WO2016101219A1 - 麦克风 - Google Patents

麦克风 Download PDF

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Publication number
WO2016101219A1
WO2016101219A1 PCT/CN2014/094978 CN2014094978W WO2016101219A1 WO 2016101219 A1 WO2016101219 A1 WO 2016101219A1 CN 2014094978 W CN2014094978 W CN 2014094978W WO 2016101219 A1 WO2016101219 A1 WO 2016101219A1
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WIPO (PCT)
Prior art keywords
boss
hole
microphone
sound collecting
pcb
Prior art date
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Ceased
Application number
PCT/CN2014/094978
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English (en)
French (fr)
Inventor
丁俊
李芳庆
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to US15/539,625 priority Critical patent/US20170353803A1/en
Priority to KR1020177020360A priority patent/KR20170099976A/ko
Priority to EP14908787.6A priority patent/EP3229492B1/en
Priority to PCT/CN2014/094978 priority patent/WO2016101219A1/zh
Priority to CN201480072651.XA priority patent/CN105917669B/zh
Publication of WO2016101219A1 publication Critical patent/WO2016101219A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H04R1/083—Special constructions of mouthpieces
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • Embodiments of the present invention relate to communication technologies, and in particular, to a microphone.
  • FIG. 1 is a schematic structural view of a microphone for bottom pickup in the prior art.
  • 2 is a cross-sectional view showing the structure of a microphone for pickup at the bottom in the prior art.
  • the microphone is a built-in microphone for a terminal device, for example, a built-in microphone of a terminal device such as a mobile phone or a tablet.
  • the bottom pickup microphone includes a metal cover 1 and a printed circuit board (PCB) 2 of the microphone.
  • the PCB board 2 of the microphone is provided with a plurality of pads 3 and a sound collecting hole 5, and the periphery of the sound collecting hole 5 is provided with green oil 4.
  • FIG. 3 is a schematic structural view of welding of a microphone and a terminal device in the prior art.
  • the PCB 2 of the microphone is soldered to the PCB 6 of the terminal device through the pad, and the pickup hole 4 of the microphone and the position of the pickup hole 7 of the terminal device are in a connected state, and the green oil is 4 Used to prevent the solder from entering the microphone (Microphone, Mic for short)
  • the embodiment of the invention provides a microphone, which effectively prevents the solder and the flux from entering the sound collecting hole, thereby avoiding the problem that the microphone has no sound or noise.
  • a first aspect of the embodiments of the present invention provides a microphone, including:
  • the microphone printed circuit board PCB connected to the metal cover, and provided with a sound collecting hole, characterized in that: further comprising: a boss provided with a through hole;
  • the boss is disposed on the PCB, facing away from the other side of the metal cover, and the boss is located on the pad surrounding the sound collecting hole to prevent solder and flux from entering the sound collecting hole;
  • the through hole is in communication with the sound collecting hole to realize an audio signal entering the sound collecting hole through the through hole.
  • the diameter of the through hole is greater than or equal to the diameter of the sound collecting hole.
  • the height of the boss is greater than 0 mm and less than or equal to 20 mm.
  • the boss is in an interference fit with the sound collecting hole, so that the boss is riveted in the On the PCB.
  • the boss is a non-porous boss bonded to the PCB by a high temperature resistant glue, and is disposed Above the sound collecting hole, a boss formed by punching the non-hole boss to form a boss.
  • the boss is a protrusion that is milled over the sound collecting hole on the PCB using a numerically controlled machine tool station.
  • the material of the boss is metal, high temperature resistant plastic or ceramic.
  • the diameter of the boss is smaller than a diameter of a pad surrounding the sound collecting hole.
  • FIG. 1 is a schematic structural view of a microphone for bottom pickup in the prior art
  • FIG. 2 is a cross-sectional view showing the structure of a microphone for pickup at the bottom in the prior art
  • FIG. 3 is a schematic structural view of welding of a microphone and a terminal device in the prior art
  • FIG. 4 is a schematic structural diagram of a microphone according to Embodiment 1 of the present invention.
  • Figure 5 is a cross-sectional view showing the structure of a microphone according to Embodiment 1 of the present invention.
  • FIG. 6 is a schematic structural diagram of welding of a microphone and a terminal device according to an embodiment of the present invention.
  • FIG. 7 is a cross-sectional view showing the structure of a microphone according to Embodiment 2 of the present invention.
  • FIG. 8 is a schematic structural diagram of a manufacturing process of a boss of a microphone according to Embodiment 3 of the present invention.
  • FIG. 9 is a schematic structural diagram of a manufacturing process of a boss of a microphone according to Embodiment 4 of the present invention.
  • FIG. 4 is a schematic structural diagram of a microphone according to Embodiment 1 of the present invention.
  • FIG. 5 is a cross-sectional view showing the structure of a microphone according to Embodiment 1 of the present invention.
  • the microphone includes a metal cover 21, a PCB 22 connected to the metal cover 21, and a microphone provided with a sound collecting hole 24, and a boss 23 provided with a through hole 25.
  • the periphery of the sound collecting hole is provided with a pad 26 to solder the PCB 22 of the microphone to the PCB of the terminal device.
  • the boss 23 is disposed on the PCB 22 away from the other side of the metal cover 21, and the boss 23 is located on the pad 26 surrounding the sound collecting hole 24 to prevent solder and flux from entering the sound collecting hole.
  • the through hole 25 communicates with the sound collecting hole 24 to realize an audio signal entering the sound collecting hole 24 through the through hole 25.
  • the diameter of the through hole is greater than, equal to, or smaller than the diameter of the sound collecting hole, and the through hole 25 can communicate with the sound collecting hole 24.
  • the boss 23 can be disposed above the sound collecting hole 24.
  • the boss 23 can be directly inserted into the sound collecting hole 24, which is not the case in the present invention. limit.
  • the diameter of the through hole 25 is greater than or equal to the diameter of the sound collecting hole 24.
  • the diameter of the through hole is greater than or equal to the diameter of the sound collecting hole, the audio characteristic of the audio signal entering the sound collecting hole through the through hole can be better ensured.
  • the microphone provided in this embodiment can be disposed on a terminal device such as a mobile phone, a computer, a handheld terminal, and the like, and the microphone is soldered to the PCB of the terminal device through the pad on the PCB of the microphone.
  • FIG. 6 is a schematic structural diagram of welding of a microphone and a terminal device according to an embodiment of the present invention. As shown in FIG. 6, the PCB 22 of the microphone is soldered to the PCB 31 of the terminal device, and the boss 23 is inserted into the sound collecting hole 32 of the terminal device. When soldering through the oven, the boss 23 can effectively prevent soldering and assisting. Flux enters the microphone pickup hole.
  • the boss in this embodiment may be a ring-shaped boss, or may be a square boss with a through hole in the middle, or a hexagonal boss with a through hole in the middle and other shapes.
  • the annular shaped boss is taken as an example to illustrate the technical solution of the embodiment of the present invention, and the size and shape of the boss 23 can be set and adjusted according to the sound collecting hole 32 of the terminal device. This invention is not limited thereto.
  • the material of the boss is metal, high temperature resistant plastic or ceramic. Other materials may also be used to make the bosses, which are not limited in this invention.
  • the height of the boss is greater than 0 mm and less than or equal to 20 mm.
  • those skilled in the art can set the size of the boss according to actual requirements, so that the boss can better engage with the sound collecting hole, and effectively prevent the solder and the flux from entering the sound collecting hole.
  • the diameter of the boss is smaller than the diameter of the pad surrounding the sound collecting hole.
  • a plurality of pads are disposed on the PCB 22 of the microphone to achieve soldering of the microphone and the terminal device through the pads, wherein the diameter of the boss 23 is smaller than the pads 26 of the sound collecting holes 24 surrounding the microphone. diameter of.
  • FIG. 7 is a cross-sectional view showing the structure of a microphone according to Embodiment 2 of the present invention.
  • the boss 23 is interference-fitted with the sound collecting hole 24 so that the boss 23 is riveted to the PCB 22.
  • the microphone provided in this embodiment has an interference fit between the boss and the sound collecting hole, so that the boss is riveted on the PCB, thereby effectively preventing the solder and the flux from entering the sound collecting hole, thereby avoiding problems such as silent or noise of the microphone.
  • Making the currently banned bottom pickup microphone device an optional device Reduces the Fault Feedback Ratio (FFR) problem caused by soldering in the bottom pickup microphone project.
  • FFR Fault Feedback Ratio
  • FIG. 8 is a schematic structural diagram of a manufacturing process of a boss of a microphone according to Embodiment 3 of the present invention.
  • a non-porous boss 27 is bonded to the PCB 22 by a high temperature resistant glue, and is disposed above the sound collecting hole, and holes are formed in the non-hole boss 27 to form a boss, and the formed convex portion is formed.
  • the table is shown as a boss 23 in FIG.
  • the microphone provided in this embodiment bonds a non-porous boss to the PCB through the high temperature resistant glue, and punches the hole on the non-hole boss to form a boss.
  • the flux and the flux flow around the boss. It will be blocked by the boss to effectively prevent the solder and flux from entering the sound-collecting hole, thus avoiding the problem of silent or noise of the microphone, which makes the currently selected bottom pickup microphone device become an optional device, effectively reducing the bottom pickup.
  • the FFR problem caused by the soldering of the microphone item bonds a non-porous boss to the PCB through the high temperature resistant glue, and punches the hole on the non-hole boss to form a boss.
  • FIG. 9 is a schematic structural diagram of a manufacturing process of a boss of a microphone according to Embodiment 4 of the present invention.
  • the boss is a boss milled above the sound collecting hole 24 on the PCB 28 using a numerically controlled machine tool, and the formed boss is as shown by the boss 23 in Fig. 4.
  • the thickness of the PCB is thicker than the thickness of the PCB in the first embodiment to the third embodiment.
  • the specific thickness of the PCB may be set according to actual requirements, and is not limited thereto.
  • the microphone provided in this embodiment uses a boss of a numerically controlled machine tool milled above the sound collecting hole on the PCB to effectively prevent solder and flux from entering the sound collecting hole, thereby avoiding problems such as silent or noise of the microphone, so that now
  • the banned bottom pickup microphone device becomes an optional device, effectively reducing the FFR problem caused by soldering in the bottom pickup microphone project.
  • a ceramic substrate solution such as a Micro-Electro-Mechanical System (MEMS) MEMS process solution, such as a photolithography technique using positive and negative photoresist liquids, may also be used.
  • MEMS Micro-Electro-Mechanical System

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本发明实施例提供一种麦克风，包括：金属罩、与所述金属罩连接，且设置有拾音孔的所述麦克风的印制电路板PCB，还包括：设置有通孔的凸台；所述凸台设置在所述PCB上，背离金属罩的另一面，且所述凸台位于包围所述拾音孔的焊盘上，以实现防止焊锡和助焊剂进入所述拾音孔，其中，所述通孔与所述拾音孔连通，以实现音频信号通过所述通孔进入所述拾音孔，当麦克风在过烤炉焊接到终端的PCB上时，焊锡和助焊剂流动到凸台周围后将被凸台挡住，有效防止焊锡和助焊剂进入拾音孔，从而避免了该麦克风存在无声或者杂音等问题。

Description

麦克风 技术领域
本发明实施例涉及通信技术，尤其涉及一种麦克风。
背景技术
图1为现有技术中底部拾音的麦克风的结构示意图。图2为现有技术中底部拾音的麦克风的结构剖视图。该麦克风为用于终端设备的内置麦克风，例如，手机、平板电脑等终端设备的内置麦克风。如图1和图2所示，该底部拾音的麦克风包括金属罩1和麦克风的印制电路板(Printed Circuit Board，简称PCB)2。其中，麦克风的PCB板2上设置有多个焊盘3和一个拾音孔5，拾音孔5的外围设置有绿油4。
图3为现有技术中麦克风和终端设备焊接的结构示意图。如图3所示，麦克风的PCB 2与终端设备的PCB 6通过焊盘焊接在一起，麦克分的拾音孔4和终端设备的拾音孔7的位置相对应，呈连通状态，绿油4用于防止焊接过程中焊锡进入麦克风(Microphone，简称Mic)的拾音孔
但是，当底部拾音的麦克风在过烤炉焊接时，由于焊锡和助焊剂的流动方向无法精确控制，绿油仍然无法完全阻挡焊锡和助焊剂进入麦克风的拾音孔，从而导致了终端设备的Mic存在无声或者杂音等问题。
发明内容
本发明实施例提供一种麦克风，有效防止焊锡和助焊剂进入拾音孔，从而避免了该麦克风存在无声或者杂音等问题。
本发明实施例第一方面提供一种麦克风，包括：
金属罩、与所述金属罩连接，且设置有拾音孔的所述麦克风印制电路板PCB、其特征在于，还包括：设置有通孔的凸台；
所述凸台设置在所述PCB上，背离金属罩的另一面，且所述凸台位于包围所述拾音孔的焊盘上，以实现防止焊锡和助焊剂进入所述拾音孔；
其中，所述通孔与所述拾音孔连通，以实现音频信号通过所述通孔进入所述拾音孔。
在第一方面的第一种可能实现方式中，所述通孔的直径大于或者等于所述拾音孔的直径。
结合第一方面的第一种可能实现方式，在第一方面的第二种可能实现方式中，所述凸台的高度为大于0mm，且小于或者等于20mm。
结合第一方面的第二种可能实现方式，在第一方面的第三种可能实现方式中，所述凸台与所述拾音孔进行过盈配合，以使所述凸台铆接在所述PCB上。
结合第一方面的第二种可能实现方式，在第一方面的第四种可能实现方式中，所述凸台为通过耐高温胶将一个无孔凸台粘接到所述PCB上，且设置在拾音孔上方，在所述无孔凸台上打孔以形成的凸台。
结合第一方面的第二种可能实现方式，在第一方面的第五种可能实现方式中，所述凸台为使用数控机床在所述PCB上的所述拾音孔的上方铣出的凸台。
结合第一方面的第二种可能实现方式，在第一方面的第六种可能实现方式中，所述凸台的材料为金属、耐高温塑胶或者陶瓷。
结合第一方面的第二种可能实现方式，在第一方面的第七种可能实现方式中，所述凸台的直径小于包围所述拾音孔的焊盘的直径。
本实施例提供的麦克风，由于在PCB上、且围绕拾音孔设置了一个环形凸台，因此，当麦克风在过烤炉焊接到终端的PCB上时，焊锡和助焊剂流动到凸台周围后将被凸台挡住，有效防止焊锡和助焊剂进入拾音孔，从而避免了该麦克风存在无声或者杂音等问题。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中底部拾音的麦克风的结构示意图；
图2为现有技术中底部拾音的麦克风的结构剖视图；
图3为现有技术中麦克风和终端设备焊接的结构示意图；
图4为本发明实施例一提供的麦克风的结构示意图；
图5本发明实施例一提供的麦克风的结构剖视图；
图6为本发明实施例中麦克风和终端设备焊接的结构示意图；
图7为本发明实施例二提供的麦克风的结构剖视图；
图8为本发明实施例三提供的麦克风的凸台制作工艺结构示意图；
图9为本发明实施例四提供的麦克风的凸台制作工艺结构示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
图4为本发明实施例一提供的麦克风的结构示意图。图5本发明实施例一提供的麦克风的结构剖视图。如图4和图5所示，该麦克风包括金属罩21、与金属罩21连接，且设置有拾音孔24的麦克风的PCB 22和设置有通孔25的凸台23。所述拾音孔外围设置有焊盘26，以实现将麦克风的PCB 22焊接到终端设备的PCB上。其中，凸台23设置在PCB 22上，背离金属罩21的另一面，且凸台23位于包围拾音孔24的焊盘26上，以实现防止焊锡和助焊剂进入拾音孔。另外，通孔25与拾音孔24连通，以实现音频信号通过通孔25进入拾音孔24。
在本实施例中，通孔的直径大于、等于或者小于拾音孔的直径均可以实现通孔25与拾音孔24连通，当通孔25的直径大于或者等于拾音孔24的直径时，可以将凸台23设置在拾音孔24的上方，当通孔25的直径小于拾音孔24的直径时，可以将凸台23直接插入拾音孔24内，本发明中并不以此为限。
优选地，在本实施例中，通孔25的直径大于或者等于拾音孔24的直径。
本实施例中，由于通孔的直径大于或者等于拾音孔的直径，因此可以更好的保证了通过通孔进入拾音孔的音频信号的音频特性。
本实施例提供的麦克风可设置于手机、电脑、手持终端等终端设备上，麦克风通过麦克风的PCB上的焊盘与终端设备的PCB焊接在一起。图6为本发明实施例中麦克风和终端设备焊接的结构示意图。如图6所示，麦克风的PCB 22与终端设备的PCB 31焊接在一起，凸台23插入终端设备的拾音孔32中，当经过烤炉焊接时，凸台23可以有效的防止焊锡和助焊剂进入麦克风拾音孔中。
需要说明的是，本实施例中的凸台可以为圆环形状的凸台，也可以为中间设置有通孔的方形凸台，或者是中间设置有通孔的六边形凸台等其它形状的凸台，本发明中仅以圆环形状的凸台为例，来说明本发明实施例的技术方案，并且，凸台23的尺寸和形状可以根据终端设备的拾音孔32进行设置和调整，本发明中并不以此为限。
可选地，在本实施例中，凸台的材料为金属、耐高温塑胶或者陶瓷。也可以选用其它的材料制作凸台，本发明中并不以此为限。
本实施例提供的麦克风，由于在PCB上、且围绕拾音孔设置了一个环形凸台，因此，当麦克风在过烤炉焊接到终端的PCB上时，焊锡和助焊剂流动到凸台周围后将被凸台挡住，有效防止焊锡和助焊剂进入拾音孔，从而避免了该麦克风存在无声或者杂音等问题。
优选地，在本实施例中，凸台的高度为大于0mm，且小于或者等于20mm。
在本实施例中，本领域技术人员可于根据实际需求设置凸台的尺寸大小，以使凸台更好的与拾音孔衔接，有效防止焊锡和助焊剂进入拾音孔。
优选地，在本实施例中，凸台的直径小于包围拾音孔的焊盘的直径。
本实施例中，麦克风的PCB 22上设置有多个焊盘，以实现通过焊盘将麦克风和终端设备焊接在一起，其中，凸台23的直径小于包围麦克风的拾音孔24的焊盘26的直径。
图7为本发明实施例二提供的麦克风的结构剖视图。在上述图4所示实施例的基础上，如图7所示，凸台23与拾音孔24进行过盈配合，以使凸台23铆接在PCB 22上。
本实施例提供的麦克风，凸台与拾音孔进行过盈配合，以使凸台铆接在PCB上，有效防止焊锡和助焊剂进入拾音孔，从而避免了该麦克风存在无声或者杂音等问题，使得现在禁选的底部拾音麦克风器件变为可选用器件，有 效降低底部拾音麦克风项目由于进焊锡而导致的故障反馈率(Fault Feedback Ratio，简称FFR)问题。
图8为本发明实施例三提供的麦克风的凸台制作工艺结构示意图。如图6所示，通过耐高温胶将一个无孔凸台27粘接到PCB 22上，且设置在拾音孔上方，在无孔凸台27上打孔以形成凸台，成型后的凸台如图4中的凸台23所示。
本实施例提供的麦克风，通过耐高温胶将一个无孔凸台粘结到PCB上，在无孔凸台上打孔以形成凸台，在焊接时，焊锡和助焊剂流动到凸台周围后将被凸台挡住，有效防止焊锡和助焊剂进入拾音孔，从而避免了该麦克风存在无声或者杂音等问题，使得现在禁选的底部拾音麦克风器件变为可选用器件，有效降低底部拾音麦克风项目由于进焊锡而导致的FFR问题。
图9为本发明实施例四提供的麦克风的凸台制作工艺结构示意图。如图9所示，凸台为使用数控机床在PCB 28上的拾音孔24的上方铣出的凸台，成型后的凸台如图4中的凸台23所示。
需要说明的是，在本实施例中，PCB的厚度比上述实施例一至三中的PCB的厚度厚，PCB的具体厚度尺寸可根据实际需求来设置，本发明中并不以此为限。
本实施例提供的麦克风，使用数控机床在PCB上的拾音孔的上方铣出的凸台，有效防止焊锡和助焊剂进入拾音孔，从而避免了该麦克风存在无声或者杂音等问题，使得现在禁选的底部拾音麦克风器件变为可选用器件，有效降低底部拾音麦克风项目由于进焊锡而导致的FFR问题。
可选地，在本发明实施例中，还可以使用陶瓷基板方案、微机电系统(Micro-Electro-Mechanical System，简称MEMS)MEMS制程方案，例如使用正负光阻液的光刻技术等来实现在拾音孔处做出一个凸台。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (8)

  1. 一种麦克风，包括金属罩、与所述金属罩连接，且设置有拾音孔的所述麦克风印制电路板PCB、其特征在于，还包括：设置有通孔的凸台；
    所述凸台设置在所述PCB上，背离金属罩的另一面，且所述凸台位于包围所述拾音孔的焊盘上，以实现防止焊锡和助焊剂进入所述拾音孔；
    其中，所述通孔与所述拾音孔连通，以实现音频信号通过所述通孔进入所述拾音孔。
  2. 根据权利要求1所述的麦克风，其特征在于，所述通孔的直径大于或者等于所述拾音孔的直径。
  3. 根据权利要求1或2所述的麦克风，其特征在于，所述凸台的高度为大于0mm，且小于或者等于20mm。
  4. 根据权利要求1或3所述的麦克风，其特征在于，所述凸台与所述拾音孔进行过盈配合，以使所述凸台铆接在所述PCB上。
  5. 根据权利要求1-3所述的麦克风，其特征在于，所述凸台为通过耐高温胶将一个无孔凸台粘接到所述PCB上，且设置在拾音孔上方，在所述无孔凸台上打孔以形成的凸台。
  6. 根据权利要求1-3所述的麦克风，其特征在于，所述凸台为使用数控机床在所述PCB上的所述拾音孔的上方铣出的凸台。
  7. 根据权利要求1-6任一项所述的麦克风，其特征在于，所述凸台的材料为金属、耐高温塑胶或者陶瓷；
  8. 根据权利要求1-7任一项所述的麦克风，其特征在于，所述凸台的直径小于包围所述拾音孔的焊盘的直径。
PCT/CN2014/094978 2014-12-25 2014-12-25 麦克风 Ceased WO2016101219A1 (zh)

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