WO2016000662A1 - 一种led的散热装置 - Google Patents

一种led的散热装置 Download PDF

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Publication number
WO2016000662A1
WO2016000662A1 PCT/CN2015/083294 CN2015083294W WO2016000662A1 WO 2016000662 A1 WO2016000662 A1 WO 2016000662A1 CN 2015083294 W CN2015083294 W CN 2015083294W WO 2016000662 A1 WO2016000662 A1 WO 2016000662A1
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heat
conductive material
air
heat conductive
wire
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English (en)
French (fr)
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张逸兴
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Priority to EP15815941.8A priority Critical patent/EP3166153B1/en
Priority to US15/320,837 priority patent/US20170162772A1/en
Priority to KR1020167036876A priority patent/KR101938466B1/ko
Priority to JP2016576040A priority patent/JP6587641B2/ja
Publication of WO2016000662A1 publication Critical patent/WO2016000662A1/zh
Anticipated expiration legal-status Critical
Priority to US17/484,559 priority patent/US20220010952A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8586—Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention belongs to the field of lighting electrical appliances, and in particular relates to a heat dissipation device for LEDs.
  • LED As a green lighting, LED has a series of outstanding advantages.
  • the current LED lighting industry is at an explosive growth stage.
  • the object of the present invention is to provide a heat dissipating device for an LED, which can reduce the weight and volume of the LED heat sink by double the condition under the condition of ensuring the proper operating temperature of the LED chip, and at the same time ensure the entire heat sink to the ground. insulation.
  • the invention provides a heat dissipating device for an LED, the device comprising a plurality of columnar bodies composed of a heat conductive material, the columnar body of the heat conductive material having a diameter of less than 2 mm and a minimum diameter of more than 0.01 mm; the heat dissipating outer casing of the LED chip is made of a heat conductive material or Directly contacting one end of the columnar body made of the heat conductive material heats the air around the columnar body, and heat is carried away by the flow of the air.
  • the columnar body of the heat conductive material has a diameter of less than 0.3 mm, so that the columnar body composed of the heat conductive material becomes a bundle or a plurality of heat conductive material wires;
  • the thermally conductive material is in direct contact with one end of the filament of thermally conductive material to transfer heat to the filament of thermally conductive material to heat the air surrounding the filament of thermally conductive material; heat is carried away by the flow of such air.
  • the heat dissipation outer casing of the LED chip can be directly integrated with one end of the heat conductive material wire; the LED chip directly heats the air around the heat conductive material wire through the heat conductive material wire on the heat dissipation outer casing thereof Gas, heat is carried away by the flow of these air.
  • the heat conductive material may be copper; the columnar body of the heat conductive material is a copper pillar, and the heat conductive material filament is a copper wire.
  • the columnar body of the heat conductive material or the surface of the heat conductive material wire may be covered with a protective layer to prevent the columnar body of the heat conductive material or the heat conductive material wire from being oxidized, corroded or contaminated.
  • the protective layer covered by the surface may be a silver plating layer
  • the columnar body of the heat conductive material covered with a protective layer is a silver-plated copper pillar
  • the surface is covered with a protective layer.
  • the heat conductive material wire is a silver plated copper wire.
  • the columnar body of the heat conductive material or the heat conductive material wire is disposed in a pipe capable of circulating air; the fan is connected to the fan, and the fan is used to push the air to circulate and take away heat.
  • the heat dissipating device of the LED provided by the invention may also not be connected to the fan, but the columnar body of the heat conductive material or the heat conducting material wire is disposed in the air capable of flowing, and there is a certain height difference between the outlet and the inlet of the pipe. In the pipeline, the air is heated and expanded to become light, resulting in a pressure difference between the outlet and the inlet, which promotes air circulation and removes heat.
  • the apparatus may further comprise a section of a specially circulated air for storing the heated air; there is a certain height difference between the outlet of the special air-flowing duct and the inlet, and the air is heated and expanded to become lighter, further A pressure difference is formed to accelerate the flow of air and remove heat.
  • the pipe described above may be constructed of an insulating material to ensure insulation of the entire heat sink from the ground.
  • the invention converts the heat dissipating device of the LED from the usual bulky and heavy aluminum profile into some metal wires which can be installed in the plastic pipe, and the heat dissipation effect of these wires is not difficult to be seen by the following simple calculation.
  • the area of the cylindrical surface is inversely proportional to the radius.
  • the surface area of the copper wire having a wire diameter of 0.1 mm is 100 times the side area of a copper column having the same volume of 1 cm in diameter.
  • Figure 1 shows an LED chip of the present invention and a plurality of strands of copper wire soldered to the heat sink of the LED chip.
  • FIG. 2 is a schematic view of a heat sink of an LED according to the present invention.
  • a plurality of strands of copper wire are used as a bundle of heat conductive materials, which are directly soldered to the heat dissipation casing of the LED chip.
  • the heat sink transmits heat to the copper wires, heating the air around the copper wires; heat is carried away by the flow of these air.
  • the surface of these copper wires is covered with a protective layer to prevent the columnar body of the thermally conductive material from being oxidized, corroded or contaminated.
  • the heat sink of the LED chip can also be directly integrated with one end of the copper wire.
  • a plurality of LED chips having a plurality of copper wires welded together are gathered together and appropriately arranged and placed in a plastic pipe through which air flows.
  • the pipe is constructed of an insulating material to ensure insulation of the entire heat sink to ground.
  • the invention converts the heat dissipating device of the LED from a generally bulky and heavy aluminum profile into a wire which can be installed in a plastic pipe, which can double the LED under the condition of ensuring the proper working temperature of the LED chip.
  • the weight and volume of the heat sink ensure the insulation of the entire heat sink to the ground.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本发明公开了一种LED的散热装置，该装置包含一束或几束导热材料丝，LED芯片的散热外壳通过导热材料或直接与所述导热材料丝的一端接触，把热量传递给这些导热材料丝，并通过这些导热材料丝加热周围的空气；所述导热材料丝被安置在能流通空气的管道里，靠空气的流动，带走热量，所述管道由绝缘材料构成。本发明可以在保证LED芯片适当的工作温度的条件下，成倍地减少LED散热装置的重量和体积，并确保整个散热装置对地的绝缘。

Description

一种LED的散热装置 技术领域
本发明属于照明电器领域，具体涉及一种LED的散热装置。
背景技术
作为绿色照明，LED有着一系列突出的优点。当前LED照明产业正处于爆发式增长的阶段。
但是我们看到，尽管LED相对别的光源有比较高的发光效率，它从电源得到的能量，一多半仍然是用来发热。对于LED来说，一个不大的LED芯片在发光的同时，总是产生大量的热量，而这个发热将会直接影响到LED的正常运行。
随着LED功率的增大，为了增加散热器的散热表面面积，如今的散热器是做得越来越庞大，越来越笨重，而收效却相对甚微。因此LED的散热问题，已经是一个必须优先考虑的问题。
发明内容
本发明的目的是提供一种LED的散热装置，能够使得在保证LED芯片适当的工作温度的条件下，可以成倍地减少LED散热装置的重量和体积，同时还能确保整个散热装置对地的绝缘。
本发明提供一种LED的散热装置，该装置包含大量由导热材料构成的柱状体，所述导热材料的柱状体的直径小于2毫米，最小直径大于0.01毫米；LED芯片的散热外壳通过导热材料或直接与所述导热材料构成的柱状体的一端接触，对柱状体周围的空气加热，热量通过空气的流动被带走。
本发明提供的LED的散热装置中，所述导热材料的柱状体的直径小于0.3毫米，从而所述由导热材料构成的柱状体成了一束或几束导热材料丝；LED芯片的散热外壳通过导热材料或直接与所述导热材料丝的一端接触，把热量传递给所述导热材料丝，加热所述导热材料丝周围的空气；热量通过这些空气的流动被带走。
更进一步，可以把LED芯片的散热外壳直接与所述导热材料丝的一端融为一体；LED芯片直接通过它的散热外壳上的导热材料丝加热导热材料丝周围的空 气，热量通过这些空气的流动被带走。
这里，所述导热材料可以是铜；所述导热材料的柱状体为铜柱，所述导热材料丝为铜丝。
所述导热材料的柱状体或所述导热材料丝的表面可以覆盖一层保护层，用以防止所述导热材料的柱状体或所述导热材料丝被氧化、腐蚀或污染。
具体地说，所述表面覆盖的一层保护层可以是一层银镀层，所述表面覆盖一层保护层的的导热材料的柱状体即为镀银铜柱，所述表面覆盖一层保护层的的导热材料丝为镀银铜丝。
本发明提供的LED的散热装置中，所述导热材料的柱状体或所述导热材料丝被安置在能流通空气的管道里；管道内接入风机，依靠风机推动空气流通，带走热量。
本发明提供的LED的散热装置也可以不接入风机，而是将所述导热材料的柱状体或所述导热材料丝安置在能流通空气，而且管道的出口和入口之间存在一定的高度差的管道里，利用空气受热膨胀变轻，导致出口和入口之间产生的压差，推动空气流通，带走热量。
更进一步，该装置还可以包括一段专门流通空气的管道，用以储存被加热的空气；所述专门流通空气的管道的出口和入口之间存在一定的高度差，利用空气受热膨胀变轻，进一步形成压差，加速推动空气流通，带走热量。
前面所述管道，可以由绝缘材料构成，以确保整个散热装置对地的绝缘。
本发明将LED的散热装置由通常的庞大笨重的铝型材变成为一些可以装在塑料管道中的金属丝，这些金属丝的散热效果，通过以下的简单计算就不难看出。
我们知道，对于半径为r，高为h的圆柱体，它的体积
V＝πr2h
而它的侧面积
S＝2πrh
因此，对于同样体积的圆柱体，圆柱面的面积与半径成反比。这样，线径0.1毫米的铜丝的表面积是相同体积的一个直径1厘米的铜柱的侧面积100倍。
因此，我们只要用少量的铜丝就能得到足够的散热面积。这样，在保证LED芯片适当的工作温度的条件下，可以成倍地减少LED散热装置的重量和体积， 同时还能确保整个散热装置对地的绝缘。这对于LED的散热装置来说，应该是一个根本的变革。
附图说明
图1为本发明LED芯片与焊接在LED芯片散热外壳上的多股铜丝。
图2为本发明一种LED的散热装置的示意图。
具体实施方式
如附图1所示，以多股铜丝作为一束导热材料丝，直接焊接在LED芯片的散热外壳上。散热外壳把热量传递给这些铜丝，对铜丝周围的空气加热；热量通过这些空气的流动被带走。
这些铜丝的表面覆盖一层保护层，用以防止所述导热材料的柱状体被氧化、腐蚀或污染。
LED芯片的散热外壳也可直接与铜丝的一端融为一体。
如附图2所示，以多个焊有多股铜丝的LED芯片集合在一起，并把它们适当排列，安置在一个流通空气的塑料管道中。
所述塑料管道的出口和入口之间存在一定的高度差，利用空气受热膨胀变轻，进一步形成压差，推动空气流通，带走热量。
所述管道由绝缘材料构成，以确保整个散热装置对地的绝缘。
适当连接LED芯片，并接通适当的驱动电源，就得到我们所需要的LED灯具。
本发明将LED的散热装置由通常的庞大笨重的铝型材变成为一些可以装在塑料管道中的金属丝，这使得在保证LED芯片适当的工作温度的条件下，可以成倍度地减少LED散热装置的重量和体积，同时还能确保整个散热装置对地的绝缘。

Claims (10)

  1. 一种LED的散热装置，其特征在于：该装置包含大量由导热材料构成的柱状体，所述导热材料的柱状体的直径大于0.01毫米小于2毫米，LED芯片的散热外壳通过导热材料或直接与所述导热材料构成的柱状体的一端接触，对柱状体周围的空气加热，热量通过空气的流动被带走。
  2. 根据权利要求1所述的LED的散热装置，其特征在于：所述导热材料的柱状体的直径小于0.3毫米，从而所述由导热材料构成的的柱状体成了一束或几束导热材料丝；LED芯片的散热外壳通过导热材料或直接与所述导热材料丝的一端接触，把热量传递给所述导热材料丝，加热所述导热材料丝周围的空气；热量通过这些空气的流动被带走。
  3. 根据权利要求2所述的LED的散热装置，其特征在于：LED芯片的散热外壳直接与所述导热材料丝的一端融为一体；LED芯片直接通过它的散热外壳上的导热材料丝加热导热材料丝周围的空气，热量通过这些空气的流动被带走。
  4. 根据权利要求1、2、和3所述的LED的散热装置，其特征在于：所述导热材料为铜；所述导热材料的柱状体为铜柱，所述导热材料丝为铜丝。
  5. 根据权利要求1、2、3和4所述的LED的散热装置，其特征在于：所述导热材料的柱状体或所述导热材料丝的表面覆盖一层保护层，用以防止所述导热材料的柱状体或所述导热材料丝被氧化、腐蚀或污染。
  6. 根据权利要求5所述的LED的散热装置，其特征在于：所述表面覆盖的一层保护层为一层银镀层，所述表面覆盖一层保护层的的导热材料的柱状体为镀银铜柱，所述表面覆盖一层保护层的的导热材料丝为镀银铜丝。
  7. 根据权利要求1、2、3、4、5、和6所述的LED的散热装置，其特征在于：所述导热材料的柱状体或所述导热材料丝被安置在能流通空气的管道里；管道内接入风机，依靠风机推动空气流通，带走热量。
  8. 根据权利要求1、2、3、4、5、和6所述的LED的散热装置，其特征在于：所述导热材料的柱状体或所述导热材料丝被安置在能流通空气的管道里；所述管道的出口和入口之间存在一定的高度差，利用空气受热膨胀变轻，导致出口和入口之间产生的压差，推动空气流通，带走热量。
  9. 根据权利要求8所述的LED的散热装置，其特征在于：该装置还包括一段专门流通空气的管道，用以储存被加热的空气；所述专门流通空气的管道的出口和入口之间存在一定的高度差，利用空气受热膨胀变轻，进一步形成压差，加速推动空气流通，带走热量。
  10. 根据权利要求7、8、9所述的LED的散热装置，其特征在于：所述管道由绝缘材料构成，以确保整个散热装置对地的绝缘。
PCT/CN2015/083294 2014-07-04 2015-07-03 一种led的散热装置 Ceased WO2016000662A1 (zh)

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US15/320,837 US20170162772A1 (en) 2014-07-04 2015-07-03 Heat-dissipation device of led
KR1020167036876A KR101938466B1 (ko) 2014-07-04 2015-07-03 Led 방열 장치
JP2016576040A JP6587641B2 (ja) 2014-07-04 2015-07-03 Ｌｅｄの放熱装置
US17/484,559 US20220010952A1 (en) 2014-07-04 2021-09-24 Heat-dissipation device of led

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US20170162772A1 (en) 2017-06-08
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KR101938466B1 (ko) 2019-01-14
EP3166153B1 (en) 2018-10-24
EP3166153A4 (en) 2017-05-10
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