WO2015174761A1 - Tdi 라인 이미지 센서 - Google Patents
Tdi 라인 이미지 센서 Download PDFInfo
- Publication number
- WO2015174761A1 WO2015174761A1 PCT/KR2015/004855 KR2015004855W WO2015174761A1 WO 2015174761 A1 WO2015174761 A1 WO 2015174761A1 KR 2015004855 W KR2015004855 W KR 2015004855W WO 2015174761 A1 WO2015174761 A1 WO 2015174761A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- line
- image sensor
- tdi
- charge
- ccd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/709—Circuitry for control of the power supply
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
- H04N25/621—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for the control of blooming
- H04N25/623—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for the control of blooming by evacuation via the output or reset lines
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/711—Time delay and integration [TDI] registers; TDI shift registers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/701—Line sensors
Definitions
- the present invention relates to a TDI line image sensor. More particularly, the pixel unit is configured to accumulate charge in a TDI (Time Delay Integration) method through a CCD device, and the output unit is configured to convert the charge of each column accumulated in the CCD into a memory.
- the present invention relates to a TDI line image sensor, which is configured to output sequentially after storing in a buffer, thereby improving resolution and transmission speed due to characteristics of CCD and CMOS devices, as well as reducing power consumption and noise.
- a semiconductor device mainly used in such an image sensor is a charge coupled device (CCD).
- CCD refers to a device capable of transferring charge from one device to another adjacent device.
- a sensor employing such a CCD has a structure that converts a change in the amount of free charge in each cell by an amount of light into an electrical signal.
- the CCD includes an output portion largely composed of a cell region in which charge is accumulated by an actual amount of light and a shift register serving as a passage for sequentially transferring the accumulated charge.
- the CCD is divided into an area scan method, a line scan method, and a time delay integration (TDI) line scan method according to an array in which each cell is arranged to generate an image.
- TDI time delay integration
- the line scan type image sensor (hereinafter referred to as "line sensor”) is a one-dimensional sensor in which pixels for receiving image light are arranged on a line. In the case of picking up an image widened in two dimensions, the line sensor or the subject is moved to sequentially photograph the subject line by line.
- the line scan method has a merit that high speed and high resolution images can be obtained at a low cost compared to the area scan method by exposing and transmitting at a random speed one line at a time.
- an area scan method requires 4M pixels to obtain a frame size of 2048 * 2048
- a line scan method obtains frames of various sizes such as 2048 * 1000 as well as 2048 * 2048 with only 2K pixels. Can be.
- a TDI line scan type image sensor (hereinafter referred to as a "TDI line image sensor”) is a line sensor in which a plurality of stages are arranged in the scanning direction, and the charge accumulated in the CCD of each line is synchronized with the movement of the image to the next line. Transfer to CCD. This process is repeated until the last line sensor is overlaid and outputted, resulting in an image that satisfies the amount of light even in a high-speed scan.
- the charge accumulated in the CCD of each line is moved horizontally to the CCD of the next adjacent line to move to the last line and accumulated, and then the charge accumulated in the last line is vertically moved and output to the signal processor.
- Data can be processed sequentially for each cell on a line basis.
- the present invention has been made to solve the above problems, and an object of the present invention is to configure a pixel portion to accumulate charge in a TDI (Time Delay Integration) method through a CCD element, and an output portion of each column accumulated in the CCD.
- TDI Time Delay Integration
- a TDI line image sensor includes a line sensor in which M CCDs are arranged in a line, and N line sensors are arranged horizontally in a scan direction to move charges accumulated for each column of the line sensor in a horizontal direction. A pixel portion to be accumulated and stored; And an output unit configured to sequentially receive the charges accumulated in the pixel unit for each column, store the AD conversion, and sequentially output the AD.
- the output unit M amplifiers for receiving the charge accumulated in the pixel unit in parallel to the charge storage node for each column; M AD converters for AD-converting each signal output from the amplifier; And a memory buffer which sequentially stores and outputs the output of the AD converter.
- the amplifier is characterized in that the source follower amplifier.
- the TDI line image sensor configures the pixel unit to accumulate charge in a TDI (Time Delay Integration) method through a CCD element, and the output unit AD converts the charge of each column accumulated in the CCD and stores it in a memory buffer.
- TDI Time Delay Integration
- the output unit AD converts the charge of each column accumulated in the CCD and stores it in a memory buffer.
- FIG. 1 is a block diagram illustrating a TDI line image sensor according to an exemplary embodiment of the present invention.
- FIG. 2 is a diagram illustrating a pixel part structure of a TDI line image sensor according to an exemplary embodiment of the present invention.
- FIG 3 is a view for explaining the movement of charge in the TDI line image sensor according to an embodiment of the present invention.
- TDI line image sensor according to an embodiment of the present invention will be described with reference to the accompanying drawings.
- the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of description.
- FIG. 1 is a block diagram showing a TDI line image sensor according to an embodiment of the present invention
- FIG. 2 is a diagram illustrating a pixel portion structure of a TDI line image sensor according to an embodiment of the present invention
- the TDI line image sensor includes a pixel unit 10 and an output unit 20.
- the pixel portion 10 includes a line sensor 12 in which M CCDs 14 are arranged in a line, and N line sensors 12 are arranged horizontally in the scan direction, and line sensors 12_1 to 12_N in a TDI manner. The charge accumulated by each column in the column is shifted and accumulated in the horizontal direction.
- the charge storage node FD is moved as the charges accumulated in the CCD 14 are transferred to the adjacent CCD 14 by sequentially controlling the voltages V1, V2, and V3 of each CCD 14. It is nested in the output.
- the configuration of the pixel portion 10 corresponds to the configuration of the pixel portion of a general TDI line image sensor, and thus a detailed description thereof will be omitted.
- the output unit 20 includes an amplifier 22, an AD converter 24, and a memory buffer 26 so as to sequentially receive the charges accumulated in the pixel unit 10 for each column, store the AD conversions, and store the ADs sequentially. do.
- the amplifier 22 corresponds to the number of CCDs 14 arranged in one line sensor 12 in order to amplify the charges accumulated in the pixel unit 10 in parallel to the charge storage node FD for each column. M pieces are provided if possible.
- the amplifier 22 may be configured as a source follower amplifier that is turned on according to the potential of the charge storage node FD accumulated by the charge being moved from the last line sensor 12_N of the pixel unit 10 and outputs a voltage value. have.
- the AD converter 24 AD-converts each signal output from the M amplifiers 22.
- the memory buffer 26 stores the image signals converted into digital signals by the M AD converters 24 and sequentially outputs them so that the signal processing unit (not shown) can process the image signals for each line.
- the charge accumulated in the CCD 14 of each line sensor 12 of the pixel unit 10 in the TDI method is synchronized with the scan to the adjacent line sensor 12 for each column. It is moved and output to the charge storage node FD of the output unit 20.
- the charge accumulated in the charge storage node FD is amplified by the amplifier 22 and then converted into AD and output as a signal. Thereafter, the charge storage node FD is reset to the voltage VDD connected to the reset drain RD through the reset gate RG to receive the charge of the next line sensor 12.
- the charge stored in the charge storage node FD of the output unit 20 is amplified by the amplifier 22 without moving through the CCD element, and then converted into a digital signal by the AD converter 24 to the memory buffer 26.
- the pixel portion is configured to accumulate charge in a TDI (Time Delay Integration) manner through the CCD element, and the output portion charges each column accumulated in the CCD.
- TDI Time Delay Integration
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Abstract
Description
Claims (3)
- M개의 CCD가 일렬로 배열된 라인센서와, 스캔방향에 수평으로 N개의 상기 라인센서가 배열되어 상기 라인센서의 컬럼별로 축적된 전하를 수평방향으로 이동시켜 축적하는 화소부; 및상기 화소부에 축적된 상기 전하를 컬럼별로 병렬 입력받아 AD변환하여 저장한 후 순차적으로 출력하는 출력부를 포함하는 것을 특징으로 하는 TDI 라인 이미지 센서.
- 제 1항에 있어서, 상기 출력부는,상기 화소부에 축적된 상기 전하를 컬럼별로 전하저장노드에 병렬 입력받아 각각 증폭하기 위한 M개의 증폭기;상기 증폭기에서 출력되는 각 신호를 AD변환하는 M개의 AD변환기; 및상기 AD변환기의 출력을 저장하여 순차적으로 출력하는 메모리버퍼;를 포함하는 것을 특징으로 하는 TDI 라인 이미지 센서.
- 제 2항에 있어서, 증폭기는 소스 폴로워 증폭기인 것을 특징으로 하는 TDI 라인 이미지 센서.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15793516.4A EP3145177A4 (en) | 2014-05-15 | 2015-05-14 | Tdi line image sensor |
| CN201580025998.3A CN106464820B (zh) | 2014-05-15 | 2015-05-14 | Tdi行图像传感器 |
| US15/311,384 US10015418B2 (en) | 2014-05-15 | 2015-05-14 | TDI line image sensor including source follower amplifiers |
| EP21158762.1A EP3855728A1 (en) | 2014-05-15 | 2015-05-14 | Tdi line image sensor |
| JP2016567850A JP6348992B2 (ja) | 2014-05-15 | 2015-05-14 | Tdiラインイメージセンサ |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140058501A KR101653228B1 (ko) | 2014-05-15 | 2014-05-15 | Tdi 라인 이미지 센서 |
| KR10-2014-0058501 | 2014-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2015174761A1 true WO2015174761A1 (ko) | 2015-11-19 |
Family
ID=54480237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2015/004855 Ceased WO2015174761A1 (ko) | 2014-05-15 | 2015-05-14 | Tdi 라인 이미지 센서 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10015418B2 (ko) |
| EP (2) | EP3145177A4 (ko) |
| JP (1) | JP6348992B2 (ko) |
| KR (1) | KR101653228B1 (ko) |
| CN (1) | CN106464820B (ko) |
| WO (1) | WO2015174761A1 (ko) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864347B (zh) * | 2017-10-27 | 2020-07-28 | 天津津航技术物理研究所 | 一种红外tdi探测器预处理电路噪声的统计方法 |
| CN108174124B (zh) * | 2018-01-29 | 2021-02-19 | 京东方科技集团股份有限公司 | 像素电路及其驱动方法以及探测器 |
| KR102474449B1 (ko) | 2018-03-07 | 2022-12-06 | 삼성전자주식회사 | 이미지 센서 및 이를 포함하는 전자 시스템 |
| US10691926B2 (en) | 2018-05-03 | 2020-06-23 | Analog Devices, Inc. | Single-pixel sensor |
| US11157694B2 (en) | 2018-08-14 | 2021-10-26 | Snap Inc. | Content suggestion system |
| EP4211892A4 (en) * | 2020-09-10 | 2024-04-24 | Teledyne Digital Imaging, Inc. | METHOD AND APPARATUS FOR HIGH SPEED CHARGE-COUPLED CMOS TDI IMAGING |
| CN115911071A (zh) * | 2022-12-27 | 2023-04-04 | 上海集成电路研发中心有限公司 | 图像传感器 |
| CN117038684B (zh) * | 2023-07-14 | 2024-12-24 | 北京空间机电研究所 | 一种可精细调整电荷累加级数的tdi-cmos图像探测器 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0993490A (ja) * | 1995-09-21 | 1997-04-04 | Fujitsu Ltd | 赤外線撮像装置 |
| JPH10257269A (ja) * | 1997-03-11 | 1998-09-25 | Tokyo Seimitsu Co Ltd | イメージセンサ |
| KR20000018460A (ko) * | 1998-09-02 | 2000-04-06 | 오쯔보 히데오 | 이미지 센서 |
| US20140054443A1 (en) * | 2012-08-23 | 2014-02-27 | Naser Faramarzpour | Cmos time delay and integration image sensor |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2895941B2 (ja) * | 1990-09-19 | 1999-05-31 | 富士通株式会社 | 固体撮像装置 |
| US6166768A (en) * | 1994-01-28 | 2000-12-26 | California Institute Of Technology | Active pixel sensor array with simple floating gate pixels |
| US5652150A (en) * | 1995-06-07 | 1997-07-29 | Texas Instruments Incorporated | Hybrid CCD imaging |
| US6831998B1 (en) * | 2000-06-22 | 2004-12-14 | Hitachi, Ltd. | Inspection system for circuit patterns and a method thereof |
| EP1868366A1 (en) | 2006-06-16 | 2007-12-19 | THOMSON Licensing | Method for controlling a TDI-CCD image sensor |
| FR2959902B1 (fr) * | 2010-05-04 | 2013-08-23 | E2V Semiconductors | Capteur d'image lineaire a defilement et sommation analogique et numerique et procede correspondant |
| JP5915031B2 (ja) * | 2011-08-31 | 2016-05-11 | ソニー株式会社 | 撮像装置および撮像方法、並びに電子機器 |
| JP5941659B2 (ja) * | 2011-11-02 | 2016-06-29 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| CN102811321B (zh) * | 2012-07-12 | 2014-09-24 | 天津大学 | 低噪声3t像素cmos图像传感器 |
| TW201423965A (zh) * | 2012-08-03 | 2014-06-16 | 國立大學法人靜岡大學 | 半導體元件及固體攝像裝置 |
| CN103022067A (zh) * | 2012-12-21 | 2013-04-03 | 上海宏力半导体制造有限公司 | Cmos图像传感器的像素单元及cmos图像传感器 |
-
2014
- 2014-05-15 KR KR1020140058501A patent/KR101653228B1/ko not_active Ceased
-
2015
- 2015-05-14 CN CN201580025998.3A patent/CN106464820B/zh not_active Expired - Fee Related
- 2015-05-14 EP EP15793516.4A patent/EP3145177A4/en not_active Withdrawn
- 2015-05-14 EP EP21158762.1A patent/EP3855728A1/en not_active Withdrawn
- 2015-05-14 WO PCT/KR2015/004855 patent/WO2015174761A1/ko not_active Ceased
- 2015-05-14 JP JP2016567850A patent/JP6348992B2/ja not_active Ceased
- 2015-05-14 US US15/311,384 patent/US10015418B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0993490A (ja) * | 1995-09-21 | 1997-04-04 | Fujitsu Ltd | 赤外線撮像装置 |
| JPH10257269A (ja) * | 1997-03-11 | 1998-09-25 | Tokyo Seimitsu Co Ltd | イメージセンサ |
| KR20000018460A (ko) * | 1998-09-02 | 2000-04-06 | 오쯔보 히데오 | 이미지 센서 |
| US20140054443A1 (en) * | 2012-08-23 | 2014-02-27 | Naser Faramarzpour | Cmos time delay and integration image sensor |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP3145177A4 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6348992B2 (ja) | 2018-06-27 |
| CN106464820B (zh) | 2019-05-03 |
| US20170085812A1 (en) | 2017-03-23 |
| EP3855728A1 (en) | 2021-07-28 |
| KR101653228B9 (en) | 2022-07-25 |
| CN106464820A (zh) | 2017-02-22 |
| EP3145177A1 (en) | 2017-03-22 |
| JP2017516413A (ja) | 2017-06-15 |
| KR20150131600A (ko) | 2015-11-25 |
| KR101653228B1 (ko) | 2016-09-01 |
| US10015418B2 (en) | 2018-07-03 |
| EP3145177A4 (en) | 2017-05-24 |
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