WO2016070643A1 - 一种薄介质的无接触式检测方法及装置 - Google Patents

一种薄介质的无接触式检测方法及装置 Download PDF

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Publication number
WO2016070643A1
WO2016070643A1 PCT/CN2015/083512 CN2015083512W WO2016070643A1 WO 2016070643 A1 WO2016070643 A1 WO 2016070643A1 CN 2015083512 W CN2015083512 W CN 2015083512W WO 2016070643 A1 WO2016070643 A1 WO 2016070643A1
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WIPO (PCT)
Prior art keywords
light
thin medium
light source
processing module
signal processing
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Ceased
Application number
PCT/CN2015/083512
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English (en)
French (fr)
Inventor
金晓峰
刘建平
梁添才
龚文川
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GRG Banking Equipment Co Ltd
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GRG Banking Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GRG Banking Equipment Co Ltd filed Critical GRG Banking Equipment Co Ltd
Priority to RU2017118452A priority Critical patent/RU2667328C1/ru
Priority to US15/523,203 priority patent/US10113976B2/en
Priority to EP15857062.2A priority patent/EP3217166A4/en
Publication of WO2016070643A1 publication Critical patent/WO2016070643A1/zh
Anticipated expiration legal-status Critical
Priority to ZA2017/03116A priority patent/ZA201703116B/en
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
    • G07D7/06—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency using wave or particle radiation
    • G07D7/12—Visible light, infrared or ultraviolet radiation
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
    • G07D7/16—Testing the dimensions
    • G07D7/164—Thickness
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
    • G07D7/181—Testing mechanical properties or condition, e.g. wear or tear
    • G07D7/189—Detecting attached objects, e.g. tapes or clips

Definitions

  • the invention relates to the field of photoelectric detection technology, in particular to a contactless detection method and device for a thin medium.
  • banknotes In daily life and commercial activities, banknotes often have cornering and tearing during use. People often use tape or tissue and glue to bond damaged or torn banknotes and continue to use them. It is difficult to effectively detect the banknotes with foreign matter on the surface using traditional mechanical equipment. Paper money attached to foreign objects is likely to cause damage to the bank's money detector equipment and clearing identification equipment. If manual detection is used, manpower and time are wasted, and the detection efficiency is low. With the support of the state, the financial industry has put forward the requirement that “the RMB currency vouchers should be more than 70% new”, which has put a lot of pressure on the banknote recognition ability and level of financial self-service equipment.
  • the method for detecting foreign matter on the surface of the existing banknotes includes a mechanical thickness measuring device, an infrared detecting device and an ultrasonic detecting device, wherein the mechanical thickness measuring device has low measurement accuracy, and it is difficult to effectively detect thin foreign matter on the surface of the banknote.
  • the infrared detecting device has a narrow application surface and can only detect foreign objects having different reflection characteristics in different directions on the surface of the banknote, such as a transparent tape
  • the ultrasonic detecting device uses ultrasonic waves as a carrier, and has a technical problem of long measuring wavelength and low precision.
  • the embodiment of the invention provides a contactless detection method and device for a thin medium, which solves the problem that the existing mechanical thickness measuring device, the infrared detecting device and the ultrasonic detecting device perform foreign matter detection on a thin medium surface, resulting in low precision and measurement Technical problems with long wavelengths.
  • S3 Calculate a first optical path and a second optical path corresponding to the target ray and the reference ray according to the obtained target ray and the time when the reference ray reaches the line photodetector, and then pass the signal processing module according to the signal processing module. Preset calculation method to obtain the number of light and dark stripes of interference fringes;
  • the method further includes:
  • the first light is reflected by the thin medium into a target light
  • the second light is reflected back to the light splitting component through the reference plane for re-reflection into reference light.
  • the preset threshold is determined according to a maximum difference manner according to the oldest thin medium and the standard thin medium.
  • step S3 specifically includes:
  • the average number of interference fringes of the interference fringes is calculated according to the fourth formula according to the fourth formula.
  • step S4 includes:
  • the thin medium surface has foreign matter, if the comparison result is not greater than the preset threshold and not less than zero , Then there is no foreign matter on the surface of the thin medium.
  • t1 is the time from when the light source is turned on until the reference light reaches the line photodetector
  • t2 is the time when the target light is turned on from the light source to reach the line photodetector
  • the third formula is the number of bright and dark stripes of the interference fringe
  • M is the total number of lines of the optical signal of the light source
  • N is the number of photosensitive cells of the line photodetector
  • ⁇ 0 is the wavelength of the light source
  • the fourth formula is that the number of bright and dark stripes of the interference fringes is the average value of the interference fringes
  • a non-contact detecting device for a thin medium includes: a light source, a beam splitting component, a reference plane, a line photodetector, a signal processing module and a thin medium;
  • the light source, the light splitting component is located at the same horizontal line position as the reference plane;
  • the signal processing module, the photoelectric technology module, the light splitting component is located at the same vertical line position as the thin medium
  • the line photodetector is located between the signal processing module and the beam splitting component;
  • the light splitting member is inclined.
  • the light source is configured to emit light to the beam splitting component to divide the light into a first light reflected at the thin medium, and a second light transmitted to the reference plane;
  • the thin medium is configured to reflect the first light to the signal processing module for signal extraction;
  • the reference plane is configured to reflect the second light back to the beam splitting component and to be received by the signal processing module for signal extraction;
  • the line photodetector is mounted above the signal processing module for recording the time when the target light and the reference light respectively reach the line photodetector after the light source is turned on.
  • the thin medium contactless detecting device further comprises a transparent member placed under the thin medium.
  • a lens array is mounted between the line photodetector and the beam splitting member.
  • the non-contact detecting device of the thin medium further comprises:
  • the outer frame has two inner walls respectively mounted with the light source and the reference plane, the top is provided with a transparent member placed under the thin medium, the inner bottom is provided with an inner groove, and the inner groove is provided with a wired column Photodetector;
  • the signal processing module is disposed at the bottom of the outer frame.
  • a contactless detection method and apparatus for a thin medium includes: S1: acquiring a time when a target light reflected by the light source and reflected by the thin medium reaches the line photodetector; S2: obtaining time when the reference light reflected by the light source is reflected by the reference plane reaches the line photodetector; S3: calculating the target light and the reference light according to the time of the acquired target light and the reference light reaching the line photodetector An optical path and a second optical path are respectively obtained by the signal processing module according to a preset calculation manner to obtain the number of light and dark stripes of the interference fringe; S4: the number of the light and dark stripes of the interference fringe and the number of the standard interference fringes and the dark and dark stripes are different according to a preset manner Value method comparison, if the comparison result is greater than the preset threshold, foreign matter exists on the surface of the thin medium.
  • the first optical path and the second optical path corresponding to the target ray and the reference ray are calculated, and then calculated according to presets by the signal processing module.
  • the method obtains the number of light and dark stripes of the interference fringe, and performs the difference method comparison according to the preset manner. If the comparison result is greater than the preset threshold, the foreign matter exists on the surface of the thin medium, thereby solving the existing mechanical thickness measuring device and the infrared detecting device.
  • the ultrasonic detecting device performs the detection of foreign matter on the surface of the thin medium, and the mechanical thickness measuring device has low measurement precision, and it is difficult to effectively detect the technical problem of thin foreign matter on the surface of the banknote, and the application surface of the infrared detecting device is narrow, and only the surface of the banknote can be differently oriented.
  • the technical problem of detecting foreign matter having different reflection characteristics, and the ultrasonic detecting device using ultrasonic waves as carriers, have technical problems of long measuring wavelength and low precision.
  • FIG. 1 is a schematic flow chart of an embodiment of a contactless detection method for a thin medium according to an embodiment of the present invention
  • FIG. 2 is a schematic flow chart of another embodiment of a contactless detection method for a thin medium according to an embodiment of the present invention
  • FIG. 3 is a schematic structural view of an embodiment of a contactless detecting device for a thin medium according to an embodiment of the present invention
  • FIG. 4 is a schematic structural view of another embodiment of a contactless detecting device for a thin medium according to an embodiment of the present invention.
  • 3 and 4 illustrate: light source 1; beam splitting member 2; reference plane 3; signal processing module 4; thin medium 5; line photodetector 6; transparent member 7; lens array 8; outer frame 9; Groove 10.
  • the embodiment of the invention provides a contactless detection method and device for a thin medium, which solves the problem that the existing mechanical thickness measuring device, the infrared detecting device and the ultrasonic detecting device perform foreign matter detection on a thin medium surface, resulting in low precision and measurement Technical problems with long wavelengths.
  • an embodiment of a contactless detection method for a thin medium provided in an embodiment of the present invention includes:
  • the aforementioned light source may be a laser source, and further may be a line laser source.
  • the aforementioned reference plane can be a mirror.
  • S3 Calculate the first optical path and the second optical path corresponding to the target ray and the reference ray according to the time when the acquired target ray and the reference ray reach the line photodetector, and then obtain the interference according to the preset calculation manner by the signal processing module. Stripe light and dark stripes number;
  • the target light reflected by the light source of the light source After acquiring the time when the target light reflected by the light source of the light source is reflected by the thin medium reaches the line photodetector, and the time when the reference light reflected by the reference light reflected by the reference plane reaches the line photodetector, it needs to be obtained according to the obtained time.
  • the target light and the reference light reach the time of the line photodetector, and the first light path and the second light path corresponding to the target light and the reference light are calculated, and then the number of light and dark stripes of the interference fringe is obtained by the signal processing module according to a preset calculation manner.
  • the acquired reference light can be passed through the lens array, and then received by the line photodetector to record the time from when the starting light source reaches the reference light to the line photodetector and transmitted to the signal processing module.
  • the signal processing module After obtaining the number of light and dark stripes of the interference fringe according to the preset calculation manner by the signal processing module, it is necessary to compare the number of the interference fringe bright and dark stripes with the standard interference fringe bright and dark stripes according to a preset method, if the comparison result Above the preset threshold, there is foreign matter on the surface of the thin medium. It can be understood that the aforementioned preset threshold is determined according to the maximum difference between the oldest thin medium and the standard thin medium. It should be noted that the aforementioned standard interference fringe light and dark stripes number is in progress Prior to the contactless detection method of the thin medium in the present embodiment, the interference fringe information acquired for the standard thin medium is performed according to steps S1 to S3.
  • the first optical path and the second optical path corresponding to the target ray and the reference ray are calculated, and then calculated according to presets by the signal processing module.
  • the method obtains the number of light and dark stripes of the interference fringe, and performs the difference method comparison according to the preset manner. If the comparison result is greater than the preset threshold, the foreign matter exists on the surface of the thin medium, thereby solving the existing mechanical thickness measuring device and the infrared detecting device.
  • the ultrasonic detecting device performs the detection of foreign matter on the surface of the thin medium, and the mechanical thickness measuring device has low measurement precision, and it is difficult to effectively detect the technical problem of thin foreign matter on the surface of the banknote, and the application surface of the infrared detecting device is narrow, and only the surface of the banknote can be differently oriented.
  • the technical problem of detecting foreign matter having different reflection characteristics, and the ultrasonic detecting device using ultrasonic waves as carriers, have technical problems of long measuring wavelength and low precision.
  • FIG. 2 another embodiment of a contactless detection method for a thin medium provided in an embodiment of the present invention includes:
  • a light source is activated, such that the emitted light of the light source splits the light into a first light reflected at the thin medium and a second light transmitted to the reference plane under the action of the light splitting component;
  • the light source when it is required to detect whether there is foreign matter on the surface of the thin medium, for example, the banknote, the light source needs to be activated first, so that the emitted light of the light source is divided into the thin medium by the light splitting component.
  • the aforementioned light source may be a laser light source, and may further be a line laser light source.
  • the foregoing first light is reflected by the thin medium into the target light, and the second light is reflected back to the light splitting component through the reference plane for re-reflection into the reference light.
  • the light emitted by the light source splits the light into the first light at the thin medium under the action of the light splitting component, and after transmitting the second light at the reference plane, it is first necessary to acquire the light emitted by the light source.
  • the time when the target light reflected by the thin medium reaches the line photodetector, the time may be obtained by the line photodetector, and the foregoing light source may be a laser light source, and further may be a line laser light source.
  • the acquired target light may be passed through the lens array, and then the light source is activated by the line photodetector to the time when the target light reaches the line photodetector and transmitted to the signal processing module.
  • the aforementioned reference plane can be a mirror.
  • the acquired reference light may be passed through the lens array, and then the light source is turned on by the line photodetector to the time when the reference light reaches the line photodetector and transmitted to the signal processing module.
  • the first formula is required according to the first formula.
  • the first optical path of the reference ray is calculated according to the time when the reference ray reaches the line photodetector, and the second optical path of the target ray is calculated according to the second formula and the time when the target ray reaches the line photodetector.
  • first optical path ⁇ 1 ct 1
  • second optical path ⁇ 2 ct 2 ;
  • t1 is the time from when the light source is turned on until the reference light reaches the line photodetector
  • t2 is the time from when the light source turns on the target light to reach the line photodetector
  • the number calculates the number of light and dark stripes of the interference fringes according to the third formula.
  • M is the total number of lines of the optical signal line scan of the light source
  • N is the number of photosensitive cells of the line photodetector line photodetector
  • ⁇ 0 is the wavelength of the light source.
  • the number of times of the interference fringe change described above is a change in the number of times the interference fringe is bright or dark, and is a phenomenon of laser interference caused by a change in optical path difference.
  • Laser interference refers to a phenomenon that occurs when two or more columns of light waves of the same frequency, the same vibration phase, and the same constant phase difference meet each other in the overlapping area of space.
  • the visual representation is that the intensity of the light field is in a certain Some areas have always been strengthened, and in other areas, they have been weakened, forming a stable distribution of strong and weak, that is, forming interference fringes according to certain laws.
  • the interference fringe is the trajectory of the same point of the optical path difference of the two paths, and the optical path difference is the difference between the optical paths of the two optical paths of the inventive device. It is not the difference between the geometric paths of the two beams but the optical path difference between the two beams that are determined by the laser interference.
  • the optical path is the corresponding path through which the light passes through the medium to the same time in a vacuum, and the optical path of the different refractive index material corresponds to the refractive index multiplied by the propagation path of the material.
  • the number of interference fringes needs to be calculated according to the fourth formula.
  • the interference fringe of the number of bright and dark stripes changes the average value of light and dark.
  • the foregoing fourth formula is the average value of the interference fringe of the interference fringe bright and dark stripes.
  • the difference between the average value of the interference fringes and the average value of the interference fringes is obtained.
  • the foregoing standard interference fringe light and dark stripe number may be obtained by taking a standard thin medium, such as a standard non-damaged banknote, through steps 201 to 206 and pre-storing the signal processing module into the foregoing.
  • a standard thin medium such as a standard non-damaged banknote
  • the difference is compared with the preset threshold. If the comparison result is greater than the preset threshold, there is a foreign matter on the surface of the thin medium. If the comparison result is not greater than the preset threshold and is not less than zero, there is no foreign matter on the surface of the thin medium.
  • the foregoing preset threshold may be a value obtained by a person skilled in the art from a known condition, and a conclusion value obtained by experience or experiment, or an empirical value obtained by a person skilled in the art or an experimental result. Further, the preset threshold is determined according to the maximum difference between the oldest thin medium and the standard thin medium. For example, when the thin medium is a circulating banknote, the plurality of oldest banknotes are first determined according to the foregoing steps 202 to 206 to determine the oldest banknote. The average value of the number of times of interference fringes, and then the maximum difference between the number of interference fringes of the standard interference fringe information mentioned in step 207 is calculated as the difference between the two, the difference being the aforementioned Preset threshold.
  • the entire calculation process may be performed by a signal processing module, and the process is well known to those skilled in the art, and details are not described herein again.
  • the signal processing module obtains the number of light and dark stripes of the interference fringes according to the preset calculation manner, and performs the difference method comparison according to the preset manner. If the comparison result is greater than the preset threshold, the foreign matter exists on the surface of the thin medium, thereby solving the existing machinery.
  • the thickness measuring device, the infrared detecting device and the ultrasonic detecting device perform the detection of foreign matter on the surface of the thin medium, and the mechanical thickness measuring device has low measurement precision, and it is difficult to effectively detect the technical problem of thin foreign matter on the surface of the banknote, and the application of the infrared detecting device is narrow.
  • the technical problem that only the foreign matter having different reflection characteristics in the different directions of the banknote is detected, and the ultrasonic detecting device adopts the ultrasonic wave as the carrier, has the technical problem of long measuring wavelength and low precision, and further improves the measurement sensitivity and the measurement precision.
  • an embodiment of a contactless detecting device for a thin medium provided in an embodiment of the present invention includes:
  • the aforementioned light source 1 is a line laser light source
  • the reference plane 3 is a plane mirror
  • the light source 1, the beam splitting member 2 and the reference plane 3 are located at the same horizontal line position;
  • the signal processing module 4, the line photodetector 6, the beam splitting component 2 and the thin medium 5 are located at the same vertical line position;
  • the line photodetector 6 is located between the signal processing module 4 and the beam splitting component 2;
  • the light splitting member 2 is inclined.
  • the light source 1, the beam splitting member 2, the reference plane 3, the signal processing module 4 and the thin medium 5 in the embodiment of FIG. 3 are only a schematic diagram of a positional structure in space, and the contactless detection of the thin medium
  • the device may be integrally provided with the light source 1, the beam splitting member 2, the reference plane 3, the line photodetector 6, the signal processing module 4 and the thin medium 5, and may also be the light source 1, the beam splitting member 2, and the reference plane 3.
  • the signal processing module 4 and the thin medium 5 are independent structures supported by different support members in an exploded form, and are not specifically limited herein.
  • the beam splitting member 2 and the reference plane 3 are located at the same horizontal line position and the signal processing module 4, the line photodetector 6, the light splitting member 2 and the thin medium 5 are located at the same vertical line position, and realize The first light path and the second optical path corresponding to the target light and the reference light are calculated, and the interference light is obtained by the signal processing module 4 according to a preset calculation manner. Dark stripes, and will dry The number of bright and dark stripes and the number of bright and dark stripes of the standard interference fringes are compared according to the preset method. If the comparison result is greater than the preset threshold, foreign matter exists on the surface of the thin medium, thus solving the existing mechanical thickness measuring device.
  • the infrared detecting device and the ultrasonic detecting device perform the detection of foreign matter on the surface of the thin medium, and the mechanical thickness measuring device has low measurement precision, and it is difficult to effectively detect the technical problem of thin foreign matter on the surface of the banknote, and the application of the infrared detecting device is narrow, and only The technical problem of detecting foreign matter having different reflection characteristics in different directions on the surface of the banknote, and the ultrasonic detecting device using ultrasonic waves as a carrier, have technical problems of long measuring wavelength and low precision.
  • FIG. 4 a contactless detecting device for a thin medium provided in the embodiment of the present invention is provided. Another embodiment includes:
  • the light source 1, the light splitting part 2, the reference plane 3, the signal processing module 4 and the thin medium 5 it should be noted that the aforementioned light source 1 is a line laser light source, and the reference plane 3 is a plane mirror;
  • the light source 1, the beam splitting member 2 and the reference plane 3 are located at the same horizontal line position;
  • the signal processing module 4, the line photodetector 6, the beam splitting component 2 and the thin medium 5 are located at the same vertical line position;
  • the line photodetector 6 is located between the signal processing module 4 and the beam splitting component 2;
  • the light splitting member 2 is inclined.
  • the outer frame 9 has two inner walls respectively mounted with a light source 1 and a reference plane 3, and a top portion is provided with a transparent member 7 disposed under the thin medium 5, the inner bottom portion is provided with an inner groove 10, and the inner groove 10 is provided with a wired column photoelectric Detector 6;
  • a signal processing module 4 is disposed at the bottom of the outer frame 9;
  • a transparent member 7, such as glass, placed under the thin medium 5, may be attached to the upper frame 6 by a clamping member, such as a holder;
  • a lens array 8 mounted between the line photodetector 6 and the beam splitting member 2;
  • the line photodetector 6 is mounted above the signal processing module 4 for recording the time when the target light and the reference light respectively reach the line photodetector 6 after the light source is turned on.
  • a light source 1 for emitting light to the beam splitting member 2, dividing the light into a first light reflected at the thin medium 5, and transmitting the second light at the reference plane 3;
  • the reference plane 3 is for reflecting the second light back to the beam splitting component 2 and introducing it to the signal processing module 4 for signal extraction.
  • the light source 1 is disposed on the left inner side of the outer frame 9 for emitting laser light of a narrow wavelength band; the light splitting member 2 is located directly under the transparent member 7, is fixed by a clamp frame, and the clamp frame is connected to the outer frame 9, and the light splitting member 2 is used for The beam splitting and merging of the laser beam; the plane mirror of the reference plane 3 is located at the left inner side of the outer frame 9 for the light splitting member 2 for reflecting the normally incident light and returning the original path; the lens array 8 is located directly below the beam splitting member 2.
  • the line photodetector 6 is located below the lens array 8 and disposed in the middle of the inner groove 10 for brightening the interference fringe stripes The number of dark times is measured, and the signal processing module 4 is located below the line photodetector 6 for measuring the processing of the signal.
  • the outer frame 9 is used for positional fixing and connection of the line laser light source 1, the beam splitting member 2, the reference plane 3, the lens array 8, the line photodetector 6, and the signal processing module 3.
  • the transparent member 7 is located directly above the outer frame 9 for keeping the internal components clean.
  • the beam splitting member 2 and the reference plane 3 are located at the same horizontal line position and the signal processing module 4, the line photodetector 6, the light splitting member 2 and the thin medium 5 are located at the same vertical line position, and realize The first light path and the second optical path corresponding to the target light and the reference light are calculated, and the interference light is obtained by the signal processing module 4 according to a preset calculation manner.
  • the number of dark stripes, and the number of interference dark stripes and the number of standard interference stripes bright and dark stripes are compared according to the preset method. If the comparison result is greater than the preset threshold, foreign matter exists on the surface of the thin medium, and the solution is solved.
  • the existing mechanical thickness measuring device, the infrared detecting device and the ultrasonic detecting device perform the detection of foreign matter on the surface of the thin medium, and the mechanical thickness measuring device has low measurement precision, and it is difficult to effectively detect the technical problem of thin foreign matter on the surface of the banknote, and the application of the infrared detecting device a technical problem that the surface is narrow and can only detect foreign objects having different reflection characteristics in different directions on the surface of the banknote, and Ultrasonic wave detection means as a carrier, there is a measurement wavelength long, low accuracy of technical problems.
  • the disclosed system, apparatus, and method may be implemented in other manners.
  • the device embodiments described above are merely illustrative.
  • the division of the unit is only a logical function division.
  • there may be another division manner for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored or not executed.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
  • each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
  • the above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.
  • the integrated unit if implemented in the form of a software functional unit and sold or used as a standalone product, may be stored in a computer readable storage medium.
  • the technical solution of the present invention which is essential or contributes to the prior art, or all or part of the technical solution, may be embodied in the form of a software product stored in a storage medium.
  • a number of instructions are included to cause a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present invention.
  • the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like. .

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Abstract

一种薄介质（5）的无接触式检测方法及装置，该装置包括光源（1）、分光部件（2）、参考平面（3）、线列光电探测器（6）、信号处理模块（4）和薄介质（5）。该方法包括：获取由光源（1）的发射光线经薄介质（5）反射回的目标光线到达线列光电探测器（6）的时间和获取光源（1）经参考平面（3）反射回的参考光线到达线列光电探测器（6）的时间；根据获取到的目标光线和参考光线到达线列光电探测器（6）的时间，计算目标光线和参考光线对应的第一光程和第二光程，通过信号处理模块（4）按照预置计算方式获取干涉条纹亮暗条纹数；将干涉条纹亮暗条纹数与标准干涉条纹亮暗条纹数按照预置方式进行差值法比对，若比对结果大于预置阈值，则薄介质（5）表面存在异物。该检测方法及装置解决了现有机械测厚装置、红外检测装置和超声波检测装置进行薄介质表面异物检测，而导致的精度较低和测量波长长的技术问题。

Description

一种薄介质的无接触式检测方法及装置
本申请要求于2014年11月04日提交中国专利局、申请号为201410617820.5、发明名称为“一种薄介质的无接触式检测方法及装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及光电检测技术领域，尤其涉及一种薄介质的无接触式检测方法及装置。
背景技术
在日常生活及商业活动中，纸币在使用过程中常常会出现缺角、撕裂等现象，人们常常是采用胶带或者薄纸和胶水等方式将缺损或撕裂的纸币粘接起来，继续使用。表面粘有异物的纸币采用传统机械设备难以实现有效检出。附着异物的纸币容易造成银行验钞设备和清分识别设备的损坏，如果采用人工检出的方式，浪费人力与时间，检出效率低。金融行业在国家的支持下提出“人民币流通券要到七成新以上”的要求，这些给金融自助设备的纸币识别能力和水平增加了很大的压力。
现有纸币表面异物检测方法有机械测厚装置、红外检测装置和超声波检测装置，其中机械测厚装置测量精度较低，难以有效检测纸币表面的薄异物。红外检测装置应用面窄，只能对纸币表面不同方向具有不同反射特性的异物进行检测，如透明胶带，超声波检测装置采用超声波作为载体，存在测量波长长、精度低的技术问题。
发明内容
本发明实施例提供了一种薄介质的无接触式检测方法及装置，解决了现有机械测厚装置、红外检测装置和超声波检测装置进行薄介质表面异物检测，而导致的精度较低和测量波长长的技术问题。
本发明实施例提供的一种薄介质的无接触式检测方法，包括：
S1：获取由光源的发射光线经薄介质反射回的目标光线到达线列光电探测器的时间；
S2：获取所述光源经参考平面反射回的参考光线到达所述线列光电探 测器的时间；
S3：根据获取到的所述目标光线和所述参考光线到达所述线列光电探测器的时间，计算目标光线和参考光线对应的第一光程和第二光程，之后通过信号处理模块按照预置计算方式获取干涉条纹亮暗条纹数；
S4：将所述干涉条纹亮暗条纹数与标准干涉条纹亮暗条纹数按照预置方式进行差值法比对，若比对结果大于预置阈值，则所述薄介质表面存在异物。
可选地，所述步骤S1之前还包括：
启动所述光源，使得所述光源的发射的所述光线在分光部件的作用下将所述光线分为反射至所述薄介质处的第一光线，以及透射至所述参考平面处的第二光线；
所述第一光线经所述薄介质再反射为目标光线；
所述第二光线经所述参考平面反射回分光部件进行再反射为参考光线。
可选地，所述预置阈值为根据最旧的所述薄介质和所述标准薄介质按照最大差值方式确定。
可选地，所述步骤S3具体包括：
根据第一公式结合所述参考光线到达所述线列光电探测器的时间计算出所述参考光线的所述第一光程，并根据第二公式结合所述目标光线到达所述线列光电探测器的时间计算出所述目标光线的所述第二光程；
结合所述第一光程、所述第二光程和所述线列光电探测器的光敏单元的数目按照第三公式计算出所述干涉条纹亮暗变化次数；
将所述干涉条纹变化次数根据第四公式计算出所述干涉条纹亮暗条纹数的干涉条纹亮暗变化平均值。
可选地，所述步骤S4包括：
获取所述干涉条纹亮暗变化平均值与干涉条纹亮暗变化平均值的差值；
对所述差值与所述预置阈值进行比对，若比对结果大于所述预置阈值，则所述薄介质表面存在异物，若比对结果不大于所述预置阈值且不小于零， 则所述薄介质表面不存在异物。
可选地，所述第一公式为所述第一光程Δ1＝ct1；
所述第二公式为所述第二光程Δ2＝ct2；
其中，t1为从光源开启到参考光线到达线列光电探测器的时间，t2为从光源开启目标光线到达线列光电探测器的时间；
所述第三公式为所述干涉条纹亮暗条纹数
Figure PCTCN2015083512-appb-000001
其中，M为所述光源的光信号行扫描总行数，N为所述线列光电探测器的光敏单元的数目，λ0为所述光源的波长；
所述第四公式为所述干涉条纹亮暗条纹数为干涉条纹亮暗变化平均值
Figure PCTCN2015083512-appb-000002
本发明实施例提供的一种薄介质的无接触式检测装置，包括：光源，分光部件，参考平面，线列光电探测器，信号处理模块和薄介质；
所述光源，所述分光部件与所述参考平面位于同一水平线位置；
所述信号处理模块，所述光电技术模块，所述分光部件与所述薄介质位于同一垂直线位置；
所述线列光电探测器位于所述信号处理模块和所述分光部件之间；
所述分光部件为倾斜状。
可选地，所述光源，用于将光线发射至所述分光部件将所述光线分为反射至所述薄介质处的第一光线，以及透射至所述参考平面处的第二光线；
所述薄介质，用于将所述第一光线反射至所述信号处理模块接收进行信号提取；
所述参考平面，用于将所述第二光线反射回所述分光部件引入至所述信号处理模块接收进行信号提取；
所述线列光电探测器，安装在所述信号处理模块上方，用于记录光源开启后，目标光线和参考光线各自到达线列光电探测器的时间。
可选地，所述的薄介质的无接触式检测装置还包括透明部件，置放在所述薄介质下方。
透镜阵列，安装在所述线列光电探测器和所述分光部件之间。
可选地，所述的薄介质的无接触式检测装置还包括：
外框架，其两内壁各安装有所述光源和所述参考平面，顶部设置有置放在所述薄介质下方的透明部件，内底部设置有内凹槽，所述内凹槽中设置有线列光电探测器；
所述外框架底部设置有所述信号处理模块。
从以上技术方案可以看出，本发明实施例具有以下优点：
本发明实施例中提供的一种薄介质的无接触式检测方法及装置，其中，方法包括：S1：获取由光源的发射光线经薄介质反射回的目标光线到达线列光电探测器的时间；S2：获取光源经参考平面反射回的参考光线到达线列光电探测器的时间；S3：根据获取到的目标光线和参考光线到达线列光电探测器的时间，计算目标光线和参考光线对应的第一光程和第二光程，之后通过信号处理模块按照预置计算方式获取干涉条纹亮暗条纹数；S4：将干涉条纹亮暗条纹数与标准干涉条纹亮暗条纹数按照预置方式进行差值法比对，若比对结果大于预置阈值，则薄介质表面存在异物。本实施例中，根据获取到的目标光线和参考光线到达线列光电探测器的时间，计算目标光线和参考光线对应的第一光程和第二光程，之后通过信号处理模块按照预置计算方式获取干涉条纹亮暗条纹数，并按照预置方式进行差值法比对，若比对结果大于预置阈值，则薄介质表面存在异物，便解决了现有机械测厚装置、红外检测装置和超声波检测装置进行薄介质表面异物检测，而导致的机械测厚装置测量精度较低，难以有效检测纸币表面的薄异物的技术问题，以及红外检测装置应用面窄，只能对纸币表面不同方向具有不同反射特性的异物进行检测的技术问题，和超声波检测装置采用超声波作为载体，存在测量波长长、精度低的技术问题。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地， 下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其它的附图。
图1本发明实施例中提供的一种薄介质的无接触式检测方法的一个实施例的流程示意图；
图2本发明实施例中提供的一种薄介质的无接触式检测方法的另一个实施例的流程示意图；
图3本发明实施例中提供的一种薄介质的无接触式检测装置的一个实施例的结构示意图；
图4本发明实施例中提供的一种薄介质的无接触式检测装置的另一个实施例的结构示意图。
图3和图4的图示说明：光源1；分光部件2；参考平面3；信号处理模块4；薄介质5；线列光电探测器6；透明部件7；透镜阵列8；外框架9；内凹槽10。
具体实施方式
本发明实施例提供了一种薄介质的无接触式检测方法及装置，解决了现有机械测厚装置、红外检测装置和超声波检测装置进行薄介质表面异物检测，而导致的精度较低和测量波长长的技术问题。
为使得本发明的发明目的、特征、优点能够更加的明显和易懂，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，下面所描述的实施例仅仅是本发明一部分实施例，而非全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请参阅图1，本发明实施例中提供的一种薄介质的无接触式检测方法的一个实施例包括：
S1：获取由光源的发射光线经薄介质反射回的目标光线到达线列光电探测器的时间；
本实施例中，需要对薄介质，例如纸币的表面是否有异物进行检测时，首先需要获取由光源的发射光线经薄介质反射回的目标光线到达线列光电 探测器的时间，该时间可以是由线列光电探测器进行获取，前述的光源可以是激光光源，进一步可以是线列激光光源。
S2：获取光源经参考平面反射回的参考光线到达线列光电探测器的时间；
在获取由光源的发射光线经薄介质反射回的目标光线的同时，需要获取光源经参考平面反射回的参考光线到达线列光电探测器的时间，该时间可以是由线列光电探测器进行获取，可以理解的是，前述的参考平面可以是反射镜。
S3：根据获取到的目标光线和参考光线到达线列光电探测器的时间，计算目标光线和参考光线对应的第一光程和第二光程，之后通过信号处理模块按照预置计算方式获取干涉条纹亮暗条纹数；
当获取由光源的发射光线经薄介质反射回的目标光线到达线列光电探测器的时间，以及获取光源经参考平面反射回的参考光线到达线列光电探测器的时间之后，需要根据获取到的目标光线和参考光线到达线列光电探测器的时间，计算目标光线和参考光线对应的第一光程和第二光程，之后通过信号处理模块按照预置计算方式获取干涉条纹亮暗条纹数。
需要说明的是，前述的信号处理模块按照预置计算方式获取干涉条纹亮暗条纹数的具体过程将在后续实施例中进行详细的描述，此处便不再详细赘述。
可以理解的是，获取的参考光线可以是通过透镜阵列，再由线列光电探测器器接收记录启动光源到参考光线到达线列光电探测器的时间，并传输至信号处理模块。
S4：将干涉条纹亮暗条纹数与标准干涉条纹亮暗条纹数按照预置方式进行差值法比对，若比对结果大于预置阈值，则薄介质表面存在异物。
当通过信号处理模块按照预置计算方式获取干涉条纹亮暗条纹数之后，需要将干涉条纹亮暗条纹数与标准干涉条纹亮暗条纹数按照预置方式进行差值法比对，若比对结果大于预置阈值，则薄介质表面存在异物，可以理解的是，前述的预置阈值为根据最旧的薄介质和标准薄介质按照最大差值方式确定。需要说明的是，前述的标准干涉条纹亮暗条纹数为在进行 本实施例中的薄介质的无接触式检测方法之前，根据步骤S1至S3对标准薄介质进行获取的干涉条纹信息。
可以理解的是，前述的按照预置方式进行比对的具体过程将在后续实施例中进行详细的描述，此处便不再详细赘述。
本实施例中，根据获取到的目标光线和参考光线到达线列光电探测器的时间，计算目标光线和参考光线对应的第一光程和第二光程，之后通过信号处理模块按照预置计算方式获取干涉条纹亮暗条纹数，并按照预置方式进行差值法比对，若比对结果大于预置阈值，则薄介质表面存在异物，便解决了现有机械测厚装置、红外检测装置和超声波检测装置进行薄介质表面异物检测，而导致的机械测厚装置测量精度较低，难以有效检测纸币表面的薄异物的技术问题，以及红外检测装置应用面窄，只能对纸币表面不同方向具有不同反射特性的异物进行检测的技术问题，和超声波检测装置采用超声波作为载体，存在测量波长长、精度低的技术问题。
上面是对薄介质的无接触式检测方法进行详细的描述，下面将对光电技术器转化的电信号按照预置计算方式获取干涉条纹信息和按照预置方式进行比对的具体过程进行详细的描述，请参阅图2，本发明实施例中提供的一种薄介质的无接触式检测方法的另一个实施例包括：
201、启动光源，使得光源的发射的光线在分光部件的作用下将光线分为反射至薄介质处的第一光线，以及透射至参考平面处的第二光线；
本实施例中，当需要对薄介质，例如纸币的表面是否有异物进行检测时，需要先启动光源，使得光源的发射的光线在分光部件的作用下将光线分为反射至薄介质处的第一光线，以及透射至参考平面处的第二光线，前述的光源可以是激光光源，进一步可以是线列激光光源。
可以理解的是，前述的第一光线经薄介质再反射为目标光线，前述的第二光线经参考平面反射回分光部件进行再反射为参考光线。
需要说明的是，前述的薄介质可以是通过走钞机构传送进行后续步骤的检测，此处不再详细赘述。
202、获取由光源的发射光线经薄介质反射回的目标光线到达线列光电探测器的时间；
本实施例中，当光源的发射的光线在分光部件的作用下将光线分为反射至薄介质处的第一光线，以及透射至参考平面处的第二光线之后，首先需要获取由光源的发射光线经薄介质反射回的目标光线到达线列光电探测器的时间，该时间可以是由线列光电探测器进行获取，前述的光源可以是激光光源，进一步可以是线列激光光源。
需要说明的是，获取的目标光线可以是通过透镜阵列，再由线列光电探测器启动光源到目标光线到达线列光电探测器的时间，并传输至信号处理模块。
203、获取光源经参考平面反射回的参考光线到达线列光电探测器的时间；
在获取由光源的发射光线经薄介质反射回的目标光线的同时，需要获取光源经参考平面反射回的参考光线到达线列光电探测器的时间，该时间可以是由线列光电探测器进行获取，可以理解的是，前述的参考平面可以是反射镜。
需要说明的是，获取的参考光线可以是通过透镜阵列，再由线列光电探测器启动光源到参考光线到达线列光电探测器的时间，并传输至信号处理模块。
204、根据第一公式结合参考光线到达线列光电探测器的时间计算出参考光线的第一光程，并根据第二公式结合目标光线到达线列光电探测器的时间计算出目标光线的第二光程；
当获取由光源的发射光线经薄介质反射回的目标光线到达线列光电探测器的时间，以及获取光源经参考平面反射回的参考光线到达线列光电探测器的时间之后，需要根据第一公式结合参考光线到达线列光电探测器的时间计算出参考光线的第一光程，并根据第二公式结合目标光线到达线列光电探测器的时间计算出目标光线的第二光程。
需要说明的是，前述的第一公式为第一光程Δ1＝ct1，第二公式为第二光程Δ2＝ct2；
其中，t1为从光源开启到参考光线到达线列光电探测器的时间，t2为从光源开启目标光线到达线列光电探测器的时间，可以理解的是，前述的 c为光速。
205、结合第一光程、第二光程和线列光电探测器的光敏单元的数目按照第三公式计算出干涉条纹亮暗条纹数；
当根据第一公式计算参考光线的第一光程，并根据第二公式计算目标光线的第二光程之后，需要结合第一光程、第二光程和线列光电探测器的光敏单元的数目按照第三公式计算出干涉条纹亮暗条纹数。
可以理解的是，前述的第三公式为干涉条纹亮暗变化次数
Figure PCTCN2015083512-appb-000003
其中，M为光源的光信号行扫描总行数，N为线列光电探测器线列光电探测器的光敏单元的数目，λ0为光源的波长。
需要说明的是，前述的干涉条纹变化次数为干涉条纹亮暗次数的变化，是由光程差变化所引起的激光干涉现象。激光干涉是指满足同频率、同振动方向、具有相同恒定的相位差的两列或两列以上的光波在空间的重叠区域内各点相遇时所发生的现象，直观表现是光场强度在某些区域始终加强，在另一些区域则始终削弱，形成稳定的强弱分布的现象，即形成按照一定规律的亮暗变化的干涉条纹。干涉条纹是两路光光程差相同点联成的轨迹，而光程差是发明装置两支光路光程之差。对激光干涉形成的亮暗条纹变化起决定作用的不是这两束光的几何路程之差，而是两者的光程差。光程是光在介质中通过的路程折合到同一时间内在真空中通过的相应路程，在不同的折射率材料的光程对应于折射率乘以在该材料的传播路径。当干涉装置的光程差随时间改变时，在某一固定点处接收到的光场强度将作亮暗交替的变化，其中，干涉条纹变化次数为本领域技术人员公知技术。
206、将干涉条纹变化次数根据第四公式计算出干涉条纹亮暗条纹数的干涉条纹亮暗变化平均值；
当结合第一光程、第二光程和线列光电探测器的光敏单元的数目按照第三公式计算出干涉条纹亮暗条纹数之后，需要将干涉条纹变化次数根据第四公式计算出干涉条纹亮暗条纹数的干涉条纹亮暗变化平均值。
需要说明的是，前述的第四公式为干涉条纹亮暗条纹数的干涉条纹亮 暗变化平均值
Figure PCTCN2015083512-appb-000004
207、获取干涉条纹亮暗变化平均值与干涉条纹亮暗变化平均值的差值；
当将干涉条纹变化次数根据第四公式计算出干涉条纹亮暗条纹数的干涉条纹亮暗变化平均值之后，需要获取干涉条纹亮暗变化平均值与干涉条纹亮暗变化平均值的差值。
可以理解的是，前述的标准干涉条纹亮暗条纹数可以是将标准薄介质，例如标准无受损纸币通过步骤201至206进行获取并预先存储进前述的信号处理模块，
208、对差值与预置阈值进行比对，若比对结果大于预置阈值，则薄介质表面存在异物，若比对结果不大于预置阈值且不小于零，则薄介质表面不存在异物。
当获取干涉条纹亮暗变化平均值与干涉条纹亮暗变化平均值的差值之后，需要对差值与预置阈值进行比对，若比对结果大于预置阈值，则薄介质表面存在异物，若比对结果不大于预置阈值且不小于零，则薄介质表面不存在异物。
需要说明的是，前述的预置阈值可以是本领域技术人员从公知条件下获取的已经通过经验或实验得出结论值，还可以是本领域技术人员的经验值或实验得出的结论值，进一步地，预置阈值为根据最旧的薄介质和标准薄介质按照最大差值方式确定，例如薄介质为流通纸币时，先将多个最旧纸币按照前述的步骤202至206确定最旧纸币的干涉条纹亮暗变化次数的平均值，然后再与步骤207提及的标准干涉条纹信息的的干涉条纹亮暗变化次数进行最大差值方式计算求两者的差值，该差值即前述的预置阈值。
本实施例中，整个计算过程可以是通过信号处理模块进行计算处理，该处理过程为本领域技术人员公知技术，此处不再详细赘述。
本实施例中，根据获取到的目标光线和参考光线到达线列光电探测器的时间，计算目标光线和参考光线对应的第一光程和第二光程，之后通过 信号处理模块按照预置计算方式获取干涉条纹亮暗条纹数，并按照预置方式进行差值法比对，若比对结果大于预置阈值，则薄介质表面存在异物，便解决了现有机械测厚装置、红外检测装置和超声波检测装置进行薄介质表面异物检测，而导致的机械测厚装置测量精度较低，难以有效检测纸币表面的薄异物的技术问题，以及红外检测装置应用面窄，只能对纸币表面不同方向具有不同反射特性的异物进行检测的技术问题，和超声波检测装置采用超声波作为载体，存在测量波长长、精度低的技术问题，进一步提高了测量灵敏度和测量精度。
请参阅图3，本发明实施例中提供的一种薄介质的无接触式检测装置的一个实施例包括：
光源1，分光部件2，参考平面3，线列光电探测器6，信号处理模块4和薄介质5，需要说明的是，前述的光源1为线列激光光源，参考平面3为平面反射镜；
光源1，分光部件2与参考平面3位于同一水平线位置；
信号处理模块4，线列光电探测器6，分光部件2与薄介5质位于同一垂直线位置；
线列光电探测器6位于信号处理模块4和分光部件2之间；
分光部件2为倾斜状。
需要说明的是，图3的本实施例中的光源1，分光部件2，参考平面3，信号处理模块4和薄介质5仅仅是空间上的一个位置结构示意图，该薄介质的无接触式检测装置可以是一体将光源1，分光部件2，参考平面3，线列光电探测器6，信号处理模块4和薄介质5进行上述的设置，还可以是光源1，分光部件2，参考平面3，信号处理模块4和薄介质5为分解形式通过不同的支撑部件支撑的独立结构，此处具体不做限定。
本实施例中，通过光源1，分光部件2与参考平面3位于同一水平线位置和信号处理模块4，线列光电探测器6，分光部件2与薄介质5位于同一垂直线位置的设计，实现了将获取到的目标光线和参考光线到达线列光电探测器的时间，计算目标光线和参考光线对应的第一光程和第二光程，通过信号处理模块4按照预置计算方式获取干涉条纹亮暗条纹数，并将干 涉亮暗条纹数与标准干涉条纹亮暗条纹数按照预置方式进行差值法比对，根据比对结果若大于预置阈值，则薄介质表面存在异物，便解决了现有机械测厚装置、红外检测装置和超声波检测装置进行薄介质表面异物检测，而导致的机械测厚装置测量精度较低，难以有效检测纸币表面的薄异物的技术问题，以及红外检测装置应用面窄，只能对纸币表面不同方向具有不同反射特性的异物进行检测的技术问题，和超声波检测装置采用超声波作为载体，存在测量波长长、精度低的技术问题。
上面是对薄介质的无接触式检测装置的结果进行详细的说明，下面将对附加结构进行详细的描述，请参阅图4，本发明实施例中提供的一种薄介质的无接触式检测装置的另一个实施例包括：
光源1，分光部件2，参考平面3，信号处理模块4和薄介质5，需要说明的是，前述的光源1为线列激光光源，参考平面3为平面反射镜；
光源1，分光部件2与参考平面3位于同一水平线位置；
信号处理模块4，线列光电探测器6，分光部件2与薄介5质位于同一垂直线位置；
线列光电探测器6位于信号处理模块4和分光部件2之间；
分光部件2为倾斜状。
本实施例还可以进一步包括：
外框架9，其两内壁各安装有光源1和参考平面3，顶部设置有置放在薄介质5下方的透明部件7，内底部设置有内凹槽10，内凹槽10中设置有线列光电探测器6；
外框架9底部设置有信号处理模块4；
透明部件7，例如玻璃，置放在薄介质5下方，可以是通过夹持部件，例如夹持架连接在外框架6的上方；
透镜阵列8，安装在线列光电探测器6和分光部件2之间；
线列光电探测器6，安装在信号处理模块4上方，用于记录光源开启后，目标光线和参考光线各自到达线列光电探测器6的时间。
光源1，用于将光线发射至分光部件2将光线分为反射至薄介质5处的第一光线，以及透射至参考平面3处的第二光线；
薄介质5，用于将第一光线反射至信号处理模块4接收进行信号提取；
参考平面3，用于将第二光线反射回分光部件2引入至信号处理模块4接收进行信号提取。
下面对本实施例中的薄介质的无接触式检测装置详细连接结构进行描述：
光源1设置在外框架9的左内侧，用于发出窄波段的激光光线；分光部件2位于透明部件7的正下方，用夹持架固定，夹持架连接在外框架9上，分光部件2用于激光光线的分束和合束；参考平面3的平面反射镜位于分光部件2设置在外框架9的左内侧，用于将垂直入射的光线反射并原路返回；透镜阵列8位于分光部件2的正下方，与外框架9相连接，用于将激光光线汇聚到线列光电探测器6；线列光电探测器6位于透镜阵列8的下方，设置在内凹槽10中间，用于对干涉条纹条纹亮暗次数进行测量，信号处理模块4位于线列光电探测器6的下方，用于测量信号的处理。外框架9用于线列激光光源1、分光部件2、参考平面3、透镜阵列8、线列光电探测器6和信号处理模块3的位置固定和连接。透明部件7位于外框架9的正上方，用于保持内部器件的清洁。
本实施例中，通过光源1，分光部件2与参考平面3位于同一水平线位置和信号处理模块4，线列光电探测器6，分光部件2与薄介质5位于同一垂直线位置的设计，实现了将获取到的目标光线和参考光线到达线列光电探测器的时间，计算目标光线和参考光线对应的第一光程和第二光程，通过信号处理模块4按照预置计算方式获取干涉条纹亮暗条纹数，并将干涉亮暗条纹数与标准干涉条纹亮暗条纹数按照预置方式进行差值法比对，根据比对结果若大于预置阈值，则薄介质表面存在异物，便解决了现有机械测厚装置、红外检测装置和超声波检测装置进行薄介质表面异物检测，而导致的机械测厚装置测量精度较低，难以有效检测纸币表面的薄异物的技术问题，以及红外检测装置应用面窄，只能对纸币表面不同方向具有不同反射特性的异物进行检测的技术问题，和超声波检测装置采用超声波作为载体，存在测量波长长、精度低的技术问题。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述 描述的系统，装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统，装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本发明各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本发明的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本发明各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者 对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (10)

  1. 一种薄介质的无接触式检测方法，其特征在于，包括：
    S1：获取由光源的发射光线经薄介质反射回的目标光线到达线列光电探测器的时间；
    S2：获取所述光源经参考平面反射回的参考光线到达所述线列光电探测器的时间；
    S3：根据获取到的所述目标光线和所述参考光线到达所述线列光电探测器的时间，计算目标光线和参考光线对应的第一光程和第二光程，之后通过信号处理模块按照预置计算方式获取干涉条纹亮暗条纹数；
    S4：将所述干涉条纹亮暗条纹数与标准干涉条纹亮暗条纹数按照预置方式进行差值法比对，若比对结果大于预置阈值，则所述薄介质表面存在异物。
  2. 根据权利要求1所述的薄介质的无接触式检测方法，其特征在于，所述步骤S1之前还包括：
    启动所述光源，使得所述光源的发射的所述光线在分光部件的作用下将所述光线分为反射至所述薄介质处的第一光线，以及透射至所述参考平面处的第二光线；
    所述第一光线经所述薄介质再反射为目标光线；
    所述第二光线经所述参考平面反射回分光部件进行再反射为参考光线。
  3. 根据权利要求1所述的薄介质的无接触式检测方法，其特征在于，所述预置阈值为根据最旧的所述薄介质和所述标准薄介质按照最大差值方式确定。
  4. 根据权利要求1所述的薄介质的无接触式检测方法，其特征在于，所述步骤S3具体包括：
    根据第一公式结合所述参考光线到达所述线列光电探测器的时间计算出所述参考光线的所述第一光程，并根据第二公式结合所述目标光线到达所述线列光电探测器的时间计算出所述目标光线的所述第二光程；
    结合所述第一光程、所述第二光程和所述线列光电探测器的光敏单元 的数目按照第三公式计算出所述干涉条纹亮暗变化次数；
    将所述干涉条纹变化次数根据第四公式计算出所述干涉条纹亮暗条纹数的干涉条纹亮暗变化平均值。
  5. 根据权利要求4所述的薄介质的无接触式检测方法，其特征在于，所述步骤S4包括：
    获取所述干涉条纹亮暗变化平均值与干涉条纹亮暗变化平均值的差值；
    对所述差值与所述预置阈值进行比对，若比对结果大于所述预置阈值，则所述薄介质表面存在异物，若比对结果不大于所述预置阈值且不小于零，则所述薄介质表面不存在异物。
  6. 根据权利要求4所述的薄介质的无接触式检测方法，其特征在于，
    所述第一公式为所述第一光程Δ1＝ct1；
    所述第二公式为所述第二光程Δ2＝ct2；
    其中，t1为从光源开启到参考光线到达线列光电探测器的时间，t2为从光源开启目标光线到达线列光电探测器的时间；
    所述第三公式为所述干涉条纹亮暗变化次数
    Figure PCTCN2015083512-appb-100001
    其中，M为所述光源的光信号行扫描总行数，N为所述线列光电探测器线列光电探测器的光敏单元的数目，λ0为所述光源的波长；
    所述第四公式为所述干涉条纹亮暗条纹数为干涉条纹亮暗变化次数平均值
    Figure PCTCN2015083512-appb-100002
  7. 一种薄介质的无接触式检测装置，其特征在于，包括：光源，分光部件，参考平面，线列光电探测器，信号处理模块和薄介质；
    所述光源，所述分光部件与所述参考平面位于同一水平线位置；
    所述信号处理模块，所述光电技术模块，所述分光部件与所述薄介质位于同一垂直线位置；
    所述线列光电探测器位于所述信号处理模块和所述分光部件之间；
    所述分光部件为倾斜状。
  8. 根据权利要求7所述的薄介质的无接触式检测装置，其特征在于，
    所述光源，用于将光线发射至所述分光部件将所述光线分为反射至所述薄介质处的第一光线，以及透射至所述参考平面处的第二光线；
    所述薄介质，用于将所述第一光线反射至所述信号处理模块接收进行信号提取；
    所述参考平面，用于将所述第二光线反射回所述分光部件引入至所述信号处理模块接收进行信号提取；
    所述线列光电探测器，安装在所述信号处理模块上方，用于记录光源开启后，目标光线和参考光线各自到达线列光电探测器的时间。。
  9. 根据权利要求7所述的薄介质的无接触式检测装置，其特征在于，还包括透明部件，置放在所述薄介质下方。
    透镜阵列，安装在所述线列光电探测器和所述分光部件之间。
  10. 根据权利要求7至9中任意一项所述的薄介质的无接触式检测装置，其特征在于，还包括：
    外框架，其两内壁各安装有所述光源和所述参考平面，顶部设置有置放在所述薄介质下方的透明部件，内底部设置有内凹槽，所述内凹槽中设置有线列光电探测器；
    所述外框架底部设置有所述信号处理模块。
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