WO2015109674A1 - Led照明装置 - Google Patents

Led照明装置 Download PDF

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Publication number
WO2015109674A1
WO2015109674A1 PCT/CN2014/076050 CN2014076050W WO2015109674A1 WO 2015109674 A1 WO2015109674 A1 WO 2015109674A1 CN 2014076050 W CN2014076050 W CN 2014076050W WO 2015109674 A1 WO2015109674 A1 WO 2015109674A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
led lighting
light
led
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/076050
Other languages
English (en)
French (fr)
Inventor
陈必寿
许礼
王鹏
李晟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO LTD
Shanghai Sansi Electronic Engineering Co Ltd
Jiashan Sansi Photoelectric Technology Co Ltd
Original Assignee
SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO LTD
Shanghai Sansi Electronic Engineering Co Ltd
Jiashan Sansi Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO LTD, Shanghai Sansi Electronic Engineering Co Ltd, Jiashan Sansi Photoelectric Technology Co Ltd filed Critical SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO LTD
Priority to CA2938027A priority Critical patent/CA2938027A1/en
Priority to US15/114,829 priority patent/US20160356481A1/en
Priority to EP14880324.0A priority patent/EP3101337A4/en
Priority to JP2016548057A priority patent/JP6495307B2/ja
Priority to KR1020167023573A priority patent/KR20160132824A/ko
Publication of WO2015109674A1 publication Critical patent/WO2015109674A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10113—Lamp

Definitions

  • the present invention relates to LEDs and, in particular, to LED lighting devices.
  • a conventional LED lighting unit generally includes: a package portion, a light emitting chip, a light source bracket (also referred to as a substrate), a circuit board, and a heat sink; and wherein the combination of the package portion, the light emitting chip, and the light source bracket is called For LED devices.
  • the LED device itself does not have the corresponding electrical and heat dissipation capability, it cannot be used independently, so it needs to be coupled to the circuit board for electrical connection, and then the circuit board is bonded to the heat sink with thermal grease or the like. Achieve heat dissipation. It can be seen that in the conventional LED lighting unit, the heat generated by the light-emitting chip needs to pass through the "chip-one light source bracket, the electrical layer of the circuit board surface, the circuit board, the thermal grease, the heat sink". The path can eventually be dissipated, which creates a huge thermal resistance.
  • Conventional process packaging materials generally use resin materials, which have poor thermal conductivity, so that the heat generated by the chip cannot be exported through the package components, and can only rely on the heat conduction in one direction of the heat sink.
  • the chip in the manufacture of the bulb, usually the chip has a separate package, and then the hollow cover is covered to form the shape of the bulb, so that the heat generated by the chip needs to be transmitted to the air through the independent package. It is passed to the outer cover and then to the surrounding air, so that heat is almost impossible to export.
  • an object of the present invention is to provide a new LED lighting device which has a better heat dissipation function, so that a larger power can be realized in a smaller volume, so that it can be Higher illumination levels are required to increase the size of the device.
  • An LED lighting device includes: a base, an LED lighting unit, and a lamp cover;
  • the LED lighting unit is disposed on the upper surface of the base, the lamp cover is in direct contact with the base, and the LED lighting unit is covered;
  • the LED lighting unit comprises a plurality of LED lighting chips;
  • the lamp cover includes an outer surface and an inner surface, the outer surface is a light exit surface, and the inner surface includes a light distribution surface and a heat conduction surface, wherein the light distribution surface is disposed on an inner surface region of the inner surface corresponding to the LED light emitting chip A gap is formed between the non-glossy surface and the LED light-emitting chip, and a light distribution cavity is formed together with the upper surface of the base.
  • the heat-dissipating surface is disposed on a part or all of the inner surface and the LED light-emitting chip mounted on the base.
  • the inner surface area corresponding to the surface is closely adhered to the base, and the heat conducting surface is distributed at least in the central area and the edge area of the inner surface.
  • the inner surface of the lamp cover is composed only of a light distribution surface and a heat conduction surface.
  • the lamp cover is made of light transmissive ceramic or glass.
  • the light transmissive ceramic comprises at least one material selected from the group consisting of one or a combination of PLZT, CaF2, Y203, YAG, polycrystalline AION, and MgA1204.
  • the inventors of the present invention made a lampshade by using PC, glass and light-transmissive ceramics through repeated experiments.
  • the experimental results show that the junction temperature of PC is the highest, and the temperature rise of the junction temperature of the glass lens is significantly lower than that of PC.
  • the temperature rise of the junction temperature of the lens is lower than that of glass. Therefore, the present invention uses glass and ceramics which have better thermal conductivity and lower temperature and temperature rise in use.
  • the LED lighting unit further comprises a circuit board, the LED lighting chip is disposed on the circuit board, and the circuit board is disposed on the base.
  • the LED lighting unit further comprises a circuit coating layer, the circuit coating layer is directly coated on the upper surface of the base, and the LED light emitting chip is directly disposed on the upper surface of the base and connected to each other through the circuit coating.
  • the circuit coating is a liquid or powder coating comprising a metal material, and the circuit coating circuit layer has a thickness of 20 ⁇ m or more.
  • the metal material of the circuit coating layer is selected from at least one of a combination of molybdenum, manganese, tungsten, silver, gold, platinum, silver-palladium alloy, copper, aluminum, tin, and the like. .
  • the upper surface of the pedestal is a planar, curved, or multi-planar combined shape.
  • the outer surface of the lamp cover is formed into a specific curved shape according to the light distribution requirement, and the inner surface in contact with the base is a curved surface shape corresponding to the shape of the upper surface of the base.
  • the base is provided with a first heat dissipation through hole.
  • the lamp cover is provided with a second heat dissipation through hole, wherein the second heat dissipation through hole is correspondingly connected to the first heat dissipation through hole.
  • the susceptor is a metal pedestal coated with an insulating layer or a pedestal made of an insulating material.
  • the pedestal is a hollow structure, and the first heat dissipation through hole on the pedestal communicates with the outside air through the side of the pedestal.
  • the base is a non-hollow structure, and the outer side of the base is provided with heat dissipation fins.
  • the power supply cavity is further included, wherein the power supply cavity is not in communication with the base, that is, the cavity of the power supply cavity is isolated from the base.
  • the outer casing of the power supply cavity and the base are connected by means of card insertion, snapping, screwing, etc., and can realize independent heat dissipation separately. Reduce the impact of the heat generated by the chip on the power supply and enhance the overall heat dissipation capability of the entire LED lighting unit.
  • the present invention has the following beneficial effects:
  • the heat generated by the chip can be radiated through the susceptor, and can also be led out through the heat conduction surface of the inner surface of the lamp cover which is directly attached to the pedestal. Since the heat conducting surface of the lamp cover is distributed in the central area and the edge area of the inner surface, the contact area of the lamp cover and the base is increased as compared with the prior art which only contacts the edge, thereby increasing the heat dissipation function of the lamp cover.
  • the inventors of the present invention calculated by computer thermal simulation software. Compared with the existing materials of the same material, the same volume, and the same power with only edge contact, the temperature rise of the junction temperature is significantly reduced, and can be reduced by at least 30 ⁇ .
  • some preferred structures of the present invention can further enhance the heat dissipation function.
  • the entire device can be radiated in all directions, the heat dissipation performance of the device is greatly improved, and the service life of the device is improved.
  • the independently set power supply cavity can dissipate the heat generated by the chip and the heat generated by the power supply through different structures, thereby reducing the influence of heat generated by the chip on the power supply, thereby reducing the influence of excessive heat on the power supply.
  • a higher power lighting device can be manufactured without increasing the volume of the device, thereby improving the illumination brightness of the device, and increasing the range and flexibility of the LED lighting device in living and industrial use.
  • FIG. 1 is a schematic view showing the overall structure of an LED lighting device in a first embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional structural view of the LED lighting device of FIG. 1;
  • FIG. 3 is a schematic view showing the overall structure of an LED lighting device in a second embodiment of the present invention
  • 4 is a schematic cross-sectional structural view of the LED lighting device of FIG. 3;
  • Figure 5 is a schematic view showing the overall structure of an LED lighting device in a third embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional structural view of the LED lighting device of FIG. 5;
  • Figure 7 is a schematic view showing the assembly of an LED lighting device in a fourth embodiment of the present invention.
  • FIG. 8 is a schematic structural view of a light emitting unit of an LED lighting device according to a fourth embodiment of the present invention
  • FIG. 9 is a schematic view showing an overall structure of an LED lighting device according to a fourth embodiment of the present invention.
  • Figure 10 is a schematic view showing the overall structure of an LED lighting device in a fifth embodiment of the present invention.
  • Figure 11 is a cross-sectional structural view of the LED lighting device of Figure 10.
  • Figure 12 is a schematic view showing the overall structure of an LED lighting device in a sixth embodiment of the present invention.
  • Figure 13 is a cross-sectional structural view of the LED lighting device of Figure 12;
  • Figure 14 is a detailed distribution diagram of the light distribution surface 31 and the heat transfer surface 32 of the lampshade 3 shown in Figure 2;
  • Figure 15 is a detailed distribution diagram of the light distribution surface 31 and the heat transfer surface 32 of the lampshade 3 shown in Figure 4;
  • 6 is a schematic diagram showing the detailed distribution of the light distribution surface 31 and the heat transfer surface 32 of the globe 3.
  • the LED lighting device comprises: a base 1, an LED lighting unit, a lamp cover 3, and a power supply chamber 5.
  • the lampshade 3 is made of a solid heat conductive material and has good heat conduction.
  • the LED lighting unit is fixed on the base 1 , and the lamp cover 3 is disposed on the base 1 to cover the LED lighting unit.
  • the lamp cover 3 is apart from the inner surface area (ie, the light distribution surface 31 ) corresponding to the LED light emitting chip 2 .
  • the inner surface is in contact with the susceptor 1 as the heat conducting surface 32 to realize the heat dissipation function, and the inner surface of the corresponding area of the lamp cover 3 and the LED light emitting chip 2 is formed into a specific spatial structure shape according to design to change the light intensity distribution; wherein, the heat conducting surface As a part of the inner surface of the lampshade 3, it can participate in the light distribution by utilizing the reflection and/or refraction characteristics of the light. Therefore, the technical solution of participating in the light distribution by the heat-conducting surface 32 is also a non-limiting embodiment protected by the present invention. .
  • the upper surface of the susceptor 1 is a flat, curved, or multi-planar combined shape.
  • the pedestal 1 can adopt a hollow structure to increase air circulation to enhance heat dissipation.
  • a first heat dissipation through hole 81 is disposed in the middle of the susceptor 1 to increase air circulation to enhance heat dissipation.
  • the lamp cover 3 is disposed at a position corresponding to the susceptor 1 to provide a second heat dissipation.
  • Through hole 82 The number of LED light-emitting chips is plural.
  • the lampshade 3 has a light distribution function selected from ceramics, glass or other highly thermally conductive materials having light transmitting properties.
  • the outer surface of the lamp cover 3 is designed to have a specific shape according to actual needs.
  • the susceptor 1 is disposed separately from the power supply chamber 5 to achieve independent heat dissipation.
  • the susceptor 1 may be a metal pedestal coated insulating layer, a ceramic pedestal or the like.
  • the LED lighting device is an LED bulb.
  • the LED bulb mainly comprises a base 1, 16 LED light emitting chips 2, a circuit board 4, a lamp cover 3 and a power supply cavity 5.
  • the susceptor 1 is an aluminum base coated with an insulating layer having a flat upper surface, and a circuit board 4 is disposed on the aluminum base, and 16 LED light-emitting chips 2 are disposed on the circuit board 4.
  • the lamp cover 3 is a solid light transmissive glass. The lamp cover 3 is in direct contact with the susceptor 1 and covers the susceptor 1 to enclose the LED illuminating unit.
  • the light distribution surface 31 is disposed on the inner surface corresponding to the LED illuminating chip 2, and is not associated with the LED illuminating chip 2.
  • the light-shaping cavity is formed together with the upper surface of the base, and the heat-transfer surface 32 is distributed in the central area and the edge area of the inner surface, and is completely adhered to the upper surface of the base 1 to realize light transmission and heat dissipation.
  • the base 1 is a non-hollow structure, and the outer surface of the base 1 is provided with heat-dissipating fins 9, which can increase the heat dissipation area.
  • the power supply chamber 5 is integrated with the base, and the cavity and the base 1 are not connected, so that independent heat dissipation can be achieved.
  • the LED lighting device can be an LED bulb.
  • the LED bulb mainly comprises a base 1, 12 LED light-emitting chips 2, a circuit coating, a lamp cover 3 and a power supply cavity 5.
  • the base 1 is a ceramic base 1 having a curved upper surface. As shown in FIG. 3 and FIG. 4, the LED light-emitting chip is disposed on a curved surface of the upper surface of the base 1 on the base 1. The surface is directly coated with a circuit coating to connect all the chips and the power supply for electrical connection.
  • the circuit coating material is a conductive silver paste.
  • the lampshade 3 is a solid light transmissive ceramic made of PLZT.
  • the lampshade 3 is in direct contact with and bonded to the susceptor 1 and covers the susceptor 1 to encapsulate the LED illuminating chip 2 and the circuit coating.
  • the light distribution surface 31 is disposed on the inner surface corresponding to the LED light emitting chip 2,
  • the LED light-emitting chip 2 is bonded to the LED light-emitting chip 2 to form a light distribution cavity, and the heat-transfer surface 32 is distributed in the central region and the edge region of the inner surface to completely conform to the upper surface of the base 1 to achieve light transmission and heat dissipation.
  • the power supply chamber 5 is of a separate structure and is not in communication with the base 1.
  • the base 1 and the housing of the power supply chamber 5 are connected by sockets, so that independent heat dissipation can be achieved.
  • the LED lighting device can be a unitized LED lighting device.
  • Each LED lighting device acts as an LED lighting unit in the entire lighting system, wherein each LED lighting unit is mainly composed of a base 1, four LED light emitting chips 2, and a lamp cover 3.
  • the susceptor 1 is an aluminum base and is coated with an insulating material, and the circuit board 4 is mounted on the susceptor 1, and the LED illuminating chip 2 is disposed on the circuit board 4.
  • the lampshade 3 is a solid light transmissive ceramic made of polycrystalline AINO.
  • the lamp cover 3 is in direct contact with the susceptor 1 and covers the susceptor 1 , and the LED illuminating chip 2 and the circuit board 4 are enclosed.
  • the light distribution surface 31 is disposed on the inner surface corresponding to the LED light emitting chip 2,
  • the LED light-emitting chip 2 is bonded to the LED light-emitting chip 2 to form a light distribution cavity, and the heat-transfer surface 32 is distributed in the central region and the edge region of the inner surface to completely conform to the upper surface of the base 1 to achieve light transmission and heat dissipation.
  • the base 1 is a non-hollow structure, and the outer side of the base 1 is provided with heat-dissipating fins 9, which can increase the heat dissipation area. Multiple LED lighting units can be combined to form a lighting system.
  • the LED lighting device may be a modular LED lighting device, mainly composed of a combination of the light emitting mold strip 6 and the frame 7.
  • the modular LED lighting device comprises a base 1, 24 LED light-emitting chips 2, and 8 light covers 3.
  • the susceptor 1 is an aluminum base and is coated with an insulating material, and the insulating material is coated with a circuit coating.
  • the 24 LED light-emitting chips 2 are respectively divided into three groups and respectively disposed on the susceptor 1 coated with the insulating material, and passed through the circuit.
  • the coatings are connected to each other.
  • the circuit coating is a conductive copper paste.
  • the eight lampshades 3 are a solid light transmissive ceramic made of YAG. The outer surface is hemispherical, and is respectively covered on the pedestal 1.
  • Each of the hoods 3 respectively encloses three corresponding LED illuminating chips 2, and the illuminating surface 31 is disposed on an inner surface corresponding to the LED illuminating chip 2, It does not fit with the LED light-emitting chip 2, and forms a light distribution cavity together with the upper surface of the base.
  • the heat-transfer surface 32 is distributed in the central area and the edge area of the inner surface, and completely conforms to the upper surface of the base 1 to realize light transmission and heat dissipation. .
  • the base 1 is a non-hollow structure, and the outer side of the base 1 is provided with heat-dissipating fins 9, which can increase the heat dissipation area.
  • Nine light-emitting strips 6 are connected to the frame 7 to form a complete modular LED lighting system, as shown in Figure 10.
  • the LED lighting device can be an LED bulb.
  • the LED bulb mainly comprises a base 1, 12 LED light emitting chips and a high heat conducting lamp cover 3.
  • the base 1 is a ceramic base 1 whose upper surface is a curved surface. As shown in FIG. 9 and FIG. 10, the base 1 is coated with a circuit coating, and the circuit coating is a conductive silver-palladium alloy. Slurry.
  • a first heat dissipation through hole 81 is defined in the middle of the susceptor 1.
  • the LED light emitting chip 2 is disposed on the upper surface of the susceptor 1 except for the heat dissipation through hole, and is connected to each other by a circuit coating.
  • the lampshade 3 is a solid light transmissive ceramic made of MgAl 2 0 4 .
  • a second heat dissipation through hole 82 of the same size is opened at an intermediate position corresponding to the first heat dissipation through hole 81 of the susceptor 1 to achieve air circulation.
  • the inner surface of the globe 3 in contact with the susceptor 1 is a curved surface corresponding to the shape of the susceptor 1.
  • the lampshade 3 is in direct contact with the susceptor 1 and covers the susceptor 1 to encapsulate the LED illuminating unit 2 and the circuit coating.
  • the light distribution surface 31 is disposed on the inner surface corresponding to the LED light emitting chip 2, and is not associated with the LED.
  • the light-emitting chip 2 is bonded to form a light distribution cavity together with the upper surface of the base.
  • the heat transfer surface 32 is distributed on the central area and the edge area of the inner surface, and is completely adhered to the upper surface of the base 1 to realize light transmission and heat dissipation.
  • the pedestal 1 is a fully hollow structure that allows convection ventilation.
  • the housing of the power supply chamber 5 and the base 1 are not in communication.
  • the base 1 and the housing of the power supply chamber 5 are screwed together to achieve independent heat dissipation.
  • the LED lighting device comprises a base 1, 25 LED light emitting chips and a lamp cover 3.
  • the base 1 is a square ceramic base 1, and a circuit board 4 is disposed on the base 1, and an LED light emitting chip is disposed on the circuit board 4.
  • the lampshade 3 is a solid light transmissive ceramic.
  • the light-transmissive ceramic is a square shape corresponding to the susceptor 1 and covers the susceptor 1 , and all the LED light-emitting chips 2 and the circuit board 4 are packaged therein, and the light-distributing surface 31 is disposed corresponding to the LED light-emitting chip 2 .
  • the inner surface is not bonded to the LED light-emitting chip 2, and forms a light distribution cavity together with the upper surface of the base.
  • the heat-transfer surface 32 is distributed in the central area and the edge area of the inner surface, and completely conforms to the upper surface of the base 1 to achieve transparency. Light and heat dissipation.

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
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Abstract

一种LED照明装置，包括：基座（1）、LED发光单元（2）和灯罩（3）。LED发光单元（2）和灯罩（3）设置在基座（1）上，灯罩（3）为由导热材料制成的实体部件。灯罩（3）将LED发光单元（2）包覆在内，灯罩（3）的内表面包括配光面（31）以及导热面（32）。该LED照明装置采用导热性能较好的实体材料用作灯罩（3），LED发光单元产生的热量除了可以通过基座（1）散热，还可以通过灯罩（3）向外导出，从而形成整个装置全方位均可散热，提高了装置的散热性能。由于散热性能的提升，可以在不增加装置体积的情况下制造更大功率的照明装置。

Description

LED照明装置 技术领域
本发明涉及 LED, 具体地， 涉及 LED照明装置。
背景技术
LED技术的应用引发了新一轮的光源革命， 而目前， LED装置的散热一直是业 内较难解决的一个难题， 因此也限制了大功率 LED装置的制造， 从而导致单个 LED 光源的亮度不足以及陈列式 LED照明装置的体积过大。 传统的 LED发光单元通常包 括： 封装部分、 发光芯片、 光源支架 （也称基板） 、 线路板和散热器等结构； 而这 其中， 又将封装部分、 发光芯片和光源支架三者的结合称之为 LED器件。 由于 LED 器件本身并不具备相应的电学和散热能力， 不能拿它独立地使用， 所以需要将其耦 合至线路板上以实现电气连接， 再将线路板用导热硅脂等黏结在散热器上以实现热 量的耗散。 可以看到， 在传统的 LED发光单元中， 发光芯片所产生的热量需要依次 通过 "芯片一一光源支架一一线路板表面的电气层一一线路板一一导热硅脂一一散 热器" 的路径才能最终散去， 这其中会产生巨大的热阻。 传统工艺的封装材料一般 多采用树脂材料， 此种材料导热性能很差， 导致芯片产生的热量无法通过封装部件 方向导出， 只能依赖于散热器一个方向进行导热。 另外， 在球泡灯的制作中， 通常 是芯片有独立的封装件， 然后再罩上中空的外罩以形成球泡灯的形状， 这样芯片产 生的热量需要先通过独立的封装件传到空气中再传到外罩然后再传到周围空气中， 致使热量几乎无法导出。
导热性差将导致无法开发大功率的 LED装置， 如果要制造大功率的 LED照明装 置， 则必须要增加装置的体积， 在日常生活使用中， 造成许多不便。 发明人基于以 上情况， 致力于开发一种导热性能较好的 LED装置。
发明内容
针对现有技术中的缺陷， 本发明的目的是提供一种新的 LED照明装置， 该 LED 照明装置具有更好的散热功能， 从而可以以较小的体积实现更大的功率， 从而可以 在不需要增加装置体积的情况下实现更高的照明亮度。
根据本发明提供的 LED照明装置， 包括： 基座、 LED发光单元、 灯罩； LED发光单元设置在基座的上表面， 灯罩与基座直接接触， 把 LED发光单元包 覆在内； 所述 LED发光单元包含多个 LED发光芯片；
所述灯罩包括外表面和内表面， 外表面为光线出射面， 所述内表面包括配光面 和导热面，其中，所述配光面设置在内表面的与 LED发光芯片对应的内表面区域上， 不 配光面与 LED发光芯片之间存在间隙贴合， 与基座上表面共同形成配光腔， 所 述导热面设置在内表面的与基座上安装 LED发光芯片以外的部分或全部上表面所对 应的内表面区域上， 并与基座紧密贴合， 导热面至少分布于内表面的中央区域和边 缘区域。
优选地， 所述灯罩内表面仅由配光面和导热面构成。
优选地， 所述灯罩采用透光陶瓷或者玻璃制成。
优选地， 所述透光陶瓷包含从 PLZT、 CaF2、 Y203、 YAG、 多晶 AION和 MgA1204 中的一种或几种的组合组成的组中选择的至少一种材料。
本发明的发明人通过反复实验， 分别使用了 PC,玻璃和透光陶瓷制作灯罩， 实验结 果证明采用 PC的结温温升最高，玻璃透镜的结温温升明显低于 PC，而透光陶瓷透镜的 结温温升比玻璃更低。 因此本发明采用导热性更好、 使用中结温温升更低的玻璃和 陶瓷。
优选地， 所述 LED发光单元还包括线路板， LED发光芯片设置在线路板上， 线路板 设置在基座上。
优选地，所述 LED发光单元还包括电路涂层，电路涂层直接涂覆在所述基座上表面， LED发光芯片直接设置在所述基座上表面， 通过电路涂层相互连接。
优选地， 所述电路涂层为包含有金属材料的流质或粉末涂层， 所述电路涂层线路层 的厚度为 20 μ πι以上。
优选地， 所述电路涂层的金属材料选自钼、 锰、 钨、 银、 金、 铂、 银钯合金、 铜、 铝、 锡等材料中的至少一种或几种的组合。。
优选地， 基座的上表面为平面、 曲面、 或者多平面结合形状。
优选地， 灯罩外表面按照配光要求制成特定曲面形状， 与基座接触的内表面为与 基座上表面形状相对应的曲面形状。
优选地， 基座设置有第一散热通孔。
优选地， 灯罩设置有第二散热通孔， 其中， 第二散热通孔与第一散热通孔对应 连通。 优选地， 基座为涂覆有绝缘层的金属基座、 或者为由绝缘材料制成的基座。 优选地， 所述基座为镂空结构， 其上的第一散热通孔通过基座的侧面与外界空气相 通。
优选地， 所述基座为非镂空结构， 基座的外侧面设置有散热鳍片。
优选地， 还包括电源腔， 其中， 电源腔不与基座相通， 即电源腔的腔体与基座 相隔离。 电源腔的外壳体与基座通过卡插、 卡接、 螺口等方式相连接， 可以实现分 别独立散热。 降低芯片产生的热量对电源的影响， 增强整个 LED照明装置的综合散 热能力。
与现有技术相比， 本发明具有如下的有益效果：
由于采用了导热性能较好的材料用作灯罩， 芯片产生的热量除了可以通过基座 散热， 还可以通过灯罩内表面上设置的与基座直接贴合的导热面向外导出。 由于灯 罩导热面分布于内表面的中央区域和边缘区域， 与仅边缘接触的现有技术相比， 增大了 灯罩与基座的接触面积， 从而增加了灯罩的散热功能。 本发明的发明人通过计算机热 模拟软件进行计算， 本发明与相同材料、 相同体积、 相同功率的仅有边缘接触的现 有产品相比较， 结温温升明显下降， 可降低至少 30Ό以上。 同时， 发明人经过反复 实验验证， 得出的实验结果， 完全符合计算机热模拟软件模拟出的结果。 另外， 本 发明的一些优选的结构，如散热通孔和镂空的基座，可以更进一步地增强散热功能。 从而形成整个装置全方位均可散热， 大大提高了装置的散热性能， 提高了装置的使 用寿命。 独立设置的电源腔可以使芯片产生的热量和电源产生的热量分别通过不同 的结构向外散出， 从而可以减少芯片产生的热量对电源造成的影响， 从而减少因热 量过高对电源的影响。
进一步地， 由于散热性能的提升， 可以在不增加装置体积的情况下制造更大功 率的照明装置， 提高装置的照明亮度， 同时在生活和工业使用上增加了 LED照明装 置的使用范围和灵活度。
附图说明
通过阅读参照以下附图对非限制性实施例所作的详细描述， 本发明的其它特 征、 目的和优点将会变得更明显：
图 1为本发明第一实施例中 LED照明装置的整体结构示意图；
图 2为图 1中 LED照明装置的剖面结构示意图；
图 3为本发明第二实施例中 LED照明装置的整体结构示意图； 图 4为图 3中 LED照明装置的剖面结构示意图；
图 5为本发明第三实施例中 LED照明装置的整体结构示意图；
图 6为图 5中 LED照明装置的剖面结构示意图；
图 7为本发明第四实施例中 LED照明装置的装配示意图；
图 8为本发明第四实施例中 LED照明装置的发光单元的结构示意图； 图 9为本发明第四实施例中 LED照明装置的整体结构示意图；
图 10为本发明第五实施例中 LED照明装置的整体结构示意图。
图 11为图 10中 LED照明装置的剖面结构示意图。
图 12为本发明第六实施例中 LED照明装置的整体结构示意图；
图 13为图 12中 LED照明装置的剖面结构示意图；
图 14为图 2所示灯罩 3的配光面 31和导热面 32的详细分布示意图； 图 15为图 4所示灯罩 3的配光面 31和导热面 32的详细分布示意图； 图 16为图 6所示灯罩 3的配光面 31和导热面 32的详细分布示意图。
图中：
1为基座；
2为 LED发光芯片；
3为灯罩；
31为配光面；
32为导热面；
4为线路板；
5为电源腔；
6为发光模条；
7为框架；
81为第一散热通孔；
82为第二散热通孔；
9为散热鳍片。
具体实施方式
下面结合具体实施例对本发明进行详细说明。以下实施例将有助于本领域的技术人 员进一步理解本发明， 但不以任何形式限制本发明。应当指出的是， 对本领域的普通技 术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干变形和改进。这些都属于 本发明的保护范围。
根据本发明提供的 LED照明装置，包括：基座 1、 LED发光单元、灯罩 3、 电源腔 5。 所述灯罩 3是实体导热材料制成， 具有良好的导热作用。所述 LED发光单元固定在基座 1上， 灯罩 3设置在基座 1上， 把 LED发光单元包覆在内， 灯罩 3除与 LED发光芯片 2 对应内表面区域（即配光面 31 ) 以外的内表面作为导热面 32与基座 1接触， 以实现散 热功能，灯罩 3与 LED发光芯片 2对应区域的内表面按设计需要形成特定的空间结构形 状， 以改变光强分布； 其中， 导热面 32作为灯罩 3内表面的一部分， 其本身可以利用 对光线的反射和 /或折射特性参与配光， 因此， 利用导热面 32参与配光的技术方案同样 属于本发明所保护的非限制性实施例。
基座 1的上表面为平面、 曲面、或者多平面结合形状。基座 1可以采用镂空结构以 增加空气流通加强散热， 例如基座 1的中间设置第一散热通孔 81以增加空气流通加强 散热， 相应地， 灯罩 3与基座 1对应的位置设置第二散热通孔 82。 LED发光芯片的数量 为多个。
灯罩 3具有配光功能， 选自陶瓷， 玻璃或其他具有透光性能的高导热材料。所述灯 罩 3的外表面根据实际需要设计成特定形状。基座 1相分离地设置电源腔 5上， 可以实 现分别独立散热。 基座 1可以是金属基座涂覆绝缘层、 陶瓷基座等。
接下来结合图 1和图 2对第一实施例进行具体描述。
所述 LED照明装置为 LED球泡灯。该 LED球泡灯主要包括基座 1、 16个 LED发光芯 片 2、线路板 4、灯罩 3和电源腔 5。所述基座 1为一上表面为平面的涂覆有绝缘层的铝 基座， 铝基座上设置线路板 4， 16个 LED发光芯片 2设置在线路板 4上。所述灯罩 3为 一实体的透光玻璃。所述灯罩 3与基座 1直接接触并覆盖在基座 1上， 把 LED发光单元 封装在内，所述配光面 31设置在与 LED发光芯片 2对应的内表面，不与 LED发光芯片 2 贴合， 与基座上表面共同形成配光腔， 导热面 32分布于内表面的中央区域和边缘区域， 与基座 1上表面完全贴合从而实现透光及散热作用。基座 1为非镂空结构， 基座 1外侧 面设计有散热鳍片 9， 可以增大散热面积。 电源腔 5与基座为一个整体， 腔体和基座 1 不连通， 可以实现分别独立散热。
接下来结合图 3和图 4对第二实施例进行具体描述。
所述 LED照明装置可以为 LED球泡灯。该 LED球泡灯主要包括基座 1、 12个 LED发 光芯片 2、 电路涂层、 灯罩 3和电源腔 5。 所述基座 1为一上表面为曲面的陶瓷基座 1， 如图 3、 图 4所示的形状， LED发光芯片设置在基座 1上表面凸出的曲面上， 基座 1上 表面直接涂覆电路涂层连接所有芯片和电源实现电气连接。所述电路涂层材料为导电银 浆。所述灯罩 3为一实体的透光陶瓷， 由 PLZT制成。灯罩 3与基座 1直接接触并接合， 覆盖在基座 1上，把 LED发光芯片 2和电路涂层封装在内，所述配光面 31设置在与 LED 发光芯片 2对应的内表面， 不与 LED发光芯片 2贴合， 与基座上表面共同形成配光腔， 导热面 32分布于内表面的中央区域和边缘区域， 与基座 1上表面完全贴合从而实现透 光及散热作用。 电源腔 5为独立结构， 和基座 1不连通。基座 1与电源腔 5的壳体用插 口方式连接， 可以实现分别独立散热。
接下来结合图 5和图 6对第三实施例进行具体描述。
所述 LED照明装置可以为单元化 LED照明装置。每个 LED照明装置在整个照明系统 中作为一个 LED发光单位，其中，每个 LED发光单位主要由基座 1、 4个 LED发光芯片 2、 灯罩 3构成。 基座 1为铝基座且涂覆有绝缘材料， 基座 1上安装线路板 4， LED发光芯 片 2设置在线路板 4上。 所述灯罩 3为一实体的透光陶瓷， 由多晶 AI0N制成。 所述灯 罩 3与基座 1直接接触并覆盖在基座 1上， 把 LED发光芯片 2和线路板 4封装在内， 所 述配光面 31设置在与 LED发光芯片 2对应的内表面， 不与 LED发光芯片 2贴合， 与基 座上表面共同形成配光腔， 导热面 32分布于内表面的中央区域和边缘区域， 与基座 1 上表面完全贴合从而实现透光及散热作用。基座 1为非镂空结构， 基座 1外侧面设计有 散热鳍片 9， 可以增大散热面积。 多个 LED发光单位可以组合形成一个照明系统使用。
接下来结合图 7、 图 8和图 9对第四实施例进行具体描述。
所述 LED照明装置可以为模块式 LED照明装置，主要由发光模条 6和框架 7组合而 成。所述模块式 LED照明装置包含 1个基座 1， 24个 LED发光芯片 2、 8个灯罩 3。基座 1为铝基座且涂覆有绝缘材料， 绝缘材料上面涂覆电路涂层， 24个 LED发光芯片 2分成 3个一组分别设置在涂有绝缘材料的基座 1上， 并通过电路涂层相互连接。 所述电路涂 层为导电铜浆。 所述 8个灯罩 3为一实体的透光陶瓷， 由 YAG制成。 外表面为半球型， 分别覆盖在基座 1上， 每个灯罩 3分别把 3个对应的 LED发光芯片 2封装在内， 所述配 光面 31设置在与 LED发光芯片 2对应的内表面， 不与 LED发光芯片 2贴合， 与基座上 表面共同形成配光腔， 导热面 32分布于内表面的中央区域和边缘区域， 与基座 1上表 面完全贴合从而实现透光及散热作用。基座 1为非镂空结构， 基座 1外侧面设计有散热 鳍片 9，可以增大散热面积。 9个发光模条 6连接到框架 7上形成一个完整的模块式 LED 照明装置系统， 如图 10所示。
接下来结合图 10和图 11对第五实施例进行具体描述。 所述 LED照明装置可以为 LED球泡灯。该 LED球泡灯主要包括基座 1、 12个 LED发 光芯片和高导热灯罩 3。 所述基座 1为一上表面是曲面的陶瓷基座 1， 如图 9、 图 10所 示的形状， 基座 1上涂覆电路涂层， 所述电路涂层为一种导电银钯合金浆体。基座 1的 中间开设第一散热通孔 81， LED发光芯片 2设置在基座 1上表面除散热通孔以外的其他 部分， 并由电路涂层相互连接。 所述灯罩 3为一实体的透光陶瓷， 由 MgAl204制成。 与 基座 1的第一散热通孔 81对应的中间位置开设同样大小的第二散热通孔 82， 以实现空 气流通。 灯罩 3与基座 1接触的内表面为与基座 1形状相对应的曲面。 灯罩 3与基座 1 直接接触并覆盖在基座 1上， 把 LED发光单元 2和电路涂层封装在内， 所述配光面 31 设置在与 LED发光芯片 2对应的内表面， 不与 LED发光芯片 2贴合， 与基座上表面共同 形成配光腔， 导热面 32分布于内表面的中央区域和边缘区域， 与基座 1上表面完全贴 合从而实现透光及散热作用。基座 1为全镂空结构， 可以实现对流通风。 电源腔 5的壳 体和基座 1不连通。基座 1与电源腔 5的壳体用螺口方式连接，可以实现分别独立散热。
接下来结合图 12和图 13对第六实施例进行具体描述。
所述 LED照明装置， 包括一个基座 1、 25个 LED发光芯片、一个灯罩 3构成。基座 1为正方型陶瓷基座 1， 基座 1上设置线路板 4， LED发光芯片设置在线路板 4上。所述 灯罩 3为一实体的透光陶瓷。该透光陶瓷为与基座 1相对应的正方型，覆盖在基座 1上， 把所有 LED发光芯片 2和线路板 4封装在内， 所述配光面 31设置在与 LED发光芯片 2 对应的内表面， 不与 LED发光芯片 2贴合， 与基座上表面共同形成配光腔， 导热面 32 分布于内表面的中央区域和边缘区域，与基座 1上表面完全贴合从而实现透光及散热作 用。
以上对本发明的具体实施例进行了描述。 需要理解的是， 本发明并不局限于上 述特定实施方式， 本领域技术人员可以在权利要求的范围内做出各种变形或修改， 这并不影响本发明的实质内容。

Claims

权利要求书
1、 一种 LED照明装置， 其特征在于， 包括： 基座、 LED发光单元、 灯罩;
LED发光单元设置在基座的上表面， 灯罩与基座直接接触， 把 LED发光单元包覆在 内； 所述 LED发光单元包含多个 LED发光芯片；
所述灯罩包括外表面和内表面， 外表面为光线出射面， 所述内表面包括配光面和导 热面， 其中， 所述配光面设置在内表面的与 LED发光芯片对应的区域上， 配光面与 LED 发光芯片之间存在间隙， 与基座上表面共同形成配光腔， 所述导热面设置在内表面的与 基座上安装 LED发光芯片以外的部分或全部上表面所对应的区域上，并与基座紧密贴合， 导热面至少分布于内表面的中央区域和边缘区域。
2、 根据权利要求 1所述的 LED照明装置， 其特征在于， 所述灯罩内表面仅由配光 面和导热面构成。
3、 根据权利要求 1所述的 LED照明装置， 其特征在于， 所述灯罩采用透光陶瓷或 者玻璃制成。
4、 根据权利要求 3所述的 LED照明装置，其特征在于，所述透光陶瓷为 PLZT、CaF2、 Y203、 YAG、 多晶 AI0N和 MgAl204中的一种或几种的组合。
5、 根据权利要求 1所述的 LED照明装置， 其特征在于， 所述 LED发光单元还包括 线路板， LED发光芯片设置在线路板上， 线路板设置在基座上。
6、 根据权利要求 1所述的 LED照明装置， 其特征在于， 所述 LED发光单元还包括 电路涂层， 电路涂层直接涂覆在所述基座上表面， LED发光芯片直接设置在所述基座上 表面， 通过电路涂层相互连接。
7、 根据权利要求 6所述的 LED照明装置， 其特征在于， 所述电路涂层为包含有金 属材料的流质或粉末涂层， 所述电路涂层的厚度为 20 μ ιη以上。
8、 根据权利要求 7所述的 LED照明装置， 其特征在于， 所述电路涂层的金属材料 选自钼、锰、钨、银、金、铂、银钯合金、铜、铝、锡材料中的至少一种或几种的组合。
9、 根据权利要求 1所述的 LED照明装置， 其特征在于， 基座的上表面为平面、 曲 面、 或者多平面结合形状。
10、 根据权利要求 1所述的 LED照明装置，其特征在于，基座设置有第一散热通孔。
11、 根据权利要求 10所述的 LED照明装置， 其特征在于， 灯罩设置有第二散热通 孔， 其中， 第二散热通孔与第一散热通孔对应连通。
12、 根据权利要求 1所述的 LED照明装置，其特征在于，基座为涂覆有绝缘层的金 属基座、 或者为由绝缘材料制成的基座。
13、 根据权利要求 10所述的 LED照明装置， 其特征在于， 所述基座为镂空结构， 基座上的第一散热通孔通过基座的镂空结构与外界空气相通。
14、 根据权利要求 1所述的 LED照明装置， 其特征在于， 所述基座为非镂空结构， 基座的外侧面设置有散热鳍片。
15、 根据权利要求 1所述的 LED照明装置， 其特征在于， 还包括电源腔， 其中， 电 源腔的外壳体与基座相连接， 电源腔的腔体与基座相隔离。
PCT/CN2014/076050 2014-01-27 2014-04-23 Led照明装置 Ceased WO2015109674A1 (zh)

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2938049A1 (en) * 2014-01-27 2015-07-30 Shanghai Sansi Electronic Engineering Co., Ltd Led lighting device and lamp shade, and circuit preparation method thereof
CN103791439B (zh) * 2014-01-27 2015-05-06 上海三思电子工程有限公司 新型led照明装置
CN107906424A (zh) * 2017-12-14 2018-04-13 广东工业大学 一种led聚光灯

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101666439A (zh) * 2009-09-16 2010-03-10 鹤山丽得电子实业有限公司 一种液冷led灯具
CN102072428A (zh) * 2010-12-20 2011-05-25 鸿富锦精密工业（深圳）有限公司 Led日光灯
CN202349777U (zh) * 2011-11-24 2012-07-25 上海天逸电器有限公司 金属铝外壳的机床照明灯
CN202791524U (zh) * 2012-09-21 2013-03-13 深圳市浩原义光电科技有限公司 带pc外壳的led球泡灯
CN202868352U (zh) * 2012-07-25 2013-04-10 宁波圣彼电气有限公司 散热led灯泡
JP5178930B1 (ja) * 2011-03-11 2013-04-10 株式会社東芝 照明装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7728345B2 (en) * 2001-08-24 2010-06-01 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
JP4031784B2 (ja) * 2004-07-28 2008-01-09 シャープ株式会社 発光モジュールおよびその製造方法
US8427059B2 (en) * 2008-07-31 2013-04-23 Toshiba Lighting & Technology Corporation Lighting device
TW201031859A (en) * 2009-02-23 2010-09-01 Taiwan Green Point Entpr Co High efficiency luminous body
WO2010136985A1 (en) * 2009-05-28 2010-12-02 Koninklijke Philips Electronics N.V. Ceramic illumination device
DE102009035370A1 (de) * 2009-07-30 2011-02-03 Osram Gesellschaft mit beschränkter Haftung Lampe
TWM381175U (en) * 2009-12-22 2010-05-21 Li-Yu Lin Improved ceramic radiator structure
DE102010001046A1 (de) * 2010-01-20 2011-07-21 Osram Gesellschaft mit beschränkter Haftung, 81543 Leuchtvorrichtung
DE102010001047A1 (de) * 2010-01-20 2011-07-21 Osram Gesellschaft mit beschränkter Haftung, 81543 Leuchtvorrichtung
CN201696926U (zh) * 2010-05-28 2011-01-05 艾迪光电（杭州）有限公司 一种灯罩内置导热件的led灯
CN201795333U (zh) * 2010-08-06 2011-04-13 艾迪光电（杭州）有限公司 一种双层灯罩液冷散热的led灯
TW201207310A (en) * 2010-08-13 2012-02-16 Foxsemicon Integrated Tech Inc LED lamp and method for manufacturing a heat sink of the LED lamp
DE102010043918B4 (de) * 2010-11-15 2016-05-12 Osram Gmbh Halbleiterlampe
KR101535463B1 (ko) * 2010-11-30 2015-07-10 삼성전자주식회사 엘이디 램프
CN202092058U (zh) * 2011-04-30 2011-12-28 深圳市易特照明有限公司 一种led灯陶瓷基板和led灯
CN102809137A (zh) * 2011-06-01 2012-12-05 弘凯光电股份有限公司 灯具散热结构制造方法及灯具组件制造方法
JP6058655B2 (ja) * 2011-07-15 2017-01-11 フィリップス ライティング ホールディング ビー ヴィ キャリア及びエンベロープを備えた照明装置
KR101253199B1 (ko) * 2011-07-25 2013-04-10 엘지전자 주식회사 조명 장치
CN102261589B (zh) * 2011-07-28 2013-07-17 厦门立明光电有限公司 照明led灯
CN102913773B (zh) * 2011-08-02 2016-05-04 欧司朗股份有限公司 Led发光组件以及具有该led发光组件的led改型灯
JP5809493B2 (ja) * 2011-09-09 2015-11-11 東芝ライテック株式会社 照明装置
WO2013086454A1 (en) * 2011-12-09 2013-06-13 Switch Bulb Company, Inc. Led bulb with liquid-cooled drive electronics
KR101333009B1 (ko) * 2011-12-15 2013-11-27 (주) 글로벳 눈부심 방지 ｌｅｄ 조명장치
JP2014002862A (ja) * 2012-06-15 2014-01-09 Toshiba Lighting & Technology Corp 口金付ランプおよび照明器具
US20140016316A1 (en) * 2012-07-12 2014-01-16 Elementech International Co., Ltd. Illuminant device
CN202955537U (zh) * 2012-12-04 2013-05-29 上海三思电子工程有限公司 可实现大角度发光的led球泡灯
CA2938049A1 (en) * 2014-01-27 2015-07-30 Shanghai Sansi Electronic Engineering Co., Ltd Led lighting device and lamp shade, and circuit preparation method thereof
CN103791439B (zh) * 2014-01-27 2015-05-06 上海三思电子工程有限公司 新型led照明装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101666439A (zh) * 2009-09-16 2010-03-10 鹤山丽得电子实业有限公司 一种液冷led灯具
CN102072428A (zh) * 2010-12-20 2011-05-25 鸿富锦精密工业（深圳）有限公司 Led日光灯
JP5178930B1 (ja) * 2011-03-11 2013-04-10 株式会社東芝 照明装置
CN202349777U (zh) * 2011-11-24 2012-07-25 上海天逸电器有限公司 金属铝外壳的机床照明灯
CN202868352U (zh) * 2012-07-25 2013-04-10 宁波圣彼电气有限公司 散热led灯泡
CN202791524U (zh) * 2012-09-21 2013-03-13 深圳市浩原义光电科技有限公司 带pc外壳的led球泡灯

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