WO2016101778A1 - 一种基于生物兼容薄膜的柔性可延展电子器件及制备方法 - Google Patents

一种基于生物兼容薄膜的柔性可延展电子器件及制备方法 Download PDF

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WO2016101778A1
WO2016101778A1 PCT/CN2015/096294 CN2015096294W WO2016101778A1 WO 2016101778 A1 WO2016101778 A1 WO 2016101778A1 CN 2015096294 W CN2015096294 W CN 2015096294W WO 2016101778 A1 WO2016101778 A1 WO 2016101778A1
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layer
biocompatible
film
electronic device
functional
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French (fr)
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冯雪
陈颖
苏红宏
陆炳卫
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Tsinghua University
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Tsinghua University
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Priority to EP15871847.8A priority patent/EP3238610B1/en
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/683—Means for maintaining contact with the body
    • A61B5/6832—Means for maintaining contact with the body using adhesives
    • A61B5/6833—Adhesive patches
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/0002—Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network
    • A61B5/0015—Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network characterised by features of the telemetry system
    • A61B5/0024—Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network characterised by features of the telemetry system for multiple sensor units attached to the patient, e.g. using a body or personal area network
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/024—Measuring pulse rate or heart rate
    • A61B5/02416—Measuring pulse rate or heart rate using photoplethysmograph signals, e.g. generated by infrared radiation
    • A61B5/02427—Details of sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander

Definitions

  • the invention relates to a flexible extensible electronic device based on a biocompatible film and a preparation method thereof, which can be used for, but not limited to, various body sensors.
  • various sensors are always required to perform intermittent or real-time monitoring of human physiological information.
  • Conventional measurements include body temperature, pulse, heart rate, electrocardiogram, blood oxygen and other signals.
  • the devices that test the corresponding signals in clinical or healthy medical consumer electronics use hard-to-soft contact methods, such as mercury thermometers, finger-pig pulse oximeters, and electrocardiographic electrodes. They all use reliable and effective physicochemical principles, but there are some unavoidable problems with hard-to-soft contact: the uncomfortable feeling of hard contact may affect the performance of normal physiological parameters; the imperfect fit of hard contact The detection signal is affected by the good contact; relying on such equipment can not achieve 24-hour comfortable and effective health monitoring. Therefore, electronic devices/components that can be integrated with the human body are a major branch of flexible electronics, and their research has a wide-ranging commercial value of people's death.
  • biocompatibility It not only includes chemical components that do not contain harmful chemical components, but also has physical permeability, so that body surface sweat can be evaporated normally, avoiding impregnation or allergic reactions; 2) Flexible malleability: flexible requirements device ( The base layer and the functional layer have low bending rigidity, can be flexibly bent to adapt to the natural curvature of the surface of the human tissue, and the ductility requires that the tensile rigidity of the device is small, and can be deformed in the in-plane direction to adapt to non-compatibility. Exhibition of human tissue surface.
  • a flexible extensible electronic device based on a biocompatible film comprising an encapsulation layer, a functional layer and a substrate layer, wherein the encapsulation layer adopts a biocompatible encapsulation layer, and the substrate layer adopts a biocompatible substrate layer; the biocompatible The encapsulation layer and the biocompatible substrate layer are biocompatible films.
  • the technical feature of the present invention is also that a layer is provided between the biocompatible encapsulation layer and the functional layer for enhancing and functional layers.
  • the biocompatible film of the present invention is a polymer film or a bio-transparent film having a porous microstructure; the biocompatible encapsulation layer and the biocompatible substrate layer have the same thickness.
  • the functional layer of the present invention comprises functional elements, interconnecting wires and extraction electrodes; the functional elements are materials having a temperature resistance, piezoresistive or piezoelectric effect.
  • the functional layer of the present invention adopts a flexible extensible structure; the flexible extensible structure preferably adopts an island bridge structure, an S-shaped structure or a wavy buckling structure.
  • the invention provides a method for preparing a flexible extensible electronic device based on a biocompatible film, characterized in that the method comprises the following steps:
  • the device is packaged with a biocompatible film to form a biocompatible encapsulation layer to complete device fabrication.
  • the functional layer of steps 4)-5) is integrated with the biocompatible substrate layer using a transfer technique.
  • the invention Compared with the conventional flexible malleable electronic device, the invention has the following advantages and outstanding technical effects: the device designed by the method of the invention adopts the biocompatible encapsulation layer and the biocompatible substrate layer to introduce good traditional flexible extensible electronic devices. Biocompatibility while maintaining or even improving its flexibility and extensibility. Its bio-compatible properties such as waterproof, low sensitization make it work on the surface of the human body for more than 24 hours without any foreign body sensation and discomfort. It can avoid the poor biocompatibility (non-breathable). Skin impregnation, redness or other allergic reactions.
  • FIG. 1 is a schematic perspective view of a layered three-dimensional structure of a flexible extensible electronic device based on a biocompatible film according to the present invention.
  • FIG. 2 is a schematic cross-sectional view of a flexible extensible electronic device based on a biocompatible film proposed in the present invention.
  • FIG. 3 is a flow chart of a preparation process based on transfer proposed in the present invention.
  • 1-biocompatible encapsulation layer 2-bonding layer; 3-functional component; 4-interconnecting wire; 5-biocompatible substrate layer; 6-adhesion layer; 7-functional layer.
  • the film 1 and 2 are respectively a layered stand of a flexible extensible electronic device based on a biocompatible film according to the present invention.
  • Schematic diagram of the bulk and layered cross-section, the basic structure of the flexible extensible electronic device is a biocompatible encapsulation layer/functional layer/biocompatible substrate layer, wherein the biocompatible encapsulation layer 1 is a kind of biocompatible film, including but not Limited to a polymer film having a porous microstructure (such as a porous polyurethane film) or a biological semi-permeable film (such as a selectively permeated biological tissue film) having a thickness of several tens of micrometers, mainly characterized by a diameter distributed from several hundred Non-through holes ranging from nanometers to tens of micrometers, oxygen and water vapor can pass, and liquid water and bacteria cannot pass. Therefore, the film has biocompatibility and waterproof and breathable functions, and is biocompatible when applied to human body surface. Sex.
  • the biocompatible substrate layer 5 is also made of the above biocompatible film for supporting the functional component 3 and the interconnecting wire 4; the functional component 3 and the interconnecting wire 4 are both designed for flexible ductility, and the non-extensible functional component 3 can be
  • the design buffer layer is used to isolate the strain, and the interconnecting wires 4 are ductilely designed to achieve ductility.
  • the S-shaped fractal design wire increases the wavelength in the in-plane direction and reduces the amplitude to accommodate the tensile deformation in the substrate surface.
  • the biocompatible film provides the biocompatibility of the device with the breathability, water repellency and low sensitization of the biocompatible film, allowing the device to work on human tissue (including but not limited to skin) for up to 24 hours.
  • the biocompatible substrate layer 5 is an integrated device functional layer comprising various functional elements 3, interconnecting wires 4 and extraction electrodes.
  • Each type of functional component 3 and its interconnecting conductors 4 are designed through a flexible and extensible structure, such as an island bridge structure, an out-of-plane buckling structure, or an in-plane curved arrangement.
  • the package is made of a biocompatible encapsulation layer 1 to protect the functional structure of the functional device, and the circuit function and biocompatibility are not damaged by the external liquid.
  • the package can encapsulate the device as a whole, or only the functional component 3 and the interconnection wire 4 exist. Perform partial packaging.
  • the final encapsulation of the device using the biocompatible encapsulation layer 1 of the same thickness as the biocompatible substrate layer 5 not only ensures the overall biocompatibility of the device, but also allows the functional elements 3 and interconnecting wires 4 in the device to be located in the mechanical neutral layer of the overall structure.
  • the stress strain of the functional element 3 under bending deformation load is reduced.
  • the adhesive layer 2 selectively exists between the biocompatible encapsulation layer 1 and the functional layer, and has a thickness of about several micrometers. If the biocompatible encapsulation layer 1 and the functional layer are both thin enough, the van der Waals force can be used for bonding without using Bonding layer 2.
  • An adhesive layer 6 selectively present between the biocompatible substrate layer 5 and the surface of the object to be tested (human skin) for enhancing the adhesion of the device to the surface of the object to be tested, the layer being composed of a material having high viscosity and extremely low sensitization The composition makes the whole device firmly contact with the surface of the human tissue, and the debonding failure is not easy to occur.
  • the components in the functional layer may be temperature sensing components utilizing the metal temperature resistance effect, strain sensing components of the semiconductor/metal piezoresistive effect, or energy collecting components of the piezoelectric material piezoelectric effect, etc., different functional materials and structural forms may be Achieve different kinds of signal acquisition functions.
  • Biocompatible flexible extensible electronic device components with separate functions or multiple functions can be prepared using the preparation procedure shown in FIG.
  • FIG. 3 is a process flow diagram of a method for preparing a flexible extensible electronic device based on a biocompatible film provided by the present invention, the preparation method comprising the following steps:
  • the device is packaged with a biocompatible film to form a biocompatible encapsulation layer 1 to complete device fabrication.
  • steps 2) to 3) may be repeated to perform multilayer preparation, and the insulation layer is used for isolation between layers, or perforation is used to help the connection.
  • the biocompatible film may be bonded to the functional layer on the silicon substrate through the bonding layer 2, and the biocompatible film and the silicon substrate are placed together in the sacrificial layer etching solution, and the etching is sacrificed.
  • the layer, the method of transferring the functional layer onto the flexible substrate can also realize the integration of the functional layer with the flexible substrate by using a transfer stamp having a novel microstructure without using the bonding layer 2.
  • a layer of adhesion layer 6 may be used to reinforce the fit between the skin and the biocompatible substrate layer 5, and if the thickness of the device is sufficiently small, the adhesion layer 6 is not used. Directly rely on Van der Waals force to achieve a firm fit between the device and the skin.
  • the method utilizes a biocompatible film as a biocompatible substrate layer 5, and the functional layer is prepared by a thin film growth, photolithography process on a silicon substrate by a conventional semiconductor process, and the biocompatible film is used as a biocompatible encapsulation layer 1 at the top, functional layers and organisms.
  • a low-sensitivity adhesive is used between the compatible encapsulating layers 1 and between the biocompatible substrate layer 5 and the surface of the object to be tested as the bonding layer 2 and the adhesion layer 6.
  • the integration of the functional layer with the biocompatible substrate layer 5 is achieved by a transfer method during preparation.
  • the preparation method utilizes a transfer method to realize integration of the functional layer with the biocompatible substrate layer 5.
  • the functional layer is prepared on a silicon substrate using a conventional semiconductor process, including film growth, photolithography, etching, and the like.
  • a sacrificial layer is prepared in advance on the silicon substrate to facilitate the peeling of the functional layer from the silicon substrate for transfer.
  • the requirements for the selection of the sacrificial layer material and the preparation process are as follows: 1) The preparation of the functional layer can be ensured smoothly, that is, the flatness, hardness and glass transition temperature of the sacrificial layer can satisfy the growth condition of the functional part film, and the quality of the film growth is not affected; 2) It can ensure that the patterned etching of the functional part is completed smoothly, that is, the sacrificial layer can withstand the physicochemical reaction during photolithography and etching, and no vitrification occurs; 3) the sacrificial layer can be easily etched after the functional layer is prepared. Dropped, and the reaction does not affect the functional part pattern and material properties.
  • Embodiment 1 A flexible ductile temperature sensor based on biocompatible film
  • This embodiment is a biocompatible film-based extensible electronic device that utilizes the temperature resistance effect of gold.
  • the device is fabricated by using the design method and the preparation process proposed in the technical solution of the present invention, wherein the biocompatible encapsulation layer 1 and the biocompatible substrate layer 5 each adopt a porous polyurethane film of 50 ⁇ m thickness, and the adhesive layer 2 and the adhesion layer 6 are low-induced.
  • Sensitive, highly viscous acrylic, functional elements 3 in the functional layer and interconnecting wires 4 are patterned gold nano-films that can be used to measure body temperature.
  • the preparation method is as follows:
  • a flat sacrificial layer is prepared on a silicon substrate, that is, a PI film is prepared on the silicon substrate by spin coating, and the water is horizontally placed to serve as a sacrificial layer.
  • Electron beam deposition is used to grow a layer of dense and flat chromium as a metal bonding layer, and a layer of gold is grown thereon as a temperature resistance effect.
  • the functional layer material should be.
  • the chrome bonding layer bonds the gold to the substrate more closely.
  • the temperature rise of the substrate is small, and the vitrification of the soluble polymer of the sacrificial layer is not made insoluble, and the subsequent sacrificial layer is easily etched to release the functional portion from the silicon substrate.
  • the gold/chromium thin film is patterned into a functional layer by forming a temperature-resistance effect functional element 3 portion and a interconnecting wire 4 in the pattern forming sensor through a flexible and extensible design by photolithography and wet etching using a conventional semiconductor micromachining process.
  • Transfer is a technique in which a functional layer prepared by a conventional semiconductor process is peeled off from a silicon substrate and printed onto a flexible substrate, and the integration of the functional layer with the biocompatible substrate layer 5 can be realized by the transfer.
  • the exposed portion of the device is packaged with a porous polyurethane film of the same thickness to form a biocompatible encapsulation layer 1.
  • the package functions as a protection function while the functional layer is located in the neutral layer of the final device.

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Abstract

一种基于生物兼容薄膜的柔性可延展电子器件，利用生物兼容薄膜作为柔性可延展电子器件的封装层（1）和基底层（5），还在封装层（1）和功能层（7）之间设置一层用于增强与功能层（7）之间界面强度的粘结层（2）以及在基底层（5）下面设置一层用于增强器件与待测物体表面附着力的附着层（6）。功能层（7）采用柔性可延展结构。这种柔性可延展电子器件的制备过程主要采用基于溶液转印技术实现功能层（7）与柔性基底（5）集成。这种柔性可延展电子器件从结构上保持甚至提升了柔性延展性，同时其防水透气、低致敏性等生物兼容特性使得它可以在人体表面正常工作长达24小时以上，而不带来异物感和不舒适感，可以避免由于生物兼容性差带来的皮肤浸渍、发红或其他过敏反应。

Description

一种基于生物兼容薄膜的柔性可延展电子器件及制备方法 技术领域
本发明涉及一种基于生物兼容薄膜的柔性可延展电子器件及其制备方法，可用于但不限于各种体征传感器。
背景技术
医疗保健、健康监测中总是需要各种传感器对人体生理信息进行间断或实时监测，常规测量包括体温、脉搏、心率、心电、血氧等信号。目前，不论是临床上还是健康医疗消费电子中测试相应信号的设备均采用硬对软的接触方式，如水银体温计、指夹脉搏血氧仪、心电电极贴等。它们均采用可靠有效的物理化学原理，但硬对软的接触存在一些不可避免的问题：硬接触给患者带来的不舒适感可能会影响正常生理参数的表现；硬接触的非完美贴合会使检测信号受到接触良好与否的影响；依靠该类仪器设备无法实现24小时舒适又有效的健康监测。因此，可与人体集成的电子器件\元件作为柔性电子的一大分支，其研究存在广泛长足的民生商业价值。
自2011年《科学》报道一项关于皮肤电子工作以来，关于可与人体表皮集成电子器件引起众多科研工作者的研究兴趣，相继出现在皮肤上测量水分、体温、心电、肌电等人体生理信号的柔性传感器。它们采用薄而柔的聚合物薄膜材料作为基底，利用粘结层或范德华力将柔性功能器件与人体皮肤直接或间接接触，在皮肤表层进行各种生理信号采集。该部分研究内容重点在器件如何实现柔性、可延展性，缺乏对器件在人体表面长时间存在的生物兼容性的考虑。仅利用范德华力进行黏附的柔性器件在长有汗毛的表皮处黏附性较差。利用粘结层进行黏附的柔性器件，由于没有考虑到透气性，很难在人体皮肤表面保持较长时间。
发明内容
本发明的目的是提供一种基于生物兼容薄膜的柔性可延展电子器件及制备方法，以解决柔性可延展电子器件与人体结合时生物兼容性的问题，即包括但不限于：①生物兼容性：不仅包括化学上器件中不含有对人体有害的化学成分，同时在物理上还要具有透气性，使得体表汗液可以正常蒸发，避免浸渍或过敏反应；②)柔性可延展性：柔性要求器件(包括基底层和功能层)的弯曲刚度小，可以不费力地进行弯折以适应人体组织表面天然存在的曲率，可延展性要求器件的拉伸刚度小，可以在面内方向变形以适应非可展的人体组织表面。
本发明的技术方案如下：
一种基于生物兼容薄膜的柔性可延展电子器件，含有封装层、功能层和基底层，其特征在于，所述封装层采用生物兼容封装层，基底层采用生物兼容基底层；所述的生物兼容封装层和生物兼容基底层采用生物兼容薄膜。
本发明的技术特征还在于，在生物兼容封装层和功能层之间设有一层用于增强与功能层 之间界面强度的粘结层；在生物兼容基底层下面设有一层用于增强器件与待测物体表面附着力的附着层。
本发明所述的生物兼容薄膜为具有多孔微结构的聚合物薄膜或生物半透膜；生物兼容封装层和生物兼容基底层的厚度相同。
本发明所述功能层包含功能元件、互联导线和引出电极；所述功能元件采用具有温阻、压阻或压电效应的材料。
本发明所述功能层采用柔性可延展结构；所述柔性可延展结构优选采用岛桥结构、S型结构或波浪状屈曲结构。
本发明一种制备基于生物兼容薄膜的柔性可延展电子器件的方法，其特征在于该方法包括如下步骤：
1)在硅基片上制备牺牲层；
2)利用薄膜生长技术在硅基片上进行功能层材料的生长和制备；
3)利用半导体工艺对功能层材料进行光刻刻蚀，完成图案化，形成功能层；
4)将生物兼容薄膜与硅基片上的功能层贴合；
5)将生物兼容薄膜与带有功能层的硅基片一起放入牺牲层刻蚀液中，刻蚀牺牲层，使生物兼容基底层(5)与功能层结合；
6)在功能层预留的引出电极处接入外接导线；
7)用生物兼容薄膜对器件进行封装，形成生物兼容封装层，完成器件制备。
本发明的所述方法中，其中第4)-5)步功能层与生物兼容基底层集成时利用转印技术实现。
本发明相比于传统柔性可延展电子器件具有以下优点及突出性的技术效果：采用本发明方法所设计制备的器件采用生物兼容封装层和生物兼容基底层为传统柔性可延展电子器件引入良好的生物兼容性，同时保持甚至提升其柔性可延展性。它的防水透气、低致敏性等生物兼容特性使得它可以在人体表面正常工作长达24小时以上，而不带来异物感和不舒适感，可以避免由于生物兼容性差(不透气)带来的皮肤浸渍、发红或其他过敏反应。
附图说明
图1是本发明中提出的一种基于生物兼容薄膜的柔性可延展电子器件的分层立体结构示意图。
图2是本发明中提出的一种基于生物兼容薄膜的柔性可延展电子器件的分层截面示意图。
图3是本发明中提出的一种基于转印的制备工艺流程方案。
图中：1-生物兼容封装层；2-粘结层；3-功能元件；4-互联导线；5-生物兼容基底层；6-附着层；7-功能层。
具体实施方式
下面结合附图和实施例进一步说明本发明具体内容。
图1、图2分别为本发明提出的一种基于生物兼容薄膜的柔性可延展电子器件的分层立 体和分层截面示意图，该柔性可延展电子器件的基本结构是生物兼容封装层/功能层/生物兼容基底层，其中，生物兼容封装层1是一类具有生物兼容性的薄膜，包括但不限于具有多孔微结构的聚合物薄膜(如多孔聚氨酯薄膜)或生物半透膜(如具有选择性透过的生物组织膜)，厚度为几十微米，主要特征在于其上分布有直径从几百纳米到几十微米不等的非贯穿孔，氧气、水蒸气可以通过，而液态水、细菌无法通过，因此该类薄膜具有生物兼容性及防水透气功能，应用于人体体表时具有良好生物兼容性。
生物兼容基底层5亦采用上述具有生物兼容性薄膜制成，用于承托功能元件3和互联导线4；功能元件3和互联导线4均经过柔性可延展性设计，不可延展的功能元件3可采用设计缓冲层来隔离应变，互联导线4通过S型的分形设计实现延展性。S型分形设计的导线通过在面内方向增大波长、减小波幅适应基底面内拉伸变形。
采用生物兼容薄膜作为柔性基底层，利用生物兼容薄膜的透气防水性、低致敏性提供整体器件的生物兼容性，使得器件可以在人体组织(包括但不限于皮肤)表面工作时间长达24小时以上。生物兼容基底层5上是集成的器件功能层，包括各类功能元件3、互联导线4和引出电极。每类功能元件3及其互联导线4均经过柔性可延展的结构设计，如岛桥结构、离面屈曲结构或面内弯曲排布结构等设计。封装时采用生物兼容封装层1，以保护功能器件的结构完整，不被外部液体破坏电路功能和生物兼容性，封装可以对器件整体进行封装，也可以只对功能元件3和互联导线4存在部位进行局部封装。
采用与生物兼容基底层5厚度相同的生物兼容封装层1对器件进行最后封装，不仅可以保证器件整体生物兼容性，还可以使得器件中功能元件3和互联导线4位于整体结构的力学中性层，减少弯曲变形载荷下功能元件3所受的应力应变。
位于生物兼容封装层1和功能层之间选择性存在的粘结层2，厚度约为几微米，若生物兼容封装层1和功能层都足够薄时可利用范德华力实现结合，而不需使用粘结层2。生物兼容基底层5和待测物体表面(人体皮肤)之间选择性存在的附着层6，用于增强器件与待测物体表面附着力，该层由粘性较强、致敏性极低的材料组成，使得器件整体与人体组织表面牢固接触，不易发生脱粘失效。
功能层中的元件可以是利用金属温阻效应的温度传感部件，半导体\金属压阻效应的应变传感部件，或者压电材料压电效应的能量收集部件等，不同功能材料和结构形态可以实现不同种类的信号采集功能。单独功能或多种功能兼有的生物兼容柔性可延展电子器件元件均可采用图3中所示制备流程进行制备。
图3是本发明提供的一种基于生物兼容薄膜的柔性可延展电子器件的制备方法的工艺流程图，该制备方法包括如下步骤：
1)在硅基片上制备牺牲层；
2)利用薄膜生长技术在硅基片上进行功能层材料的生长和制备；
3)利用半导体工艺对功能层材料进行光刻刻蚀，完成图案化，形成功能层；
4)将生物兼容薄膜与硅基片上的功能层贴合；
5)将生物兼容薄膜与带有功能层的硅基片一起放入牺牲层刻蚀液中，刻蚀牺牲层，形成生物兼容基底层5与功能层结合；
6)在功能层预留引出电极处接入外接导线；
7)用生物兼容薄膜对器件进行封装，形成生物兼容封装层1，完成器件制备。
上述制备方法中，根据不同器件功能设计要求，如有需要，可以重复步骤2)～3)，进行多层制备，层与层之间采利用绝缘层进行隔离，或打孔帮助连接。第4)步转印，可以采用将生物兼容薄膜通过粘结层2与硅基片上的功能层贴合，再将生物兼容薄膜与硅基片一起放入牺牲层刻蚀液中，刻蚀牺牲层，完成功能层转移到柔性基底上的方法，也可以利用具有新型微结构的转印印章实现功能层与柔性基底的集成，而不使用粘结层2。第6)步中，为实现柔性器件与皮肤的良好接触，可以采用一层附着层6加固皮肤和生物兼容基底层5之间的贴合，而如果器件厚度足够小，则不用附着层6，直接依靠范德华力实现器件与皮肤的牢固贴合。
该方法利用生物兼容薄膜作为生物兼容基底层5，功能层采用传统半导体工艺在硅基片上采用薄膜生长、光刻等工艺进行制备，顶部利用生物兼容薄膜作为生物兼容封装层1，功能层与生物兼容封装层1之间、生物兼容基底层5与待测物表面之间采用低致敏粘胶作为粘结层2和附着层6。制备时采用转印方法实现功能层与生物兼容基底层5的集成。
制备方法，利用转印方法实现功能层与生物兼容基底层5的集成。功能层采用传统半导体工艺在硅基底上进行制备，包括薄膜生长、光刻、刻蚀等方法。硅基底上预先制备好牺牲层，方便功能层从硅基底上剥离利于转印。选择牺牲层材料和制备工艺时需要满足的要求：1)能保证功能层制备顺利完成，即牺牲层平整度、硬度和玻璃化温度能满足功能部分薄膜生长条件，不影响薄膜生长质量；2)能保证功能部分的图案化刻蚀顺利完成，即牺牲层能耐受光刻、刻蚀过程中物理化学反应，不发生玻璃化；3)功能层制备完成后牺牲层能较容易地被刻蚀掉，且该反应不影响功能部分图案和材料性质。
具体实施例如下：
实施例一：一种基于生物兼容薄膜的柔性可延展温度传感器
本实施例是利用金的温阻效应的基于生物兼容薄膜的可延展电子器件。该器件采用本发明技术方案中提出的设计方法和制备流程制成，其中生物兼容封装层1和生物兼容基底层5均采用50μm厚的多孔聚氨酯薄膜，粘结层2和附着层6采用低致敏性、高粘性的丙烯酸，功能层中功能元件3和互联导线4采用图案化的金纳米薄膜，可以用来测量人体体温。制备方法如下：
1)首先在硅基片上制备一层平整的牺牲层，即用旋涂方式在硅基片上制备一层PI薄膜，水平放置烘干水分后作为牺牲层。
2)采用电子束沉积生长一层致密平整的铬作为金属粘结层，其上生长一层金作为温阻效 应的功能层材料。铬粘结层使金与基底结合更紧密。电子束沉积的生长方式中基片温升较小，不会使牺牲层的可溶聚合物玻璃化变得不可溶，保证后面牺牲层容易被刻蚀，将功能部分从硅基片上释放。
3)采用传统半导体微加工工艺光刻、湿法腐蚀将金/铬薄膜图案化成经过柔性可延展化设计的图案形成传感器中的温阻效应功能元件3部分和互联导线4部分，形成功能层。
4)去掉表面残留光刻胶，将生物兼容薄膜平整地贴合到制备好的带功能部件的硅基片上，准备进行转印。转印是柔性电子中一种将传统半导体工艺制备的功能层从硅基片上剥离，印制到柔性基底上的技术，借助它可以实现功能层与生物兼容基底层5的集成。
5)利用刻蚀液刻蚀掉牺牲层。随着刻蚀的完成，功能层从硅基片上完全释放，整体集成到生物兼容基底层5上。
6)最后利用同样厚度的多孔聚氨酯薄膜对器件裸露部分进行封装，形成生物兼容封装层1。封装起保护功能部分的作用，同时使得功能层位于最终器件的中性层。

Claims (10)

  1. 一种基于生物兼容薄膜的柔性可延展电子器件，含有封装层、功能层(7)和基底层，其特征在于，所述封装层采用生物兼容封装层(1)，基底层采用生物兼容基底层(5)；所述的生物兼容封装层(1)和生物兼容基底层(5)采用生物兼容薄膜。
  2. 如权利要求1所述的一种基于生物兼容薄膜的柔性可延展电子器件，其特征在于，在生物兼容封装层(1)和功能层之间设有一层用于增强与功能层之间界面强度的粘结层(2)。
  3. 如权利要求1或2所述的一种基于生物兼容薄膜的柔性可延展电子器件，其特征在于，在生物兼容基底层(5)下面设有一层用于增强器件与待测物体表面附着力的附着层(6)。
  4. 如权利要求3所述的一种基于生物兼容薄膜的柔性可延展电子器件，其特征在于，所述生物兼容薄膜为具有多孔微结构的聚合物薄膜或生物半透膜。
  5. 如权利要求4所述的一种基于生物兼容薄膜的柔性可延展电子器件，其特征在于，生物兼容封装层(1)和生物兼容基底层(5)的厚度相同。
  6. 如权利要求1所述的一种基于生物兼容薄膜的柔性可延展电子器件，其特征在于，所述功能层(7)采用柔性可延展结构。
  7. 如权利要求6所述的一种基于生物兼容薄膜的柔性可延展电子器件，其特征在于，所述柔性可延展结构采用岛桥结构、S型结构或波浪状屈曲结构。
  8. 如权利要求1所述的一种基于生物兼容薄膜的柔性可延展电子器件，其特征在于，所述功能层包含功能元件(3)、互联导线(4)和引出电极，所述功能元件(3)采用具有温阻、压阻或压电效应的材料。
  9. 一种制备基于生物兼容薄膜的柔性可延展电子器件的方法，其特征在于该方法包括如下步骤：
    1)在硅基片上制备牺牲层；
    2)利用薄膜生长技术在硅基片上进行功能层材料的生长和制备；
    3)利用半导体工艺对功能层材料进行光刻刻蚀，完成图案化，形成功能层；
    4)将生物兼容薄膜与硅基片上的功能层贴合；
    5)将生物兼容薄膜与带有功能层的硅基片一起放入牺牲层刻蚀液中，刻蚀牺牲层，使生物兼容基底层(5)与功能层结合；
    6)在功能层预留的引出电极处接入外接导线；
    7)用生物兼容薄膜对器件进行封装，形成生物兼容封装层(1)，完成器件制备。
  10. 如权利要求9所述一种制备基于生物兼容薄膜的柔性可延展电子器件的方法，其特征在于，其中第4)-5)步功能层与生物兼容基底层(5)集成时利用转印技术实现。
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