WO2015096499A1 - 一种插箱及终端 - Google Patents

一种插箱及终端 Download PDF

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Publication number
WO2015096499A1
WO2015096499A1 PCT/CN2014/084959 CN2014084959W WO2015096499A1 WO 2015096499 A1 WO2015096499 A1 WO 2015096499A1 CN 2014084959 W CN2014084959 W CN 2014084959W WO 2015096499 A1 WO2015096499 A1 WO 2015096499A1
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WO
WIPO (PCT)
Prior art keywords
sub
exhaust device
air
casing
air duct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/084959
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English (en)
French (fr)
Inventor
高益兵
么东升
赵飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZTE Corp
Original Assignee
ZTE Corp
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Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to EP14875343.7A priority Critical patent/EP3071005B1/en
Publication of WO2015096499A1 publication Critical patent/WO2015096499A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/025—Cabinets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/035—Cooling of active equipments, e.g. air ducts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Definitions

  • the present invention relates to the field of communications, and in particular, to a plug-in box and a terminal. Background technique
  • the related subrack generally includes a casing, a plurality of first main plates disposed at a front portion of the casing, and a plurality of second main plates disposed at a rear portion of the casing, and a fan is usually installed at a rear portion for facilitating heat dissipation of the casing, and The air inlet is opened in front of the box.
  • the air exhausting method easily brings the heat of the first main board located at the front part of the insertion box to the second main board of the rear part, so that the second main board of the rear part is in a high temperature environment for a long time, which is located at the rear of the insertion box.
  • the second motherboard is aging too quickly, thereby reducing device reliability.
  • the present invention provides a plug-in box and a terminal, which avoids the problem that the second main board at the rear of the box is heated by the heat of the front main board.
  • a sub-cassette including a casing, and a first main board area disposed at a front portion of the cabinet and a second main board area disposed at a rear portion of the cabinet, and further including a first air duct is disposed in the casing, a first air inlet of the first air duct is disposed on a front wall of the casing, and the first air inlet and the first main board area are a first air outlet of the first air duct is disposed on a rear wall of the casing;
  • a second air passage is disposed in the casing, the second air passage is disposed apart from the first air passage, and a second air inlet of the second air passage is disposed on a front wall of the casing And the second air inlet is located below the first main board area, and the second air outlet of the second air duct is disposed on a rear wall of the casing.
  • a first partition is disposed between the first main board area and the second air inlet for separating the first air inlet and the second air inlet.
  • the first main board area includes a plurality of first sub-boards arranged horizontally, each of the first sub-boards including a PCB board, a panel and a tray, and the panel is located on the PCB board
  • the side portion is provided with a first ventilation hole, and a second ventilation hole is disposed between the PCB board and the tray, and the first ventilation hole and the second ventilation hole are both connected to the first air inlet And the second venting hole communicates with the adjacent first sub-motherboard through an opening in the tray.
  • a backplane is disposed between the first main board area and the second main board area, and the back board is provided with an opening communicating with the first air duct, and the second air duct is disposed at Below the backing plate.
  • the second main board area includes a plurality of second sub-boards arranged longitudinally, and the second main board area and the lower wall of the casing have inclined baffles, the baffles and The plurality of second sub-boards are in communication to introduce air in the second air duct into the plurality of second sub-boards.
  • the insertion box further includes:
  • a first exhaust device configured to drive air entering the first air duct from the first air inlet, and discharged from the rear wall of the casing after flowing through the first main board area, the first row a wind device is disposed on a rear wall of the casing;
  • the second exhaust air is disposed on a rear wall of the casing, and the second exhaust device is disposed apart from the first exhaust device.
  • the first exhaust device includes a first sub exhausting device, a second sub exhausting device, and a third sub exhausting device, and the first sub exhausting device
  • the device and the third sub-exhaust device are respectively disposed above and below the second main board area, and the first sub exhausting device, the second sub exhausting device, and the third sub exhausting device are connected as The whole body has a C-shaped structure.
  • the second exhaust device is disposed between the second main board area and the first sub exhausting device, and the first sub exhausting device is disposed between the first sub exhausting device and the second exhausting device There is a second partition.
  • the utility model also provides a terminal, comprising the above-mentioned plug box.
  • FIG. 1 is a schematic view showing the structure of a plug-in box according to an embodiment of the present invention
  • Figure 2 is a front elevational view of the insertion box of the embodiment of the present invention
  • Figure 3 is a rear view showing the insertion box of the embodiment of the present invention.
  • FIG. 4 is a schematic view showing the air flow direction of the first air passage and the second air passage of the insertion box according to the embodiment of the present invention
  • FIG. 5 is a schematic structural view of the first sub-board according to the embodiment of the present invention.
  • the embodiment provides a plug-in box, including a casing 10, and a first main board area 20 disposed at the front of the casing 10 and a second main board area disposed at the rear of the casing 10. 30.
  • the first air duct is disposed in the casing 10.
  • the first air inlet 20b of the first air duct is disposed on the front wall 11 of the casing 10, and the first The tuyere 20b is disposed opposite to the first main board area 20, and the first air outlet of the first air duct is disposed on the rear wall 12 of the casing 10;
  • a second air passage is disposed in the casing 10, the second air passage is disposed opposite to the first air passage, and the second air inlet 30b of the second air passage is disposed in the casing 10
  • the front wall 11 and the second air inlet 30b are located below the first main board area 20, and the second air outlet of the second air duct is disposed at the rear wall 12 of the casing 10.
  • the first air passage disposed to cool the first main board area and the second air duct disposed to cool the second main board area are disposed apart from each other to realize independent heat dissipation of the first main board area and the second main board area, thereby avoiding mutual interference and accumulation of heat; Both the first air duct and the second air duct are in the form of forward and backward, which can avoid hot air return.
  • a first partition (not shown) is disposed between the first main board area 20 and the second air inlet for isolating the first air inlet and the second air inlet.
  • the first main board area 20 includes a plurality of first sub-boards arranged horizontally, and is located adjacent to the lower wall of the casing 10 of the first main board area 20.
  • the first sub-board itself can function to isolate the first air inlet and the second air inlet, but to prevent the first air inlet and the air vent on the first sub-board from affecting the first air inlet and the Second entry
  • the tuyere is isolated and sealed.
  • the first air partition and the second air inlet are separated by the first partition to avoid heat accumulation of the first main board area 20 and the second main board area 30.
  • each of the first sub-boards includes a PCB board, a panel, and a tray, and a portion of the panel on a side of the PCB board is provided with a first ventilation hole 31, and the PCB board and the tray a second venting hole 32 is provided between the first venting opening 31 and the second venting opening 32, and the second venting opening 32 is communicated with the first venting opening 20b.
  • the opening is in communication with the adjacent first sub-board.
  • the air entering from the first venting opening 31 is used to cool the corresponding first sub-board, and the air entering from the second venting opening 32 cools the lower, adjacent first sub-board through the opening in the tray.
  • the tray is provided with an opening and a windshield such that air entering from the vent 32 can enter the lower, adjacent first sub-board.
  • the additional venting holes (second venting holes 32) of the first sub-board can effectively increase the air inlet area and improve the heat dissipation capability of the system.
  • a backplane 80 is disposed between the first main board area 20 and the second main board area 30, and the back board 80 is provided with an opening communicating with the first air duct, and the The second air passage is disposed below the backing plate 80.
  • the second main board area 30 includes a plurality of second sub-boards arranged in a longitudinal direction, and the second main board area 30 and the lower wall of the casing 10 have a deflector 17 disposed obliquely.
  • the baffle 17 is in communication with the plurality of second sub-boards to introduce air in the second air duct into the plurality of second sub-boards.
  • a gap is formed between the plurality of first sub-boards 20, the gap forms a part of the first air passage, and the first partition forms a part of the second air passage with the lower wall of the casing 10 and the deflector 17 .
  • the first air duct and the second air duct are isolated from each other and do not interfere with each other, thereby avoiding accumulation of heat in the first main board area 20 and the second main board area 30.
  • the insertion box further includes:
  • a first exhaust device for driving air entering the first air duct from the first air inlet 20b, flowing out of the rear wall 12 of the casing 10 after flowing through the first main board region 20,
  • the first exhaust device is disposed on the rear wall 12 of the casing 10;
  • the first exhaust device includes a first sub exhaust device 40, a second sub exhaust device 50, and a third sub exhaust device 60, which are disposed around the second main board region 30, and the first sub exhaust
  • the wind device 40 and the third sub-venting device 60 are respectively disposed above and below the second main board area 30, the first sub exhausting device 40, the second sub exhausting device 50, and the third
  • the sub-exhaust device 60 is connected in a single C-shaped structure as shown in FIG.
  • the first sub-exhaust device 40, the second sub-exhaust device 50, and the third sub-exhaust device 60, which are arranged in a C-shape, are more capable of dissipating heat and are more easily realized in structure.
  • the first exhaust device and the second exhaust device are respectively disposed at a first air outlet of the first air duct and a second air outlet of the second air duct.
  • the second exhaust device 70 is disposed between the second main board region 30 and the first sub exhaust device 40, and the first sub exhaust device 40 and the second exhaust device 70 A second partition 18 is provided between them.
  • the first air inlet 20b faces the plurality of first main board areas 20, and the cold air enters from the first air inlet 20b, passes through the first ventilation holes 31 and the second ventilation holes 32 of the plurality of first sub-boards, and cools The first sub-board in the main board area 20, the cold air flowing through the first main board area 20 passes through the opening on the back board 80, and then the first sub-exhaust device 40, the second sub-exhaust device 50 and the first The three sub exhaust unit 60 discharges hot air.
  • the second air inlet 30b is disposed under the first main board area 20, the cold air enters from the second air inlet 30b, is guided by the deflector 17, and after cooling the plurality of second sub-boards, the second exhaust device 70
  • the hot air is discharged, and the air flow in the first air passage and the second air passage is shown in Fig. 4.
  • the black arrow indicates the air flow direction in the first air passage, and the white arrow indicates the air flow direction in the second air passage.
  • the insertion box provided by the invention passes through the special first exhaust device and the second exhaust device, and the first air passage and the second air passage structure, shortens the ventilation path, improves heat dissipation efficiency, and realizes the first main board area and the second main board.
  • the area is independently dissipated to prevent heat from interfering with each other and accumulating.
  • the embodiment of the invention further provides a terminal, including the above-mentioned plug-in box.
  • a terminal including the above-mentioned plug-in box.
  • the independent heat dissipation of the first main board area and the second main board area of the plug box is realized, the heat mutual interference and accumulation are avoided, the aging speed of the second main board at the rear part of the insert box is reduced, and the device reliability is provided.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种插箱及终端，其中一种插箱，包括机壳（10），以及设置在机壳（10）前部的第一主板区（20）和设置在机壳（10）后部的第二主板区（30），还包括：第一风道，设置于所述机壳（10）内，所述第一风道的第一进风口（20b）设置于所述机壳（10）的前壁上，且所述第一进风口（20b）与所述第一主板区（20）相对设置，所述第一风道的第一出风口设置于所述机壳（10）的后壁；第二风道，设置于所述机壳（10）内，所述第二风道与所述第一风道相隔离设置，所述第二风道的第二进风口（30b）设置于所述机壳（10）的前壁，且所述第二进风口（30b）位于所述第一主板区（20）的下方，所述第二风道的第二出风口设置于所述机壳（10）的后壁。上述技术方案实现了第一主板区（20）和第二主板区（30）的独立散热，避免热量相互干扰和累积。

Description

一种插箱及终端
技术领域
本发明涉及通信领域， 尤其涉及一种插箱及终端。 背景技术
相关的插箱一般包括机壳， 设置在机壳前部的多个第一主板和设置在机 壳后部的多个第二主板， 为了便于插箱散热通常会在后部安装风扇， 并在插 箱前面开设进风口。 然而， 这种排风方式易将位于插箱前部的第一主板的热 量带到后部的第二主板上， 从而使得后部的第二主板长期处于高温环境中， 造成位于插箱后部的第二主板过快老化， 从而降低设备可靠性。
发明内容
为了解决上述技术问题， 本发明提供一种插箱及终端， 避免插箱后部的 第二主板被前部的第一主板的热量所加热的问题。
为了达到上述目的， 本发明釆用的技术方案是： 一种插箱， 包括机壳， 以及设置在机壳前部的第一主板区和设置在机壳后部的第二主板区，还包括： 第一风道， 设置于所述机壳内， 所述第一风道的第一进风口设置于所述 机壳的前壁上， 且所述第一进风口与所述第一主板区相对设置， 所述第一风 道的第一出风口设置于所述机壳的后壁；
第二风道， 设置于所述机壳内， 所述第二风道与所述第一风道相隔离设 置， 所述第二风道的第二进风口设置于所述机壳的前壁， 且所述第二进风口 位于所述第一主板区的下方， 所述第二风道的第二出风口设置于所述机壳的 后壁。
进一步的， 所述第一主板区和第二进风口之间设置有第一隔板， 用于隔 离所述第一进风口和所述第二进风口。
进一步的， 所述第一主板区包括水平排列设置的多个第一子主板， 每一 个所述第一子主板包括 PCB板、 面板和托盘， 所述面板位于所述 PCB板上 侧的部分设有第一通风孔， 所述 PCB板和所述托盘之间设有第二通风孔， 所 述第一通风孔和所述第二通风孔均与所述第一进风口相连通， 且所述第二通 风孔通过所述托盘上的开孔与相邻的所述第一子主板相连通。
进一步的， 所述第一主板区和所述第二主板区之间设有背板， 所述背板 上设有与所述第一风道相通的开口，且所述第二风道设置于所述背板的下方。
进一步的， 所述第二主板区包括纵向排列的多个第二子主板， 所述第二 主板区与所述机壳的下壁之间具有倾斜设置的导流板， 所述导流板与所述多 个第二子主板相连通以将所述第二风道内的空气导入所述多个第二子主板 内。
进一步的， 所述插箱还包括：
设置为驱动从所述第一进风口进入所述第一风道的空气、 流经所述第一 主板区后从所述机壳的后壁排出的第一排风装置， 所述第一排风装置设置于 所述机壳的后壁；
设置为驱动从所述第二进风口进入所述第二风道的空气、 流经所述第二 主板区从所述机壳的后壁排出的第二排风装置， 所述第二排风装置设置于所 述机壳的后壁， 且所述第二排风装置与所述第一排风装置相隔离设置。
进一步的， 所述第一排风装置包括围设在所述第二主板区周围的第一子 排风装置、 第二子排风装置和第三子排风装置， 所述第一子排风装置和所述 第三子排风装置分别设置在所述第二主板区的上方和下方， 所述第一子排风 装置、 第二子排风装置和所述第三子排风装置连通为一体呈 C型结构。
进一步的， 所述第二排风装置设置在所述第二主板区与所述第一子排风 装置之间， 且所述第一子排风装置与所述第二排风装置之间设有第二隔板。
本实用新型还提供一种终端， 包括上述的插箱。
上述技术方案有益效果是： 实现第一主板区和第二主板区的独立散热， 避免热量相互干扰和累积。 附图概述
图 1表示本发明实施例插箱结构示意图； 图 2表示本发明实施例插箱前视图；
图 3表示本发明实施例插箱后视图；
图 4表示本发明实施例插箱第一风道和第二风道的空气流向示意图； 图 5表示本发明实施例第一子主板结构示意图。 本发明的较佳实施方式
以下结合附图对本发明实施例的结构和原理进行详细说明， 所举实施例 仅用于解释本发明， 并非以此限定本发明的保护范围。
如图 1-图 5所示， 本实施例提供一种插箱， 包括机壳 10, 以及设置在机 壳 10前部的第一主板区 20和设置在机壳 10后部的第二主板区 30, 还包括： 第一风道，设置于所述机壳 10内， 所述第一风道的第一进风口 20b设置 于所述机壳 10的前壁 11上，且所述第一进风口 20b与所述第一主板区 20相 对设置， 所述第一风道的第一出风口设置于所述机壳 10的后壁 12;
第二风道，设置于所述机壳 10内， 所述第二风道与所述第一风道相隔离 设置， 所述第二风道的第二进风口 30b设置于所述机壳 10的前壁 11 , 且所 述第二进风口 30b位于所述第一主板区 20的下方，所述第二风道的第二出风 口设置于所述机壳 10的后壁 12。
设置为冷却第一主板区的第一风道和设置为冷却第二主板区的第二风道 相互隔离设置， 实现第一主板区和第二主板区的独立散热， 避免热量相互干 扰和累积； 第一风道和第二风道都釆用前入后出的形式， 能避免热空气回流。
需要说明的是， 本实施例中涉及的 "上" 、 "下" "左" 、 "右" "前" 、 "后" 等位置关系的词的描述均参照图中所示。
本实施例中， 所述第一主板区 20和第二进风口之间设置有第一隔板（图 中未示） ， 用于隔离所述第一进风口和所述第二进风口。
如图 1和图 2所示， 本实施例中， 所述第一主板区 20包括水平排列设置 的多个第一子主板， 位于所述第一主板区 20的靠近所述机壳 10下壁的第一 子主板本身可以起到隔离所述第一进风口和所述第二进风口的作用， 但是为 了防止第一子主板上通风孔或安装缝隙等影响所述第一进风口和所述第二进 风口隔离密封性， 本实施例中， 釆用所述第一隔板隔离所述第一进风口和所 述第二进风口以避免第一主板区 20和第二主板区 30热量的累积。
本实施例中， 每一个所述第一子主板包括 PCB板、 面板和托盘， 所述面 板位于所述 PCB板上侧的部分设有第一通风孔 31 , 所述 PCB板和所述托盘 之间设有第二通风孔 32, 所述第一通风孔 31和所述第二通风孔 32均与所述 第一进风口 20b相连通，且所述第二通风孔 32通过所述托盘上的开孔与相邻 的所述第一子主板相连通。
从第一通风孔 31进入的空气用于冷却相应的第一子主板，从第二通风孔 32进入的空气， 通过托盘上的开孔冷却下方的、 相邻的第一子主板。 所述托 盘上设有开孔和挡风条， 使得从通风孔 32进入的空气能进入下方的、相邻的 第一子主板。
第一子主板的附加通风孔（第二通风孔 32 ) 能有效增加进风面积， 提高 了系统散热能力。
本实施例中 ,所述第一主板区 20和所述第二主板区 30之间设有背板 80, 所述背板 80上设有与所述第一风道相通的开口，且所述第二风道设置于所述 背板 80的下方。
本实施例中， 所述第二主板区 30包括纵向排列的多个第二子主板， 所述 第二主板区 30与所述机壳 10的下壁之间具有倾斜设置的导流板 17 , 所述导 流板 17 与所述多个第二子主板相连通以将所述第二风道内的空气导入所述 多个第二子主板内。
所述多个第一子主板 20之间具有间隙， 该间隙形成第一风道的一部分， 所述第一隔板与所述机壳 10下壁及导流板 17形成第二风道的一部分。 所述 第一风道和第二风道相互隔离， 互不干涉， 避免第一主板区 20和第二主板区 30热量的累积。
本实施例中， 所述插箱还包括：
用于驱动从所述第一进风口 20b进入所述第一风道的空气、 流经所述第 一主板区 20后从所述机壳 10的后壁 12排出的第一排风装置，所述第一排风 装置设置于所述机壳 10的后壁 12;
用于驱动从所述第二进风口 30b进入所述第二风道的空气、 流经所述第 二主板区 30从所述机壳 10的后壁 12排出的第二排风装置 70,所述第二排风 装置 70设置于所述机壳 10的后壁 12,且所述第二排风装置 70与所述第一排 风装置相隔离设置。
所述第一排风装置包括围设在所述第二主板区 30 周围的第一子排风装 置 40、 第二子排风装置 50和第三子排风装置 60， 所述第一子排风装置 40和 所述第三子排风装置 60分别设置在所述第二主板区 30的上方和下方， 所述 第一子排风装置 40、 第二子排风装置 50和所述第三子排风装置 60连通为一 体呈 C型结构， 如图 3所示。
集中呈 C型排列的所述第一子排风装置 40、 第二子排风装置 50和所述 第三子排风装置 60, 散热能力更强， 结构上更易实现。
所述第一排风装置和所述第二排风装置分别设置在所述第一风道的第一 出风口和第二风道的第二出风口。
所述第二排风装置 70设置在所述第二主板区 30与所述第一子排风装置 40之间， 且所述第一子排风装置 40与所述第二排风装置 70之间设有第二隔 板 18。
所述第一进风口 20b正对多个第一主板区 20, 冷空气从第一进风口 20b 进入， 经过多个第一子主板上的第一通风孔 31和第二通风孔 32, 冷却第一 主板区 20内的第一子主板， 流经所述第一主板区 20后的冷空气通过背板 80 上的开口后由第一子排风装置 40、 第二子排风装置 50和第三子排风装置 60 将热空气排出。
所述第二进风口 30b设置于第一主板区 20下方， 冷空气从第二进风口 30b进入， 通过导流板 17导流， 冷却多个第二子主板后， 由第二排风装置 70 将热空气排出， 第一风道和第二风道内的空气流向由图 4所示， 黑色箭头表 示第一风道内空气流向， 白色箭头表示第二风道内空气流向。
本发明提供的插箱通过特有的第一排风装置和第二排风装置、 以及第一 风道和第二风道结构形式， 缩短通风路径提高散热效率， 实现第一主板区和 第二主板区独立散热， 避免热量相互干扰和累积。
本发明实施例还提供一种终端， 包括上述的插箱。 以上所述为本发明较佳实施例， 应当指出， 对于本领域普通技术人员来 说， 在不脱离本发明所述原理的前提下， 还可以作出若干改进和润饰， 这些 改进和润饰也应视为本发明保护范围。
工业实用性
实现了插箱第一主板区和第二主板区的独立散热， 避免热量相互干扰和 累积， 减小了插箱后部第二主板的老化速度， 提供了设备可靠性。

Claims

权 利 要 求 书
1、 一种插箱， 包括机壳， 以及设置在机壳前部的第一主板区、 设置在机 壳后部的第二主板区、 第一风道和第二风道， 其中
第一风道， 设置于所述机壳内， 所述第一风道的第一进风口设置于所述 机壳的前壁上， 且所述第一进风口与所述第一主板区相对设置， 所述第一风 道的第一出风口设置于所述机壳的后壁；
第二风道， 设置于所述机壳内， 所述第二风道与所述第一风道相隔离设 置， 所述第二风道的第二进风口设置于所述机壳的前壁， 且所述第二进风口 位于所述第一主板区的下方， 所述第二风道的第二出风口设置于所述机壳的 后壁。
2、 根据权利要求 1所述的插箱， 其中， 所述第一主板区和第二进风口之 间设置有第一隔板， 用于隔离所述第一进风口和所述第二进风口。
3、 根据权利要求 2所述的插箱， 其中， 所述第一主板区包括水平排列设 置的多个第一子主板， 每一个所述第一子主板包括 PCB板、 面板和托盘， 所 述面板位于所述 PCB板上侧的部分设有第一通风孔， 所述 PCB板和所述托 盘之间设有第二通风孔， 所述第一通风孔和所述第二通风孔均与所述第一进 风口相连通， 且所述第二通风孔通过所述托盘上的开孔与相邻的所述第一子 主板相连通。
4、 根据权利要求 2所述的插箱， 其中， 所述第一主板区和所述第二主板 区之间设有背板， 所述背板上设有与所述第一风道相通的开口， 且所述第二 风道设置于所述背板的下方。
5、 根据权利要求 4所述的插箱， 其中， 所述第二主板区包括纵向排列的 多个第二子主板， 所述第二主板区与所述机壳的下壁之间具有倾斜设置的导 流板， 所述导流板与所述多个第二子主板相连通以将所述第二风道内的空气 导入所述多个第二子主板内。
6、 根据权利要求 5所述的插箱， 所述插箱还包括：
设置为驱动从所述第一进风口进入所述第一风道的空气、 流经所述第一 主板区后从所述机壳的后壁排出的第一排风装置， 所述第一排风装置设置于 所述机壳的后壁；
设置为驱动从所述第二进风口进入所述第二风道的空气、 流经所述第二 主板区从所述机壳的后壁排出的第二排风装置， 所述第二排风装置设置于所 述机壳的后壁， 且所述第二排风装置与所述第一排风装置相隔离设置。
7、 根据权利要求 6所述的插箱， 其中， 所述第一排风装置包括围设在所 述第二主板区周围的第一子排风装置、 第二子排风装置和第三子排风装置， 所述第一子排风装置和所述第三子排风装置分别设置在所述第二主板区的上 方和下方， 所述第一子排风装置、 第二子排风装置和所述第三子排风装置连 通为一体呈 C型结构。
8、 根据权利要求 6所述的插箱， 其中， 所述第二排风装置设置在所述第 二主板区与所述第一子排风装置之间， 且所述第一子排风装置与所述第二排 风装置之间设有第二隔板。
9、 一种终端， 包括权利要求 1-8任一项所述的插箱。
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