
A2为酚酞型苯并噁嗪树脂。
比较例 7: 比较例 7为 CN 101643570A所公开的实施例 1。
预浸料的制备方法为： 按照上述无卤阻燃树脂组合物的配方， 将各固形物 混合， 然后加入液态溶剂， 搅拌直至完全溶解后， 再加入液态树脂和固化促进 剂， 继续搅拌均匀平衡即可， 最后用 PM (丙二醇甲醚）溶剂适当调整溶液的固 体含量 65%~75%而制成胶液， 使用该胶液含浸基料玻璃布， 将含浸好的玻璃布 在 160°C的烘箱中加热干燥 4分钟制成。
所述印制电路用层压板包括通过加热和加压使两片或两片以上的预浸料粘 合在一起而制成的层压板， 粘合在层压板的一面或两面以上的金属箔。 所述的 层压板是使用上述的预浸料 8片和 2片一盎司（35μπι厚）的金属箔叠合在一起， 通过热压机中层压， 从而压制成双面金属箔的层压板。 所述的层压须满足以下 要求： ①层压的升温速率通常在料温 80~140°C时应控制在 1.5~2.5°C/min; ②层 压的压力设置， 外层料温在 80~100°C施加满压， 满压压力为 350psi左右； ③固 化时， 控制料温在 185°C， 并保温 60mm。 所述的金属箔为铜箔、 镍箔、 铝箔及 SUS箔等， 其材质不限。
针对于上述制成的印制电路板用层压板 （8片预浸料） 测其介电损耗因素、 耐热性、 吸水性、 C.T.E、 玻璃化转变温度、 阻燃性等性能， 如表 4-表 6所小 ' 表 4、 性能评估 （一)
Figure imgf000025_0001
卤素含量 （％) 0.03 0.03 0.03 0.03 0.03 0.03 耐迁移性 o o ◎ ◎ o o
Anti-CAF性
>1000 >1000 >1500 >1500 >1000 >1000
(h) 耐碱性 o o ◎ ◎ △ △
表 5、 特性评估 （二)
Figure imgf000026_0001
介电损耗因素
0.005 0.005 0.005 0.005 0.005 0.005
( 1GHZ) 弯曲强度
650 550 550 550 550 550 (N/mm2) 冲孔性 o o o o o o 卤素含量 （％) 0.03 0.03 0.03 0.03 0.03 0.03 耐迁移性 o o o o △ △
Anti-CAF性
>1500 >1500 >1500 >1500 >1000 >1000
(h) 耐碱性 o o o o △ △ 表 6、 特性评估 （三)
Figure imgf000027_0001
(分层） 耐浸悍性
o o o o o o 〇 (白斑） 吸水性
0.09 0.10 0.012 0.013 0.09 0.09 0.11 (%) 介电损耗因
0.005 0.005 0.005 0.005 0.005 0.005 0.005
( 1GHZ) 弯曲强度
540 550 480 490 500 500 630 (N/mm2 ) 冲孔性 ◎ ◎ ◎ ◎ o o 〇 卤素含量（％) 0.03 0.03 0.03 0.03 0.03 0.03 0.03 耐迁移性 〇 〇 〇 〇 〇 〇 〇
Anti-CAF性
>1500 >1500 >1500 >1000 >1000 >1000 >1000
(h) 耐碱性 ◎ ◎ ◎ 〇 〇 〇 〇 表 7性能评估 （四)
Figure imgf000028_0001
剥离强度
1.72 1.61 1.45 1.28 1.46 1.58 1.52 1.55
(N/mm) 耐燃烧性
V-1 V-0 V-0 V-0 V-0 V-1 V-0 V-0 ( 1.60mm) 耐燃烧性
V-1 V-0 V-0 V-0 V-0 V-1 V-0 V-0 (0.08mm) 耐浸焊性
o o o Δ o o ◎ ◎ (分层） 耐浸悍性
o o o Δ o o ◎ ◎ (白斑） 吸水性
0.13 0.10 0.08 0.015 0.09 0.09 0.08 0.08 (%) 介电损耗因
0.005 0.005 0.005 0.005 0.005 0.005 0.005 0.005 ( 1GHZ) 弯曲强度
580 550 490 440 480 550 540 540 (N/mm2 ) 冲孔性 ◎ ◎ o 〇 ◎ o △ Δ 卤素含量
0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 (%) 耐迁移性 ◎ Δ ◎ ◎ 〇 ◎ ◎ ◎
Anti-CAF性 >1500 >1000 >1500 <1000 >1500 〉1500 >1000 〉1000 (h)
耐碱性 ◎ o ◎ △ o ◎ ◎ ◎
以上性能的测试方法如下: 定的 DSC方法进行测定。
(b) 剥离强度： 按照 IPC-TM-650 2.4.8方法中的 "热应力后" 的实验条 件， 测试金属盖层的剥离强度。
(c) 难燃烧性： 依据 UL94法测定。
(d)耐浸悍性： 将在 121 °C、 105Kpa的加压蒸煮处理装置内保持 2小时后 的试（100x100mm的基材）浸在加热至 260°C的悍锡槽中 20秒钟， 以肉眼观察
(¾ ) 有无分层， （h2) 有无发生白斑或起皱。 表中的符号◎表示无变化， 〇表 示个别小白点， Δ表示发生大面积白斑， X表示发生分层。
(e) 吸水性： 按照 IPC-TM-650 2.6.2.1方法进行测定。
(0 介电损耗因素： 根据使用条状线的共振法， 按照 IPC-TM-650 2.5.5.5 测定 1GHz下的介电损耗因素。
(g) 弯曲强度： 按照 IPC-TM-650 2.4.4方法进行， 在室温下把负载施加于 规定尺寸和形状的试样上进行测定。
(h)冲孔性： 将 1.6mm厚的基材放于一定图形的冲模器上进行冲孔， 以肉 眼观察（h 孔边光滑无白圈， （h2)空边有白圈 >lmm， (h3 )空边有白圈 >3mm，
(h4 ) 孔边开裂， 表中分别以◎、 〇、 △、 X表示。
(0 卤素含量： 按照 JPCA-ES-01-2003 《无卤型覆铜板试验方法》 测定， 采用氧瓶燃烧法和离子色谱法测定覆铜箔层压板的卤素含量。
(J )耐迁移性： 将 100x100mm的基材置于 200°C的烘箱中烘烤 4小时， 以 肉眼观察（h 无渗出，（h2)只有个别点状渗出，（h3)渗出 >lmm，（h4)渗出 >3mm， 表中分别以◎、 〇、 △、 X表示。
(k) Anti-CAF性： 按照广东生益科技股份有限公司企业标准 Q/DZAD650 2.6.25方法进行。
(1) 耐碱性： 将 50x50mm的基材置于 80°C、 10%的的氢氧化钠溶液中浸 泡 60分钟， 以肉眼观察 （ ) 无白点， （h2) 点状白点， （h3) 片状白点， （h4 ) 整板白点。 表中分别以◎、 〇、 △、 X表示。
综上述结果可知， 依据本发明可达到高玻璃化温度、 高剥离强度、 高弯曲 强度、 高可靠性、 耐燃烧性、 耐浸悍性、 耐化学性、 吸水性、 低介电损耗因素 之功效， 同时机械加工性能佳， 卤素含量在 JPCA无卤标准要求范围内能达到难 燃性试验 UL94中的 V-0标准；本发明充分利用苯氧基磷腈化合物与苯并噁嗪树 脂之协同阻燃特性， 卤素含量在 0.09重量％以下， 从而达到环保之功效。
以上所述， 仅为本发明的较佳实施例， 对于本领域的普通技术人员来说， 可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形， 而所 有这些改变和变形都应属于本发明权利要求的保护范围。
申请人声明， 本发明通过上述实施例来说明本发明的详细组成， 但本发明 并不局限于上述详细组成， 即不意味着本发明必须依赖上述详细组成才能实施。 所属技术领域的技术人员应该明了， 对本发明的任何改进， 对本发明产品各原 料的等效替换及辅助成分的添加等， 均落在本发明的保护范围和公开范围之内。

Claims

WO 2014/089934 权 利 要 求 书 PCT/CN2013/071513
1、 一种无卤阻燃树脂组合物， 其特征在于， 所述树脂组合物按重量份数包 括：
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 45~90重量份， 苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物
(A2) 的重量比为 1 :25~1 :2；
(B) 环氧当量为 500 2000的环氧树脂： 10~45重量份；
(C) 酚醛树脂： 10~25重量份， 和
(D) 胺类固化剂： 0.5~10重量份。
2、 如权利要求 1所述的无卤阻燃树脂组合物， 其特征在于， 所述树脂组合 物按重量份数包括：
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 50~90重量份， 苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物
(A2) 的重量比为 1 :20~1 :5；
(B) 环氧当量为 500 2000的环氧树脂： 10~40重量份；
(C) 酚醛树脂： 15~25重量份， 和
(D) 胺类固化剂： 1~8重量份。
3、 如权利要求 2所述的无卤阻燃树脂组合物， 其特征在于， 所述无卤阻燃 树脂组合物， 按重量份数包括：
(A)苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物（A2) 的混 合物： 60~90重量份， 苯氧基磷腈化合物（A 与具有二氢苯并噁嗪环的化合物
(A2) 的重量比为 1 :15~1 :5；
(B) 环氧当量为 500 2000的环氧树脂： 10~35重量份；
(C) 酚醛树脂： 15~25重量份， 和 (D) 胺类固化剂： 2~7重量份
4、 如权利要求 1-3之一所述的无卤阻燃树脂组合物， 其特征在于， 所述苯 基磷腈化合物（ ） 的软化点为 60~150°C， 是选自结构式（α)所示的环状苯 基磷腈化合物和构式 （β) 所示的链状苯氧基磷腈化合物的混合物：
式中， m为
Figure imgf000033_0001
式中， X为 -N=P(OC6¾)3或 -N=P(0)C6¾ Y为 -P(OC6¾)4或 -P(0)(C6¾)2; n为 3-100的整数。
5、 如权利要求 4所述的无卤阻燃树脂组合物， 其特征在于， 所述苯氧基磷 腈化合物（ ） 的软化点为 60~150°C， 是选自结构式（α)所示的环状苯氧基磷 腈化合物和结构式（β)所示的链状苯氧基磷腈化合物的混合物， 具体组成如下:
①六苯氧基环三磷腈化合物的重量百分比为 70~90%;
②八苯氧基环四磷腈化合物的重量比百分比 3~20%;
@m 5的环状苯氧基磷腈化合物和链状苯氧基磷腈化合物的重量百分比为 所述重量百分比以①、 ②和③的重量和为基准;
Figure imgf000033_0002
(α) ， m为 3~25的整数;
Figure imgf000034_0001
式中， X为 -N=P(OC6¾)3或 -N=P(0)C6¾ Y为 -P(OC6¾)4或 -P(0)(C6¾)2; n为 3-100的整数。
6、 如权利要求 5所述的无卤阻燃树脂组合物， 其特征在于， 具有二氢苯并 噁嗪环的化合物（A2)选自结构式（γ)所示的双酚 Α型苯并噁嗪树脂、 结构式 (δ)所示的双酚 F型苯并噁嗪树脂、酚酞型苯并噁嗪树脂或 4,4'-二氨基二苯甲 垸型苯并噁嗪树脂中的任意一种或者至少两种的混合物， 优选酚酞型苯并噁嗪 树脂 /和 4,4'-二氨基二苯甲垸型苯并噁嗪树脂；
Figure imgf000034_0002
7、 如权利要求 1-3之一所述的无卤阻燃树脂组合物， 其特征在于， 所述环 氧树脂选自环氧当量为 500 1500的双酚 A型环氧树脂、 环氧当量为 700 2000 的羧基丁腈橡胶改性环氧树脂、 环氧当量为 600 1600的具有噁唑垸酮环的无卤 环氧树脂中的任意一种或者至少两种的混合物， 优选环氧当量为 500 1500的双 酚 A型环氧树脂、 环氧当量为 700 2000的 10~30wt%的羧基丁腈橡胶改性环氧 树脂、 环氧当量为 600 1600的具有噁唑垸酮环的无卤环氧树脂中的任意一种或 者至少两种的混合物。
8、 如权利要求 1-3之一所述的无卤阻燃树脂组合物， 其特征在于， 所述酚 醛树脂选自苯酚酚醛树脂、 双酚 A型酚醛树脂、 含氮酚醛树脂或含磷酚醛树脂 中的任意一种或者至少两种的混合物， 优选苯酚酚醛树脂和 /或含氮酚醛树脂。
9、 如权利要求 1-3之一所述的无卤阻燃树脂组合物， 其特征在于， 所述胺 类固化剂优选芳香胺固化剂， 进一歩优选二氨基二苯醚、 二氨基二苯砜、 二氨 基二苯基甲垸、 间苯二甲胺或联苯胺中任意一种或者至少两种的混合物。
10、如权利要求 1-3之一所述的无卤阻燃树脂组合物， 其特征在于， 所述树 脂组合物还包括有固化促进剂。
11、 如权利要求 10所述的无卤阻燃树脂组合物， 其特征在于， 所述固化促 进剂优选咪唑类化合物， 进一歩优选 2-甲基咪唑、 2-乙基 -4-甲基咪唑、 2-苯基咪 唑或 2-十一垸基咪唑中的任意一种或者至少两种的混合物。
12、 如权利要求 11所述的无卤阻燃树脂组合物， 其特征在于， 所述固化促 进剂的重量份数为 0.01~1 重量份， 优选 0.05 0.9重量份， 进一歩优选 0.1~0.8 重量份。
13、 如权利要求 1 之一所述的无卤阻燃树脂组合物， 其特征在于， 所述树 脂组合物还包括有无机填料， 选自氢氧化铝、 博姆石、 二氧化硅、 滑石粉、 云 母、 硫酸钡、 立德粉、 碳酸钙、 硅灰石、 高岭土、 水镁石、 硅藻土、 膨润土、 或浮石粉中的任意一种或者至少两种的混合物， 优选氢氧化铝、 博姆石、 二氧 化硅、 滑石粉或云母中的任意一种或者至少两种的混合物， 进一歩优选氢氧化 铝、 博姆石或二氧化硅中的任意一种或者至少两种的混合物。
14、 如权利要求 13所述的无卤阻燃树脂组合物， 其特征在于， 所述无机填 料的重量份数为 6~300重量份，优选 10~100重量份，进一歩优选 20~80重量份。
15、 如权利要求 1 所述的无卤阻燃树脂组合物， 其特征在于， 所述无卤阻 燃型树脂组合物的磷含量为 0.5~3重量％， 氮含量为 1~10重量％， 卤素含量为 0.09重量％以下。
16、 一种预浸料， 包括基料及通过含浸干燥之后附着在基料上的如权利要 求 1所述的无卤阻燃树脂组合物。
17、 一种层压板， 其特征在于， 所述层压板包括至少一个如权利要求 16所 述的预浸料。
18、 一种印制电路板， 其特征在于， 所述印制电路板由至少一个如权利要 求 17所述的层压板制备。
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TW201431923A (zh) 2014-08-16
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CN103013046B (zh) 2014-07-16
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