WO2016041320A1 - 超声聚焦换能器以及超声聚焦治疗头 - Google Patents

超声聚焦换能器以及超声聚焦治疗头 Download PDF

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Publication number
WO2016041320A1
WO2016041320A1 PCT/CN2015/072706 CN2015072706W WO2016041320A1 WO 2016041320 A1 WO2016041320 A1 WO 2016041320A1 CN 2015072706 W CN2015072706 W CN 2015072706W WO 2016041320 A1 WO2016041320 A1 WO 2016041320A1
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WO
WIPO (PCT)
Prior art keywords
piezoelectric ceramic
ceramic wafer
hole
power cable
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/072706
Other languages
English (en)
French (fr)
Inventor
张学勇
乔宪波
张激
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN PRO-HIFU MEDICAL TECH Co Ltd
Original Assignee
SHENZHEN PRO-HIFU MEDICAL TECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN PRO-HIFU MEDICAL TECH Co Ltd filed Critical SHENZHEN PRO-HIFU MEDICAL TECH Co Ltd
Priority to EP15841875.6A priority Critical patent/EP3195903B1/en
Priority to KR1020177010399A priority patent/KR20170056678A/ko
Priority to ES15841875T priority patent/ES2874520T3/es
Publication of WO2016041320A1 publication Critical patent/WO2016041320A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N7/00—Ultrasound therapy
    • A61N7/02—Localised ultrasound hyperthermia
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/04—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00571—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for achieving a particular surgical effect
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N7/00—Ultrasound therapy
    • A61N2007/0056—Beam shaping elements
    • A61N2007/0065—Concave transducers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N7/00—Ultrasound therapy
    • A61N7/02—Localised ultrasound hyperthermia
    • A61N2007/025—Localised ultrasound hyperthermia interstitial

Definitions

  • the present invention relates to the field of ultrasonic medical device technology, and in particular, to an ultrasonic focusing transducer and an ultrasonic focusing treatment head.
  • Ultrasound therapy has the advantages of non-invasive, high-efficiency, controllable, etc.
  • the ultrasound can be used to heat the tumor to an effective therapeutic temperature.
  • Ultrasound focusing transducers can be applied to gynecological diseases, liver cancer, breast cancer, pancreatic cancer, kidney cancer, soft tissue tumors and the like.
  • the ultrasound focused treatment head includes an ultrasound focus transducer and a probe housed within the ultrasound focus transducer, which is typically a cardiac probe.
  • the ultrasonic focusing transducer converts high-frequency electric energy into ultrasonic waves of the same frequency through a piezoelectric ceramic wafer, and then realizes a therapeutic function by ultrasonic waves, and at the same time, the cardiac probe monitors the entire treatment process during the treatment, and transmits the B-ultrasound image in real time.
  • the ultrasonic focusing transducer comprises a piezoelectric ceramic wafer and a bracket for mounting and supporting the piezoelectric ceramic wafer, the bracket is provided with a mounting hole for mounting a heart probe, and between the piezoelectric ceramic wafer and the bracket A sealed air cavity is formed.
  • the piezoelectric ceramic wafer Since the piezoelectric ceramic wafer is fixed on the bracket by adhesive means, under the influence of the high frequency vibration of the piezoelectric ceramic wafer, the sealing effect of the adhesive is poor, affecting the airtightness of the air cavity, resulting in ultrasonication.
  • the stability of the focusing transducer is not high, affecting the life of the ultrasonic focusing transducer.
  • the main object of the present invention is to solve the technical problem that the air cavity between the piezoelectric ceramic wafer and the holder of the ultrasonic focusing transducer is not well sealed.
  • the present invention provides an ultrasonic focusing transducer including a housing and a piezoelectric ceramic wafer housed in the housing, a fixed seal, and a bracket having a mounting hole;
  • the piezoelectric ceramic wafer has a spheroidal shape and has a spherical-shaped through-hole, and the spherical-shaped through-hole has two opposite circular first side openings and a second side opening, wherein the first side opening has a smaller aperture An aperture of the second side opening, one end of the second side opening of the piezoelectric ceramic wafer is in contact with an inner end of the outer casing, and one end of the first side opening of the piezoelectric ceramic wafer faces the other end of the outer casing;
  • the fixing seal is an annular body mounted on an inner surface of the outer casing and abutting against the piezoelectric ceramic wafer for sealing connection with the bracket;
  • the bracket has a clamping portion, the clip The holding portion is configured to press and clamp a circumference of the first
  • the bracket includes a connecting barrel and a core tube, an inner surface of one end of the connecting barrel is sleeved on an outer surface of one end of the core tube, and the clamping portion is formed on the core tube and the Connect between the barrels.
  • the connecting barrel comprises a first cylinder body, an annular connecting portion and a second cylinder body
  • the first cylinder body has a first end portion and a second end portion
  • the annular connecting portion is formed by the second end a portion extending radially inwardly, the second barrel extending from an inner circumference of the annular connection portion away from the second end portion
  • the core tube including a tube body and the tube body a ring piece formed by extending radially outwardly at one end
  • an inner surface of the second barrel is sleeved on an outer surface of the tube body, and the clamping portion is formed at an end portion of the second barrel body Between the rings.
  • a first internal thread is formed on an inner surface of the second cylinder
  • a first external thread is formed on an outer surface of the tubular body
  • the second cylinder and the core tube pass the first An internal thread is engaged with the first external thread to achieve a sealed connection.
  • the piezoelectric ceramic wafer has a convex first side and a recessed second side, and the piezoelectric ceramic wafer includes a ceramic region and a plating region outside the ceramic region, the ceramic region is annular and a circumference around the first side opening is disposed on the first side; the material of the bracket is a conductive material, an end of the second barrel is in contact with the ceramic area, and the ring piece serves as a negative electrode Resisting on the plating zone on the second side.
  • the ultrasonic focusing transducer further comprises a power cable electrically connected to a plating zone of the piezoelectric ceramic wafer, the power cable comprising a negative power cable and a positive power cable, the connecting cylinder further comprising a setting a cable hole and a first conductive hole are formed in the extending portion of the first cylindrical body, and one end of the negative power cable is electrically connected to the first conductive hole, The other end of the negative power cable passes through the cable hole.
  • the fixed seal comprises an inner pressure ring and a ring baffle
  • the inner pressure ring comprises a ring body and an abutting portion extending axially from one end of the ring body, the outer surface of the ring body and The inner surface of the outer casing is fixedly connected
  • the annular baffle is sealingly fixed on an inner circumference of the ring body, and the abutting portion abuts on the first side surface of the piezoelectric ceramic wafer.
  • the outer surface of the ring body is formed with a second external thread
  • the inner surface of the outer casing is formed with a second internal thread
  • the inner pressure ring and the outer casing pass through the second external thread
  • the inner thread of the annular inner baffle is in contact with the outer surface of the first cylinder and is fixedly connected by gluing;
  • the material of the inner pressure ring is electrically conductive a second conductive hole and a side hole are formed in the ring body
  • the positive power cable includes a first positive power cable and a second positive power cable, and one end of the first positive power cable is electrically connected to the On the plated region of the first side of the piezoelectric ceramic wafer, the other end of the first positive power cable is electrically sealed and connected to the side hole, and one end of the second positive power cable is electrically connected to the first On the two conductive holes, the other end of the second positive power cable passes through the cable hole.
  • the present invention also provides an ultrasonic focusing treatment head comprising a B-ultrasound probe and an ultrasonic focusing transducer as described above, the B-ultrasound probe being received in the mounting hole With the ball-shaped through hole.
  • the B-ultrasound probe comprises an abdominal probe.
  • the ultrasonic focusing transducer and the ultrasonic focusing treatment head of the present invention press and fix the piezoelectric ceramic wafer in the outer casing through a sealing fixture, and the clamping portion of the bracket presses and clamps the periphery of the first side opening of the piezoelectric ceramic wafer.
  • the piezoelectric ceramic wafer is not fixed by adhesive means, and the first side of the piezoelectric ceramic wafer forms a closed air cavity with the bracket and the sealing fixture, thereby overcoming the influence of the high frequency vibration of the piezoelectric ceramic wafer on the air cavity sealing property.
  • the air chamber has excellent sealing performance, which improves the stability of the product and prolongs the service life of the product.
  • FIG. 1 is a top plan view of an embodiment of an ultrasonic focus transducer of the present invention
  • Figure 2 is a cross-sectional view of the ultrasonic focusing transducer of Figure 1 taken along line A-A;
  • Figure 3 is an exploded perspective view of a portion of the components of the ultrasonic focusing transducer of Figure 2;
  • Figure 4 is a plan view of the outer casing of Figure 2;
  • Figure 5 is a cross-sectional view of the outer casing of Figure 4 taken along line C-C;
  • Figure 6 is a perspective view of the piezoelectric ceramic wafer of Figure 2;
  • Figure 7 is a perspective view of the connecting barrel of Figure 2;
  • Figure 8 is a plan view of the connecting barrel of Figure 7;
  • Figure 9 is a cross-sectional view of the connecting barrel of Figure 8 taken along line B-B;
  • Figure 10 is a perspective view of the core tube of Figure 2;
  • Figure 11 is a perspective view of the inner pressure ring of Figure 2;
  • Figure 12 is a plan view of the inner pressure ring of Figure 11;
  • Figure 13 is a cross-sectional view of the inner pressure ring of Figure 12 taken along line D-D;
  • Figure 14 is a perspective view of the annular baffle of Figure 2;
  • Figure 15 is a front elevational view of the first clamping portion or the second clamping portion of an embodiment of the ultrasonic focusing treatment head of the present invention.
  • Fig. 16 is a plan view showing the first nip portion and the second nip portion of Fig. 15 attached to the connecting cylinder.
  • the ultrasonic focusing transducer includes a housing 2 and a piezoelectric ceramic wafer 8 housed in the housing 2, fixed.
  • the seal 5 the power cable 10, the waterproof cable head 1, the bracket 3 having the mounting hole 30, and a sealing liquid (not shown).
  • the outer casing 2 has a cylindrical shape, and includes a side wall 20 and an annular convex portion 22 extending radially inward from one end of the side wall 20 .
  • the cylindrical outer casing 2 is formed with two oppositely disposed openings, one opening being a first opening 24 formed by the annular convex portion 22 and the other opening being a second opening 28 formed by the end of the side wall 20 away from the annular convex portion 22.
  • An inner surface of the outer casing 2 connected to the annular convex portion 22 forms a first step 23 radially inwardly, and an inner surface of the outer casing 2 between the second opening 28 and the first step 23
  • a second step 21 is formed radially inward, the aperture of the first step 23 being smaller than the aperture of the second step 21, and the aperture of the annular protrusion 22 being smaller than the aperture of the first step 23.
  • a second internal thread 26 is formed on the inner surface of the outer casing 2, and the second internal thread 26 is formed on the wall of the second step 21.
  • the piezoelectric ceramic wafer 8 has a spherical shape and has a spherical-shaped through-hole, and the spherical-shaped through-hole has two opposite circular first side openings 84 and a second side.
  • An opening (not labeled), wherein the aperture of the first side opening 84 is smaller than the aperture of the second side opening.
  • the piezoelectric ceramic wafer 8 is convex toward the second opening 28, the piezoelectric ceramic wafer 8 having a first side 86 facing the second opening 28, having a first opening 24 facing away from the first side
  • the second side 88 of the 86 is shown in FIG.
  • the aperture of the first side opening 84 is preferably 55 mm, and the aperture of the second side opening is preferably 115 mm.
  • the piezoelectric ceramic wafer 8 is made of a metasilicate ceramic, which includes a ceramic region 80 and a plating region 82, wherein the ceramic region 80 is such that the surface of the piezoelectric ceramic wafer 8 is not plated with any metal. a region, in particular, the ceramic region 80 is annular and disposed on a first side 86 of the piezoelectric ceramic wafer 8 around a circumference of the first side opening 84; the plating region 82 is the piezoelectric ceramic The surface of the wafer 8 is plated with a region of silver. Specifically, the plated region 82 is located outside the ceramic region 80, and the plated region 82 is used to electrically connect the power cable 10.
  • the power cable 10 is electrically connected to the plating region 82 of the piezoelectric ceramic wafer 8, which includes a positive power cable and a negative power cable 16, wherein the positive power cable A first positive power cable 12 and a second positive power cable 14 are included, the second positive power cable 14 and the negative power cable 16 are connected to the waterproof cable head 1 through which the waterproof cable head 1 is the piezoelectric ceramic chip 8 A high-frequency voltage is supplied to vibrate the piezoelectric ceramic wafer 8 to output ultrasonic waves of the same frequency.
  • the material of the bracket 3 is a conductive material, preferably brass.
  • the bracket 3 includes a connecting barrel 4 and a core tube 6, and the connecting barrel 4 is sleeved with the core tube 6 to form a clamping portion 32 and a mounting hole 30.
  • the clamping portion 32 is used for squeezing Pressing the periphery of the first side opening 84 to fix the bracket 3 on the piezoelectric ceramic wafer 8, the mounting hole 30 mating with the first side opening 84 of the piezoelectric ceramic wafer 8 for mounting B-ultrasound probe, which can be a heart probe or an abdomen probe.
  • the connecting barrel 4 includes a first barrel 40, an annular connecting portion 44, a second barrel 42 and an extension 46.
  • the first cylinder 40 includes a first end portion 41 and a second end portion 43.
  • the annular connecting portion 44 is formed by extending radially inwardly from the second end portion 43.
  • An inner circumference of the annular connecting portion 44 is formed to extend away from the second end portion 43.
  • the extending portion 46 includes two symmetrical segments, and the extending portion 46 is external to the first cylinder 40. Formed outside the extension.
  • a cable hole 48 and a first conductive hole 49 are formed in the extending portion 46, and the waterproof cable head 1 is mounted on the cable hole 48.
  • a first internal thread (not labeled) is formed on the inner surface of the second cylinder 42 as shown in FIGS. 7 to 9.
  • the inner diameter of the first cylinder 40 in the connecting cylinder 4 is preferably 75 mm, and the inner diameter of the second cylinder 42 is preferably 55 mm.
  • the annular connecting portion 44 extends radially outward relative to a sidewall of the second cylindrical body 42 , and the first cylindrical body 40 is coupled to the annular connecting portion 44 and further increases relative to the second cylindrical body 42 .
  • the accommodating space of the connecting cylinder 4, that is, the first cylinder 40 and the annular connecting portion 44 form a larger accommodating space, so that the accommodating space can accommodate various types of B-ultrasound probes.
  • the ultrasound treatment process can be monitored with a higher resolution and larger abdominal probe, and the B-ultrasound image transmitted in real time is clearer, which improves the safety and accuracy of the treatment, thereby improving the treatment efficiency.
  • the core tube 6 includes a tube body 60 and a ring piece 62 extending radially outward from one end of the tube body 60; the outer surface of the tube body 60 has a first external thread 64, as shown in FIG. Shown.
  • a first internal thread of an inner surface of the second cylinder 42 is engaged with a first external thread 64 of an outer surface of the tubular body 60, and the clamping portion 32 is formed at an end of the second cylinder 42 Between the ring piece 62 and the ring piece 62.
  • the fixed seal 5 includes an inner pressure ring 50 and a ring baffle 52
  • the inner pressure ring 50 includes a ring body 500 and one end from the ring body 500.
  • An abutting portion 502 formed by axially extending, the abutting portion 502 is for pressing the first side surface 86 of the piezoelectric ceramic wafer 8, and the inner circumference of the other end of the ring body 500 is provided with a recess 504
  • the ring baffle 52 is carried on the recess 504 and is sealed and fixedly connected by gluing.
  • a second external thread 508 is formed on the outer surface of the ring body 500.
  • the inner pressure ring 50 is made of a conductive material, preferably brass, and the ring body 500 is provided with a second conductive hole 506 and a side hole 504.
  • the first positive power cable 12 is One end is electrically connected to the plating area 82 of the first side 86 of the piezoelectric ceramic chip 8, and the other end of the first positive power cable 12 is electrically sealed and connected to the side hole 504, the second One end of the positive power cable 14 is electrically connected to the second conductive hole 506, and the other end of the second positive power cable 14 is connected to the waterproof cable head 1.
  • the abutting portion 502 of the inner pressure ring 50 is fixed on the first side surface 86 of the piezoelectric ceramic wafer 8, wherein one end of the first positive power cable 12 is soldered to the piezoelectric ceramic The other end is sealed and fixed on the side hole 504 of the inner pressing ring 50, and the other end of the second positive power cable 14 is electrically connected to the inner pressing ring. 50 in the second conductive hole 506;
  • the inner pressure ring 50 and the piezoelectric ceramic wafer 8 as a whole are placed into the outer casing 2, the second outer thread 508 of the inner pressure ring 50 and the second inner portion of the outer casing 2
  • the thread 26 is fitted, and the inner pressure ring 50 is screwed so that one end of the second side opening of the piezoelectric ceramic wafer 8 abuts at the junction of the annular convex portion 22 and the side wall 20 of the outer casing 2 and the piezoelectric
  • One end of the first side opening 84 of the ceramic wafer 8 faces the other end of the outer casing 2 while the abutting portion 502 of the inner pressing ring 50 abuts against the first side 86 of the piezoelectric ceramic wafer 8, thereby fixing the An inner pressure ring 50, the piezoelectric ceramic wafer 8 is inside the outer casing 2;
  • the ring baffle 52 is carried on the concave platform 504 of the ring body 500 of the inner pressure ring 50, and is sealed and fixedly connected by gluing;
  • the end of the second cylinder 42 of the connecting cylinder 4 passes through the annular baffle 52 and abuts against the ceramic zone 80 of the piezoelectric ceramic wafer 8, the core tube 6 is The second side 88 of the piezoelectric ceramic wafer 8 is nested in the second cylinder 42 of the connecting cylinder 4, wherein the first external thread 64 on the outer surface of the tubular body 60 of the core tube 6 and the first The first internal thread of the inner surface of the second cylinder 42 cooperates to rotate and tighten the tubular body 60 in the second cylinder 42.
  • the ring piece 62 of the core tube 6 and the second cylinder 42 A clamping portion 32 is formed between the end portions, and the clamping portion 32 presses the periphery of the first side opening 84 of the piezoelectric ceramic wafer 8 , and the annular baffle 52 and the connecting barrel 4 A cylindrical body 40 is adhesively fixedly sealed between the cylinders 40; wherein the ultrasonic focusing transducer of the present embodiment fixes the piezoelectric ceramic wafer 8 in the outer casing 2 through the sealing fixture 5, and the clamping portion 32 of the bracket 3
  • the periphery of the first side opening 84 of the piezoelectric ceramic wafer 8 is squeezed, and the piezoelectric ceramic wafer 8 is not fixed by adhesive bonding, and the piezoelectric ceramic wafer 8 is densely formed with the holder 3 and the sealing member 5.
  • the sealed air chamber 7 overcomes the influence of the high frequency vibration of the piezoelectric ceramic wafer 8 on the tightness of the air chamber 7.
  • the air chamber 7 has excellent sealing performance, improves
  • one end of the negative power cable 16 is electrically connected to the first conductive hole 49 of the extending portion 46 of the connecting barrel 4, and the other end is connected to the waterproof cable head 1 installed in the cable hole 48.
  • the other end of the second positive power cable 14 is connected to the waterproof cable head 1; the negative power cable 16 connected to the waterproof cable head 1 is electrically connected to the extension portion 46 of the first cylinder 40,
  • the second cylinder 42 is electrically connected to the core tube 6 , and the ring piece 62 of the core tube 6 is electrically connected to the second side surface 88 of the piezoelectric ceramic wafer 8 , and the second barrel 42 is The end portion abuts against the insulating ceramic region 80.
  • the ring piece 62 of the core tube 6 is electrically connected indirectly to the negative power cable 16 through the connecting barrel 4, and the piezoelectric ceramic wafer 8 is provided as a negative electrode. Electrical energy, without the need for additional cable routing through the air cavity 7, avoiding the sealing of the air cavity 7 being affected;
  • the working principle of the ultrasonic focusing transducer of this embodiment is that one end of the first positive power cable 12 soldered to the plating region 82 of the first side 86 of the piezoelectric ceramic wafer 8 is a positive pole, and the first positive power is The other end of the cable 12 is electrically connected to the inner pressure ring 50.
  • the inner pressure ring 50 is electrically connected to one end of the second positive cable 14; the ring piece 62 of the core tube 6 is a negative electrode.
  • the connecting barrel 4 is electrically connected to one end of the negative power cable 16 as a conductor; therefore, the positive and negative electrodes provide a high frequency voltage to the piezoelectric ceramic chip 8 through the indirectly connected waterproof cable head 1
  • the piezoelectric ceramic wafer 8 converts a high frequency voltage into ultrasonic waves of the same frequency.
  • the present invention also provides an ultrasonic focusing treatment head.
  • the ultrasonic focusing treatment head includes a B-ultrasound probe and the above-mentioned ultrasonic focusing transducer, and the B-ultrasound probe is received in the mounting hole 30 and the In the ball-shaped through hole.
  • the B-ultrasound probe includes an abdominal probe.
  • the ultrasonic focusing treatment head has good sealing performance due to the air cavity of the ultrasonic focusing transducer, improves the stability of the product, prolongs the service life of the product, and can use the abdominal probe with higher definition and larger volume.
  • the ultrasound treatment process is monitored, and the B-ultrasound image transmitted in real time is clearer, which improves the safety and accuracy of the treatment, thereby improving the treatment efficiency of the ultrasound focused treatment head.
  • the ultrasonic focusing treatment head further includes a first clamping portion 90 and a second clamping portion 92, the first clamping portion 90 and the second clamping portion.
  • the portion 92 has the same structure, and the first clamping portion 90 is disposed opposite to the second clamping portion 92 and fixed to the first end portion 41 of the first cylinder 40 of the connecting cylinder 4 of the bracket 3
  • the first clamping portion 90 cooperates with the second clamping portion 92 for clamping the B-ultrasound probe.
  • the first clamping portion 90 cooperates with the second clamping portion 92, and the B-ultrasound probe protrudes from the connecting barrel 4 of the bracket 3.
  • the monitoring center of the B-ultrasound probe is in focus with the piezoelectric ceramic wafer, and the B-ultrasound probe is fixedly mounted in the ultrasonic focusing transducer under accurate positioning.
  • first clamping portion 90 has a first clamping surface
  • second clamping portion 92 has a second clamping surface
  • the first clamping surface is parallel to the second clamping surface and both are In the "work" shape, the first clamping surface cooperates with the second clamping surface for clamping the B-ultrasound probe.
  • the distance between the first clamping surface and the second clamping surface is greater than zero and smaller than the inner diameter of the first cylinder 40.
  • the inner diameter of the first cylinder 40 is preferably 75 mm.
  • the B-ultrasound probes of different specifications can be clamped.
  • the first clamping surface is The distance between the second clamping surfaces is small, and when the B-ultrasound probe is an abdominal probe, the distance between the first clamping surface and the second clamping surface is large.
  • An ultrasonic focusing transducer characterized in that the ultrasonic focusing transducer comprises a housing and a piezoelectric ceramic wafer housed in the housing, a fixed sealing member and a bracket having a mounting hole;
  • the piezoelectric ceramic wafer has a spherical shape and has a spherical-shaped through-hole, and the spherical-shaped through-hole has two opposite circular first side openings and a second side opening, wherein the first side opening has an aperture An aperture smaller than the opening of the second side, one end of the second side opening of the piezoelectric ceramic wafer is in contact with an inner end of the outer casing, and one end of the first side opening of the piezoelectric ceramic wafer faces the other end of the outer casing ;
  • the fixing seal is in the form of a torus, mounted on an inner surface of the outer casing and abutting against the piezoelectric ceramic wafer for sealing connection with the bracket;
  • the bracket has a clamping portion for pressing a periphery of a first side opening of the piezoelectric ceramic wafer and fixing the bracket on the piezoelectric ceramic wafer, the mounting hole Conducting with the spherical through hole;
  • the fixed seal, the bracket and the piezoelectric ceramic wafer are enclosed to form a closed air cavity.

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Abstract

一种超声聚焦换能器，包括外壳(2)以及容置于外壳(2)内的压电陶瓷晶片(8)、固定密封件(5)与支架(3)；压电陶瓷晶片(8)呈球台形且具有球台状通孔，球台状通孔具有第一侧开口(84)与第二侧开口，第一侧开口(84)的孔径小于第二侧开口的孔径，压电陶瓷晶片(8)的第二侧开口的一端抵触在外壳(2)的一端，压电陶瓷晶片(8)的第一侧开口(84)的一端朝向外壳(2)的另一端；固定密封件(5)呈圆环体，安装在外壳(2)的内表面上并抵触在压电陶瓷晶片(8)上，用于与支架(3)密封连接；支架(3)具有夹持部(32)，夹持部(32)用于挤压夹持压电陶瓷晶片(8)的第一侧开口(84)的周缘；固定密封件(5)、支架(3)与压电陶瓷晶片(8)围合形成密闭的空气腔，该空气腔的密封性好。一种超声聚焦治疗头包括B超探头以及上述的超声聚焦换能器。

Description

超声聚焦换能器以及超声聚焦治疗头 技术领域
本发明涉及超声医疗器械技术领域，尤其涉及一种超声聚焦换能器以及超声聚焦治疗头。
 背景技术
超声治疗具有无创、高效、可控等优势，通过超声聚焦技术使肿瘤能加热到有效的治疗温度。超声聚焦换能器可以应用于妇科疾病、肝癌、乳腺癌、胰腺癌、肾癌、软组织肿瘤等方面。
超声聚焦治疗头包括超声聚焦换能器以及容置于所述超声聚焦换能器内的探头，通常而言，该探头为心脏探头。所述超声聚焦换能器通过压电陶瓷晶片将高频电能转换为相同频率的超声波，然后通过超声波实现治疗功能，同时在治疗过程中心脏探头对整个治疗过程进行监控，实时传输B超图像。其中，所述超声聚焦换能器包括压电陶瓷晶片以及用于安装且支撑该压电陶瓷晶片的支架，该支架上开设有安装心脏探头的安装孔，该压电陶瓷晶片与该支架之间形成有密封的空气腔，由于压电陶瓷晶片采用胶粘方式固定在支架上，在压电陶瓷晶片高频振动的影响下，导致胶粘的密封效果差，影响空气腔的密闭性，造成超声聚焦换能器的稳定性不高，影响超声聚焦换能器的使用寿命。
上述内容仅用于辅助理解本发明的技术方案，并不代表承认上述内容是现有技术。
 技术问题
本发明的主要目的在于解决超声聚焦换能器的压电陶瓷晶片与支架之间的空气腔的密闭性不好的技术问题。
 技术解决方案
为实现上述目的，本发明提供一种超声聚焦换能器，所述超声聚焦换能器包括外壳以及容置于所述外壳内的压电陶瓷晶片、固定密封件与具有安装孔的支架；所述压电陶瓷晶片呈球台形且具有球台状通孔，所述球台状通孔具有两相对设置的圆形的第一侧开口与第二侧开口，其中，所述第一侧开口的孔径小于第二侧开口的孔径，所述压电陶瓷晶片的第二侧开口的一端抵触在所述外壳的内侧一端，所述压电陶瓷晶片的第一侧开口的一端朝向所述外壳的另一端；所述固定密封件呈圆环体，安装在所述外壳的内表面上并抵触在所述压电陶瓷晶片上，用于与所述支架密封连接；所述支架具有夹持部，所述夹持部用于挤压夹持所述压电陶瓷晶片的第一侧开口的周缘并固定所述支架在所述压电陶瓷晶片上，所述安装孔与所述球台状通孔导通；所述固定密封件、所述支架与所述压电陶瓷晶片围合形成密闭的空气腔。
优选地，所述支架包括连接筒以及芯管，所述连接筒的一端的内表面套设在所述芯管的一端的外表面上，所述夹持部形成于所述芯管与所述连接筒之间。
优选地，所述连接筒包括第一筒体、环形连接部以及第二筒体，所述第一筒体具有第一端部以及第二端部，所述环形连接部由所述第二端部径向向内延伸形成，所述第二筒体自所述环形连接部的内周缘朝向远离所述第二端部的方向延伸形成；所述芯管包括管体以及自所述管体的一端径向向外延伸形成的环片；所述第二筒体的内表面套设在所述管体的外表面上，所述夹持部形成于所述第二筒体的端部与所述环片之间。
优选地，所述第二筒体的内表面上形成有第一内螺纹，所述管体的外表面上形成有第一外螺纹，所述第二筒体与所述芯管通过所述第一内螺纹与所述第一外螺纹的配合实现密封连接。
优选地，所述压电陶瓷晶片具有凸起的第一侧面以及凹陷的第二侧面，所述压电陶瓷晶片包括陶瓷区以及所述陶瓷区之外的镀层区，所述陶瓷区呈环形并围绕所述第一侧开口的周缘设置在所述第一侧面上；所述支架的材质为导电材质，所述第二筒体的端部抵触在所述陶瓷区上，所述环片作为负极抵触在所述第二侧面的镀层区上。
优选地，所述超声聚焦换能器还包括电性连接在所述压电陶瓷晶片的镀层区上的功率电缆，所述功率电缆包括负极功率电缆以及正极功率电缆，所述连接筒还包括设置在所述第一筒体的外表面上的延伸部，所述延伸部上开设有电缆孔以及第一导电孔，所述负极功率电缆的一端与所述第一导电孔电性连接，所述负极功率电缆的另一端经过所述电缆孔。
优选地，所述固定密封件包括内压圈以及圆环挡板，所述内压圈包括圈体以及自所述圈体的一端轴向延伸形成的抵触部，所述圈体的外表面与所述外壳的内表面固定连接，所述圆环挡板密封固定在所述圈体的内周缘上，所述抵触部抵触在所述压电陶瓷晶片的第一侧面上。
优选地，所述圈体的外表面上形成有第二外螺纹，所述外壳的内表面上形成有第二内螺纹，所述内压圈与所述外壳通过所述第二外螺纹与所述第二内螺纹的配合实现固定连接，所述圆环挡板的内表面与所述第一筒体的外表面接触配合并通过胶粘方式密封固定连接；所述内压圈的材质为导电材质，所述圈体上开设有第二导电孔以及侧孔，所述正极功率电缆包括第一正极功率电缆以及第二正极功率电缆，所述第一正极功率电缆的一端电性连接在所述压电陶瓷晶片的第一侧面的镀层区上，所述第一正极功率电缆的另一端电性密封连接在所述侧孔上，所述第二正极功率电缆的一端电性连接在所述第二导电孔上，第二正极功率电缆的另一端穿过所述电缆孔。
此外，为实现上述目的，本发明还提供一种超声聚焦治疗头，所述超声聚焦治疗头包括B超探头以及如上所述的超声聚焦换能器，所述B超探头收容于所述安装孔与所述球台状通孔中。
优选地，所述B超探头包括腹部探头。
 有益效果
本发明的超声聚焦换能器以及超声聚焦治疗头通过密封固定件将压电陶瓷晶片挤压固定在外壳内，支架的夹持部挤压夹持压电陶瓷晶片的第一侧开口的周缘，无需采用胶粘方式固定压电陶瓷晶片，压电陶瓷晶片的第一侧面与支架、密封固定件形成密闭的空气腔，克服了压电陶瓷晶片的高频振动对空气腔密封性的影响，该空气腔的密封性优，提高了产品的稳定性，延长了产品的使用寿命。
 附图说明
图1为本发明超声聚焦换能器的一实施例的俯视图；
图2为图1中的超声聚焦换能器沿A-A线的剖视图；
图3为图2中的超声聚焦换能器的部分元件的分解示意图；
图4为图2中的外壳的俯视图；
图5为图4中的外壳沿C-C线的剖视图;
图6为图2中的压电陶瓷晶片的立体示意图；
图7为图2中的连接筒的立体示意图；
图8为图7中的连接筒的俯视图；
图9为图8中的连接筒沿B-B线的剖视图；
图10为图2中的芯管的立体示意图；
图11为图2中的内压圈的立体示意图；
图12为图11中的内压圈的俯视图；
图13为图12中的内压圈沿D-D线的剖视图；
图14为图2中的环形挡板的立体示意图；
图15为本发明的超声聚焦治疗头的一实施例的第一夹持部或第二夹持部的主视图；
图16为图15中的第一夹持部和第二夹持部安装在连接筒时的俯视图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明提供一种超声聚焦换能器，参照图1至图3，在一实施例中，该超声聚焦换能器包括外壳2以及容置于所述外壳2内的压电陶瓷晶片8、固定密封件5、功率电缆10、防水电缆头1、具有安装孔30的支架3与密封液（未图示）。
参照图4及图5，在本实施例中，所述外壳2呈圆筒状，包括侧壁20以及自所述侧壁20的一端径向向内延伸形成的环形凸部22，所述呈圆筒状的外壳2形成两相对设置的开口，其一开口为环形凸部22形成的第一开口24，另一开口为侧壁20的远离环形凸部22的一端形成的第二开口28。与所述环形凸部22相连的所述外壳2的内表面径向向内形成第一台阶23，位于所述第二开口28与所述第一台阶23之间的所述外壳2的内表面径向向内形成第二台阶21，所述第一台阶23的孔径小于第二台阶21的孔径，所述环形凸部22的孔径小于第一台阶23的孔径。此外，所述外壳2的内表面上形成有第二内螺纹26，所述第二内螺纹26形成于所述第二台阶21的孔壁上。
参照图6，在本实施例中，所述压电陶瓷晶片8呈球台形且具有球台状通孔，所述球台状通孔具有两相对设置的圆形的第一侧开口84与第二侧开口（未标记），其中，所述第一侧开口84的孔径小于第二侧开口的孔径。压电陶瓷晶片8凸起朝向所述第二开口28，所述压电陶瓷晶片8具有朝向所述第二开口28的第一侧面86，具有朝向所述第一开口24且背对第一侧面86的第二侧面88，如图3所示。其中，所述第一侧开口84的孔径优选为55mm，所述第二侧开口的孔径优选为115mm。
进一步地，所述压电陶瓷晶片8由偏硅酸盐陶瓷制成，其包括陶瓷区80以及镀层区82，其中，所述陶瓷区80为所述压电陶瓷晶片8表面不镀任何金属的区域，具体地，所述陶瓷区80呈环形并设置在所述压电陶瓷晶片8的第一侧面86上围绕所述第一侧开口84的周缘；所述镀层区82为所述压电陶瓷晶片8表面镀有银的区域，具体地，所述镀层区82位于所述陶瓷区80之外的区域，所述镀层区82用于电性连接功率电缆10。
参照图2，在本实施例中，所述功率电缆10电性连接在所述压电陶瓷晶片8的镀层区82上，其包括正极功率电缆以及负极功率电缆16，其中，所述正极功率电缆包括第一正极功率电缆12以及第二正极功率电缆14，所述第二正极功率电缆14与所述负极功率电缆16连接至防水电缆头1内，通过防水电缆头1为所述压电陶瓷晶片8提供高频电压，使所述压电陶瓷晶片8振动进而输出相同频率的超声波。
参照图7至图10，在本实施例中，所述支架3的材质为导电材料，优选黄铜。所述支架3包括连接筒4和芯管6，所述连接筒4与芯管6拼套而形成夹持部32和安装孔30，如图2所示，所述夹持部32用于挤压夹持所述第一侧开口84的周缘而固定所述支架3在所述压电陶瓷晶片8上，所述安装孔30配合所述压电陶瓷晶片8的第一侧开口84用于安装B超探头，该B超探头可以是心脏探头也可以是腹部探头。
进一步地，所述连接筒4包括第一筒体40、环形连接部44、第二筒体42以及延伸部46。所述第一筒体40包括第一端部41以及第二端部43，所述环形连接部44由所述第二端部43径向向内延伸形成，所述第二筒体42自所述环形连接部44的内周缘朝向远离所述第二端部43的方向延伸形成，所述延伸部46包括两个对称的扇片，所述延伸部46自所述第一筒体40的外表面向外延伸形成。所述延伸部46上开设有电缆孔48以及第一导电孔49，所述防水电缆头1安装在所述电缆孔48上。此外，所述第二筒体42的内表面上形成有第一内螺纹（未标记），如图7至图9所示。
所述连接筒4中所述第一筒体40的内径优选为75mm，所述第二筒体42的内径优选为55mm。所述环形连接部44相对于所述第二筒体42的侧壁径向向外延伸，所述第一筒体40与所述环形连接部44连接，进而相对于第二筒体42增大了所述连接筒4的容置空间，即所述第一筒体40与所述环形连接部44形成了更大的容置空间，使得该容置空间可以容置各种类型的B超探头，即可以使用清晰度更高、体积更大的腹部探头对超声治疗过程进行监控，实时传输的B超图像更清晰，提高了治疗的安全性和准确性，进而提高了治疗效率。
进一步地，所述芯管6包括管体60以及自所述管体60的一端径向向外延伸形成的环片62；所述管体60的外表面具有第一外螺纹64，如图10所示。
所述第二筒体42的内表面的第一内螺纹与所述管体60的外表面的第一外螺纹64配合，所述夹持部32形成于所述第二筒体42的端部与所述环片62之间。
参照图11至图14，在本实施例中，所述固定密封件5包括内压圈50以及圆环挡板52，所述内压圈50包括圈体500以及自所述圈体500的一端轴向延伸形成的抵靠部502，所述抵靠部502用于抵压所述压电陶瓷晶片8的第一侧面86，所述圈体500的另一端的内周缘上开设有凹台504，所述圆环挡板52承载在所述凹台504上并采用胶粘方式密封固定连接。所述圈体500的外表面上形成第二外螺纹508。
进一步地，所述内压圈50的材质为导电材料，优选黄铜，所述圈体500上开设有第二导电孔506以及侧孔504，参照图2，所述第一正极功率电缆12的一端电性连接在所述压电陶瓷晶片8的第一侧面86的镀层区82上，所述第一正极功率电缆12的另一端电性密封连接在所述侧孔504上，所述第二正极功率电缆14的一端电性连接在所述第二导电孔506上，第二正极功率电缆14的另一端连接在防水电缆头1上。
本实施例的超声聚焦换能器的组装过程如下：
S1、将所述内压圈50的抵靠部502固定在所述压电陶瓷晶片8的第一侧面86上，其中，将所述第一正极功率电缆12的一端焊接在所述压电陶瓷晶片8的第一侧面86的镀层区82上，另一端密封固定在所述内压圈50的侧孔504上，将所述第二正极功率电缆14的一端电性连接在所述内压圈50的第二导电孔506内；
S2、将所述内压圈50与所述压电陶瓷晶片8作为一个整体，放置入所述外壳2内，所述内压圈50的第二外螺纹508与所述外壳2的第二内螺纹26配合，旋拧所述内压圈50使所述压电陶瓷晶片8的第二侧开口的一端抵触在所述外壳2的环形凸部22与侧壁20的连接处且所述压电陶瓷晶片8的第一侧开口84的一端朝向所述外壳2的另一端，同时所述内压圈50的抵靠部502抵触所述压电陶瓷晶片8的第一侧面86，进而固定所述内压圈50、所述压电陶瓷晶片8在所述外壳2内；
S3、所述圆环挡板52承载在所述内压圈50的圈体500的凹台504上，并采用胶粘方式密封固定连接；
S4、所述连接筒4的第二筒体42的端部穿过所述圆环挡板52并抵靠在所述压电陶瓷晶片8的陶瓷区80上，所述芯管6自所述压电陶瓷晶片8的第二侧面88套入所述连接筒4的第二筒体42内，其中，所述芯管6的管体60的外表面上的第一外螺纹64与所述第二筒体42的内表面的第一内螺纹配合，使所述管体60旋转并拧紧在所述第二筒体42内，所述芯管6的环片62与所述第二筒体42的端部之间形成夹持部32，所述夹持部32挤压夹持所述压电陶瓷晶片8的第一侧开口84的周缘，所述圆环挡板52与连接筒4的第一筒体40之间采用胶粘方式固定密封连接；其中，本实施例的超声聚焦换能器通过密封固定件5将压电陶瓷晶片8固定在外壳2内，且支架3的夹持部32挤压夹持压电陶瓷晶片8的第一侧开口84的周缘，无需采用胶粘方式固定压电陶瓷晶片8，进而压电陶瓷晶片8与支架3、密封固定件5形成密封的空气腔7，克服了压电陶瓷晶片8的高频振动对空气腔7密封性的影响，该空气腔7的密封性优，提高了产品的稳定性，延长了超声聚焦换能器的使用寿命；
S5、将所述负极功率电缆16的一端电性连接在所述连接筒4的延伸部46的第一导电孔49内，另一端与安装在所述电缆孔48内的防水电缆头1连接，所述第二正极功率电缆14的另一端与所述防水电缆头1连接；连接在防水电缆头1上的负极功率电缆16与所述第一筒体40的延伸部46电性连接，所述第二筒体42与所述芯管6电性连接，所述芯管6的环片62与所述压电陶瓷晶片8的第二侧面88电性连接，而所述第二筒体42的端部抵靠在绝缘的陶瓷区80内，因此，所述芯管6的环片62通过所述连接筒4间接与负极功率电缆16电性连接，作为负极为所述压电陶瓷晶片8提供电能，无需额外的电缆走线穿过所述空气腔7，避免了所述空气腔7的密封性受到影响；
S6、将密封液自所述延伸部46与所述外壳2之间形成的开口注入所述外壳2内，填充在所述外壳2、支架3与固定密封件5之间形成的空隙，该密封液凝固而进一步实现密封防水。
本实施例的超声聚焦换能器的工作原理为：所述第一正极功率电缆12焊接在所述压电陶瓷晶片8的第一侧面86的镀层区82上的一端为正极，第一正极功率电缆12的另一端密封电性连接所述内压圈50，所述内压圈50作为导体与所述第二正极电缆14的一端电性连接；所述芯管6的环片62为负极，所述连接筒4作为导体与所述负极功率电缆16的一端电性连接；因此，所述正极和负极通过间接连接的防水电缆头1为所述压电陶瓷晶片8提供高频电压，所述压电陶瓷晶片8将高频电压转换为相同频率的超声波。
本发明还提供一种超声聚焦治疗头，在本实施例中，所述超声聚焦治疗头包括B超探头以及上述的超声聚焦换能器，所述B超探头收容于所述安装孔30与所述球台状通孔中。
在本实施例中，所述B超探头包括腹部探头。
该超声聚焦治疗头由于其超声聚焦换能器的空气腔的密封性能好，提高了产品的稳定性，延长了产品的使用寿命长，同时其可以使用清晰度更高、体积更大的腹部探头对超声治疗过程进行监控，实时传输的B超图像更清晰，提高了治疗的安全性和准确性，进而提高了超声聚焦治疗头的治疗效率。
参照图15及图16，在本实施例中，所述超声聚焦治疗头还包括第一夹持部90以及第二夹持部92，所述第一夹持部90与所述第二夹持部92具有相同的结构，所述第一夹持部90与所述第二夹持部92相对设置并固定在所述支架3的连接筒4的第一筒体40的第一端部41上，所述第一夹持部90与所述第二夹持部92配合用于夹持B超探头。当B超探头容置在所述支架3的安装孔30内，所述第一夹持部90与所述第二夹持部92配合，将B超探头伸出所述支架3的连接筒4部分夹持固定，使B超探头的监控中心与所述压电陶瓷晶片的焦点对准，进而在准确定位的前提下固定安装所述B超探头在所述超声聚焦换能器内。
进一步地，所述第一夹持部90具有第一夹持面，所述第二夹持部92具有第二夹持面，所述第一夹持面与第二夹持面平行且均呈“工”形，所述第一夹持面与所述第二夹持面配合用于夹持B超探头。具体地，所述第一夹持面与所述第二夹持面之间的距离大于零且小于所述第一筒体40的内径。其中，所述第一筒体40的内径优选为75mm。
通过调节所述第一夹持面与所述第二夹持面之间的距离，从而可以夹持不同规格的B超探头，当B超探头为心脏探头时，所述第一夹持面与所述第二夹持面之间的距离小，当B超探头为腹部探头时，所述第一夹持面与所述第二夹持面之间的距离大。
以上仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。
一种超声聚焦换能器，其特征在于，所述超声聚焦换能器包括外壳以及容置于所述外壳内的压电陶瓷晶片、固定密封件与具有安装孔的支架；
所述压电陶瓷晶片呈球台形且具有球台状通孔，所述球台状通孔具有两相对设置的圆形的第一侧开口与第二侧开口，其中，所述第一侧开口的孔径小于第二侧开口的孔径，所述压电陶瓷晶片的第二侧开口的一端抵触在所述外壳的内侧一端，所述压电陶瓷晶片的第一侧开口的一端朝向所述外壳的另一端；
所述固定密封件呈圆环体，安装在所述外壳的内表面上并抵触在所述压电陶瓷晶片上，用于与所述支架密封连接；
所述支架具有夹持部，所述夹持部用于挤压夹持所述压电陶瓷晶片的第一侧开口的周缘并固定所述支架在所述压电陶瓷晶片上，所述安装孔与所述球台状通孔导通；
所述固定密封件、所述支架与所述压电陶瓷晶片围合形成密闭的空气腔。

Claims (10)

  1. 一种超声聚焦换能器，其特征在于，所述超声聚焦换能器包括外壳以及容置于所述外壳内的压电陶瓷晶片、固定密封件与具有安装孔的支架；
    所述压电陶瓷晶片呈球台形且具有球台状通孔，所述球台状通孔具有两相对设置的圆形的第一侧开口与第二侧开口，其中，所述第一侧开口的孔径小于第二侧开口的孔径，所述压电陶瓷晶片的第二侧开口的一端抵触在所述外壳的内侧一端，所述压电陶瓷晶片的第一侧开口的一端朝向所述外壳的另一端；
    所述固定密封件呈圆环体，安装在所述外壳的内表面上并抵触在所述压电陶瓷晶片上，用于与所述支架密封连接；
    所述支架具有夹持部，所述夹持部用于挤压夹持所述压电陶瓷晶片的第一侧开口的周缘并固定所述支架在所述压电陶瓷晶片上，所述安装孔与所述球台状通孔导通；
    所述固定密封件、所述支架与所述压电陶瓷晶片围合形成密闭的空气腔。
  2. 如权利要求1所述的超声聚焦换能器，其特征在于，所述支架包括连接筒以及芯管，所述连接筒的一端的内表面套设在所述芯管的一端的外表面上，所述夹持部形成于所述芯管与所述连接筒之间。
  3. 如权利要求2所述的超声聚焦换能器，其特征在于，所述连接筒包括第一筒体、环形连接部以及第二筒体，所述第一筒体具有第一端部以及第二端部，所述环形连接部由所述第二端部径向向内延伸形成，所述第二筒体自所述环形连接部的内周缘朝向远离所述第二端部的方向延伸形成；所述芯管包括管体以及自所述管体的一端径向向外延伸形成的环片；所述第二筒体的内表面套设在所述管体的外表面上，所述夹持部形成于所述第二筒体的端部与所述环片之间。
  4. 如权利要求3所述的超声聚焦换能器，其特征在于，所述第二筒体的内表面上形成有第一内螺纹，所述管体的外表面上形成有第一外螺纹，所述第二筒体与所述芯管通过所述第一内螺纹与所述第一外螺纹的配合实现密封连接。
  5. 如权利要求3所述的超声聚焦换能器，其特征在于，所述压电陶瓷晶片具有凸起的第一侧面以及凹陷的第二侧面，所述压电陶瓷晶片包括陶瓷区以及所述陶瓷区之外的镀层区，所述陶瓷区呈环形并围绕所述第一侧开口的周缘设置在所述第一侧面上；所述支架的材质为导电材质，所述第二筒体的端部抵触在所述陶瓷区上，所述环片作为负极抵触在所述第二侧面的镀层区上。
  6. 如权利要求5所述的超声聚焦换能器，其特征在于，所述超声聚焦换能器还包括电性连接在所述压电陶瓷晶片的镀层区上的功率电缆，所述功率电缆包括负极功率电缆以及正极功率电缆，所述连接筒还包括设置在所述第一筒体的外表面上的延伸部，所述延伸部上开设有电缆孔以及第一导电孔，所述负极功率电缆的一端与所述第一导电孔电性连接，所述负极功率电缆的另一端经过所述电缆孔。
  7. 如权利要求6所述的超声聚焦换能器，其特征在于，所述固定密封件包括内压圈以及圆环挡板，所述内压圈包括圈体以及自所述圈体的一端轴向延伸形成的抵触部，所述圈体的外表面与所述外壳的内表面固定连接，所述圆环挡板密封固定在所述圈体的内周缘上，所述抵触部抵触在所述压电陶瓷晶片的第一侧面上。
  8. 如权利要求7所述的超声聚焦换能器，其特征在于，所述圈体的外表面上形成有第二外螺纹，所述外壳的内表面上形成有第二内螺纹，所述内压圈与所述外壳通过所述第二外螺纹与所述第二内螺纹的配合实现固定连接，所述圆环挡板的内表面与所述第一筒体的外表面接触配合并通过胶粘方式密封固定连接；所述内压圈的材质为导电材质，所述圈体上开设有第二导电孔以及侧孔，所述正极功率电缆包括第一正极功率电缆以及第二正极功率电缆，所述第一正极功率电缆的一端电性连接在所述压电陶瓷晶片的第一侧面的镀层区上，所述第一正极功率电缆的另一端电性密封连接在所述侧孔上，所述第二正极功率电缆的一端电性连接在所述第二导电孔上，第二正极功率电缆的另一端穿过所述电缆孔。
  9. 一种超声聚焦治疗头，其特征在于，所述超声聚焦治疗头包括B超探头以及如权利要求1至8项任意一项所述的超声聚焦换能器，所述B超探头收容于所述安装孔与所述球台状通孔中。
  10. 如权利要求9所述超声聚焦治疗头，其特征在于，所述B超探头包括腹部探头。
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EP3195903B1 (en) 2021-03-31
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CN104225811B (zh) 2017-09-19

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