WO2014161493A1

WO2014161493A1 - Metal compound, method for preparing the same, selective metallization of surface of substrate with the metal compound

Info

Publication number: WO2014161493A1
Application number: PCT/CN2014/074669
Authority: WO
Inventors: Qing Gong; Wei Zhou; Bifeng Mao; Weifeng Miao
Original assignee: BYD Co Ltd; Shenzhen BYD Auto R&D Co Ltd
Current assignee: BYD Co Ltd; Shenzhen BYD Auto R&D Co Ltd
Priority date: 2013-04-02
Filing date: 2014-04-02
Publication date: 2014-10-09
Anticipated expiration: 2015-10-02
Also published as: CN104098138A; EP2981507B1; EP2981507A1; JP2016521234A; KR20150138852A; TWI520910B; US20140290530A1; TW201439004A; CN104098138B; EP2981507A4; US10059852B2; JP6116752B2; KR101862916B1

Abstract

The present disclosure provides a metal compound. The metal compound is represented by a formula(I): Cu2AαB2-αO4-β. A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group13 of the periodic table, 0<α<2, and 0<β<1.5. Polymer article and containing the metal compound and method for preparing the polymer article as well as selective metallization of a surface of the polymer article are also provided. In addition, the present disclosure provides an ink composition and the selective metallization for a surface of the insulative substrate using the ink composition.

Description

METAL COMPOUND,METHOD FOR PREPARING THE SAME,SELECTIVE METALLIZATION OF SURFACE OF SUBSTRATE WITH THE METAL COMPOUND

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority to and benefits of Chinese Patent Application No. 201310113641.3,filed with State Intellectual Property Office,P.R.C.on April2,2013.The entire content of above-referenced application is incorporated herein by reference.

FIELD

Embodiments of the present disclosure generally relate to the field of metal compound,a method for preparing the metal compound and use of the metal compound.Embodiments of the present disclosure further relate to a polymer article containing the metal compound and a method for preparing the polymer article as well as a method for selective metallization of a surface of the polymer article.Still further,embodiments of the present disclosure further relate to an ink composition containing the metal compound.Still further,embodiments of the present disclosure further relate to a method for selective metallization of a surface of an insulative substrate.

BACKGROUND

Polymer articles with a surface deposited with metal layers are used for conducting electro-magnetic signals,are widely used in fields like automobile,computer,communications,etc. Forming the metal layer selectively on the surface of the polymer article is the key step in the manufacturing of these polymer articles.

U.S.Patent Application Publication No.2004/0241422to Naundorf et al.,entitled “Conductor Track Structures And Method for Production Thereof,”discloses a method for preparing a polymer article,which includes steps of:adding an inorganic compound having a spinel structure and containing Cu,Ni,Co,Cr,Fe,etc to a polymer matrix,and activating the norganic compound with an ultraviolet laser(with wave lengths of248nm,308nm,355nm,532 nm)and an infrared laser(with wave lengths of1064nm and10600nm).Specifically,Naundorf mentioned that the oxides having spinel structures should be reduced into metal under the effect of aser.Then the metal may act as a metal core,onto which metal may be deposited during a chemical plating process.However,the method needs very strict control on the process condition. Further,the energy of the laser has to be high enough to reduce the oxides having a spinel structure into pure metal.Therefore,the method has rather stringent requirements for the manufacturing instrument and the processing condition.

Therefore,there is a need for a process for metallization of a surface of the polymer article which has less stringent requirement for the manufacturing instrument and the processing condition.

SUMMARY

Embodiments of the present disclosure seek to solve at least one of the problems existing in the prior art to at least some extent,or to provide a consumer with a useful commercial choice.

According to embodiments of the present disclosure,a metal compound is provided.The metal compound may have a formula(I):Cu ₂A _αB _2-αO _4-β(I),in some embodiments,A may contain one or two or more elements selected from the groups6and8of the periodic table.In some embodiments,B may contain one or two or more elements selected from the group13of the periodic table.In some embodiments,0<α<2.In some embodiments,0<β<1.5.

According to embodiments of the present disclosure,a method for preparing a metal compound is provided.The method may include the steps of:providing a mixture of Cu ₂O,an oxide of A and an oxide of B with a molar ratio of100:2-90:3-80,and sintering the mixture under a non-reactive atmosphere.In some embodiments,A may contain at least one element selected from the groups6and8of the periodic table.In some embodiments,B may contain at least one element selected from the group13of the periodic table.In some embodiments,the mixture may further contain CuO,and the content of the CuO may be less than about0.01mol%.

According to embodiments of the present disclosure,a metal compound obtained by a method according to embodiments of the present disclosure for preparing a metal compound is provided.

According to embodiments of the present disclosure,a metal compound obtained by a method according to embodiments of the present disclosure for preparing a metal compound is provided for selective metallization of a surface of an insulative substrate.

According to embodiments of the present disclosure,a polymer article is provided.In some embodiments,the polymer article may contain a polymer matrix and a metal compound obtained by a method according to embodiments of the present disclosure for preparing a metal compound, wherein the metal compound is dispersed in the polymer matrix.

According to embodiments of the present disclosure,a method for preparing a polymer article is provided.The method may include the steps of:providing a mixture containing a polymer matrix and a metal compound obtained by a method according to embodiments of the present disclosure for preparing a metal compound,and molding the mixture.

According to embodiments of the present disclosure,a polymer article obtained by a method according to embodiments of the present disclosure for preparing a polymer article is provided.

According to embodiments of the present disclosure,a method for selective metallization of a surface of a polymer article obtained by a method according to embodiments of the present disclosure for preparing a polymer article is provided.The method may include steps of:providing the polymer article;removing at least a part of the polymer matrix and exposing the metal compound by irradiating the surface of the polymer article with a laser;and forming at least one metal layer on the surface of the polymer article by chemical plating.

According to embodiments of the present disclosure,an ink composition is provided.In some embodiments,the ink composition may contain a binder material and a metal compound obtained by a method according to embodiments of the present disclosure for preparing a metal compound, wherein the metal compound is dispersed in the binder material.

According to embodiments of the present disclosure,a method for selective metallization of a surface of an insulative substrate is provided.The method may include steps of:providing an ink composition according to an embodiment of the present disclosure on the surface of the insulative substrate to form an ink layer,and forming at least one metal layer on the ink layer by chemical plating.

According to some embodiments of the present disclosure,a metal compound obtained by a method according to embodiments of the present disclosure for preparing a metal compound may act as an accelerator for the chemical plating,without reducing the metal compound into pure metal.Thereby,after subjecting a polymer article containing the metal compound to an optional pretreatment,such as selective increase of roughness on the surface of the polymer article performed by irradiating with a laser,selective metallization on the surface of the polymer article may be achieved.In some embodiments,a predetermined area of the surface of the polymer article may be irradiated with a laser,which can cause the metal compound dispersed in the polymer matrix to be exposed.Then at least one metal layer may be formed on the exposed metal compound by chemical plating directly without reducing the metal compound into pure metal.In this way,at least one metal layer may be formed on the predetermined area of the surface of the polymer article.

In some embodiments,selective metallization of the surface of the polymer article may also be performed by applying an ink composition containing the metal compound on the predetermined area of the surface of the polymer article,followed by chemical plating.

According to some embodiments of the present disclosure,when employing the laser to perform the pretreatment,such as increasing the surface roughness,the laser only needs sufficient energy to expose the metal compound in the predetermined areas of the surface of the polymer article.The laser needs not have the amount of energy required to reduce the metal compound into pure metal.After the metal compound is exposed,at least one metal layer may be formed on the predetermined area of the surface of the polymer article by chemical plating,to achieve the selective metallization of the surface of the polymer article is achieved.

With such an arrangement,the method for selective metallization of a surface of an insulative substrate,such as the polymer article mentioned above,may be implemented with a relatively simple process and requires less energy,yet can achieve high plating speed.Furthermore,the adhesion between the insulative substrate and the metal layers can become stronger.

In some embodiments,the metal compound according to embodiments of the present disclosure has light colors.Therefore,when the metal compound is dispersed in the polymer article,the polymer article can have relative lighter colors as well.Such an arrangement allows creating polymer articles for special applications where polymer articles having lighter colors are required.

Additional aspects and advantages of embodiments of present disclosure will be given in part in the following descriptions,become apparent in part from the following descriptions,or be learned from the practice of the embodiments of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other aspects and advantages of embodiments of the present disclosure will become apparent and more readily appreciated from the following descriptions made with reference to the accompanying drawings,in which:

Fig.1is a flow chart showing a method for preparing an exemplary metal compound according to one embodiment of the present disclosure;

Fig.2is a flow chart showing a method for preparing an exemplary metal compound according to one embodiment of the present disclosure;

Fig.3is a flow chart showing a method for preparing an exemplary polymer article according to one embodiment of the present disclosure;

Fig.4is a flow chart showing an exemplary method for selective metallization of a surface of a polymer article according to one embodiment of the present disclosure;

Fig.5is a flow chart showing an exemplary method for selective metallization of a surface of a polymer article according to one embodiment of the present disclosure;

Fig.6is a flow chart showing an exemplary method for selective metallization of a surface of an insulative substrate according to one embodiment of the present disclosure;and

Fig.7is a flow chart showing an exemplary method for selective metallization of a surface of an insulative substrate according to one embodiment of the present disclosure.

DETAILED DESCRIPTION

Reference will be made in detail to embodiments of the present disclosure.The embodiments described herein with reference to drawings are explanatory,illustrative,and used to generally understand the present disclosure.The embodiments shall not be construed to limit the present disclosure.The same or similar elements and the elements having same or similar functions are denoted by like reference numerals throughout the descriptions.

For the purpose of the present description and of the following claims,the definitions of the numerical ranges always include the extremes unless otherwise specified.

Metal Compound

According to embodiments of a first broad aspect of the present disclosure,a metal compound is provided.The metal compound may have a formula(I):

Cu ₂A _αB _2-αO _4-β(I).

In some embodiments,A may contain at least one element selected from the groups6to8of the periodic table.In some embodiments,A may contain at least one element selected from a group consisting of Cr,Mo and Fe.

In some embodiments,B may contain at least one element selected from the group13of the periodic table.In some embodiments,B may contain at least one element selected from a group consisting of Al,Ga and In.

In some embodiments,0<α<2.In some embodiments,0<β<1.5.In some embodiments,αmay be in the range of0.2-1.5,in some embodiments,βmay be in the range of0.1-1.2.

In some embodiments,the metal compound may include but not limited to,at least one compound selected from a group consisting of:Cu ₂Cr _0.6Al _1.4O _3.3,Cu ₂FeGaO _3.9,Cu ₂Mo _1.2In _0.8O _3.5, Cu ₂Cr _0.3Mo _0.3Al _1.4O _3.3,Cu ₂Cr _0.6Ga _0.7Al _0.7O _3.3,Cu ₂Cr _0.5Al _1.5O ₃,Cu ₂Cr _0.8Ga _1.2O _3.9,Cu ₂Mo _0.5Al _1.5O ₃, Cu ₂Cr _1.1Al _0.9O _3.5,Cu ₂Fe _0.5In _1.5O ₃and Cu ₂Cr _0.5Ga _1.5O _2.8.

In some embodiments,the metal compound may be used in the form of particles.And the particle size of the metal compound may be selected according to,for example,practical applications for the compound.In some embodiments,the metal compound may have an average particle diameter of about0.01μm to about5μm.In some embodiments,the metal compound may have an average particle diameter of about0.04μm to about2μm.The average particle diameter of the metal compounds according to embodiments of the present disclosure may be measured by a conventional method with normally used instruments,such as a laser particle size analyzer.

According to some embodiments of the present disclosure,the metal compound may further contain CuO as an impurity.In some embodiments,the CuO as an impurity in the metal compound may have very low content.In some embodiments,the content of CuO may be less than about0.01 mol%.In some embodiments,the content of CuO may be less than about0.005mol%.In some embodiments,the content of CuO may be less than about0.004mol%.High content of CuO may cause a polymer to degrade.Therefore a metal compound having low content of CuO according to embodiments of the present disclosure may lead to less degradation of a polymer(such as the polymer article to be described below).Such an arrangement can make the polymer article more stable and reliable.

Method for Preparing Metal Compound and Metal Compound Prepared by the Same

According to embodiments of the present disclosure,a method for preparing a metal compound is provided.The method may include the steps of:providing a mixture of Cu ₂O,an oxide of A and an oxide of B with a molar ratio of100:2-90:3-80,and sintering the mixture under a non-reactive atmosphere.A may contain at least one element selected from the groups6and8of the periodic table.B may contain at least one element selected from the group13of the periodic table.

Fig.1is a flow chart showing an exemplary method for preparing a metal compound, according to embodiments of the present disclosure.As shown in Fig.1,the method for preparing the metal compound includes the following steps:

S101:in some embodiments,a mixture of Cu ₂O,an oxide of A and an oxide of B is provided. In some embodiments,the Cu ₂O,the oxide of A and the oxide of B may have a molar ratio of100: 2-90:3-80;and

S102:after obtaining the mixture in S101,the mixture may be further sintered under a non-reactive atmosphere,to obtain a metal compound having the formula of Cu ₂A _αB _2-αO _4-β, wherein the terms A,B,αandβhave the same meanings as explained above.

In some embodiments,the method may include the following steps:providing the mixture of Cu ₂O,an oxide of A and an oxide of B with a molar ratio of100:10-75:5-60,and sintering the mixture under a non-reactive atmosphere.

In some embodiments,A may contain at least one element selected from a group consisting of Cr,Mo and Fe.

In some embodiments,B may contain at least one element selected from a group consisting of Al,Ga and In.

A person with ordinary skill in the art will appreciate that an oxide of A may refer to a compound formed by element A and oxygen,in which A may represent any valence that is normal in A compounds.In some embodiments,A is Cr.In some embodiments,the oxide of A is Cr ₂O ₃.In some embodiments,A is Fe.In some embodiments,the oxide of A is Fe ₂O ₃.In some embodiments, A is Mo.In some embodiments,the oxide of A is MoO ₃.

A person with ordinary skill in the art will also appreciate,that an oxide of B may refer to a compound formed by element B and oxygen,in which B may have any valence that is normal in B compounds.

A person with ordinary skill in the art will appreciate,I that“a non-reactive atmosphere” typically refers a situation where gases present in the sintering environment is non-reactive or is substantially non-reactive,and“non-reactive gas”typically refers to a gas which rarely reacts with any component of the mixture or with the final metal compound,under normal condition.In some embodiments,the non-reactive gas may be at least one selected from nitrogen and the group0 gases.In some embodiments,the group0gas may be argon.

In some embodiments,the mixture may further contain CuO as an impurity.In an embodiment,the content of the CuO is less than about0.01mol%.In some embodiments,the content of the CuO is less than about0.005mol%.In some embodiments,the content of the CuO is less than about0.004mol%.

In some embodiments,the method may further include a step of grinding powders of Cu ₂O, an oxide of A and an oxide of B to form compound powders.The grinding may be performed by a method known to those with ordinary skill in the art,which includes but not limited to:drying grinding process,wet grinding process or semi-drying grinding process.

In some embodiments,the grinding may be performed using any conventional instrument, without particular limits.

In some embodiments,the grinding may be performed by a wet grinding process or a semi-drying grinding process.In some embodiments,the grinding is performed by a wet grinding process.With such an arrangement,the prepared metal compound may have a lower CuO content and show a better color.

In some embodiments,the wet grinding process may be performed by using a dispersant.A person with ordinary skill in the art will appreciate that there is no particular limit for the dispersant.In some embodiments,the dispersant may be water.

In some embodiments,the method may further include drying the compound powders to form the mixture.In some embodiments,the dispersant applied during the wet grinding process is removed or is substantially removed in the drying process.In some embodiments,the mixture thus formed contains less than0.01mol%of CuO.In some embodiments,the mixture thus formed contains less than0.005mol%of CuO.In some embodiments,the mixture thus formed contains less than0.004mol%of CuO.

In some embodiments,the drying may be carried out under a non-reactive atmosphere,to avoid oxidation of Cu ₂O into CuO when the drying is performed at high temperature,such as at 250℃,which may affect the CuO content and the color of the metal compound.Such an arrangement can prevent the color of the metal compound from becoming too dark.

In some embodiments,the drying may be performed under an oxygen-containing atmosphere at a temperature ranging from about100℃ to about200℃.The oxygen-containing atmosphere may include air atmosphere,or an atmosphere formed by oxygen and at least one non-reactive gas with a predetermined ratio between the oxygen and the gas.

In some embodiments,the drying may be performed for a time of about10to about24hours. In some embodiments,the drying ends when the dispersant in the mixture is removed or substantially removed.

In some embodiments,the drying may be carried out under normal pressure.In some embodiments,the drying may be carried out under a decreased pressure.

There are no specific limits for the temperature of sintering.In some embodiments,the sintering may be performed by any conventional method.In some embodiments,the sintering may be carried out at a temperature ranging from about500℃to about1200℃.In some embodiments, the sintering may be carried out at a temperature ranging from about800℃to about1000℃.In some embodiments,the sintering may be performed for a time ranging from about1hour to about 14hours.

In some embodiments,the method may further include a step of grinding the sintered mixture. In some embodiments,the grinding may give the final product(e.g.a metal compound prepared by the method)a predetermined range of particle diameter.In some embodiments,the metal compound includes an average particle diameter ranging from about0.01μm to about5μm.In some embodiments,the metal compound may include an average particle diameter ranging from about0.04μm to about2μm.

Fig.2is a flow chart showing an exemplary method for preparing a metal compound, according to one embodiment of the present disclosure.As shown in Fig.2,the method for preparing the metal compound includes the following steps:

S201:in this step,powders of Cu ₂O,an oxide of A and an oxide of B with a molar ratio of 100:2-90:3-80are grinded to form compound powders;

S202:after forming the compound powders,the compound powders may be further dried to form the mixture;

S203:in this step,the dried mixture may be sintered under an non-reactive atmosphere to obtain a sintered mixture;and

S204:in this step the sintered mixture may be grinded to obtain the metal compound.

According to embodiments of the present disclosure,the metal compound prepared by said method may be dispersed in a polymer matrix and can be used as chemical plating accelerator directly,without being reduced to pure metal.

According to embodiments of the present disclosure,a metal compound prepared by the above-mentioned method is provided.

Use of Metal Compound

According to embodiments of the present disclosure,use of the above-mentioned metal compound(s)in the selective metallization of a surface of an insulative substrate is provided.

A person with ordinary skill will appreciate that,selective metallization of a surface of an insulative substrate may include forming a metal layer on a predetermined area of the surface of the insulative substrate

In some embodiments,the insulative substrate may contain any insulative material.In some embodiments,the insulative material may include but not is limited to polymers,ceramics,glasses, etc.

In some embodiments,the metal metallization may be performed by using the above-identified metal compound.

In some embodiments,the metallization includes the following steps.The metal compound may be dispersed into the insulative substrate.Then the surface of the insulative substrate which is to be metallized is subjected to a process of increasing the roughness of the substrate,in which a predetermined area of the insulative substrate may be removed and metal compound in that predetermined area may be exposed.The insulative substrate is then subjected to chemical plating. With such an arrangement,at least one metal layer may be formed on the predetermined area of the surface of the insulative substrate,thereby achieving selective metallization of the surface of the insulative substrate.

In another embodiment,the metallization may include the following steps.The metal compound is included in an ink composition.Then the ink composition is applied on a predetermined area of the surface of the insulative substrate.The insulative substrate is then subjected to chemical plating.With such an arrangement,at least one metal layer may be formed on the predetermined area of the surface of the insulative substrate,thereby achieving selective metallization of the surface of the insulative substrate.

Polymer Article

According to embodiments of the present disclosure,a polymer article is provided.In some embodiments,the polymer article may contain a polymer matrix,and one or more metal compounds according to embodiments of the present disclosure dispersed in the polymer matrix.

In some embodiments,based on the total weight of the polymer article,the content of the metal compounds may range from about1wt%to about30wt%.In some embodiments,the content of the metal compounds may range from about5wt%to about30wt%.In some embodiments,the content of the metal compounds may range from about10wt%to about30wt%.The content of the metal compounds may be chosen based on practical requirement.

The polymer matrix may be any conventional polymer known to those having ordinary skill in the art,and may be chosen according to practical use.In some embodiments,the polymer matrix may be a thermoplastic polymer or a thermosetting polymer.In some embodiment,the polymer matrix may be at least one selected from a group consisting of:plastic,rubber and fiber.

By way of example and without limits,ins some embodiments the polymer may be at least one selected from a group consisting of:polyolefin,such as polystyrene,polypropylene, poly(methyl methacrylate),poly(acrylonitrile-butadiene-styrene);polycarbonate;polyester,such as poly(cyclohexyl-paradimethylene terephthalate),poly(diallyl isophthalate),poly(diallyl teraphthalate),poly(butylene naphthalate),poly(ethylene terephthalate),poly(butylene terephthalate);polyamide,such as poly(hexamethylene adipamide),poly(hexamethylene azelamide),poly(hexamethylene succinamide),poly(hexamethylene lauramide), poly(hexamethylene sebacamide),poly(decamethylene sebacamide),poly(undecanoic amide), poly(lauramide),poly(octanamide),poly(9-aminononanoic acid),polycaprolactam, poly(paraphenylene phthalamide),poly(isophenylene phthalamide),poly(paraphenylene adipamide),poly(paraphenylene azelamide);poly(aromatic ether);polyether imide; polycarbonate/(acrylonitrile-butadiene-styrene)alloy;polyphenylene oxide;polyphenylene sulfide; polyimide;polysulfone;poly(ether-ether-ketone);polybenzimidazole;phenol formaldehyde resin; urea formaldehyde resin;melamine-formaldehyde resin;epoxide resin;alkyd resin and polyurethane.

In some embodiments,the polymer article may further contain at least one additive.In some embodiments,the additive can be a filler,an antioxidant,a light stabilizer,etc.By the addition of the additive,the performance and property of the polymer article may be improved.There are no special limits for the content and the type of the additive and the additive may be selected according to,for example,practical requirements.

The filler used as the additive to the polymer article may be any filler which is non-reactive under the effect of laser(either physically or chemically).In some embodiments,the filler may be at least one selected from talc,calcium carbonate,glass fiber,tin oxide,carbon black,micro glass bead,calcium sulfate,barium sulfate,titanium dioxide,pearl powder,wollastonite,diatomite, caoline,coal fines,pot clay,mica,oil shale ash,aluminum silicate,alumina,carbon fiber,silica and zinc oxide,where at least the glass fiber is not sensitive to the laser.

In some embodiments,the polymer article may contain glass fiber.With the addition of glass fiber,the thickness of the removed polymer matrix(in other words,the distance from the top surface of the polymer article to the exposed metal compound)may be significantly increased, which may facilitate the deposition of Cu onto the metal compound during the following chemical plating process.

In some embodiments,the polymer article may contain tin oxide,particularly nano tin oxide. With the addition of the nano tin oxide,the energy of laser may be fully utilized as the layer may be used to remove the polymer matrix and to expose the metal compound by the laser.

In some embodiments,the polymer article may contain carbon black.With the addition of the carbon black,the energy absorbed by the polymer matrix may be increased,thus the removed polymer matrix may be increased accordingly.

The antioxidant used as the additive to the polymer article may be any conventional antioxidant in the related art.In some embodiments,the antioxidant may contain a primary antioxidant and a secondary antioxidant.The ratio between the primary antioxidant and the secondary antioxidant may be selected according to,for example,the type of the antioxidant.In some embodiments,the weight ratio between the primary antioxidant and the secondary antioxidant may be about1:1-4.

In some embodiments,the primary antioxidant may be a hindered phenol antioxidant.By way of example but without limits,in some embodiments,the primary antioxidant may be antioxidant 1098or antioxidant1010,in which the antioxidant1098mainly contains N,N’-bis-(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl)hexane diamine and the antioxidant 1010mainly contains tetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid]pentaerythritol.

In some embodiments,the secondary antioxidant may be a phosphite ester antioxidant.By way of example and without limits,in some embodiments,the secondary antioxidant may be antioxidant168,which mainly contains tri(2,4-di-tert-butyl-phenyl)phosphorite.

The light stabilizer used as the additive to the polymer article may be of the hindered amine type.In some embodiments,the light stabilizer may be bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate.The light stabilizer may be any known ones in the art, without special limits in the present disclosure.

Method for Preparing Polymer Article and Polymer Article Prepared by the Same

According to embodiments of the present disclosure,a method for preparing a polymer article is provided.The method may include the steps of:providing a mixture containing a polymer matrix according to embodiments of the present disclosure,and a metal compound according to embodiments of the present disclosure,and molding the mixture.

Fig.3is a flow chart showing an exemplary method for preparing a polymer article, according to one embodiment of the present disclosure.As shown in Fig.3,in some embodiments, the method for preparing the polymer article includes the following steps:

S301:in this step,a mixture containing the polymer matrix and the metal compound is provided;and

S302:after obtaining the mixture,the mixture may be further molded to obtain the polymer article.

In some embodiments,the polymer matrix may further contain a processing agent,for example,lubricant.With the addition of the processing agent,the processing performance of the polymer matrix may be improved.

In some embodiments,the lubricant may be at least one selected from a group consisting of: ethylene/vinyl acetate copolymer(EVA wax),polyethylene(PE wax)and stearate.With the addition of the lubricant,the flowing performance of the polymer article may be improved.

In some embodiments,the metal compound may have an average particle diameter ranging from about0.1μm to about5μm.In some embodiments,the metal compound may have an average particle diameter ranging from about0.4μm to about2μm.The particle size of the metal compound may be selected according to,for example,the molding step,provided that the prepared polymer article is compact.

In some embodiments,based on100weight parts of the polymer matrix,the content of the metal compound may range from about1weight part to about40weight parts.In some embodiments,the content of the metal compound may range from about5weight parts to about30 weight parts.In some embodiments,the content of the metal compound may range from about10 weight parts to about30weight parts.There are no special limits for the content of the metal compound,and the content of the metal compound in the polymer article may be selected according to,for example,practical requirements.

In some embodiments,based on100weight parts of the polymer matrix,the content of the filler,used as an additive to the polymer,may range from about weight part to about40weight parts.In some embodiments,the content of the antioxidant may range from about0.01weight part to about1weight part.In some embodiments,the content of the light stabilizer,used as an additive to the polymer,may range from about0.01weight part to about1weight part.In some embodiments,the content of the lubricant may range from about0.01weight part to about1 weight part.There are no special limits for the content of the additives(for example,antioxidant, lubricant,filler),and the additives may be selected properly based on their properties.

In some embodiments,the molding step may be performed by any conventional molding process known in the art,without special limits in the present disclosure.In some embodiments, the molding step is performed by injection molding.In another embodiment,the molding step is performed by extrusion molding.

According to embodiments of the present disclosure,a polymer article obtained by the aforementioned method is provided.

Method for the Selective Metallization of Surface of Polymer Article

According to embodiments of the present disclosure,a method for the selective metallization of a surface of the above-mentioned polymer article(s)is provided.The method may include steps of:providing the polymer article;removing at least a part of the polymer matrix and exposing the metal compound by irradiating the surface of the polymer article with a laser;and forming at least one metal layer on the surface of the polymer article by chemical plating.

Fig.4is a flow chart showing an exemplary method for selective metallization of a surface of a polymer article,according to one embodiment of the present disclosure.As shown in Fig.4,in some embodiments,the method for selective metallization of the surface of the polymer article may include the following steps:

S401:in this step,a polymer article is provided;

S402:after providing the polymer article,at least a part of the polymer matrix is removed and the metal compound is exposed by irradiating the surface of the polymer article with a laser;and

S403:at least one metal layer is formed on the surface of the polymer article by chemical plating.

A person with ordinary skill in the art will appreciate that,when removing at least a part of the polymer matrix and exposing the metal compound,a portion of the polymer matrix in a predetermined area on the surface may be exposed and the metal compound in the predetermined area may also be exposed.As described before,the metal compound according to embodiments of the present disclosure may be used as chemical plating accelerators directly,without being reduced into pure metal,which would have required a large amount of energy.With such an arrangement, when chemical plating is performed on the polymer article,at least one metal layer may be formed on the exposed metal compound,i.e.at least one metal layer may be formed on the predetermined area of the surface of the polymer article.Thus the selective metallization of the surface of the polymer article is achieved.

In some embodiments,the laser may be provided by any conventional technique in the art.In some embodiments,the laser may be provided by a laser instrument.There are no special limits for the condition of irradiating with a laser,and the irradiation just needs to be able to remove polymer matrix in the determined area of the surface of the polymer article,and to expose the metal compound in the determined area of the surface of the polymer.The condition of irradiation may be selected according to,for example,the types of the polymer matrix and the laser.

According to embodiments of the present disclosure,when applying the laser to irradiate the surface of the polymer article,the energy of the laser only needs to high enough to expose the metal compound in the determined area of the surface of the polymer article.The energy of the laser needs not be high enough to reduce the metal compound into pure metal.Chemical plating may then be directly performed on the exposed metal compound according to embodiments of the present disclosure.At least one metal layer can then form on the predetermined area of the surface of the polymer article,thereby achieving the selective metallization of the surface of the polymer article.As described above,the method is simple in the process and low in energy requirements.

In some embodiments,the laser may have a wavelength ranging from about157nm to about 10.6μm,a scan speed ranging from about500mm/s to about8000mm/s,a step ranging from about3μm to about9μm,a time delay ranging from about30μs to about100μs,a frequency ranging from about30kHz to about40kHz,a power ranging from about3kW to about4kW,and a filling distance ranging from about10μm to about50μm.

In some embodiment,the metal layer may contain at least one selected from a group consisting of:Cu layer,Ni layer and Au layer.

According to embodiments of the present disclosure,with a laser having the above parameters,the removed polymer matrix may have an average thickness ranging from several microns to dozens of microns.Then the metal compound in the polymer article may be exposed. The polymer article may be formed with a rough surface having uneven microstructures.In the following chemical plating step,metal particles may be deposited in the uneven microstructures.In some embodiments,metal particles can be deposited on the exposed metal compound,thus forming at least one metal layer on the polymer article.With such an arrangement,the adhesion between the metal layer and the polymer article can be very strong.

The chemical plating is well known to person having ordinary skill in the art.In some embodiments,the chemical plating may be carried out with the following steps.The polymer article subjected to the irradiating is immersed in a Cu solution.In some embodiments,the Cu solution may contain a Cu salt.In some embodiments,the Cu solution may further contain a reducing agent.In some embodiments,the Cu solution may further have a pH ranging from about 12to about13.In some embodiments,the reducing agent may reduce the Cu ions in the Cu salt into Cu metal.In some embodiments,the reducing agent may be at least one selected from a group consisting of:glyoxylic acid,diamide,and sodium phosphorate.

In some embodiments,the method may further include a step of electroplating or chemical plating.Said electroplating or chemical plating may be performed for at least one time,so that additional metal layers,either of the same metal as or of different metal from the prior metal layers, may be formed on the prior metal layers.

Fig.5is a flow chart showing an exemplary method for selective metallization of a surface of a polymer article,according to one embodiment of the present disclosure.In some embodiments, as shown in Fig5,the method for selective metallization of the surface of the polymer article may include the following steps:

S501:in this step,a polymer article is provided;

S502:after obtaining the polymer article,the polymer matrix at a determined area of the surface of the polymer article is removed and the metal compound at the determined area of the surface of the polymer article is exposed by irradiating the surface of the polymer article with a laser;

S503:in this step,at least one first metal layer is formed on the metal compound at the determined area of the surface of the polymer article by chemical plating;and

S504:in this step,at least one second metal layer is formed on the at least one first metal layer by chemical plating or electroplating.

In some embodiment,the method for the selective metallization of the surface of the polymer article may include steps of:providing the polymer article;removing at least a part of the polymer matrix and exposing the metal compound by irradiating the surface of the polymer article with a laser;forming a Cu layer on the surface of the polymer article by chemical plating using a Cu solution;and forming a Ni layer on the Cu layer by chemical plating using a Ni solution.

Ink Composition

According to embodiments of the present disclosure,an ink composition is provided.In some embodiments,the ink composition may contain a binder material and a metal compound according to embodiments of the present disclosure dispersed in the binder material.

According to embodiments of the present disclosure,when the ink composition is applied on a surface of an insulative substrate,the binder material may contribute to the uniform dispersion of the metal compound on the surface of the insulative substrate.In some embodiments,with the binder material,an ink layer which may contain the binder material and the ink composition,may be formed on the surface of the insulative substrate.In some embodiments,the ink layer with the binder material can have certain required strength which allows strong adhesion between the ink layer and the insulative substrate.

There are no specific limits for the binder material,provided the above requirements are satisfied.In some embodiments,the binder material is an organic binder material.

In some embodiments,the binder material may be at least one selected from a group consisting of:cellulose acetate,polyacrylate resin,ethylene-vinyl acetate copolymer,polyvinyl alcohol,polyvinyl acetal,polyvinyl acetate,polyvinyl pyrrolidone,polyphosphonic acid.

There are no specific limits for the binder material in the present disclosure.In some embodiments,acommercially available binder material may be used.In some embodiments,the binder material is at least one selected from a group consisting of:butyl acetate cellulose of CAB series commercially available from Eastman Chemical Company,US,such as butyl acetate cellulose No.CAB381-0.5,butyl acetate cellulose No.CAB381-20,butyl acetate cellulose No. CAB551-0.2and butyl acetate cellulose No.CAB381-2;and polyvinyl butyral of Mowital series commercially from Kuraray Company,JP,such as polyvinyl butyral No.Mowital B60T,polyvinyl butyral No.Mowital B75H and polyvinyl butyral No.Mowital B60H.

There are no specific limits for the ratio between the binder material and the metal compound in the ink composition.In some embodiments,provided the metal compound may be dispersed uniformly on the surface of the insulative substrate.In some embodiments,the ink layer has certain amount of strength and certain amount of adhesion with the insulative substrate,wherein, at least one metal layer may be formed on the ink layer.In some embodiments,based on100 weight parts of the metal compound,the content of the binder material may range from about1 weight part to about30weight parts.In some embodiments,the content of the binder material may range from about15weight parts to about30weight parts.

In some embodiments,the ink composition may further contain a solvent.With the solvent, the metal compound may be dispersed in the binder material more uniformly,and a more uniform ink layer may be formed on the surface of the insulative substrate.

The solvent may be any conventional one known to those with ordinary skill in the art, without specific limits.In some embodiments,the solvent may be at least one selected from a group consisting of:water,C1-C12alcohol,C3-C12ketone,C6-C12aromatic hydrocarbon,C ₁-C ₁₂ alkyl halide,and C ₂-C ₁₂alkenyl halide.

In some embodiments,the solvent may be at least one selected from a group consisting of: methanol,ethanol,n-propanol,iso-propanol,n-butanol,tert-butanol,n-pentanol,n-hexanol, n-heptanol,n-octanol,acetone,2-n-pentanone,2-n-butanone,3-methyl-2-pentanone, 2,3-butanedione,2,3-pentanedione,2,5-hexanedione,1,3-cyclohexanedione,toluene,xylene and trichloroethylene.

There are no specific limits for the amount of solvent in the ink composition.In some embodiments,an amount of solvent is added to disperse the metal compound uniformly in the binder material and to form a uniform ink layer on the surface of the insulative substrate.In some embodiments,based on100weight parts of the metal compound,the content of the solvent may range from about20weight parts to about200weight parts.In some embodiments,the content of the solvent may range from about20weight parts to about100weight parts.

In some embodiments,the ink composition may further contain an additive.The additive may be selected according to,for example,its specific performance or functions.In some embodiments, the additive may be at least one selected from a group consisting of:dispersant,antifoaming agent, leveling agent and viscosity regulator.

The content of the additive may be selected according to,for example,conventional operations.In some embodiments,based on100weight parts of the metal compound,the content of the additive may range from about0.1weigh part to about20weight parts.In some embodiments,the content of the additive may range from about0.5weigh part to about10weight parts.

According to some embodiments of the present disclosure,with the dispersant,the time which the metal compound costs to disperse uniformly in the binder material and the optional solvent may be reduced,and the stability of the metal compound may be improved.The dispersant may be any substance which is capable of providing the above functions,without specific limits. In some embodiments,the dispersant may be an organic dispersant.

In some embodiments,the organic dispersant may be at least one selected from a group consisting of:aliphatic amine,hydramine,unsaturated cycloamine,fatty acid,polymers such as polyacrylate or polyester,and organic phosphines.

In some embodiments,the dispersant may be any conventional one that is commercially available.In some embodiments,the dispersant may be at least one selected from a group consisting of:dispersants with the following Nos.commercially available from BYK company, GE:ANTI-TERRA-U,ANTI-TERRA-U80,ANTI-TERRA-U100,DISPERBYK-101, DISPERBYK-130,BYK-220S,LACTIMON,LACTIMON-WS,BYK-W966,DISPERBYK, BYK-154,BYK-9076,DISPERBYK-108,DISPERBYK-109,DISPERBYK-110, DISPERBYK-102,DISPERBYK-111,DISPERBYK-180,DISPERBYK-106,DISPERBYK-187, DISPERBYK-181,DISPERBYK-140,DISPERBYK-142,DISPERBYK-145,DISPERBYK-115, DISPERBYK-160,DISPERBYK-161,DISPERBYK-162,DISPERBYK-163,DISPERBYK-164, DISPERBYK-165,DISPERBYK-166,DISPERBYK-167,DISPERBYK-182,DISPERBYK-183, DISPERBYK-184,DISPERBYK-185,DISPERBYK-168,DISPERBYK-169,DISPERBYK-170, DISPERBYK-171,DISPERBYK-174,DISPERBYK-190,DISPERBYK-2150,BYK-9077, DISPERBYK-112,DISPERBYK-116,DISPERBYK-191,DISPERBYK-192,DISPERBYK-2000, DISPERBYK-2001,DISPERBYK-2010,DISPERBYK-2020,DISPERBYK-2025, DISPERBYK-2050and DISPERBYK-2070;dispersant No.PHOSPHOLAN PS-236 commercially available from Akzo Nobel Company,DL;dispersant No.PS-21A commercially available from Witco Chemical Company,US;and dispersants Serial Nos.Hypermer KD and Zephrym PD commercially available from Croda Company,GB.

The content of the dispersant may be determined based on normal operation in the related art, without specific limits.In some embodiments,based on100weight parts of the metal compound, the content of the dispersant may range from about0.1weight part to about4weight parts.

The antifoaming agent may be any conventional one capable of preventing the formation of foams,destroying the formed foams or removing the formed foams from the ink composition.In some embodiments,the antifoaming agent may be at least one selected from a group consisting of: organic polysiloxane,polyether and fatty alcohol.In some embodiments,the antifoaming agent is of the organic polysiloxane series.

The antifoaming agent may be any conventional one which is commercially available.In some embodiments,the antifoaming agent may be at least one selected from a group consisting of: antifoaming agents having the following Nos.commercially available from BYK Comapnay,GE: BYK-051,BYK-052,BYK-053,BYK-055,BYK-057,BYK-020,BYK-065,BYK-066N, BYK-067A,BYK-070,BYK-080A,BYK-088,BYK-141,BYK-019,BYK-021,BYK-022, BYK-023,BYK-024,BYK-025,BYK-028,BYK-011,BYK-031,BYK-032,BYK-033,BYK-034, BYK-035,BYK-036,BYK-037,BYK-038,BYK-045,BYK-A530,BYK-A555,BYK-071, BYK-060,BYK-018,BYK-044and BYK-094.

The amount of the antifoaming agent in the ink composition is known to a person having ordinary skill in the related art,without specific limits.In some embodiments,based on100weight parts of the metal compound,the amount of the antifoaming agent may range from about0.01 weight part to about3weight parts.

According to embodiments of the present disclosure,with the addition of a leveling agent,the ink layer formed on the surface of the insulative substrate can be more flat and become smoother. There are no specific limits for the leveling agent in the present disclosure,and the leveling agent may be conventional ones which are capable of realizing the above functions.In some embodiments,the leveling agent may be at least one selected from a group consisting of: polyacrylate series,polydimethylsiloxane series,polymethylphenylsiloxane series and fluorine-containing surfactant.

The leveling agent may be any conventional one which is commercially available.In some embodiments,the leveling agent may be at least one selected from a group consisting of:leveling agents having the following Nos.commercially available from BYK Company,GE:BYK-333, BYK-306,BYK-358N,BYK-310,BYK-354and BYK-356.

The amount of the leveling agent in the ink composition is known to a person having ordinary skill in the related art,without specific limits.In some embodiments,based on100weight parts of the metal compound,the amount of the leveling agent may range from about0.3weight parts to about4weight parts.

According to embodiments of the present disclosure,with the addition of a viscosity regulator, the viscosity of the ink composition may be adjusted,depending on the practical requirements. There are no specific limits for the viscosity regulator in the present disclosure,and the viscosity regulator may be conventional ones.In some embodiments,the viscosity regulator may be at least one selected from a group consisting of:gaseous silica,polyamide wax,organic bentonite, hydrogenated castor oil,metallic soap,hydroxyl alkyl cellulose and derivatives thereof;polyvinyl alcohol and polyacrylate.

The amount of the viscosity regulator in the ink composition is well known to a person having ordinary skill in the related art,without specific limits.In some embodiments,based on100 weight parts of the metal compound,the amount of the viscosity regulator may range from about 0.3weight parts to about3weight parts.

In some embodiments,the ink composition contains,or alternatively consists of,the metal compound,the binder material,the solvent,the dispersant,the antifoaming agent,the leveling agent and the viscosity regulator.Based on100weight parts of the metal compound,the amount of the binder material ranges from about1weight part to about30weight parts.In some embodiments,the amount of the solvent ranges from about20weight parts to about200weight parts.In some embodiments,the amount of the dispersant ranges from about0.4weight parts to about4weight parts.In some embodiments,the amount of the antifoaming agent ranges from about0.1weight part to about3weight parts.In some embodiments,the amount of the leveling agent ranges from about0.3weight parts to about4weight parts.In some embodiments,the amount of the viscosity regulator ranges from about0.3weight parts to about3weight parts.

There are no specific limits for the preparing method of the ink composition in the present disclosure,provided the metal compound,the binder material and the optional additive are mixed uniformly.In some embodiments,the method for preparing the ink composition includes the following steps.The metal compound,the binder material and the optional solvent and additive are mixed to form a first mixture.Then the first mixture is grinded in a mixer which can be,for example,a planetary ball mill,to obtain the ink composition.Mixing and grinding in the planetary ball mill,as well as operation steps and conditions for the mixing and grinding,are well known to a person having ordinary skill in the art,thus details thereof are omitted.

According to embodiments of the present disclosure,by applying the ink composition on the surface of the insulative substrate,which can be non-conductive to,for example,electricity,and followed by chemical plating on the insulative substrate,selective metallization of the surface of the insulative substrate may be achieved.In some embodiments,when applying the ink composition on the surface of the insulative substrate to form the ink layer,the metal compound is dispersed in a predetermined area of the ink layer,or on a predetermined area of the surface of the insulative substrate.Then with the following chemical plating,metals may be deposited on the predetermined area of the insulative substrate,thereby at least one metal layer may be formed on the predetermined area of the insulative substrate.In this way,the selective metallization of the surface of the insulative substrate can be achieved.In some embodiments,the predetermined area is designated to be consistent with the signal conduction requirements.In some embodiments,a signal conduction passage path may be formed in the insulative substrate.

Method for Selective Metallization of Surface of Insulative Substrate

According to embodiments of a tenth broad aspect of the present disclosure,a method for the selective metallization of a surface of an insulative substrate is provided.The method may include steps of:providing the above-mentioned ink composition on the surface of the insulative substrate to form an ink layer,and forming at least one metal layer on the ink layer by chemical plating.

Fig.6is a flow chart showing an exemplary method for selective metallization of a surface of an insulative substrate,according to one embodiment of the present disclosure.In some embodiments,as shown in Fig.6,the method for selective metallization of a surface of an insulative substrate may include the following steps:

S601:in this step,an ink composition is provided on the surface of the insulative substrate to form an ink layer;and

S602:after forming the ink layer,at least one metal layer is formed on the ink layer by chemical plating.

According to embodiments of the present disclosure,the ink composition may be applied on a determined area of the surface of the insulative substrate,while the remaining of the surface of the insulative substrate is not covered with the ink composition.Therefore,the ink layer is only formed in the determined area of the surface of the insulative substrate.As the ink layer containing the metal compound is conductive,by performing the chemical plating on the insulative substrate, at least one metal layer may be formed on portion of the ink layer,for example,on the determined area of the surface of the insulative substrate,and the metal layer may not be deposited on the remaining area of the surface of the substrate.In this way,selective metallization of the surface of the insulative substrate can be achieved.

Various commonly used processes may be used for providing the ink composition according to embodiments of the present disclosure on the insulative substrate,for example,a process selected from a group consisting of:screen printing,spray coating,laser printing,ink jet printing, pad printing,gravure printing,letterpress printing,and lithographic printing,can be used.In some embodiments,the ink composition is applied on the surface of the insulative substrate by ink jet printing or laser printing.Specific operating steps and conditions of screen printing,spray coating, laser printing,ink jet printing,pad printing,gravure printing,letterpress printing,and lithographic printing are well known to a person with ordinary skill in the art,so a detailed description thereof will be omitted here for the clarity purpose.

In some embodiments,the method may further include a step of drying the ink layer.

The drying is well known to a person having ordinary skill in the art,without specific limits, and the drying may be selected based on the binder material and the optional solvent in the ink composition.In some embodiments,the drying may be carried out at a temperature ranging from about40℃ to about150℃.In some embodiments,the drying can be carried out for a time ranging from about0.5hours to about5hours.In some embodiments,the drying may be performed under normal pressure.In some embodiments,the drying may be performed under a decreased pressure.

There are no specific limits for the thickness of the ink layer in the present disclosure, provided that the following chemical plating is capable of perform the selective metallization on the surface of the insulative substrate.In some embodiments,the ink layer has a thickness ranging from about12μm to about40μm.In some embodiments,the ink layer has a thickness ranging from about12μm to about25μm.

In some embodiments,the method may further include a step of forming at least one additional metal layer after the chemical plating.According to embodiments of the present disclosure,the ink layer contains the metal compound and is conductive,thus chemical plating can be performed directly on the ink layer to form at least one metal layer on the ink layer.

The chemical plating is well known to a person having ordinary skill in the related art, without specific limits.Thus details related to the chemical plating are omitted herein.

In some embodiments,the chemical plating may be performed for at least one time,so that at least one metal layer may be formed on the surface of the substrate.The component and the thickness of the at least one metal layer may be selected according to,for example,practical requirements.In some embodiments,at least two metal layers are formed on the surface of the insulative substrate.The metal layers may be formed by the same metal,or alternatively,the metal layers may be formed by different metals.

In some embodiments,the insulative substrate may contain at least one selected from a group consisting of:plastic,rubber,fiber,coating layer,ceramic,glass,wood,cement and paper.In some embodiments,the insulative substrate may be made by plastic or ceramic.

In some embodiments,the insulative substrate is made of flexible plastic,which may include but not limited to polyethylene terephthalate,polyimide,polycarbonate,poly(ether-ketone), poly(ether-ether-ketone)and liquid crystal.When applying the flexible plastic on the surface of the insulative substrate and performing the chemical plating,the at least one metal layer formed on the insulative substrate can be used for various applications,such as preparing flexible circuits.

Fig.7is a flow chart showing an exemplary method for selective metallization of a surface of an insulative substrate,according to one embodiment of the present disclosure.In some embodiments,as shown in Fig.7,the method for selective metallization of a surface of an insulative substrate may include the following steps:

S701:in this step,an ink composition is applied on a predetermined area of the surface of the insulative substrate;

S702:in this step,the insulative substrate applied with the ink composition is dried to form an ink layer on the determined area of the surface of the insulative substrate;

S703:in this step,at least one first metal layer is formed on the ink layer by chemical plating; and

S704:in this step,at least one second metal layer is formed on the at least one first metal layer by chemical plating or electroplating.

It will be understood that the features mentioned above and those still to be explained hereinafter may be used not only in the particular combination specified but also in other combinations or on their own,without departing from the scope of the present invention.

Some illustrative and non-limiting examples are provided hereunder for a better understanding of the present invention and for its practical embodiment.

Testing Method

Samples of the metal compounds and the polymer articles obtained from the following Examples and Comparative Examples were subjected to the following tests.

Composition

In the following Examples and Comparative Examples,the composition of the metal compound was measured by an Inductively Coupled Plasma-Atomic Emission Spectrometry (ICP-AES).The results were recorded in Table1.

Content of CuO

In the following Examples and Comparative Examples,the content of CuO was measured by an Inductively Coupled Plasma-Atomic Emission Spectrometry(ICP-AES).The content of CuO was based on the total weight of the metal compound.The results were recorded in Table1.

Particle Diameter(PD)

In the following Examples and Comparative Examples,the particle diameter(i.e.average volume diameter)of the metal compound was measured by a Laser Particle Sizer commercially available from Chengdu Jingxin Powder Analyse Instrument Co.,Ltd.,China.The results are shown in Table1.

Adhesion

In the following Examples and Comparative Examples,the adhesion between the metal layer and the insulative substrate was determined by a cross-cut process.Specifically,a surface of the sample to be measured was cut using a cross-cut knife to form1001mm×1mm grids.A gap between adjacent grids was formed to reach the bottom of the metal layer.Debris in the test region was cleaned using a brush,and then an adhesive tape(3M600gummed paper)was sticked to a tested grid.One end of the gummed paper was rapidly torn off in a vertical direction.Two identical tests were performed on the same grid region.The grade of the adhesion was determined according to the following standard:

ISO grade0:the cut edge is smooth and the metal layers both at the cut edge and cut intersection of the grid does not fall off;

ISO grade1:the metal layers at the cut intersection are partly removed,but no more than5% (area percent)of the metal layers are removed;

ISO grade2:the metal layers at the cut edge and the cut intersection are partly removed,and 5-15%(area percent)of the metal layers are removed;

ISO grade3:the metal layers at the cut edge and the cut intersection are partly removed,and 15-35%(area percent)of the metal layers are removed;

ISO grade4:the metal layers at the cut edge and the cut intersection are partly removed,and 35-65%(area percent)of the metal layers are removed;

ISO grade5:the metal layers at the cut edge and the cut intersection are partly removed,and more than65%(area percent)of the metal layers are removed.

The results are shown in Table1.

Degradability

In the following Examples and Comparative Examples,the Melt Flow Rates(MFRs)of the raw material,the polymer article containing the metal compound and the polymer article formed with the metal layer were determined at a temperature of300℃ and under a load of11.76N.

The degradability of the polymer article was calculated according to the following equation:

D=(MI ⁰－MI ¹)/MI ⁰.

MI ⁰is the MFR of the raw material(in g/min),and MI ¹is the MFR of the polymer article containing the metal compound or the polymer article formed with the metal layer(in g/min).The degradability of the polymer particle(De.1)and the degradability of the polymer article formed with the metal layer(De.2)were calculated.The results are shown in Table1.

Color

In the following Examples and Comparative Examples,the metal compound was observed and the color,the hex color code and the RGB color mode of the metal compound were recorded. The results were shown in Table1.

EXAMPLES

Example1(E1)

The present example included the following steps.

1)Preparation of the Metal Compound

Cu ₂O,Cr ₂O ₃and Al ₂O ₃having a molar ratio of1：0.3：0.7were mixed to form a first mixture. Then the first mixture was subjected to a wet grinding process using water as the dispersant,in which based on100weight parts of the first mixture,the content of the water was150weight parts. The wet grinding process was performed under a rotation speed of500rpm for5hours.Thus compound powders were obtained.

The compound powders were dried in a drying oven,under the air atmosphere at a temperature of100℃ for12hours,thus obtaining drying powders.

The drying powders were sintered in a muffle furnace,under a temperature of800℃ for2 hours,and then were subjected to a drying grinding process to obtain a metal compound.

The average particle diameter of the metal compound was measured according to the above-identified test,and the metal compound was proved to have an average particle diameter of 2μm.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of Cu ₂Cr _0.6Al _1.4O _3.3.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.0027mol%.

It was observed that the metal compound was light blue,and has a hex color code of #87CEFA,and a RGB color mode of135,206,250.

2)Preparation of the Polymer Article

Polycarbonate,antioxidant1098,stabilizer polyethylene(PE)wax and the metal compound obtained from the step1)were mixed and granulated to form particles,in which based on100 weight parts of the polycarbonate,the metal compound was40weight parts,the antioxidant was 0.05weight parts and the stabilizer was0.04weight parts.The particles were injection molded in an injection molding machine,thus obtaining a polymer article(sheet)having a thickness of2mm.

It was observed that the polymer article was light blue,and has a hex color code of#87CEFA, and a RGB color mode of135,206,250.

3)Forming the Metal Layer on the Polymer Article

A surface of the polymer article obtained from the step2)was irradiated with a YLP-20laser (commercially available from Hans Laser Company,China)under a condition of:a wavelength of 1064nm,a scan speed of1000mm/s,a step of6μm,a time delay of50μs,a frequency of30kHz,a power of4kW and a filling distance of20μm.The movements of the laser beam and the polymer article were controlled with a computer program.Then the irradiated polymer article was cleaned and was subjected to chemical plating using a Cu solution containing:5g/L of CuSO ₄·5H ₂O, 25g/L of potassium sodium tartrate,7g/L of NaOH,10g/L of formaldehyde and0.1g/L of a stabilizer.A metal layer(Cu layer)having a thickness of2μm was formed on the polymer article.

The plating speed was5μm/h.

The adhesion between the polymer article and the metal layer was measured according to the above-identified test,and the adhesion was proved to be ISO grade1.

The degradability of the polymer articles obtained from steps2)and3)(i.e.the degradability of the polymer article(De.1)and the degradability of the polymer article formed with the metal layer(De.2))was measured according to the above-identified test,respectively,and the degradabilities were proved to be20.01%and20.11%respectively.

Comparative Example1(CE1)

The Comparative Example1was performed substantially the same as the Example1,with the following differences.

In the step1),CuO was employed instead of Cu ₂O.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of CuCrAlO ₄.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.008mol%.

It was observed that the metal compound was black,and has a hex color code of#000000, and a RGB color mode of0,0,0.

In the step2),the metal compound from the present step1)was employed instead of the metal compound of Example1.

It was observed that the polymer article was black,and has a hex color code of#000000,and a RGB color mode of0,0,0.

In the step3),the polymer article from the present step2)was employed instead of the polymer article of Example1.

The plating speed was2μm/h.

The adhesion between the polymer article and the metal layer was measured according to the above-identified test,and the adhesion was proved to be ISO grade4.

The degradability of the polymer articles obtained from steps2)and3)was measured according to the above-identified test,respectively,and the degradability was proved to be34.12% and35.11%respectively.

Comparative Example2(CE2)

The Comparative Example2was performed substantially the same as the Example1,with the following differences.

In the step1),the sintering was carried out in the air atmosphere.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of CuCr _0.3Al _0.7O ₄.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.1075mol%.

The plating speed was2μm/h.

The degradability of the polymer articles obtained from steps2)and3)was measured according to the above-identified test,respectively,and the degradability was proved to be70.12% and73.11%respectively.

Comparative Example3(CE3)

The Comparative Example3was performed substantially the same as the Example1,with the following differences.

In the step1),ZnO was employed instead of Cr ₂O ₃.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of Cu ₂ZnAlO _3.5.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.0055mol%.

It was observed that the metal compound was dark green,and has a hex color code of #006400,and a RGB color mode of0,100,0.

It was observed that the polymer article was dark green,and has a hex color code of#006400, and a RGB color mode of0,100,0.

The plating speed was4μm/h.

The adhesion between the polymer article and the metal layer was measured according to the above-identified test,and the adhesion was proved to be ISO grade3.

The degradability of the polymer articles obtained from steps2)and3)was measured according to the above-identified test,respectively,and the degradability was proved to be33.02% and33.15%respectively.

Comparative Example4(CE4)

The Comparative Example4was performed substantially the same as the Example1,with the following differences.

In the step1),SiO ₂was employed instead of Al ₂O ₃.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of Cu ₂Cr _0.4Si _1.6O ₄.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.0073mol%.

It was observed that the metal compound was dark brown,and has a hex color code of #800000,and a RGB color mode of128,0,0.

It was observed that the polymer article was dark brown,and has a hex color code of#800000, and a RGB color mode of128,0,0.

The plating speed was1μm/h.

The degradability of the polymer articles obtained from steps2)and3)was measured according to the above-identified test,respectively,and the degradability was proved to be44.35% and45.25%respectively.

Comparative Example5(CE5)

The Comparative Example5was performed substantially the same as the Example1,with the following differences.

In the step1),Al ₂O ₃was not used.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of CuCrO ₂.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.0035mol%.

The plating speed was4μm/h.

The adhesion between the polymer article and the metal layer was measured according to the above-identified test,and the adhesion was proved to be ISO grade2.

The degradability of the polymer articles obtained from steps2)and3)wasmeasured according to the above-identified test,respectively,and the degradability was proved to be25.68% and26.35%respectively.

Comparative Example6(CE6)

The Comparative Example6was performed substantially the same as the Example1,with the following differences.

In the step1),the compound powders were drying in a drying oven,under the air atmosphere at a temperature of250℃for6hours.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of CuCrAlO4.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.0075mol%.

The plating speed was2μm/h.

The degradability of the polymer articles obtained from steps2)and3)was measured according to the above-identified test,respectively,and the degradability was proved to be37.25% and37.55%respectively.

Example2(E2)

The present example included the following steps.

1)Preparation of the Metal Compound

Cu ₂O,Fe ₂O ₃and Ga ₂O ₃having a molar ratio of1:0.5:0.5were mixed to form a first mixture. Then the first mixture was subjected to a wet grinding process using water as the dispersant,in which based on100weight parts of the first mixture,the content of the water was180weight parts. The wet grinding process was performed under a rotation speed of1500rpm for3hours.Thus compound powders were obtained.

The compound powders were drying in a drying oven,under the nitrogen atmosphere at a temperature of200℃for10hours,thus obtaining drying powders.

The drying powders were sintered in a muffle furnace,under a temperature of950℃for6 hours,and then were subjected to a drying grinding process to obtain a metal compound.

The average particle diameter of the metal compound was measured according to the above-identified test,and the metal compound was proved to have an average particle diameter of 1.5μm.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of Cu ₂FeGaO _3.9.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.0015mol%.

It was observed that the metal compound was light green,and has a hex color code of #90EE90,and a RGB color mode of144,238,144.

2)Preparation of the Polymer Article

Polycarbonate,antioxidant1098,stabilizer polyethylene(PE)wax and the metal compound obtained from the step1)were mixed and granulated to form particles,in which based on100 weight parts of the polycarbonate,the metal compound was40weight parts,the antioxidant was 0.8weight parts and the stabilizer was0.3weight parts.The particles were injection molded in an injection molding machine,thus obtaining a polymer article(sheet)having a thickness of2mm.

It was observed that the polymer article was light green,and has a hex color code of#90EE90, and a RGB color mode of144,238,144.

3)Forming the Metal Layer on the Polymer Article

A surface of the polymer article obtained from the step2)was irradiated with a YLP-20laser (commercially available from Hans Laser Company,China)under a condition of:a wavelength of 1064nm,a scan speed of1000mm/s,a step of6μm,a time delay of50μs,a frequency of30kHz,a power of3kW and a filling distance of15μm.The movements of the laser beam and the polymer article were controlled with a computer program.Then the irradiated polymer article was cleaned and was subjected to chemical plating using a Cu solution containing:5g/L of CuSO ₄·5H ₂O, 25g/L of potassium sodium tartrate,7g/L of NaOH,10g/L of formaldehyde and0.1g/L of a stabilizer.A metal layer(Cu layer)having a thickness of2μm was formed on the polymer article.

The plating speed was5μm/h.

The degradabilities of the polymer articles obtained from steps2)and3)were measured according to the above-identified test,respectively,and the degradabilities were proved to be 19.02%and19.52%.

Example3(E3)

The present example included the following steps.

1)Preparation of the Metal Compound

Cu ₂O,Mo ₂O ₃and In ₂O ₃having a molar ratio of1:0.6:0.4were mixed to form a first mixture. Then the first mixture was subjected to a wet grinding process using water as the dispersant,in which based on100weight parts of the first mixture,the content of the water was120weight parts. The wet grinding process was performed under a rotation speed of1500rpm for3hours.Thus compound powders were obtained.

The compound powders were dried in a drying oven,under the nitrogen atmosphere at a temperature of200℃for10hours,thus obtaining drying powders.

The average particle diameter of the metal compound was measured according to the above-identified test,and the metal compound was proved to have an average particle diameter of 1.3μm.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of Cu ₂Mo _1.2In _0.8O _3.5.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.0017mol%.

It was observed that the metal compound was light yellow,and has a hex color code of# FFFFE0,and a RGB color mode of255,255,224.

2)Preparation of the Polymer Article

Polycarbonate,antioxidant1098,stabilizer polyethylene(PE)wax and the metal compound obtained from the step1)were mixed and granulated to form particles,in which based on100 weight parts of the polycarbonate,the metal compound was15weight parts,the antioxidant was 0.5weight parts and the stabilizer was0.3weight parts.The particles were injection molded in an injection molding machine,thus obtaining a polymer article(sheet)having a thickness of2mm.

It was observed that the polymer article was light yellow,and has a hex color code of# FFFFE0,and a RGB color mode of255,255,224.

3)Forming the Metal Layer on the Polymer Article

A surface of the polymer article obtained from the step2)was irradiated with a YLP-20laser (commercially available from Hans Laser Company,China)under a condition of:a wavelength of 1064nm,a scan speed of1000mm/s,a step of6μm,a time delay of50μs,a frequency of35kHz, a power of3kW and a filling distance of20μm.The movements of the laser beam and the polymer article were controlled with a computer program.Then the irradiated polymer article was cleaned and was subjected to chemical plating using a Cu solution containing:5g/L of CuSO4·5H2O,25g/L of potassium sodium tartrate,7g/L of NaOH,10g/L of formaldehyde and 0.1g/L of a stabilizer.A metal layer(Cu layer)having a thickness of3μm was formed on the polymer article.

The plating speed was6μm/h.

The degradability of the polymer articles obtained from steps2)and3)was measured according to the above-identified test,respectively,and the degradability was proved to be20.01% and22.25%respectively.

Example4(E4)

The present example included the following steps.

1)Preparation of the Metal Compound

Cu ₂O,Cr ₂O ₃,Mo ₂O ₃and Al ₂O ₃having a molar ratio of Cu ₂O:(Cr ₂O ₃+Mo ₂O ₃ (Cr ₂O ₃/Mo ₂O ₃=1:1)):Al ₂O ₃being1：0.3：0.7were mixed to form a first mixture.Then the first mixture was subjected to a wet grinding process using water as the dispersant,in which based on 100weight parts of the first mixture,the content of the water was150weight parts.The wet grinding process was performed under a rotation speed of500rpm for5hours.Thus compound powders were obtained.

The compound powders were dried in a drying oven,under the air atmosphere at a temperature of200℃for10hours,thus obtaining drying powders.

The drying powders were sintered in a muffle furnace,under a temperature of800℃for2 hours,and then were subjected to a drying grinding process to obtain a metal compound.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of Cu ₂Cr _0.3Mo _0.3Al _1.4O _3.3.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.0022mol%.

2)Preparation of the Polymer Article

Polycarbonate,antioxidant1098,stabilizer polyethylene(PE)wax and the metal compound obtained from the step1)were mixed and granulated to form particles,in which based on100 weight parts of the polycarbonate,the metal compound was40weight parts,the antioxidant was 0.3weight parts and the stabilizer was0.6weight parts.The particles were injection molded in an injection molding machine,thus obtaining a polymer article(sheet)having a thickness of2mm.

3)Forming the Metal Layer on the Polymer Article

A surface of the polymer article obtained from the step2)was irradiated with a YLP-20laser (commercially available from Hans Laser Company,China)under a condition of:a wavelength of 1064nm,a scan speed of1000mm/s,a step of6μm,a time delay of50μs,a frequency of30kHz, a power of4kW and a filling distance of20μm.The movements of the laser beam and the polymer article were controlled with a computer program.Then the irradiated polymer article was cleaned and was subjected to chemical plating using a Cu solution containing:5g/L of CuSO ₄·5H ₂O,25g/L of potassium sodium tartrate,7g/L of NaOH,10g/L of formaldehyde and 0.1g/L of a stabilizer.A metal layer(Cu layer)having a thickness of3μm was formed on the polymer article.

The plating speed was4μm/h.

The degradability of the polymer articles obtained from steps2)and3)was measured according to the above-identified test,respectively,and the degradability was proved to be22.01% and23.11%respectively.

Example5(E5)

The present example included the following steps.

1)Preparation of the Metal Compound

Cu ₂O,Cr ₂O ₃,Ga ₂O ₃and Al ₂O ₃having a molar ratio of Cu ₂O:(Cr ₂O ₃+Ga ₂O ₃ (Cr ₂O ₃/Ga ₂O ₃=1:1)):Al ₂O ₃being1：0.3：0.7were mixed to form a first mixture.Then the first mixture was subjected to a wet grinding process using water as the dispersant,in which based on 100weight parts of the first mixture,the content of the water was150weight parts.The wet grinding process was performed under a rotation speed of500rpm for5hours.Thus compound powders were obtained.

The compound powders were dried in a drying oven,under the air atmosphere at a temperature of100℃for12hours,thus obtaining drying powders.

The composition of the metal compound was measured according to the above-identified test, and the metal compound was proved to have the formula of Cu ₂Cr _0.6Ga _0.7Al _0.7O _3.3.

The content of CuO in the metal compound was measured according to the above-identified test,and the content of CuO was proved to be0.0033mol%.

It was observed that the metal compound was light grey,and has a hex color code of# D3D3D3,and a RGB color mode of211,211,211.

2)Preparation of the Polymer Article

Polycarbonate,antioxidant1098,stabilizer polyethylene(PE)wax and the metal compound obtained from the step1)were mixed and granulated to form particles,in which based on100 weight parts of the polycarbonate,the metal compound was40weight parts,the antioxidant was 0.3weight parts and the stabilizer was0.4weight parts.The particles were injection molded in an injection molding machine,thus obtaining a polymer article(sheet)having a thickness of3mm.

It was observed that the polymer article was light grey,and has a hex color code of# D3D3D3,and a RGB color mode of211,211,211.

3)Forming the Metal Layer on the Polymer Article

A surface of the polymer article obtained from the step2)was irradiated with a YLP-20laser (commercially available from Hans Laser Company,China)under a condition of:a wavelength of 1064nm,a scan speed of1000mm/s,a step of6μm,a time delay of50μs,a frequency of30kHz, a power of4kW and a filling distance of20μm.The movements of the laser beam and the polymer article were controlled with a computer program.Then the irradiated polymer article was cleaned and was subjected to chemical plating using a Cu solution containing:5g/L of CuSO ₄·5H ₂O,25g/L of potassium sodium tartrate,7g/L of NaOH,10g/L of formaldehyde and 0.1g/L of a stabilizer.A metal layer(Cu layer)having a thickness of4μm was formed on the polymer article.

The plating speed was5μm/h.

The degradability of the polymer articles obtained from steps2)and3)was measured according to the above-identified test,respectively,and the degradability was proved to be30.1% and33.1%.

Example6(E6)

The present example included the following steps.

1)Preparation of the Metal Compound

The step1)of Example6was performed substantially the same as that in the Example1,with the difference that the average particle diameter of the metal compound was80nm.

2)Preparation of Ink Composition

100g the metal compound obtained from the step1),20g of binder material CAB381-0.5 (commercially available from Eastman Chemical Company,US),100g of n-ethanol,2g of dispersing agent DISPERBYK-165(commercially available from BYK Company,GE),0.2g of antifoaming agent BYK-051(commercially available from BYK Company,GE),0.4g of leveling agent BYK-333(commercially available from BYK Company,GE)and0.5g of hydrogenated castor oil(commercially available from Wuhan Jinnuo Chemical Company,China)were mixed uniformly to obtain an ink composition.

3)Forming Ink Layer on Insulative Substrate

The ink composition obtained from the step2)was applied on a surface of an Al2O3ceramic substrate by ink jet printing,and then the Al2O3ceramic substrate applied with the ink composition was drying at a temperature of120℃ for3hours,followed by heating at a temperature of800℃ for2hours under a nitrogen atmosphere.Thus an ink layer was formed on the surface of the ceramic substrate.

4)Forming Metal Layer on the Ink Layer

The ceramic substrate obtained from the step3)was subjected to chemical plating using a Cu solution containing:5g/L of CuSO ₄·5H ₂O,25g/L of potassium sodium tartrate,7g/L of NaOH, 10g/L of formaldehyde and0.1g/L of a stabilizer.A metal layer(Cu layer)having a thickness of2 μm was formed on the ink layer.

The plating speed was90μm/h.

The adhesion between the ceramic substrate and the metal layer was measured according to the above-identified test,and the adhesion was proved to be ISO grade1.

Comparative Example7(CE7)

The Comparative Example7was performed substantially the same as the Example6,with the difference that the metal compound was prepared according to the step1)of the Comparative Example1.

The results showed that the metal layer cannot be formed on the surface of the ceramic substrate.

Example7(E7)

The present example included the following steps.

1)Preparation of the Metal Compound

The step1)of Example7was performed substantially the same as that in the Example2,with the difference that the average particle diameter of the metal compound was100nm.

2)Preparation of Ink Composition

100g the metal compound obtained from the step1),15g of polyvinyl butyral Mowital (commercially available from Kuraray Company,JP)and20g of toluene were mixed uniformly to obtain an ink composition.

3)Forming Ink Layer on Insulative Substrate

The ink composition obtained from the step2)was applied on a surface of a poly(ether-ether-ketone)(PEEK)substrate,and then the PEEK substrate applied with the ink composition was drying at a temperature of150℃ for4hours.Thus an ink layer having a thickness of25μm was formed on the surface of the PEEK substrate.

4)Forming Metal Layer on the Ink Layer

The PEEK substrate obtained from the step3)was subjected to chemical plating using a Cu solution containing:5g/L of CuSO4·5H2O,25g/L of potassium sodium tartrate,7g/L of NaOH, 10g/L of formaldehyde and0.1g/L of a stabilizer.A metal layer(Cu layer)having a thickness of4 μm was formed on the ink layer.

The plating speed was86μm/h.

The adhesion between the ceramic substrate and the metal layer was measured according to the above-identified test,and the adhesion was proved to be ISO grade2.

Example8(E8)

The present example included the following steps.

1)Preparation of the Metal Compound

The step1)of Example8was performed substantially the same as that in the Example4,with the difference that the average particle diameter of the metal compound was40nm.

2)Preparation of Ink Composition

100g the metal compound obtained from the step1),30g of EVA binder material (commercially available from Eastman Chemical Company,US),110g toluene,3g of dispersing agent ANTI-TERRA-U80(commercially available from BYK Company,GE),0.5g of antifoaming agent BYK-065(commercially available from BYK Company,GE),0.5g of leveling agent BYK-306(commercially available from BYK Company,GE)and0.4g of hydroxyethyl cellulose(commercially available from Luzhou North Cellulose Co.,Ltd.,China)were mixed uniformly to obtain an ink composition.

3)Forming Ink Layer on Insulative Substrate

The ink composition obtained from the step2)was applied on a surface of an polycarbonate (PC)substrate,and then the PC substrate applied with the ink composition was drying at a temperature of150℃for4hours.Thus an ink layer having a thickness of15μm was formed on the surface of the PC substrate.

4)Forming Metal Layer on the Ink Layer

The PC substrate obtained from the step3)was subjected to chemical plating using a Cu solution containing:5g/L of CuSO ₄·5H ₂O,25g/L of potassium sodium tartrate,7g/L of NaOH, 10g/L of formaldehyde and0.1g/L of a stabilizer.A metal layer(Cu layer)having a thickness of3 μm was formed on the ink layer.

The plating speed was94μm/h.

Table1

Reference throughout this specification to“an embodiment,”“some embodiments,”“one embodiment”,“another example,”“an example,”“a specific example,”or“some examples,” means that a particular feature,structure,material,or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure.Thus,the appearances of the phrases such as“in some embodiments,”“in one embodiment”,“in an embodiment”,“in another example,”“in an example,”“in a specific example,”or“in some examples,”in various places throughout this specification are not necessarily referring to the same embodiment or example of the present disclosure.Furthermore, the particular features,structures,materials,or characteristics may be combined in any suitable manner in one or more embodiments or examples.

Although explanatory embodiments have been shown and described,it would be appreciated by those skilled in the art that the above embodiments can not be construed to limit the present disclosure,and changes,alternatives,and modifications can be made in the embodiments without departing from spirit,principles and scope of the present disclosure.

Claims

A metal compound having a formula(I)

Cu ₂A _αB _2-αO _4-β (I),

wherein

A comprises at least one element selected from the groups6and8of the periodic table,

B comprises at least one element selected from the group13of the periodic table,

0<α<2,and

0<β<1.5.
The metal compound according to claim1,wherein A comprises at least one element selected from a group consisting of Cr,Mo and Fe.
The metal compound according to claim1or2,wherein B comprises at least one element selected from a group consisting of Al,Ga and In.
The metal compound according to any one of claims1-3,wherein the metal compound further comprises CuO with a content of less than about0.01mol%.
The metal compound according to any one of claims1-4,wherein the metal compound has an average particle diameter of about0.01μm to about5μm.
A method for preparing a metal compound,comprising:

providing a mixture of Cu ₂O,an oxide of A and an oxide of B with a molar ratio of100:2-90: 3-80,and

sintering the mixture under an non-reactive atmosphere,

wherein

A comprises at least one element selected from the groups6and8of the periodic table,and

B comprises at least one element selected from the group13of the periodic table.
The method according to claim6,wherein the mixture further comprises CuO with a content of less than about0.01mol%.
The method according to claim7,wherein the mixture further comprises CuO with a content of less than about0.005mol%.
The method according to any one of claims6-8,wherein the sintering is carried out at a temperature ranging from about500℃to about1200℃and for a time ranging from about1h to about14h.
The method according to any one of claims6to9,further comprising

grinding and drying the mixture before sintering the mixture.
The method according to claim10,wherein the drying is carried out under a non-reactive atmosphere.
The method according to claim11,wherein the drying is carried out at a temperature ranging from about100℃to about200℃.
The method according to claim10,wherein the drying is carried out under an atmosphere which contains oxygen at a temperature ranging from about100℃to about200℃.
The method according to any one of claims6-13,wherein A comprises at least one element selected from a group consisting of Cr,Mo and Fe.
The method according to any one of claims6-14,wherein B comprises at least one element selected from a group consisting of Al,Ga and In.
A metal compound prepared by the method according to any one of claims6-15.
The use of the metal compound according to any one of claims1-5and16in the selective metallization of a surface of an insulative substrate.
A polymer article comprising:

a polymer matrix,and

a metal compound according to any one of claims1-5and16,wherein the metal compound is dispersed in the polymer matrix.
The polymer article according to claim18,wherein based on the total weight of the polymer article,the content of the metal compound is about1wt%to about30wt%.
A method for preparing a polymer article,comprising:

providing a mixture containing a polymer matrix and a metal compound according to any one of claims1-5and16,and

molding the mixture.
The method according to claim20,wherein based on100weight parts of the polymer matrix,the metal compound is about1to about40weight parts.
A polymer article prepared by the method according to any one of claims20and21.
A method for the selective metallization of a surface of a polymer article,comprising:

providing a polymer article according to any one of claims18-19and22;

removing at least a part of the polymer matrix of the polymer article and exposing the metal compound of the polymer article by irradiating the surface of the polymer article with a laser;and

forming at least one metal layer on the surface of the polymer article by chemical plating.
An ink composition comprising:

a binder material,and

a metal compound according to any one of claims1-5and16,wherein the metal compound is dispersed in the binder material.
The ink composition according claim24,wherein based on100weight parts of the metal compound,the binder is about1to about30weight parts.
The ink composition according to claim24or25,wherein the binder material is at least one selected from a group consisting of:cellulose acetate,polyacrylate resins,ethylene-vinyl acetate compolymer,polyvinyl alcohol,polyvinyl acetal,polyvinyl acetate,polyvinyl pyrrolidone and polyphosphonic acid.
The ink composition according to any one of claims24-26,further comprising a solvent.
The ink composition according to claim27,wherein based on100weight parts of the metal compound,the solvent is about20to about200weight parts.
A method for the selective metallization of a surface of an insulative substrate, comprising:

providing an ink composition according to any one of claims24-28on the surface of the insulative substrate to form an ink layer,and

forming at least one metal layer on the ink layer by chemical plating.
The method according to claim29,wherein the ink layer has a thickness of about8μm to about50μm.