WO2014166417A1 - Led 单元模组、发光装置以及光源系统 - Google Patents

Led 单元模组、发光装置以及光源系统 Download PDF

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Publication number
WO2014166417A1
WO2014166417A1 PCT/CN2014/075153 CN2014075153W WO2014166417A1 WO 2014166417 A1 WO2014166417 A1 WO 2014166417A1 CN 2014075153 W CN2014075153 W CN 2014075153W WO 2014166417 A1 WO2014166417 A1 WO 2014166417A1
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WO
WIPO (PCT)
Prior art keywords
led
unit module
array
leds
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/075153
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English (en)
French (fr)
Inventor
张权
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Appotronics Corp Ltd
Original Assignee
Appotronics Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Appotronics Corp Ltd filed Critical Appotronics Corp Ltd
Priority to JP2016506773A priority Critical patent/JP6266750B2/ja
Priority to KR1020187000055A priority patent/KR101884182B1/ko
Priority to EP14782224.1A priority patent/EP2985512B1/en
Priority to KR1020187020539A priority patent/KR101914684B1/ko
Priority to KR1020157032106A priority patent/KR101817310B1/ko
Priority to US14/781,531 priority patent/US9970628B2/en
Publication of WO2014166417A1 publication Critical patent/WO2014166417A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02—Combinations of only two kinds of elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/06—Controlling the distribution of the light emitted by adjustment of elements by movement of refractors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities

Definitions

  • the utility model relates to the technical field of illumination and display, in particular to an LED unit module, a light-emitting device and a light source system.
  • a gold halide discharge bulb As a light source. Since the gold halide discharge bubble is a white light source, when color light needs to be obtained, a filter is required before the metal halide discharge bubble to realize light output of different colors.
  • the drawback of this kind of light source is that the metal halide discharge bubble has a low service life, ranging from several hundred hours to several thousand hours; the filter makes the projected color light have low saturation, is not bright, and the color of the obtained light is not rich.
  • High Power Light Emitting Diode Due to its advantages of safety, pollution-free and high service life, it has gradually become the first choice for development and application in the field of lighting, with a service life of up to 100,000 hours.
  • high power LEDs will be As a stage lighting source has become possible, it has the advantages of long life, safe and pollution-free, high color saturation.
  • a single LED The luminous flux of the chip is limited. In order to obtain high-intensity color light output, LED chips of different colors are usually arranged in an array to realize high-intensity light output.
  • a common solution is to use dichroic patches to red (R), green (G), and blue (B) trichromatic LEDs.
  • the light emitted by the array is wavelength combined.
  • the filter curve of the filter cannot be steep due to the processing technology and cost, the method of wavelength combining light will cause the spectrum of the overlapping part to be Filtered and lost, especially in adding other colors to improve the color rendering index
  • the dichroic color filter filters out some important spectra, resulting in large loss of light and low color rendering of the system.
  • FIG. 1 is a schematic structural view of an LED array in the prior art.
  • the program for different colors of LED Use geometric merging to avoid loss of spectrum.
  • each LED chip is equipped with a collimating device, LEDs of different colors are made.
  • the chip is spaced apart in a spatial position by a certain distance.
  • the spatial position of the different light beams in the output beam is different. Even after the uniform light on the subsequent optical path, the projected beam will appear at a position away from the image plane. The problem of spot color unevenness.
  • the main technical problem to be solved by the present invention is to provide an LED unit module that avoids an increase in optical expansion and uniform light mixing.
  • An embodiment of the present invention provides an LED unit module, including:
  • the LED chip set including at least five LED chips, wherein each LED The chips are arranged closely to each other, and the outline of the light emitting surface of the LED chip set is close to a regular hexagon;
  • the LED chipset includes LEDs of at least four colors Chip, where the four colors are red, blue, green, and amber.
  • the LED chipset further comprises at least one of cyan, cyan, orange, and white/yellow LEDs .
  • the LED chipset comprises four white/yellow LEDs, two red LEDs, two amber colors LED, a blue LED, a dark blue LED, a green LED, and a cyan LED.
  • the arrangement of LEDs of the same color is symmetrical about the center of the regular hexagon, the blue LED and the deep blue LED Regarding the center symmetry of the regular hexagon, the green LED and the cyan LED are symmetrical about the center of the regular hexagon.
  • the four white/yellow LEDs are closely arranged in a rectangular array with each other, and the remaining eight LEDs Arranged around the rectangular array, wherein each two LED chips are in parallel adjacent to two white LED chips on one side of the rectangular array.
  • the LED chipset comprises twelve LED chips, four of which are LEDs The chips are arranged closely in a rectangular array with each other, and the remaining eight LED chips are arranged around the rectangular array, with each of the two LED chips being in parallel adjacent to two LED chips on one side of the rectangular array.
  • each color LED chip comprises at least one positive electrode tab and negative electrode tab; each LED The positive electrode tabs of the chip are arranged on the first side of the substrate to form a positive electrode connector group, and the negative electrode connectors of each LED chip are arranged on the second side of the substrate to form a negative electrode connector. group;
  • Eight LEDs located in the periphery of the LED unit module In the chip two rows of LED chips closest to the first side and the second side of the substrate are respectively provided with a certain interval between the two LED chips of each row, so that the LEDs in the rectangular array
  • the circuitry of the chip can be drawn along the surface of the substrate onto the first side and the second side to form positive and negative connectors.
  • each row of the LED chips in the two rows of LED chips is a red LED and an amber LED .
  • the embodiment of the present invention further provides a light emitting device comprising an LED composed of a plurality of the above LED unit modules Unit module array.
  • the LED The unit module array is composed of at least one concentrically arranged ring, wherein on each ring, in a counterclockwise direction, the rotation angle of each LED unit module is an arithmetic progression, wherein the tolerance of the difference series is absolute Value is 60 Degree.
  • the embodiment of the present invention further provides a light source system, including:
  • An array of collimating devices, the collimating device in the array of collimating devices and the LEDs in the array of LED unit modules One-to-one correspondence of the unit modules for collimating the illumination of the corresponding LED unit module;
  • a pair of fly-eye lenses comprising two fly-eye lenses for aligning light emitted by the array of collimating devices, wherein each microlens on the fly-eye lens remote from the lens array of the collimating device has a regular hexagon;
  • the array of collimating devices is a collimating lens array, wherein each collimating lens has a regular hexagon shape, and each collimating lens is closely connected to each other.
  • the utility model includes the following beneficial effects:
  • each LED chipset can be equipped with a collimating device on the subsequent optical path. Since the LEDs emit a Lambertian distribution, one LED The multiple colors of light in the chipset are collimated by the collimating device to form a parallel beam of light, and uniform light mixing is also achieved. The beams of different colors in the parallel beam overlap each other in space, and the corresponding angular distributions are also approximately the same.
  • LED in LED unit module The outline of the light-emitting surface of the chipset is close to a regular hexagon to match the lens unit of the regular hexagon on the second fly-eye lens of the pair of optical eye lenses on the subsequent optical path to prevent the light beam from exiting through the second fly-eye lens The amount of optical expansion becomes large.
  • FIG. 1 is a schematic structural view of an LED array in the prior art
  • FIG. 2 is a schematic structural view of an embodiment of a light source system of the present invention.
  • FIG. 3 is a schematic structural view of an LED unit module in the light source system shown in FIG. 2;
  • FIG. 4 is a schematic diagram of a wiring in the LED unit module shown in FIG. 3 ;
  • FIG. 5 is a schematic structural view of an LED unit module array in the light source system shown in FIG. 2;
  • Figure 6 is a schematic view showing the arrangement of the collimator lens array in the light source system shown in Figure 2.
  • FIG. 2 is a schematic structural view of an embodiment of a light source system according to the present invention.
  • the light source system includes a light emitting device 1 , collimation device array 2, fly-eye lens pair 3 and focusing lens 4 .
  • the illuminating device 1 includes an array of LED unit modules 12 composed of a plurality of LED unit modules 11.
  • FIG. 3 is a schematic structural view of the LED unit module 11 in the light source system shown in FIG.
  • the LED unit module 11 includes a substrate 13 and an LED on the substrate 13 Chipset 14 .
  • the substrate 13 is preferably a thermally conductive substrate
  • the thermally conductive substrate may be a thermally conductive ceramic such as alumina or aluminum nitride, as long as it has a sufficiently high thermal conductivity and an insulating surface layer.
  • the LED chipset 14 includes twelve LED chips, wherein each LED chip is closely arranged with each other, and the LED The outline of the light-emitting surface of the chipset 14 is close to the regular hexagon 15 .
  • the purpose of closely aligning the LED chips with each other is to reduce the optical expansion of the light source system on the one hand, and to make the LEDs on the other hand.
  • the gap between the chips is as small as possible, which is beneficial to the uniformity of the light spot of the light source system.
  • the spacing of the LED chips often cannot be 0. , but a small distance such as 0.1 ⁇ 0.2mm (for 1mm LED chips).
  • the shape of the LED chip is generally square, and the LED composed of multiple LED chips
  • the outline of the light-emitting surface of the chipset generally cannot be exactly a regular hexagon.
  • the outline of the light-emitting surface described in the present invention is close to a regular hexagon, which means that the area of the light-emitting surface beyond the area of the regular hexagon and the area of the area where the regular hexagon is not filled with the outline are respectively Not exceeding the contour area of the light-emitting surface 30%, where the contour of the illuminated surface includes the spacing between two adjacent LED chips.
  • LED chipset 14 includes seven color LED chips with LEDs of each color
  • the chip includes at least one positive electrode tab and a negative electrode tab.
  • Each of the LED chips is disposed on the substrate 13, and the positive electrode tabs of each of the LED chips are arranged on the first side 13a of the substrate 13 to form a positive electrode assembly. 141.
  • the negative electrode connectors of each LED chip are arranged on the second side 13b opposite to the first side edge 13a to form a negative electrode connector group 142.
  • each LED The positive and negative connectors of the chip can also be arranged in other ways.
  • the LED chipset 14 includes twelve LED chips, respectively four white LEDs. (marked as W in the figure), two red LEDs (identified as R in the figure), two amber LEDs (identified as A in the figure), one blue LED (marked as B in the figure), and a dark blue LED (labeled as dB in the figure), a green LED (marked as G in the figure), and a cyan LED (marked as C in the figure).
  • the red LED has a dominant wavelength of 720nm to Between 770nm, the amber LED has a dominant wavelength between 580nm and 600nm, and the green LED has a dominant wavelength between 520nm and 550nm. The dominant wavelength is between 490 nm and 520 nm, the blue LED has a dominant wavelength between 460 nm and 490 nm, and the deep blue LED has a dominant wavelength of 440 nm. Between 460 nm.
  • the four LED chips are arranged closely to each other in an inner rectangular array, and the remaining eight LED chips are arranged around the inner rectangular array, two of each The LED chip is parallel to the two LED chips on one side of the inner rectangular array to form an outer rectangular array such that the outline of the light emitting surface of the LED chip set 14 is close to the regular hexagon. .
  • the arrangement of LEDs of the same color is symmetric about the center of the regular hexagon 15 due to the blue LED and the deep blue LED
  • the color difference is small, and the color difference between the green LED and the cyan LED is small, so the blue LED and the dark blue LED are symmetric about the center of the regular hexagon 15 , and the green LED and the cyan LED About the center symmetry of the regular hexagon 15 .
  • the white LED is obtained by providing a yellow phosphor layer on the light emitting surface of the blue LED, compared to other colors of the LED
  • the white LED has better heat resistance, and the four LEDs in the middle have the worst heat dissipation, so the middle four LED chips are preferably white LEDs, and the remaining color LEDs surround the white LED. Arrange.
  • the use of four white LED chips can greatly improve the brightness of the illuminating device. Red and amber LEDs are less thermally stable, so the two color LEDs are preferably placed in the LED The outside of the chipset is in a circle.
  • the LEDs of each color can also be set at other locations.
  • four LEDs on an inner rectangular array The chips are blue, green, dark blue and cyan LEDs in clockwise direction, among the eight LED chips on the outer rectangular array, four white LEDs They are respectively located on four sides of the outer rectangular array and are symmetric about the center of the regular hexagon 15.
  • the arrangement position of the LEDs of the respective colors may be arbitrary in the case where the heat dissipation and the uniform light effect are not considered.
  • the white LED for improving the brightness in the LED chip set may also be a yellow LED, wherein the yellow LED The dominant wavelength is between 540 nm and 570 nm, and the spectrum is wider than the spectrum of other color LEDs other than white; LEDs included in the LED chipset
  • the color can also be other quantities.
  • the LED chipset includes only five colors of red, green, blue, white/yellow, and amber. led The chipset can specifically include four white/yellow LEDs, and the remaining colors of the LEDs are two.
  • the LED The chipset can also include only four colors of red, green, blue, and amber.
  • the four color LEDs The combined light spectrum is very close to the solar spectrum, so the color rendering is already high, which can meet the application requirements of most occasions.
  • Each of these colors LED The specific number can be determined based on the color temperature requirements of the light source. Or, based on the four colors of red, blue, green, and amber, add according to the desired color. For example, if you need cyan, add a cyan LED. A dark blue LED is required for dark blue, and an orange LED is required for orange color. The orange LED has a dominant wavelength between 710 nm and 720 nm.
  • the number of LED chips in the LED chipset may also be other numbers as long as the LEDs can be The chips are arranged closely to each other and the outline of the light emitting surface of the LED chip set is close to a regular hexagon.
  • the LED chip set may include five LED chips, one of which is LED The chip is in the middle and the remaining four LED chips are located around the LED chip.
  • the LED chipset can also include seven LED chips, one of which is LED The chip is in the middle, the other six LED chips are rounded around the middle of the LED chip; or include twenty-one LED chips, of which 15 LED chips are 3*5 The rectangular array is arranged, and each of the remaining six LED chips is located outside the two long sides of the rectangular array. Since the pattern of five or less LED chips is not close to a regular hexagon, the LED in this embodiment The chipset includes at least five LED chips.
  • Figure 4 is a schematic diagram of a wiring in the LED unit module shown in Figure 3.
  • First side of substrate 13 On the 13a, the positive electrode pieces of dark blue, green, red, white, amber, blue, and cyan are arranged in order from left to right, and the second side 13b
  • Each of the negative electrode pieces of dark blue, green, red, white, amber, blue, and cyan is arranged in order from left to right.
  • LEDs of the same color are connected in series with each other on the substrate 13 (eg two red LEDs)
  • Two amber LEDs and four white LEDs such that each color LED is on the first side 13a and the second side 13b of the substrate 13. Only one positive electrode connector and the negative electrode connector are needed for the upper part, which is advantageous for compact structure on the LED unit module and small area of the substrate 13 .
  • LEDs of the same color can also be connected in parallel with each other on the substrate 13, or LEDs of the same color.
  • the LEDs are connected in series with each other, and the other LEDs of the same color are connected in parallel.
  • each LED can also be used.
  • the chips are provided with positive and negative terminals on both sides of the substrate.
  • the two rows of LEDs which are respectively closest to the first side 13a and the second side 13b of the substrate 13 are respectively In the chip (LED chips 111 and 112, LED chips 113 and 114), two LEDs on each line
  • the pitch of the chips is slightly pulled apart so that the lines of four white LEDs on the center of the regular hexagon can be drawn along the surface of the substrate 13 to the first side 13a and the second side 13b.
  • the positive and negative connectors on the top come up.
  • the four chips are preferably set to be red LEDs and amber LEDs. .
  • the positive and negative poles of the LED on the central area may not be along the substrate 13
  • the lines on the surface are connected to the positive and negative terminals of the first side 13a and the second side 13b, but are connected to the positive and negative terminals on the two sides by jumpers.
  • the two nearest rows from the two sides In the LED chip the spacing of the two LED chips on each row can also be removed, and the two LED chips can be arranged closely. What's more, you can add one more to the two LED chips. LED chip.
  • FIG. 5 is a schematic structural view of an LED unit module array in the light source system shown in FIG. led
  • the unit module array 12 includes a plurality of LED unit modules.
  • LED unit module array 1 2 preferably consists of at least two columns of LED unit modules 11 Arranged in parallel in a circular or regular polygonal array to match the circular lens placed on the subsequent optical path of the LED unit module array to improve light utilization.
  • the LED unit module array 1 may not be circular or a regular polygon.
  • the LED unit module array 1 is composed of three columns of LED unit modules 11 Parallel to an array of nearly regular hexagons.
  • each LED unit module in the LED unit module array 1 is the same, that is, the LED in the module.
  • the arrangement position of the chipset, the arrangement order of the negative electrode sets, and the positions of the LEDs in the LED chip set are the same as those of the positive and negative electrode sets.
  • the LED unit modules 11 in the same column The positive electrode connector groups are oriented in the same direction as their negative electrode groups so as to be able to be routed in series along the LED unit modules 11 on the same column.
  • any two adjacent columns of LED unit modules 11 The positive electrode connector group is oriented in the opposite direction to its negative electrode connector group to enable the two columns of LED unit modules to be connected in series at the end of the same side of the adjacent two columns.
  • the red LEDs in the first and third columns are counted from the left.
  • the anode contacts are directed downwardly in the direction of their negative connectors, and the positive connectors of the red LEDs in the second column are directed upwards in the direction of their negative connectors.
  • all red LEDs will be When connected in series, the lines in the first and third columns sequentially connect the positive and negative connectors of each red LED in the downward direction, and the lines in the second column sequentially turn the red LEDs in the upward direction.
  • the positive and negative contacts are connected, and the red LEDs of the first and second columns pass through the red LEDs in the LED unit module 151 on the lower end of the first column.
  • the negative electrode connector and the red LED positive terminal of the LED unit module 153 on the lower end of the second column are connected. Any other adjacent two columns are also connected in series by this method.
  • the other six color LEDs are wired in the same way as the red LEDs.
  • the arrangement order of the positive and negative connector groups in the unit module is the same, and the positive electrode assembly groups of the adjacent two columns of LED unit modules are opposite to the negative electrode assembly group, so that the adjacent two columns of the pole piece group Symmetrical left and right, so the four colors
  • the lines connected in series of LEDs are adjacent to each other and form a bundle of lines parallel to each other, and the line has no intersection with itself, which makes the wiring simple and convenient.
  • the alignment device array 2 includes a plurality of collimating devices 21 corresponding to the respective LED unit modules 11 for corresponding to The LED unit module emits light for collimation.
  • the alignment device array 2 is a collimating lens array.
  • the fly-eye lens pair 3 includes a first fly-eye lens 31 and a second fly-eye lens 32, which are located in the collimating lens array 2
  • the exiting light path is used to homogenize the beam collimated by the collimating lens array 2, wherein the first fly-eye lens 31 is adjacent to the collimating lens array 2.
  • Each microlens on the two fly-eye lenses of the compound eye lens has a regular hexagonal structure, which ensures the seamless arrangement between adjacent microlenses on the one hand, and matches the projected image with the circular projection spot on the other hand. .
  • First fly-eye lens 31 Each of the upper microlenses is in one-to-one correspondence with each of the microlenses on the second fly-eye lens 32.
  • the size of each collimating lens in the collimating lens array 2 is the size of each microlens of the fly-eye lens in the fly-eye lens pair 4 More than double. Obviously, the smaller the size of each microlens in the fly-eye lens, the better the uniformity effect.
  • the focusing lens 4 is located on the outgoing light path of the pair of fly-eye lenses 3 for pairing the meniscus lens 3
  • the homogenized beam is collected onto a predetermined plane.
  • the predetermined plane is generally the focal plane of the focus lens 4.
  • the collimating lens 21 can also achieve the collimation of the outgoing beam of the LED unit module 11 while also enabling the LED.
  • the multi-color LEDs in unit module 11 are illuminated for mixing.
  • the LED chips of different colors in the LED chipset are facing the same collimating lens, and the LED The light is distributed in Lambertian, so the LED The beams of multiple colors emitted by the chipset are collected and collimated by the collimating lens into a bundle of parallel light (although not ideal parallel light, but with a certain divergence angle, but the divergence angle is small, for example ⁇ 9 °, so it can be treated as approximately parallel light) while achieving uniform mixing.
  • the beams of different colors are always coupled together, so in the final output of the source system, the spatial position and the exit angle of the beams of different colors will be substantially the same. Essentially, even The chips in the LED chipset are closely arranged, and their spatial positions are still different. This difference in spatial position will cause the beams of different colors emitted by them to pass through the collimating lens.
  • the angular distribution of the space after collimation will also vary slightly, but the area of each LED chip is small (usually only 1mm x 1mm) And the different chips are closely spaced from each other, so the difference in beam angular distribution of different colors caused by the difference in spatial position can be ignored.
  • each LED unit module in the LED unit module array is collimated and then incident on the first fly-eye lens 31.
  • the middle part of the microlens, and each microlens will form an image of the LED chip in the LED unit module from which the light received is formed to the second fly-eye lens 32.
  • the microlens corresponding to the microlens is formed, and therefore, the total area of the microlenses having imaging in the second fly-eye lens 32 constitutes the light emitting surface of the second fly-eye lens 32. Since the illuminating surface is fixed, when the second fly-eye lens The smaller the illumination angle of the emitted light, the smaller the optical expansion of the emitted light.
  • each of the microlenses of the first fly-eye lens 31 is in the second fly-eye lens 32.
  • the LED chip set is in the second fly-eye lens 32
  • the image formed on each of the microlenses is preferably inscribed in the microlens.
  • the LED unit module only one LED chip is provided in the LED unit module, and the LED The area of the chip is generally square while the second fly-eye lens 32
  • the upper microlens is a regular hexagon, so that the image formed by the square on the microlens cannot fill the entire microlens, and the light emitting surface of the microlens exiting the light is the entire microlens, which causes the LED
  • the amount of optical expansion of the unit module array is increased.
  • the second fly-eye lens 32 since the outline of the light emitting surface of the LED chip set in each LED unit module is close to a regular hexagon, the second fly-eye lens 32 is present. The image formed on each of the microlenses can nearly fill the entire microlens, thereby preventing the optical expansion of the LED unit module array from becoming larger.
  • the outline of the light emitting surface of the chipset can be filled with more than one microlens, and the contour of the light emitting surface of the LED chip set can also be beyond the regular hexagon, as long as the area of the excess portion is not larger than 30 of the contour area of the light emitting surface. % Can also be accepted.
  • Fig. 6 is a schematic view showing the arrangement of the collimator lens array in the light source system shown in Fig. 2.
  • the collimating lens array Each of the collimating lenses 21 in 2 preferably has a regular hexagon shape and is closely arranged to each other such that there is no gap between the adjacent collimating lenses 21. In this way, for the same color LED in each LED unit module The light emitted by the chip, from each collimating lens 21 When collimated, they will be connected to each other in a piece. These collimated beams are also connected to each other in a piece when they are projected through the projection lens, and fill the entire luminous surface.
  • Collimation lens array 2 compared with the ring C1 connected to the collimating lens array 2, there are some remaining blank spaces, so that the light emitting surface of the collimating lens array 2 is closer to a circular shape, so as to cooperate with the circular lens on the subsequent optical path.
  • Straight lens array 2 preferably further includes a plurality of small collimating lenses 22 located at the remaining spaces.
  • the illuminating device 1 further comprises a plurality of single chip packages or two chip packaged LEDs (not shown), wherein each LED One-to-one correspondence with each of the small collimating lenses 22.
  • the cross section of the light beam which is collimated by the light-emitting device 1 and collimated by the collimator lens array 2 is closer to a circle.
  • the LED unit module 11 and the collimating device 21 may also be used.
  • An integrator rod (not shown) is provided between the beams to illuminate the light beam emitted from the LED chip.
  • the integrator rod includes an entrance port and an exit port.
  • the light entrance is close to the light emitting surface of the LED chip in the LED unit module, so that Most of the light emitted by the LED can enter the integrator rod.
  • the light exit opening is located near the focal plane of the collimating device 21 such that its output beam passes through the collimating device 21 After collimation, it can become ideal parallel light.
  • the light-emitting surface of the integrator rod is equivalent to the light source surface of the system. This makes the LED light source system more uniform due to the mixing effect of the integrator rods on the light.
  • the integrator rod can also be a tapered square rod with a light exit area larger than the entrance aperture area.
  • the collimating lens may not be used thereafter, that is, the integrator rod acts as a collimating device; however, in order to achieve a good light mixing effect, the tapered square bar needs to be Have enough length.
  • the LED unit module array In order to achieve a more uniform mixing spot of the plurality of color lights on the predetermined surface in the LED unit module array, it is also possible to set different LEDs.
  • the position of the LED chips of different colors in the unit module is such that at least LED chips of any color other than white have substantially the same distribution at each position in the LED unit module.
  • each LED unit module is fixed at a different angle with respect to the plane of the light source.
  • each LED is made
  • the angles of rotation of the unit modules with respect to the respective centers are 1, 2, 3, 4, 5, and 6 times of 60 degrees, respectively, which will be specifically described below.
  • the LED unit module array includes seven LED unit modules, six of which are arranged in a ring, and the remaining one The LED unit module is placed on the center of the ring.
  • the positive electrode assembly of the first LED unit module is directed horizontally to the left of its negative connector group. From the first LED The unit module begins, and in the counterclockwise direction of the ring, each LED unit module is increased by 60 degrees from the angle of the counterclockwise rotation of the previous LED unit module.
  • the positive pole of the power supply when wiring, the positive pole of the power supply is connected to the first LED on the ring.
  • the positive electrode connector group of the unit module is connected in series with the LED unit module on the ring in a counterclockwise direction along the ring.
  • the negative electrode assembly of the last LED unit module on the ring and the center of the circle The positive electrode connector group of the LED unit module is connected, and the line on the negative electrode connector group of the LED unit module 55 is connected to the outside of the ring through a jumper to be connected to the negative pole of the power supply.
  • the LED unit modules on each of the rings are rotated at different angles, and the different rotation angles are in the range of 0-360. Uniform distribution within the ° range. In this way, each LED of the LED unit module except for white is in the regular hexagon of the module at 0 degrees, 60 degrees, 120 degrees, 180 degrees, Appears twice in both 240-degree and 360-degree directions. In this way, each color of the LED chip is in each LED Each location in the unit module has approximately the same distribution. At the same time, due to the wiring of any adjacent two LEDs on each ring The positive and negative connector groups of the unit module are adjacent to each other, which makes the wiring simple and convenient, and the formed circuit has fewer intersections.
  • each LED unit module on the ring rotates at an angle of 60 degrees compared to itself, and each LED The arrangement of the LED chipsets in the unit module is close to a regular hexagon, so it is rotated 60 After the degree, it can still coincide with itself.
  • the orientation of the microlenses of the second fly-eye lens of the fly-eye lens pair is the same.
  • each LED The image formed by each of the microlenses on the second fly-eye lens of the LED chipset after the rotation of the unit module can still match the microlens.
  • an LED consisting of at least two concentrically arranged rings
  • the rotation angle of each LED unit module in each of the circular rings is preferably an arithmetic progression, wherein the absolute value of the tolerance of the differential series is 60 degrees.
  • each color LED chip refers to a single LED chip.
  • the LED chip can be a multi-color LED chip, and the multi-color LED chip comprises two LED chips of dominant wavelength, and the difference between the two main wavelengths is greater than 10 nm and less than 30 nm. .
  • the human eye can distinguish the difference in the color of the luminescence, but such a color difference is not obvious to the human eye.
  • the utility model can realize LED with uniform color Light source system.
  • the inventors found that the LED light source system is sufficiently uniform that even if a multi-color LED chip is used, the human eye will not be aware of the complex color LED. The effect of the color difference of the chip.
  • the application of the multi-color LED chip can make the LED light source system have a larger illumination spectrum coverage and a higher color rendering index.
  • the LED light source system further includes a color adjustment module, and the color adjustment module receives the double color LED
  • the color adjustment signal corresponding to the chip controls the illumination power of the two main wavelength LED chips included in the multi-color LED according to the target color information carried by the color adjustment signal.
  • the color adjustment signal For example, for red, it can include Red LEDs at 618nm and 635nm
  • the chip although it has a color difference, is not obvious.
  • the red projection beam having different dominant wavelengths can be generated by adjusting the relative intensities of the two by the color adjustment module.
  • the LEDs of the two main wavelength LED chips corresponding to the multi-color LED chip are respectively located.
  • the unit modules are staggered with each other so that the light of the two main wavelengths can be more evenly mixed and less visible to the human eye.
  • white LED chips of different color temperatures may also be included, for example, 3200K and 6500K.
  • Two color temperatures, the LEDs of the two different color temperature LED chips The unit modules are staggered with each other to ensure uniform light mixing, and the relative intensity of the two can be adjusted by the adjustment module to generate projection spots of different color temperatures. This is a common knowledge for those skilled in the art and will not be described again.
  • the embodiment of the present invention also provides a
  • the projection system includes a light source system that can have the structure and function of the various embodiments described above.
  • the projection system can use various projection technologies, such as liquid crystal displays (LCD, Liquid) Crystal Display ) projection technology, digital optical path processor ( DLP , Digital Light Processor ) Projection technology.
  • LCD liquid crystal displays
  • DLP digital optical path processor
  • the above-described lighting device can also be applied to lighting systems, such as stage lighting.

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Abstract

一种LED单元模组（11）、发光装置（1）及光源系统，该LED单元模组（11）包括衬底（13）以及位于该衬底（13）上的LED芯片组（14），该LED芯片组（14）包括至少五个LED芯片，其中各LED芯片彼此紧密排布，且该LED芯片组的发光面的轮廓接近正六边形；该LED芯片组（14）包括至少四种颜色的LED芯片，其中该四种颜色为红色、蓝色、绿色和琥珀色，该LED单元模组（11）能够避免光学扩展量增大且混光均匀。

Description

LED 单元模组、发光装置以及光源系统 技术领域
本实用新型涉及照明及显示技术领域，特别是涉及一种 LED 单元模组、发光装置以及光源系统。
背景技术
传统的大功率照明装置、光照明设备一般采用金卤放电泡作为光源。由于金卤放电泡是白色光源，当需要得到彩色光时，需在金卤放电泡前设置滤光片来实现不同颜色的光输出。这种光源的缺陷在于金卤放电泡使用寿命低，仅有几百小时到数千小时不等；滤光片又使得投影出的彩色光饱和度低、不鲜艳，且获得的灯光色彩也不丰富。
大功率发光二极管（ LED, Light Emitting Diode ）由于具有安全无污染、使用寿命高等优点，已经在照明领域内逐渐成为开发应用的首选装置，其使用寿命可达十万小时。目前，将大功率 LED 作为舞台照明光源已经成为可能，它具有使用寿命长、安全无污染、色彩饱和度高等优点。然而，目前单个 LED 芯片的光通量有限，为了得到高亮度的彩色光输出，通常都是将不同颜色的 LED 芯片排成阵列来实现高亮度的光输出。
一种常用的方案为采用二向色片来对红（ R ）、绿（ G ）、蓝（ B ）三基色 LED 阵列发出的光进行波长合光。但因为一些颜色光之间会有部分光谱交叠的现象，且滤光片的滤光曲线由于加工工艺以及成本的问题而不能很陡，采用波长合光的方法会导致该重叠部分的光谱被过滤而损失掉，尤其是在为提高显色指数而添加其他颜色 LED 的场合中，二向色片会过滤掉一些重要的光谱，导致光损失较大且系统的显色性不高。
针对这个问题，另一种常用的解决方案为将红（ R ）、绿（ G ）、蓝（ B ）、白（ W ）四色 LED 芯片交叉排布成一个阵列，如图 1 所示，图 1 为现有技术中的一种 LED 阵列的结构示意图。该方案对不同颜色的 LED 利用几何合光来避免光谱的损失。但在这种方案中，由于对每个 LED 芯片都要配置一个准直装置，使得不同颜色的 LED 芯片在空间位置上间隔一定的距离，这种空间位置的不同，使得输出光束中不同颜色光束的空间角分布不同，即使经过后续光路上的匀光，投影光束还是会在偏离像面的位置出现光斑颜色不均匀性的问题。
 技术问题
本实用新型主要解决的技术问题是提供一种避免光学扩展量增大且混光均匀的 LED 单元模组。
本实用新型实施例提供 一种 LED 单元模组，包括：
衬底以及位于该衬底上的 LED 芯片组，该 LED 芯片组包括至少五个 LED 芯片，其中各 LED 芯片彼此紧密排布，且该 LED 芯片组的发光面的轮廓接近正六边形；
所述 LED 芯片组包括至少四种颜色的 LED 芯片，其中该四种颜色为红色、蓝色、绿色和琥珀色。
优选地，所述 LED 芯片组还包括青色、深蓝色、橙色和白色 / 黄色中的至少一种颜色 LED 。
优选地，所述 LED 芯片组包括四个白色 / 黄色 LED 、两个红色 LED 、两个琥珀色 LED 、一个蓝色 LED 、一个深蓝色 LED 、一个绿色 LED 和一个青色 LED 。
优选地，相同颜色的 LED 的排布关于所述正六边形的中心对称，所述蓝色 LED 和深蓝色 LED 关于所述正六边形的中心对称，所述绿色 LED 和青色 LED 关于所述正六边形的中心对称。
优选地，所述四个白色 / 黄色 LED 相互紧密排布成矩形阵列，其余八个 LED 环绕该矩形阵列排布，其中每两个 LED 芯片平行紧邻于该矩形阵列的一个边上的两个白色 LED 芯片。
优选地，其特征在于，所述 LED 芯片组包括十二个 LED 芯片，其中四个 LED 芯片相互紧密排布成矩形阵列，其余八个 LED 芯片环绕该矩形阵列排布，其中每两个 LED 芯片平行紧邻于该矩形阵列的一个边上的两个 LED 芯片。
优选地，每种颜色 LED 芯片包括至少一个正极接件和负极接件；各 LED 芯片的正极接件均排设于所述衬底的第一侧边上形成正极接件组，各 LED 芯片的负极接件均排设于所述衬底的第二侧边上形成负极接件组；
在所述 LED 单元模组中位于外围的八个 LED 芯片中，分别距离所述衬底的第一侧边和第二侧边最近的两行 LED 芯片中，每一行的两个 LED 芯片之间设有一定间距，以使得所述矩形阵列中的 LED 芯片的线路能够沿着所述衬底的表面引出到第一侧边和第二侧边上来形成正负极接件。
优选地，所述两行 LED 芯片中每行 LED 芯片为一个红光 LED 和一个琥珀色 LED 。
本实用新型实施例还提供一种发光装置，包括由多个上述 LED 单元模组组成的 LED 单元模组阵列。
优选地，所述 LED 单元模组阵列由至少一个同心设置的圆环组成，其中在每个圆环上，沿着逆时针方向，各个 LED 单元模组的旋转角度为等差数列，其中该等差数列的公差的绝对值为 60 度。
本实用新型实施例还提供一种光源系统，包括：
上述发光装置；
准直装置阵列，该准直装置阵列中的准直装置与所述 LED 单元模组阵列中的 LED 单元模组一一对应，用于对与其对应的 LED 单元模组所发光进行准直；
复眼透镜对，包括两个复眼透镜，用于对所述准直装置阵列出射的光进行匀光，其中远离所述准直装置透镜阵列的复眼透镜上的每个微透镜呈正六边形；
聚焦透镜，用于将所述复眼透镜对出射光收集至预定平面上。
优选地，所述准直装置阵列为准直透镜阵列，其中每个准直透镜呈正六边形，且各准直透镜相互紧密连接。
与现有技术相比，本实用新型包括如下有益效果：
由于包括至少五个 LED 芯片、四种颜色的 LED 芯片组均位于同一个衬底上，在后续光路上可以对每个 LED 芯片组配置一个准直装置，由于 LED 所发光呈朗伯分布，一个 LED 芯片组内的多种颜色光经准直装置收集准直成一束平行光束的同时也实现了均匀混光，该平行光束中不同颜色的光束在空间彼此重叠，其对应的角分布也近似相同，有利于提高光源所发光的均匀性；同时， LED 单元模组中的 LED 芯片组的发光面的轮廓接近正六边形，以和后续光路上复眼透镜对中的第二片复眼透镜上的呈正六边形的透镜单元相匹配，以避免光束经第二片复眼透镜出射后光学扩展量变大。
 附图说明
图 1 是 现有技术中的一种 LED 阵列的结构示意图；
图 2 为本实用新型的光源系统的一个实施例的结构示意图；
图 3 为图 2 所示光源系统中的 LED 单元模组的结构示意图；
图 4 为图 3 所示的 LED 单元模组内的一种布线示意图；
图 5 为图 2 所示光源系统中的 LED 单元模组阵列的一种结构示意图；
图 6 为图 2 所示光源系统中的准直透镜阵列的排布示意图。
 本发明的实施方式
为便于描述，以下使用了'上''下''左''右'来表示各元器件之间的位置关系，该'上''下''左''右'分别为图中的上、下、左、右。
下面结合附图和实施方式对本实用新型实施例进行详细说明。
实施例一
请参阅图 2 ，图 2 为本实用新型的光源系统的一个实施例的结构示意图。光源系统包括发光装置 1 、准直装置阵列 2 、复眼透镜对 3 和聚焦透镜 4 。
发光装置 1 包括由多个 LED 单元模组 11 组成的 LED 单元模组阵列 12 。如图 3 所示，图 3 为图 2 所示光源系统中的 LED 单元模组 11 的结构示意图。 LED 单元模组 11 包括衬底 13 以及位于衬底 13 上的 LED 芯片组 14 。 本实施例中，衬底 13 优选为导热衬底，该导热衬底可选用氧化铝、氮化铝等导热陶瓷，只要具有足够高的热导率同时具有绝缘表面层即可。
该 LED 芯片组 14 包括十二个 LED 芯片，其中 各 LED 芯片彼此紧密排布，且该 LED 芯片组 14 的发光面的轮廓接近正六边形 15 。
LED 芯片彼此紧密排列的用意在于，一方面减小光源系统的光学扩展量，另一方面使各 LED 芯片之间的间隙尽可能小，这样有利于光源系统发光光斑的均匀性。在实际操作中，由于 LED 封装工艺的限制， LED 芯片的间距往往不能为 0 ，而是一个很小的距离例如 0.1~0.2mm （对于 1mm 的 LED 芯片而言）。
值得说明的是，在实际运用中， LED 芯片的形状一般为方形，多个 LED 芯片组成的 LED 芯片组的发光面的轮廓一般不能刚好为一个正六边形。本实用新型中所描述的发光面的轮廓接近一个正六边形，指的是该发光面的轮廓超出该正六边形的区域的面积以及该正六边形未被该轮廓填满的区域的面积分别不超过该发光面的轮廓面积的 30% ，其中发光面的轮廓包括相邻两个 LED 芯片之间的间距。
LED 芯片组 14 包括七种颜色的 LED 芯片，其中每种颜色的 LED 芯片包括至少一个正极接件和负极接件。各 LED 芯片设于衬底 13 上，且各 LED 芯片的正极接件均排设于衬底 13 的第一侧边 13a 上形成正极接件组 141 ，各 LED 芯片的负极接件均排设于与第一侧边 13a 相对的第二侧边 13b 上形成负极接件组 142 。当然，在实际运用中，各 LED 芯片的正负极接件也可以采用其他排布方式。
具体地，本实施例中， LED 芯片组 14 包括十二个 LED 芯片，分别为四个白色 LED （图中标识为 W ）、两个红色 LED （图中标识为 R ）、两个琥珀色 LED （图中标识为 A ）、一个蓝色 LED （图中标识为 B ）、一个深蓝色 LED （图中标识为 dB ）、一个绿色 LED （图中标识为 G ）和一个青色 LED （图中标识为 C ）。其中红色 LED 的主波长在 720nm 至 770nm 之间，琥珀色 LED 的主波长在 580nm 至 600 nm 之间，绿色 LED 的主波长在 520 nm 至 550 nm 之间，青色 LED 的主波长在 490nm 至 520 nm 之间，蓝色 LED 的主波长在 460 nm 至 490 nm 之间，深蓝色 LED 的主波长在 440 nm 至 460 nm 之间。
四个 LED 芯片相互紧密排布成内矩形阵列，其余八个 LED 芯片环绕该内矩形阵列排布，其中每两个 LED 芯片平行紧邻于该内矩形阵列的一个边上的两个 LED 芯片，形成一个外矩形阵列，以使得 LED 芯片组 14 的发光面的轮廓接近正六边形 15 。
优选地，相同颜色的 LED 的排布关于正六边形 15 的中心对称，由于蓝色 LED 和深蓝色 LED 的色差较小，绿色 LED 和青色 LED 的色差较小，因此蓝色 LED 和深蓝色 LED 关于正六边形 15 的中心对称，绿色 LED 和青色 LED 关于正六边形 15 的中心对称。
由于白色 LED 是由蓝色 LED 的发光表面上设有黄色荧光粉层而得来的，相比其他颜色的 LED ，白色 LED 对耐热的性能较好，而位于中间的四个 LED 散热最差，因此中间四个 LED 芯片优选为白色 LED ，其余颜色的 LED 环绕该白色 LED 排布。另外，采用四颗白色 LED 芯片，可以大大提高发光装置的亮度。而红色和琥珀色 LED 的热稳定性较差，因此该两个颜色的 LED 优选排设在 LED 芯片组中外面一圈中。
当然，在实际运用中，各颜色的 LED 也可以设于其他位置。例如，内矩形阵列上的四个 LED 芯片在顺时针方向上依次为蓝色、绿色、深蓝色和青色 LED ，位于外矩形阵列上的八个 LED 芯片中，四个白色 LED 分别位于外矩形阵列的四个边上，并关于正六边形 15 的中心对称。当然，在不考虑散热以及匀光效果的场合中，各颜色的 LED 的排布位置可以是任意的。
在本实施例中， LED 芯片组中的用于提高亮度的白色 LED 也可以为黄色 LED ，其中黄色 LED 的主波长在 540 nm 至 570 nm 之间，并且光谱要宽于除白色以外其它颜色 LED 的光谱； LED 芯片组中所包括的 LED 颜色也可以是其他数量。例如，在对光源的显色性要求不是很高的场合中， LED 芯片组中只包括红、绿、蓝、白 / 黄、琥珀色这五种颜色。 LED 芯片组中可以具体包括四个白 / 黄色 LED ，而其余颜色的 LED 各两个。在对光源的亮度要求不是很高的场合中， LED 芯片组中也可以只包括红、绿、蓝、琥珀色这四种颜色。该四种颜色的 LED 的合光光谱已经很接近太阳光光谱，因此显色性已经较高，能够符合大多数场合的应用要求。其中每个颜色 LED 的具体数量可根据对光源的色温要求来确定。或者，在红、蓝、绿、琥珀这四种颜色的基础上再根据需要的颜色来添加，例如，需要青色则添加青色 LED ，需要深蓝色则添加深蓝色 LED ，需要橙色则添加橙色 LED ，其中该橙色 LED 的主波长在 710nm 至 720nm 之间。
在本实施例中， LED 芯片组中的 LED 芯片数量也可以是其他数目，只要能够将各 LED 芯片相互紧密排布并使得该 LED 芯片组的发光面的轮廓接近正六边形即可，例如 LED 芯片组可以包括五个 LED 芯片，其中一个 LED 芯片位于中间，其余四个 LED 芯片分别位于该 LED 芯片的四周。或者， LED 芯片组还可以包括七个 LED 芯片，其中一个 LED 芯片位于中间，其余六个 LED 芯片呈圆形环绕该中间的 LED 芯片；或者包括二十一个 LED 芯片，其中 15 个 LED 芯片呈 3*5 矩形阵列排布，其余六个 LED 芯片中每三个分别位于该矩形阵列的两个长边的外侧。由于五个以下的 LED 芯片排成的图形并不接近正六边形，因此本实施中的 LED 芯片组包括至少五个 LED 芯片。
如图 4 所示，图 4 为图 3 所示的 LED 单元模组内的一种布线示意图。衬底 13 的第一侧边 13a 上从左到右依序排列着深蓝色、绿色、红色、白色、琥珀色、蓝色、青色的正极接件各一个，第二侧边 13b 上从左到右依序排列着深蓝色、绿色、红色、白色、琥珀色、蓝色、青色的负极接件各一个。其中，相同颜色的 LED 在衬底 13 上相互串联（如两个红色 LED 、两个琥珀色 LED 和四个白色 LED ），这样，每种颜色 LED 在衬底 13 的第一侧边 13a 和第二侧边 13b 上分别只需设有一个正极接件和负极接件即可，有利于 LED 单元模组上的结构紧凑，衬底 13 的面积较小。
当然，在实际运用中，相同颜色的 LED 也可以在衬底 13 上相互并联，或者部分颜色相同的 LED 相互串联，另一部分颜色相同的 LED 相互并联。更甚者，在对 LED 单元模组的大小没有要求的场合中，也可以每一个 LED 芯片均在衬底的两侧上各设有正负极接件。
本实施例中，为布线方便，分别距离衬底 13 的第一侧边 13a 和第二侧边 13b 最近的两行 LED 芯片中（ LED 芯片 111 和 112 、 LED 芯片 113 和 114 ），每一行上的两个 LED 芯片的间距稍微拉开，以使得位于正六边形的中心上的四个白色 LED 的线路能够沿着衬底 13 的表面引出到第一侧边 13a 和第二侧边 13b 上的正负极接件上来。这样，在整个 LED 芯片组中，由于该四个芯片与相邻的芯片的间距较大，有利于散热，因此该四个芯片优选设为红色 LED 和琥珀色 LED 。
当然，在实际运用中，位于中心区域上的 LED 的正负极也可以不是沿着布在衬底 13 表面上的线路连到第一侧边 13a 和第二侧边 13b 的正负极接件上，而是通过跳线的方式来接到该两个侧边上的正负极接件。这样，分别离该两个侧边最近的两行 LED 芯片中，每一行上的两个 LED 芯片的间距也可以不用拉开，该两个 LED 芯片可以紧密排布。更甚者，还可以在该两行 LED 芯片中分别多加入一个 LED 芯片。
如图 5 所示，图 5 为图 2 所示光源系统中的 LED 单元模组阵列的一种结构示意图。 LED 单元模组阵列 12 包括多个 LED 单元模组。 LED 单元模组阵列 1 2 优选由至少两列 LED 单元模组 11 平行并列排布成一个呈圆形或者正多边形的阵列，以和放置在 LED 单元模组阵列的后续光路上的圆形透镜相配合，提高光利用率。当然，在不考虑配合圆形透镜的场合上， LED 单元模组阵列 1 也可以不是呈圆形或者正多边形。在本实施例中， LED 单元模组阵列 1 由三列 LED 单元模组 11 平行排布成一个接近正六边形的阵列。
本实施例中， LED 单元模组阵列 1 中每个 LED 单元模组均为一样的，即模组中的 LED 芯片组的排布位置、负极接件组的排布顺序以及 LED 芯片组中各颜色 LED 相对正负极接件组的位置均为一致的。而且，位于同一列上的 LED 单元模组 11 的正极接件组指向其负极接件组的方向一致， 以使能够顺沿着同一列上的 LED 单元模组 11 串联布线。而任意相邻两列的 LED 单元模组 11 的正极接件组指向其负极接件组的方向相反，以使能够在该相邻两列的相同一侧的末端上将该两列 LED 单元模组串联。
具体来说，以红色 LED 举例，左边数起第一列和第三列上的红色 LED 的正极接件指向其负极接件的方向均向下，第二列上的红色 LED 的正极接件指向其负极接件的方向均向上。这样，将所有红色 LED 串联起来时，第一、三列中线路均沿着向下的方向依次将各红色 LED 的正极接件和负极接件连接起来，第二列中线路均沿着向上的方向依次将各红色 LED 的正极接件和负极接件连接起来，而第一列和第二列的红色 LED 则通过位于第一列的下侧末端上的 LED 单元模组 151 内的红色 LED 负极接件，以及第二列的下侧末端上的 LED 单元模组 153 的红色 LED 正极接件连接起来。其他任意相邻两列也是通过该方法串联起来。
其他六个颜色的 LED 的布线方式均和红色 LED 的布线方式一致。由于每个 LED 单元模组中的正负极接件组的排列顺序均一致，以及相邻两列 LED 单元模组的正极接件组指向负极接件组的方向相反，使得相邻两列的极接件组左右对称，因此该四种颜色的 LED 串联的线路相邻且相互平行形成一束线，且该束线与自身没有交点，使得布线简单方便。
准直装置阵列 2 包括多个准直装置 21 ，与各 LED 单元模组 11 一一对应，用于对与其对应的 LED 单元模组所发光进行准直。具体地，本实施例中该准直装置阵列 2 为准直透镜阵列。
复眼透镜对 3 包括第一复眼透镜 31 和第二复眼透镜 32 ，位于准直透镜阵列 2 的出射光路上，用于对经准直透镜阵列 2 准直的光束进行匀光，其中第一复眼透镜 31 与准直透镜阵列 2 相邻。本实施例中， 复眼透镜对中两个复眼透镜上的每个微透镜呈正六边形结构，一方面可保证相邻微透镜之间的无缝排布，另一方面又使其投影像与圆形投影光斑匹配。第一复眼透镜 31 上的各微透镜与第二复眼透镜 32 上的各微透镜一一对应。优选地，准直透镜阵列 2 中每个准直透镜的尺寸是复眼透镜对 3 中复眼透镜的每个微透镜的尺寸的 4 倍以上。显然，复眼透镜中每个微透镜的尺寸越小，其匀光效果越好。
聚焦透镜 4 位于复眼透镜对 3 的出射光路上，用于将经复眼透镜对 3 匀光的光束收集至预定平面上。在实际运用中，该预定平面一般为聚焦透镜 4 的焦平面。
在本实施例中， 准直透镜 21 在对 LED 单元模组 11 出射光束实现准直的同时也能使 LED 单元模组 11 中的多色 LED 所发光进行混合。对每个 LED 单元模组而言，由于 LED 芯片组中不同颜色的 LED 芯片均对着同一个准直透镜，而 LED 所发光呈朗伯分布，因此 LED 芯片组发出的多种颜色的光束经该准直透镜收集和准直成一束平行光（虽然并非理想的平行光，而是具有一定的发散角，但其发散角很小，例如± 9 °，所以可近似按平行光来处理）的同时也实现了均匀混光。
该平行光束中不同颜色的光束在空间彼此重叠，其对应的角分布也近似相同，随后经复眼透镜对 3 匀光后被聚光透镜 4 会聚到光阑（图未示）处，投影镜头（图未示）再将光阑的像投影成像到远处。在整个光束的传播过程中，不同颜色的光束始终耦合在一起，所以在光源系统最后输出的光束中，不同颜色的光束的空间位置和出射角将基本相同。本质上，即使 LED 芯片组中各芯片紧密排列，它们的空间位置仍是不同的，这种空间位置的不同将导致它们所发出的不同颜色的光束经准直透镜 21 准直后的空间角分布也会略有差异，但由于每个 LED 芯片的面积很小 ( 通常只有 1mm x 1mm) ，且不同芯片又彼此相隔很近，所以这种由空间位置差异所引起的不同颜色的光束角分布的差异可以忽略。
本实施例中， LED 单元模组阵列中每个 LED 单元模组所发光经准直后会入射至第一复眼透镜 31 中部分微透镜上，而每个微透镜会将其接收到的光所来自的 LED 单元模组中的 LED 芯片组成像至第二复眼透镜 32 中与该微透镜相对应的微透镜上，因此，第二复眼透镜 32 中具有成像的微透镜的总面积构成了第二复眼透镜 32 出射光的发光面。由于发光面是一定的，当第二复眼透镜 32 出射的光的发光角度越小时，该出射光的光学扩展量也就越小。根据光学扩展量守恒可知，第一复眼透镜 31 的每个微透镜在第二复眼透镜 32 与其对应的微透镜上所成的像越大，则第二复眼透镜 32 的每个微透镜出射的光的发光角度越小。但是，当第二复眼透镜 32 上的微透镜上的像超出该微透镜的面积时，其超出的部分光会成为杂散光而损失掉。因此， LED 芯片组在第二复眼透镜 32 上各微透镜上成的像优选内接于该微透镜。
在现有技术中， LED 单元模组中只设有一个 LED 芯片， LED 芯片的面积一般为方形的，而第二复眼透镜 32 上的微透镜为正六边形的，因此该方形在该微透镜上所成的像无法填充整个微透镜，而微透镜出射光的发光面为整个微透镜，这造成了 LED 单元模组阵列的光学扩展量的增大。而在本实施例中，由于每个 LED 单元模组中的 LED 芯片组的发光面的轮廓接近正六边形，因此在第二复眼透镜 32 上每个微透镜上所成的像能够接近填满整个微透镜，进而避免了 LED 单元模组阵列的光学扩展量变大。在一些场合中，为使 LED 芯片组的发光面的轮廓能够更多的填充一个微透镜，该 LED 芯片组的发光面的轮廓也可以超出正六边形一点，只要该超出的部分的面积不大于该发光面的轮廓面积的 30% ，也能在接受范围内。
如图 6 所示，图 6 为图 2 所示光源系统中的准直透镜阵列的排布示意图。本实施例中，准直透镜阵列 2 中各个准直透镜 21 优选呈正六边形，且相互紧密排列，使得相邻准直透镜 21 之间没有间隙。这样，对于每个 LED 单元模组中相同颜色的 LED 芯片发出的光，从各个准直透镜 21 准直出射时将彼此相接连成一片，这些准直光束经投影镜头投影出射时也彼此相接连成一片，且充满整个发光面。当然，出于公差和安装考虑，也可使相邻准直透镜之间留有一定缝隙，这也应该属于本实用新型的保护范围。由于准直透镜阵列 2 相比该准直透镜阵列 2 所内接的圆环 C1 还有一些剩余空白处，为使准直透镜阵列 2 的发光面更接近一个圆形，以和后续光路上的圆形透镜配合，准直透镜阵列 2 优选还包括多个小准直透镜 22 ，位于该剩余空白处。相对应的，发光装置 1 还包括多个单颗芯片封装或两颗芯片封装的 LED （图未示），其中各 LED 与各小准直透镜 22 一一对应。这样，发光装置 1 所发光经准直透镜阵列 2 准直后的光束的横截面更接近一个圆形。
本实施例中，为了进一步改善投影光斑空间面分布的均匀性，还可在 LED 单元模组 11 和准直装置 21 之间设置积分棒（图未示）来对 LED 芯片出射的光束进行匀光。积分棒包括入光口和出光口。入光口紧紧靠近 LED 单元模组中 LED 芯片的发光面设置，使得从 LED 出射的绝大部分光都能进入该积分棒。出光口位于准直装置 21 的焦平面附近，使得其输出光束经准直装置 21 准直后能成为较理想的平行光，此时，积分棒的出光面相当于成为了系统的光源面。由于积分棒对光的混合作用，这使得 LED 光源系统发光更加均匀。
在实际应用中，积分棒还可以是出光口面积大于入光口面积的锥形方棒。当锥形方棒的出光口足够大，大到彼此相邻连成一片，此时从锥形方棒出光口出射的光束也将连成一片。由于锥形方棒出射的光的发光角度会减小，也可以不在其后的准直透镜，即该积分棒充当准直装置；但此时为了实现良好的混光效果，锥形方棒需具有足够的长度。
为实现 LED 单元模组阵列中多种颜色光在预定面上形成的混合光斑更加均匀，还可以通过设置不同 LED 单元模组中不同颜色的 LED 芯片的位置，使得至少除白色以外任意一种颜色的 LED 芯片在 LED 单元模组中的各个位置具有大致相同的分布。
具体举例来说，将各 LED 单元模组相对于光源平面旋转不同的角度进行固定。优选地，使各 LED 单元模组相对于各自的中心旋转的角度分别为 60 度的 1 、 2 、 3 、 4 、 5 、 6 倍，以下对该实施例具体说明。
本实施例与图 5 所示实施例的区别在于：
本实施例中， LED 单元模组阵列包括七个 LED 单元模组，其中六个排布成一个圆环， 而剩余一个 LED 单元模组设于圆环的圆心上。
在该圆环上，第一个 LED 单元模组的正极接件组指向其负极接件组的方向为水平向左。从该第一个 LED 单元模组开始，沿着该圆环的逆时针方向，每个 LED 单元模组相比前一个 LED 单元模组沿逆时针旋转的角度上增加 60 度。
本实施例中，在布线时，电源的正极接到圆环上第一个 LED 单元模组的正极接件组上，并沿着该圆环以逆时针方向依次将该圆环上的 LED 单元模组串联起来。而该圆环上最后一个 LED 单元模组的负极接件组和位于圆心上的 LED 单元模组的正极接件组相连，该 LED 单元模组 55 的负极接件组上的线路通过跳线连到该圆环外以和电源的负极相连。
本实施例中，每个圆环上 LED 单元模组旋转不同的角度，且这些不同的旋转角在 0-360 °范围内分布均匀。这样， LED 单元模组内除白色以外其他每一个颜色的 LED 均在该模组内正六边形的 0 度、 60 度、 120 度、 180 度、 240 度、 360 度方向上均出现两次。这样，每种颜色的 LED 芯片在各个 LED 单元模组中的各个位置具有大致相同的分布。同时，布线时由于每个圆环上任意相邻两个 LED 单元模组的正负极接件组相邻，使得布线简单方便，且形成的线路交叉点少。
而且，在本实施例中，圆环上每个 LED 单元模组相比自身旋转的角度为 60 度的倍数，而每个 LED 单元模组中 LED 芯片组的排布接近正六边形，因此在旋转 60 度后仍能和自身向重合。复眼透镜对中第二复眼透镜的微透镜的摆放方向都是一致的，本实施例中圆环上的各个 LED 单元模组虽然发生旋转，但是各个 LED 单元模组旋转后的 LED 芯片组在第二复眼透镜上每个微透镜所成的像仍能够和该微透镜相匹配。因此，在由至少两个同心设置的圆环组成的 LED 单元模组阵列中，在每个圆环上沿着逆时针方向，各个 LED 单元模组的旋转角度优选为等差数列，其中该等差数列的公差的绝对值为 60 度。这样，可以保证每个 LED 单元模组在第二复眼透镜的微透镜上形成的像能够和该微透镜相匹配。
在上面实施例中，每一种颜色的 LED 芯片都指的是单一的一种 LED 芯片。实际上，至少有一种颜色的 LED 芯片可以是复色 LED 芯片，该复色 LED 芯片包括两种主波长的 LED 芯片，且两种主波长之差大于 10nm 且小于 30nm 。对于这样两种主波长的 LED 芯片的发光，人眼可以分辨其发光颜色的差异，但是在人眼看来这样的颜色差异也不太明显。
通过以上实施例的描述可知，应用本实用新型可以实现颜色均匀的 LED 光源系统。在实验中发明人发现，由于该 LED 光源系统足够均匀，以至于即使使用了复色 LED 芯片人眼也不会察觉该复色 LED 芯片的颜色差异所带来的影响。同时，复色 LED 芯片的应用可以使得 LED 光源系统的发光光谱覆盖范围更大，显色指数更高。
优选的， LED 光源系统还包括颜色调整模块，该颜色调整模块接收复色 LED 芯片所对应的颜色调整信号，并根据该颜色调整信号所携带的目标颜色信息控制复色 LED 所包括的两种主波长的 LED 芯片的发光功率。例如，对红色而言，可以包括 618nm 和 635nm 两种波长的红色 LED 芯片，虽然有颜色差异但是不明显。此时，可以通过颜色调整模块调整两者相对强度来可以产生主波长不同的红色投影光束。
另一方面，使复色 LED 芯片所对应的两种主波长的 LED 芯片分别所在的 LED 单元模组相互交错排列，这样可以使这两种主波长的光混合的更加均匀，更不易被人眼察觉。
本实施例中，也可以包括不同色温的白光 LED 芯片，例如， 3200K 和 6500K 两种色温，使该两种不同色温的 LED 芯片所在的 LED 单元模组相互交错排列，即可以保证混光均匀，又可通过调整模块调整两者的相对强度，进而产生不同色温的投影光斑。对本领域的技术人员，这属公知常识，不再赘述。
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。
本实用新型实施例还提供一种 投影系统，包括光源系统，该光源系统可以具有上述各实施例中的结构与功能。该投影系统可以采用各种投影技术，例如液晶显示器（ LCD ， Liquid Crystal Display ）投影技术、数码光路处理器（ DLP ， Digital Light Processor ）投影技术。此外，上述发光装置也可以应用于照明系统，例如舞台灯照明。
以上所述仅为本实用新型的实施方式，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本实用新型的专利保护范围内。

Claims (12)

  1. 一种 LED 单元模组，其特征在于，包括：
    衬底以及位于该衬底上的 LED 芯片组，该 LED 芯片组包括至少五个 LED 芯片，其中各 LED 芯片彼此紧密排布，且该 LED 芯片组的发光面的轮廓接近正六边形；
    所述 LED 芯片组包括至少四种颜色的 LED 芯片，其中该四种颜色为红色、蓝色、绿色和琥珀色。
  2. 根据权利要求 1 所述的 LED 单元模组，其特征在于，所述 LED 芯片组还包括青色、深蓝色、橙色、白色和黄色中的至少一种颜色 LED 。
  3. 根据权利要求 2 所述的 LED 单元模组，其特征在于，所述 LED 芯片组包括四个白色或黄色 LED 、两个红色 LED 、两个琥珀色 LED 、一个蓝色 LED 、一个深蓝色 LED 、一个绿色 LED 和一个青色 LED 。
  4. 根据权利要求 3 所述的 LED 单元模组，其特征在于，相同颜色的 LED 的排布关于所述正六边形的中心对称，所述蓝色 LED 和深蓝色 LED 关于所述正六边形的中心对称，所述绿色 LED 和青色 LED 关于所述正六边形的中心对称。
  5. 根据权利要求 3 所述的 LED 单元模组，其特征在于，所述四个白色或黄色 LED 相互紧密排布成矩形阵列，其余八个 LED 环绕该矩形阵列排布，其中每两个 LED 芯片平行紧邻于该矩形阵列的一个边上的两个白色 LED 芯片。
  6. 根据权利要求 1 至 5 中任一项所述的 LED
    单元模组，其特征在于，所述 LED 芯片组包括十二个 LED 芯片，其中四个 LED 芯片相互紧密排布成矩形阵列，其余八个 LED 芯片环绕该矩形阵列排布，其中每两个 LED 芯片平行紧邻于该矩形阵列的一个边上的两个 LED 芯片。
  7. 根据权利要求 6 所述的 LED 单元模组，其特征在于，
    每种颜色 LED 芯片包括至少一个正极接件和负极接件；各 LED 芯片的正极接件均排设于所述衬底的第一侧边上形成正极接件组，各 LED 芯片的负极接件均排设于所述衬底的第二侧边上形成负极接件组；
    在所述 LED 单元模组中位于外围的八个 LED 芯片中，分别距离所述衬底的第一侧边和第二侧边最近的两行 LED 芯片中，每一行的两个 LED 芯片之间设有一定间距，以使得所述矩形阵列中的 LED 芯片的线路能够沿着所述衬底的表面引出到第一侧边和第二侧边上来形成正负极接件。
  8. 根据权利要求 7 所述的 LED 单元模组，其特征在于，所述两行 LED 芯片中每行 LED 芯片为一个红光 LED 和一个琥珀色 LED 。
  9. 一种发光装置，其特征在于，包括由多个如权利 1 至 8 任一项所述的 LED 单元模组组成的 LED 单元模组阵列。
  10. 根据权利要求 9 所述的发光装置，其特征在于，所述 LED 单元模组阵列由至少一个同心设置的圆环组成，其中在每个圆环上，沿着逆时针方向，各个 LED 单元模组的旋转角度为等差数列，其中该等差数列的公差的绝对值为 60 度。
  11. 一种光源系统，其特征在于，包括：
    如权利要求 9 或 10 所述的发光装置；
    准直装置阵列，该准直装置阵列中的准直装置与所述 LED 单元模组阵列中的 LED 单元模组一一对应，用于对与其对应的 LED 单元模组所发光进行准直；
    复眼透镜对，包括两个复眼透镜，用于对所述准直装置阵列出射的光进行匀光，其中远离所述准直装置透镜阵列的复眼透镜上的每个微透镜呈正六边形；
    聚焦透镜，用于将所述复眼透镜对出射光收集至预定平面上。
  12. 根据权利要求 11 所述的光源系统，其特征在于，所述准直装置阵列为准直透镜阵列，其中每个准直透镜呈正六边形，且各准直透镜相互紧密连接。
PCT/CN2014/075153 2013-04-11 2014-04-11 Led 单元模组、发光装置以及光源系统 Ceased WO2014166417A1 (zh)

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