WO2014202218A3 - Kühlvorrichtung für ein stromumrichtermodul - Google Patents

Kühlvorrichtung für ein stromumrichtermodul Download PDF

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Publication number
WO2014202218A3
WO2014202218A3 PCT/EP2014/001660 EP2014001660W WO2014202218A3 WO 2014202218 A3 WO2014202218 A3 WO 2014202218A3 EP 2014001660 W EP2014001660 W EP 2014001660W WO 2014202218 A3 WO2014202218 A3 WO 2014202218A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
cooling device
current converter
converter module
interconnected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2014/001660
Other languages
English (en)
French (fr)
Other versions
WO2014202218A2 (de
Inventor
Christoph Meyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vensys Elektrotechnik GmbH
Original Assignee
Vensys Elektrotechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vensys Elektrotechnik GmbH filed Critical Vensys Elektrotechnik GmbH
Priority to CN201480045731.6A priority Critical patent/CN105493271B/zh
Priority to EP14752555.4A priority patent/EP3036763B1/de
Publication of WO2014202218A2 publication Critical patent/WO2014202218A2/de
Publication of WO2014202218A3 publication Critical patent/WO2014202218A3/de
Priority to US14/974,866 priority patent/US10199307B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0246—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Die Erfindung betrifft eine Kühlvorrichtung für ein Stromumrichtermodul. Um die Kondensatbildung in einer Kühlvorrichtung für ein Stromumrichtermodul zu vermeiden, ist die Kühlvorrichtung versehen mit einem flüssiges Kühlmittel führenden Kühlflüssigkeitskanal, der zu einem Kühlkreislauf verschaltet ist, mit einem Wärmetauscher, der in dem Kühlkreislauf verschaltet ist und an dem wärmeleitend ein Leistungsbauelement gekoppelt ist, und mit einem Kühler zum Kühlen des flüssigen Kühlmittels, der in dem Kühlkreislauf verschaltet ist, wobei in dem Kühlkreislauf eine Heizung derart vorgesehen ist, dass der Wärmetauscher über eine Erwärmung des Kühlmittels bei Bedarf erwärmbar ist.
PCT/EP2014/001660 2013-06-18 2014-06-18 Kühlvorrichtung für ein stromumrichtermodul Ceased WO2014202218A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201480045731.6A CN105493271B (zh) 2013-06-18 2014-06-18 用于电流转换器模块的冷却装置
EP14752555.4A EP3036763B1 (de) 2013-06-18 2014-06-18 Kühlvorrichtung für ein stromumrichtermodul
US14/974,866 US10199307B2 (en) 2013-06-18 2015-12-18 Cooling device for a current converter module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013010088.7A DE102013010088A1 (de) 2013-06-18 2013-06-18 Kühlvorrichtung für ein Stromumrichtermodul
DE102013010088.7 2013-06-18

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/974,866 Continuation US10199307B2 (en) 2013-06-18 2015-12-18 Cooling device for a current converter module

Publications (2)

Publication Number Publication Date
WO2014202218A2 WO2014202218A2 (de) 2014-12-24
WO2014202218A3 true WO2014202218A3 (de) 2015-03-05

Family

ID=52009519

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2014/001660 Ceased WO2014202218A2 (de) 2013-06-18 2014-06-18 Kühlvorrichtung für ein stromumrichtermodul

Country Status (5)

Country Link
US (1) US10199307B2 (de)
EP (1) EP3036763B1 (de)
CN (1) CN105493271B (de)
DE (1) DE102013010088A1 (de)
WO (1) WO2014202218A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016212672B3 (de) * 2016-07-12 2017-07-06 Olympus Winter & Ibe Gmbh Einrichtung zum Prüfen der Dichtigkeit eines chirurgischen Instruments, Aufbereitungseinrichtung zum Aufbereiten von chirurgischen Instrumenten und Verwendung eines quellbaren Materialkörpers
US10798851B1 (en) 2019-05-24 2020-10-06 L3 Technologies, Inc. Systems and methods for implementing intelligent cooling interface archiectures for cooling systems
CN112910222B (zh) * 2021-02-04 2023-04-07 苏州汇川技术有限公司 散热结构及变频器
CN113937983B (zh) * 2021-10-21 2023-10-10 滨州学院 一种具有提高制动性能的变频器

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047561A (en) * 1974-10-18 1977-09-13 General Electric Company Cooling liquid de-gassing system
US4051509A (en) * 1975-12-26 1977-09-27 Bbc Brown Boveri & Company Limited Apparatus for cooling electrical devices at different electrical potentials by means of a flowing medium
EP0993243A2 (de) * 1997-04-04 2000-04-12 Unisys Corporation Methode und Vorrichtung zum wärmeleitenden Verbinden einer elektronischen Schaltung mit einem Wärmetauscher
EP1577739A2 (de) * 2004-02-16 2005-09-21 Hitachi, Ltd. Kühlungssystem für ein elektronisches Gerät und elektronisches Gerät mit demselben
US20060002086A1 (en) * 2004-06-30 2006-01-05 Teneketges Nicholas J Heat exchange apparatus with parallel flow
US20080223555A1 (en) * 2007-03-16 2008-09-18 Centipede Systems, Inc. Method and apparatus for controlling temperature
US20090014156A1 (en) * 2007-06-20 2009-01-15 Jan Vetrovec Thermal management system
US20090236081A1 (en) * 2008-03-18 2009-09-24 Kontron Modular Computers S. A. Device for preheating a component cooled by conduction and/or by convection
US20100253079A1 (en) * 2007-11-12 2010-10-07 Repower Systems Ag Wind energy installation with a heating device
EP2264559A2 (de) * 2009-06-12 2010-12-22 Tai-Her Yang Halbleiteranwendung mit Temperaturausgleichsystem
EP2361006A2 (de) * 2010-02-13 2011-08-24 Adensis GmbH Kühlsystem mit Lüfter für Photovoltaik-Wechselrichter
US20120227954A1 (en) * 2009-11-19 2012-09-13 Fujitsu Limited Loop heat pipe system and information processing apparatus

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5562757A (en) * 1978-11-06 1980-05-12 Hitachi Ltd Method of cooling electric machine
DE10203790A1 (de) * 2002-01-31 2003-06-26 Siemens Ag Aktive Stabilisierung des Temperaturniveaus in Halbleiterbauelementen
DE102004057526B4 (de) * 2003-12-03 2020-08-20 Denso Corporation Stapelkühler
DE102004059963A1 (de) * 2003-12-18 2005-08-11 Denso Corp., Kariya Einfach zusammengesetzter Kühler
DK2002120T3 (da) * 2006-03-25 2010-03-15 Clipper Windpower Technology Inc Varmeadministrationsanlæg til en vindturbine
US7788941B2 (en) * 2007-06-14 2010-09-07 International Business Machines Corporation Cooling system and method utilizing thermal capacitor unit(s) for enhanced thermal energy transfer efficiency
EP2203642B1 (de) * 2007-10-31 2011-06-01 Powerwind Gmbh Windenergieanlage
US7907406B1 (en) * 2009-09-28 2011-03-15 International Business Machines Corporation System and method for standby mode cooling of a liquid-cooled electronics rack
JP5627499B2 (ja) * 2010-03-30 2014-11-19 株式会社デンソー 半導体モジュールを備えた半導体装置
JP5545260B2 (ja) * 2010-05-21 2014-07-09 株式会社デンソー 熱交換器
JP5562757B2 (ja) 2010-08-07 2014-07-30 日本電波工業株式会社 メサ型のａｔカット水晶振動片及び水晶デバイス
US8274790B2 (en) * 2010-11-16 2012-09-25 International Business Machines Corporation Automatically reconfigurable liquid-cooling apparatus for an electronics rack
JP4912512B1 (ja) * 2011-02-10 2012-04-11 三菱電機株式会社 冷却装置および電力変換装置
US8925333B2 (en) * 2012-09-13 2015-01-06 International Business Machines Corporation Thermoelectric-enhanced air and liquid cooling of an electronic system
US9655286B2 (en) * 2012-10-10 2017-05-16 International Business Machines Corporation Facilitating fluid level sensing
US9288932B2 (en) * 2012-11-08 2016-03-15 International Business Machines Corporation Ground-based heat sink facilitating electronic system cooling
US9313930B2 (en) * 2013-01-21 2016-04-12 International Business Machines Corporation Multi-level redundant cooling system for continuous cooling of an electronic system(s)
CN105283263A (zh) * 2013-06-17 2016-01-27 大宇造船海洋（株） 水冷式单焊机模块及水冷式焊机
JP6217334B2 (ja) * 2013-11-13 2017-10-25 富士通株式会社 熱交換装置、電子システムおよび電子システムの冷却方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047561A (en) * 1974-10-18 1977-09-13 General Electric Company Cooling liquid de-gassing system
US4051509A (en) * 1975-12-26 1977-09-27 Bbc Brown Boveri & Company Limited Apparatus for cooling electrical devices at different electrical potentials by means of a flowing medium
EP0993243A2 (de) * 1997-04-04 2000-04-12 Unisys Corporation Methode und Vorrichtung zum wärmeleitenden Verbinden einer elektronischen Schaltung mit einem Wärmetauscher
EP1577739A2 (de) * 2004-02-16 2005-09-21 Hitachi, Ltd. Kühlungssystem für ein elektronisches Gerät und elektronisches Gerät mit demselben
US20060002086A1 (en) * 2004-06-30 2006-01-05 Teneketges Nicholas J Heat exchange apparatus with parallel flow
US20080223555A1 (en) * 2007-03-16 2008-09-18 Centipede Systems, Inc. Method and apparatus for controlling temperature
US20090014156A1 (en) * 2007-06-20 2009-01-15 Jan Vetrovec Thermal management system
US20100253079A1 (en) * 2007-11-12 2010-10-07 Repower Systems Ag Wind energy installation with a heating device
US20090236081A1 (en) * 2008-03-18 2009-09-24 Kontron Modular Computers S. A. Device for preheating a component cooled by conduction and/or by convection
EP2264559A2 (de) * 2009-06-12 2010-12-22 Tai-Her Yang Halbleiteranwendung mit Temperaturausgleichsystem
US20120227954A1 (en) * 2009-11-19 2012-09-13 Fujitsu Limited Loop heat pipe system and information processing apparatus
EP2361006A2 (de) * 2010-02-13 2011-08-24 Adensis GmbH Kühlsystem mit Lüfter für Photovoltaik-Wechselrichter

Also Published As

Publication number Publication date
CN105493271B (zh) 2018-08-07
US20160181178A1 (en) 2016-06-23
DE102013010088A1 (de) 2014-12-18
US10199307B2 (en) 2019-02-05
EP3036763A2 (de) 2016-06-29
EP3036763B1 (de) 2020-08-05
CN105493271A (zh) 2016-04-13
WO2014202218A2 (de) 2014-12-24

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