WO2016115702A1 - 一种小尺寸器件的散热装置和电路板散热系统 - Google Patents

一种小尺寸器件的散热装置和电路板散热系统 Download PDF

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Publication number
WO2016115702A1
WO2016115702A1 PCT/CN2015/071292 CN2015071292W WO2016115702A1 WO 2016115702 A1 WO2016115702 A1 WO 2016115702A1 CN 2015071292 W CN2015071292 W CN 2015071292W WO 2016115702 A1 WO2016115702 A1 WO 2016115702A1
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Prior art keywords
heat sink
small
circuit board
heat
sized device
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Ceased
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PCT/CN2015/071292
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English (en)
French (fr)
Inventor
陈登旭
刘光明
邓以实
王厚新
周列春
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Priority to EP15878380.3A priority Critical patent/EP3247185A4/en
Priority to CN201580005208.5A priority patent/CN106416447A/zh
Priority to PCT/CN2015/071292 priority patent/WO2016115702A1/zh
Publication of WO2016115702A1 publication Critical patent/WO2016115702A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Definitions

  • the invention relates to the field of heat dissipation, and in particular to a heat sink device and a circuit board heat dissipation system for a small-sized device.
  • Some electronic devices in communication terminal products have low heating power consumption, but their actual temperature rise is high due to their small size.
  • a chip-type LED lamp generally consumes power on the order of 0.01 W, and the size is around 1 mm*0.5 mm. Its own heat can cause the temperature rise to be above 10 degrees, and the influence of surrounding heat-emitting devices makes it easy to make Its temperature exceeds the specifications.
  • Another example is a crystal device that does not itself generate heat, but is sensitive to temperature. The nearby heat source transfers heat to the crystal through the copper of the circuit board, causing its temperature to easily exceed its temperature specifications.
  • a Printed Circuit Board can be enlarged to a sufficient size.
  • this method is contrary to the trend of miniaturization of consumer products, and it also greatly increases the cost; for example, it can be Cutting copper on a single board under a small, heat-generating device (such as a crystal), separating the copper skin under the small-sized device from other parts of the copper sheet on the board, and then filling the portion of the copper sheet with a lower thermal conductivity.
  • FR4 to increase the thermal resistance of other heat sources to the crystal
  • FR4 is a code name of the flame retardant material.
  • the crystal temperature will still Exceeding specifications.
  • Embodiments of the present invention provide a heat sink device and a circuit board heat dissipation system for a small-sized device for reducing temperature rise of a small-sized device while reducing heat dissipation cost for a small-sized device.
  • a first aspect of the embodiments of the present invention provides a heat dissipating device for a small-sized device for dissipating heat to a small-sized device on a circuit board, the heat dissipating device including a heat sink;
  • the small size device is soldered to the copper skin of the circuit board;
  • the heat sink is soldered to the copper skin of the circuit board, around the small size device.
  • the heat sink is soldered on the copper skin of the circuit board, and specifically includes:
  • the heat sink is directly soldered to the copper skin of the circuit board by a surface mount SMT technology by a chip mounter.
  • the heat sink is made of copper or tin-tin tinplate.
  • the heat sink is made of stainless steel, aluminum or galvanized steel.
  • the surface of the heat sink is subjected to nickel plating treatment.
  • the heat sink is passed by the sheet material. Stamping and bending forming.
  • the shape of the heat sink is a zigzag shape or a tower shape.
  • the heat sink and the small size The devices are respectively distributed on both sides of the circuit board, and the center of the small-sized device and the center point of the heat sink are located on the same perpendicular to the circuit board.
  • the heat sink and the small size The devices are respectively distributed on both sides of the circuit board, and the center point of the small-sized device and the center point of the heat sink are not located on the same perpendicular to the vertical line of the circuit board.
  • the solder copper and small-sized device of the heat sink is connected through vias on the board.
  • the heat sink and the small size The devices are all distributed on the same side of the board.
  • a second aspect of the embodiments of the present invention provides a circuit board heat dissipation system, including:
  • a circuit board, a small-sized device soldered on the circuit board, and a heat sink provided in any one of the first aspect of the embodiment of the invention to the ninth implementation of the first aspect.
  • the circuit board is further soldered with components other than the small-sized device
  • the soldered copper of the small-sized device is separated from the soldered copper of the other components by FR4.
  • the embodiment of the present invention has the following advantages: in the embodiment of the present invention, by soldering the heat sink in the vicinity of the small-sized device, the heat sink can take away the heat generated by the small-sized device itself, or the peripheral components.
  • the heat of conduction greatly reduces the temperature rise of the small-sized device, and the heat sink is soldered on the circuit board, and does not need to be fixed by other structures.
  • the heat sink has a simple structure and meets the trend of miniaturization of the product. And reduce the cost of heat dissipation for small size devices.
  • FIG. 1 is a schematic structural view of a heat sink of a small-sized device according to an embodiment of the present invention
  • FIG. 2 is another schematic structural view of a heat sink of a small-sized device according to an embodiment of the present invention.
  • FIG. 3 is another schematic structural diagram of a heat sink of a small-sized device according to an embodiment of the present invention.
  • FIG. 4 is another schematic structural view of a heat sink of a small-sized device according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a heat dissipation system of a circuit board according to an embodiment of the present invention.
  • an embodiment of a heat sink of a small-sized device in an embodiment of the present invention includes:
  • the heat sink is used to dissipate heat to the small-sized device 102 on the circuit board 101;
  • the small size device 102 is soldered on the copper skin of the circuit board 101, and the copper skin of the small size device 102 is referred to as the solder copper skin 103 of the small size device;
  • the heat sink comprises a heat sink 104;
  • the heat sink 104 is soldered to the copper skin of the circuit board 101, and is located around the small-sized device 102.
  • the copper skin of the heat sink 104 is referred to as a solder copper foil 105 of the heat sink.
  • the heat sink 104 can be soldered on the copper skin of the circuit board 101 and does not need to be fixed in other ways. Therefore, the heat sink 104 has a simple structure, a small size and is light.
  • the heat sink 104 by soldering the heat sink 104 in the vicinity of the small-sized device 102, the heat sink 104 can take away the heat generated by the small-sized device 102 or the heat conducted by the peripheral components, thereby greatly reducing the small-sized device.
  • the temperature rise of 102 wherein the temperature rise refers to the temperature of the component above the environment, and the heat sink 104 is soldered on the circuit board 101, and does not need to be fixed by other structures.
  • the heat sink 104 has a simple structure and is small in size. The trend is reduced and the cost of heat dissipation for the small size device 102 is reduced.
  • the small-sized device can be various components with small size and heat dissipation, such as LED lamps, crystals, small-sized power amplifiers, power transistors, etc., which are not limited herein.
  • the heat sink 104 is soldered to the copper of the circuit board 101.
  • the heat sink 104 can be passed by the mounter.
  • the surface mount SMT technology is directly soldered to the copper of the circuit board 101.
  • the heat sink 104 is a light heat sink, and the mounter mounts and solders other components on the surface of the circuit board 101 (for example, the small size device). At 102), the heat sink 104 can be soldered on the circuit board in synchronization.
  • the shape, material, size and the like of the heat sink 104 can be more practically used, and there are many options, as long as the requirements for the soldering of the patch can be met, which is not limited herein.
  • the heat sink 104 may be made of copper or tin-tin tinplate.
  • the material used for the heat sink 104 can be directly soldered to the copper skin on the circuit board 101, and no other processing is required. It can be understood that other materials that can be directly soldered with the copper skin can be used. limited.
  • the heat sink 104 may be made of stainless steel, aluminum or galvanized steel, and the surface of the heat sink is nickel-plated.
  • the material used for the heat sink 104 is inconvenient and directly soldered to the copper plate on the circuit board 101. Therefore, the surface of the heat sink 104 made of these materials can be nickel plated so that it can be soldered to the copper pad on the circuit board 101.
  • the heat sink 104 needs to be soldered to the circuit board 101.
  • the heat sink 104 may be made of a sheet material. Formed by stamping and bending.
  • the finished product after the stamping and bending forming of the sheet material is generally light and thin and has a simple structure, and can be used as the heat sink 104 after selecting an appropriate size according to the size of the small-sized device 102.
  • the heat sink 104 is not limited to a sheet shape, and may be a square shape or the like according to actual needs, as long as the patch can be soldered on the circuit board.
  • the requirements of the heat sink 104 in the embodiment can well dissipate the small size device 102.
  • the heat sink 104 may have a shape of a zigzag, or a tower. shape.
  • the heat sink 104 is located around the small-sized device 102. In practical applications, the heat sink 104 may have a plurality of positions relative to the small-sized device 102:
  • the heat sink 104 may be distributed on the two sides of the circuit board 101 and the small-sized device 102 respectively.
  • the center point of the small-sized device 102 is located on the same perpendicular line to the circuit board 101 as the center point of the heat sink 104.
  • the center point of the small-sized device 102 and the center point of the heat sink 104 are located on the same perpendicular to the circuit board 101, that is, the heat sink 104 is directly opposite to the small-sized device 102.
  • the heat sink 104 is at the closest distance to the small-sized device 102, which can more effectively absorb the heat of the small-sized device 102 and improve the heat dissipation effect of the heat sink 104 on the small-sized device 102.
  • the heat sink 104 may be coupled to the small-sized device 102. They are respectively distributed on both sides of the circuit board 101, and the center point of the small-sized device 102 and the center point of the heat sink 104 are not located on the same perpendicular to the vertical line of the circuit board 101.
  • the heat sink 104 can also be placed at the center point and the center point of the small-sized device 102.
  • the position is not located on the vertical line perpendicular to the circuit board 101, and the specific position may be determined according to the arrangement of the components on the circuit board, so that the heat dissipation of the small-sized device 102 can be ensured, and the specific position can be conveniently
  • the other components are arranged, and as shown in FIG. 3, one heat sink 104 can simultaneously dissipate heat from the plurality of small-sized devices 102 around, thereby improving the heat dissipation efficiency of the heat sink 104.
  • the solder copper foil 103 of the heat sink can pass through the via hole 106 of the circuit board with the solder copper film 105 of the small-sized device. Connected. This makes it easier for the heat of the small-sized device 102 to be conducted to the heat sink 104 for heat dissipation.
  • the heat sink 104 may be distributed on the same side of the circuit board 101 as the small-sized device 102.
  • the heat sink 104 and the small-sized device 102 can also be distributed on the same side of the circuit board 101 according to the specific arrangement of the components, so that it is convenient to ensure the heat dissipation of the small-sized device 102.
  • one heat sink 104 can simultaneously dissipate heat from the plurality of small-sized devices 102 around, thereby improving the heat dissipation efficiency of the heat sink 104.
  • the circuit board heat dissipation system in the embodiment of the present invention includes:
  • the heat sink includes a heat sink 104.
  • the heat sink 104 soldered in the vicinity of the small size 102 in the heat dissipation system of the circuit board can take away the heat generated by the small-sized device 102 or the heat conducted by the peripheral components, thereby greatly reducing the small-sized device 102.
  • the temperature rise, and the heat sink 104 is soldered on the circuit board 101, and does not need to be fixed by other structures.
  • the heat sink 104 has a simple structure, which satisfies the trend of miniaturization of the product, and reduces the size of the small-sized device 102. Heat dissipation costs.
  • the circuit board may further be soldered with other components 501 other than the small-sized device 102, in order to reduce other components.
  • the heat of the device 501 affects the small-sized device 102, and the solder copper 105 of the small-sized device 102 can be separated from the solder copper of the other component 501 by the FR4502.
  • the solder copper pad 105 of the small-sized device 102 and the solder copper of the other components 501 on the circuit board are separated by the FR4502. Since the heat conduction resistance of the FR4 is large, the other components 501 The generated heat is difficult to conduct to the small-sized device 102, and while the heat sink dissipates heat to the small-sized device 102, the heat conducted to the small-sized device 102 is greatly reduced, further reducing the temperature rise of the small-sized device 102.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种小尺寸器件的散热装置和电路板散热系统，包括：小尺寸器件（102）焊接在电路板（101）的铜皮（103）上，散热片（104）焊接在电路板的另一铜皮（105）上，且位于小尺寸器件的周围。降低了小尺寸器件的生产成本。

Description

一种小尺寸器件的散热装置和电路板散热系统 技术领域
本发明涉及散热领域，尤其涉及一种小尺寸器件的散热装置和电路板散热系统。
背景技术
通信终端产品中一些电子器件发热功耗很小，但因其体积尺寸小导致其本身实际温升较高。例如贴片式的LED灯，一般功耗在0.01W的量级，尺寸在1mm*0.5mm附近，其自身的发热可导致温升在10度以上，再加上周围发热器件的影响，容易使其温度超过规格。又如晶体器件，其本身并不发热，但对温度敏感，附近热源通过电路板铜皮将热量传递给晶体导致其温度极易超过其能承受的温度规格。
目前也有各种解决散热问题的办法，然而都各有其不足。例如，可以将印制电路板(Printed Circuit Board，PCB)放大至足够尺寸，然而，该方法与消费产品小型化的趋势相违背，同时也极大的增加了成本；再如，可以在自身不发热的小尺寸器件(如晶体)下方的单板上割铜，将小尺寸器件下方的铜皮与单板上其他部分铜皮隔离开，再在割掉铜皮的部分填充导热系数较低的FR4来增加其他热源到晶体的导热热阻，其中FR4为一种耐燃材料等级的代号，然而在产品小型化趋势越来越明显的今天，随着产品尺寸的继续变小，晶体的温度仍会超过规格。
发明内容
本发明实施例提供了一种小尺寸器件的散热装置和电路板散热系统，用于降低小尺寸器件的温升，同时降低对小尺寸器件的散热成本。
本发明实施例第一方面提供了一种小尺寸器件的散热装置，用于对电路板上的小尺寸器件散热，所述散热装置包含散热片；
所述小尺寸器件被焊接在所述电路板的铜皮上；
所述散热片被焊接在所述电路板的铜皮上，位于所述小尺寸器件的周围。
结合本发明实施例的第一方面，本发明实施例第一方面的第一种实现方式中，所述散热片被焊接在所述电路板的铜皮上，具体包括：
所述散热片被贴片机通过表面贴片SMT技术直接焊接在所述电路板的铜皮上。
结合本发明实施例的第一方面或第一方面的第一种实现方式，本发明实施例第一方面的第二种实现方式中，所述散热片的材质为铜，或雾锡马口铁。
结合本发明实施例的第一方面或第一方面的第一种实现方式，本发明实施例第一方面的第三种实现方式中，所述散热片的材质为不锈钢、铝或镀锌钢板，所述散热片的表面经过镀镍处理。
结合本发明实施例的第一方面至第一方面的第三种实现方式中任一种实现方式，本发明实施例第一方面的第四种实现方式中，所述散热片由片状材料通过冲压折弯成型。
结合本发明实施例第一方面的第四种实现方式，本发明实施例第一方面的第五种实现方式中，所述散热片的形状为几字形，或塔形。
结合本发明实施例的第一方面至第一方面的第五种实现方式中任一种实现方式，本发明实施例第一方面的第六种实现方式中，所述散热片与所述小尺寸器件分别分布在所述电路板的两侧，且所述小尺寸器件的中心与所述散热片的中心点位于同一条垂直于所述电路板的垂线上。
结合本发明实施例的第一方面至第一方面的第五种实现方式中任一种实现方式，本发明实施例第一方面的第七种实现方式中，所述散热片与所述小尺寸器件分别分布在所述电路板的两侧，且所述小尺寸器件的中心点与所述散热片的中心点不位于同一条垂直于所述电路板的垂线上。
结合本发明实施例第一方面的第六种实现方式或第一方面的第七种实现方式，本发明实施例第一方面的第八种实现方式中，散热片的焊接铜皮与小尺寸器件的焊接铜皮通过电路板上的过孔相连接。
结合本发明实施例的第一方面至第一方面的第五种实现方式中任一种实现方式，本发明实施例第一方面的第九种实现方式中，所述散热片与所述小尺寸器件均分布在所述电路板的同一侧。
本发明实施例第二方面提供了一种电路板散热系统，包括：
电路板，焊接在所述电路板上的小尺寸器件，和本发明实施例的第一方面至第一方面的第九种实现方式中任一种实现方式中提供的散热装置。
结合本发明实施例的第二方面，本发明实施例第二方面的第一种实现方式中，所述电路板上还焊接有除所述小尺寸器件之外的其他元器件；
所述小尺寸器件的焊接铜皮与所述其他元器件的焊接铜皮通过FR4隔离开。
从以上技术方案可以看出，本发明实施例具有以下优点：本发明实施例中，通过在小尺寸器件附近焊接散热片，使得散热片可以带走小尺寸器件自己产生的热量，或周边元器件传导的热量，极大的降低了小尺寸器件的温升，且该散热片是被焊接在电路板上的，不需要通过其他的结构固定，该散热片结构简单，满足产品小型化的趋势，并降低了对小尺寸器件的散热成本。
附图说明
图1为本发明实施例中小尺寸器件的散热装置一个结构示意图；
图2为本发明实施例中小尺寸器件的散热装置另一个结构示意图；
图3为本发明实施例中小尺寸器件的散热装置另一个结构示意图；
图4为本发明实施例中小尺寸器件的散热装置另一个结构示意图；
图5为本发明实施例中电路板散热系统一个结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，本发明实施例中小尺寸器件的散热装置一个实施例包括：
该散热装置用于对电路板101上的小尺寸器件102散热；
该小尺寸器件102被焊接在该电路板101的铜皮上，焊接该小尺寸器件102的铜皮被称为该小尺寸器件的焊接铜皮103；
该散热装置包含散热片104；
该散热片104被焊接在该电路板101的铜皮上，位于该小尺寸器件102的周围，焊接该散热片104的铜皮被称为该散热片的焊接铜皮105。
可以理解的是，该散热片104能被焊接在电路板101的铜皮上，不需要其他的方式固定，因此该散热片104结构简单，尺寸较小且轻便。
本发明实施例中，通过在小尺寸器件102附近焊接散热片104，使得散热片104可以带走小尺寸器件102自己产生的热量，或周边元器件传导的热量，极大的降低了小尺寸器件102的温升，其中温升指元器件高出环境的温度，且该散热片104是被焊接在电路板101上的，不需要通过其他的结构固定，该散热片104结构简单，满足产品小型化的趋势，并降低了对小尺寸器件102的散热成本。
可以理解的是，该小尺寸器件可以为各种尺寸较小，散热困难的元器件，例如LED灯，晶体，小尺寸功率放大器，功率三极管等等，此处不作限定。
上面实施例中，散热片104被焊接在电路板101的铜皮上，在实际应用中，作为本发明实施例中小尺寸器件的散热装置另一个实施例，该散热片104能被贴片机通过表面贴片SMT技术直接焊接在该电路板101的铜皮上。
具体的，与普通的散热器通过弹簧螺钉或钢钉固定在电路板上不同，该散热片104为轻型散热片，贴片机在电路板101表面贴片焊接其他元器件(例如该小尺寸器件102)时，可以同步将该散热片104在电路板上进行贴片焊接。
可以理解的是，该散热片104的形状，材质，尺寸等更加实际应用需求，可以有很多种选择，只要能满足贴片焊接的要求均可，此处不作限定。
可选的，作为本发明实施例中小尺寸器件的散热装置另一个实施例，上述散热片104的材质可以为铜，或雾锡马口铁。
本实施例中，散热片104使用的材质可以直接与电路板101上的铜皮焊接，不需要进行其他处理，可以理解的是，还可以为其他可用与铜皮直接焊接的材质，此处不作限定。
可选的，作为本发明实施例中小尺寸器件的散热装置另一个实施例，上述散热片104的材质可以为不锈钢、铝或镀锌钢板，所述散热片的表面经过镀镍处理。
本实施例中，散热片104使用的材质不方便直接与电路板101上的铜皮焊 接，因此可以对这些材质制成的散热片104的表面可以进行镀镍处理，这样便可以与电路板101上的铜皮焊接。
上面实施例中，散热片104需要能被贴片焊接在电路板101上，在实际应用中，作为本发明实施例中小尺寸器件的散热装置另一个实施例，上述散热片104可以由片状材料通过冲压折弯成型。
可以理解的是，片状材料冲压折弯成型后的成品一般较轻薄且结构简单，根据小尺寸器件102的大小选择合适的尺寸后，可以作为散热片104。
可以理解的是，在一些特定的应用场景中，根据实际需求，该散热片104并不限定为片状，也可以为方块状等，只要能被贴片焊接在电路板上，都满足本实施例中散热片104的要求，均能很好的对小尺寸器件102进行散热。
可选的，在实际应用中，为了使散热片104达到更好的散热效果，作为本发明实施例中小尺寸器件的散热装置另一个实施例，该散热片104的形状可以为几字形，或塔形。
上面实施例中，散热片104位于该小尺寸器件102的周围，在实际应用中，该散热片104相对于该该小尺寸器件102的位置可以有多种：
可选的：作为本发明实施例中小尺寸器件的散热装置另一个实施例，如图1所示，该散热片104可以与该小尺寸器件102分别分布在该电路板101的两侧，且该小尺寸器件102的中心点与该散热片104的中心点位于同一条垂直于该电路板101的垂线上。
本实施例中，小尺寸器件102的中心点与散热片104的中心点位于同一条垂直于该电路板101的垂线上，即该散热片104与该小尺寸器件102位置正对，在该电路板101上，该散热片104与该小尺寸器件102处于最近距离，能更有效的吸收该小尺寸器件102的热量，提高了该散热片104对小尺寸器件102的散热效果。
可选的，为了方便电路板101上各元器件的排布，作为本发明实施例中小尺寸器件的散热装置另一个实施例，如图2所示，该散热片104可以与该小尺寸器件102分别分布在该电路板101的两侧，且该小尺寸器件102的中心点与所述散热片104的中心点不位于同一条垂直于所述电路板101的垂线上。
本实施例中，散热片104还可以放置在中心点与小尺寸器件102的中心点 不位于同一条垂直于该电路板101的垂线上的位置，具体位置可以根据电路板上元器件的排布而定，这样可以在保证对小尺寸器件102进行散热的同时，还可以方便对其他元器件的排布，且如图3所示，一个散热片104可以同时对周围的多个小尺寸器件102进行散热，提高散热片104的散热效率。
可以理解的是，如图1所示，为了增强散热片104对小尺寸器件102的散热效果，该散热片的焊接铜皮103可以与小尺寸器件的焊接铜皮105通过电路板的过孔106相连接。这样更便于小尺寸器件102的热量传导到散热片104上进行散热。
可选的，作为本发明实施例中小尺寸器件的散热装置另一个实施例，如图3所示，该散热片104可以与小尺寸器件102均分布在该电路板101的同一侧。
本实施例中，根据各元器件的具体排布情况，散热片104与小尺寸器件102还可以分布在电路板101的同一侧，这样在保证对小尺寸器件102进行散热的同时，还可以方便对其他元器件的排布，且同样的，一个散热片104可以同时对周围的多个小尺寸器件102进行散热，提高散热片104的散热效率。
下面对本发明实施例中的电路板散热系统进行描述，请参阅图1，本发明实施例中电路板散热系统包括：
电路板101,焊接在电路板101上的小尺寸器件102以及上述各实施例所描述的散热装置，该散热装置包含散热片104。
本发明实施例中，电路板散热系统中焊接在小尺寸102附近的散热片104可以带走小尺寸器件102自己产生的热量，或周边元器件传导的热量，极大的降低了小尺寸器件102的温升，且该散热片104是被焊接在电路板101上的，不需要通过其他的结构固定，该散热片104结构简单，满足产品小型化的趋势，并降低了对小尺寸器件102的散热成本。
可选的，作为本发明实施例中电路板散热系统另一个实施例，如图5所示，该电路板上还可以焊接有除该小尺寸器件102外的其他元器件501，为了减少其它元器501的热量对该小尺寸器件102的影响，小尺寸器件102的焊接铜皮105可以与该其他元器件501的焊接铜皮通过FR4502隔离开。
本实施例中，小尺寸器件102的焊接铜皮105与电路板上其他元器件501的焊接铜皮通过FR4502隔离开，由于FR4的导热热阻很大，其他元器件501 产生的热量难以传导到小尺寸器件102上，在散热装置对小尺寸器件102散热的同时，极大减少了传导到该小尺寸器件102上的热量，进一步降低了小尺寸器件102的温升。
以上所述，以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (12)

  1. 一种小尺寸器件的散热装置，用于对电路板上的小尺寸器件散热，其特征在于，所述散热装置包含散热片；
    所述小尺寸器件被焊接在所述电路板的铜皮上；
    所述散热片被焊接在所述电路板的铜皮上，位于所述小尺寸器件的周围。
  2. 根据权利要求1所述的散热装置，其特征在于，所述散热片被焊接在所述电路板的铜皮上，具体包括：
    所述散热片被贴片机通过表面贴片SMT技术直接焊接在所述电路板的铜皮上。
  3. 根据权利要求1或2所述的散热装置，其特征在于，所述散热片的材质为铜，或雾锡马口铁。
  4. 根据权利要求1或2所述的散热装置，其特征在于，所述散热片的材质为不锈钢、铝或镀锌钢板，所述散热片的表面经过镀镍处理。
  5. 根据权利要求1至4中任一项所述的散热装置，其特征在于，所述散热片由片状材料通过冲压折弯成型。
  6. 根据权利要求5所述的散热装置，其特征在于，所述散热片的形状为几字形，或塔形。
  7. 根据权利要求1至6中任一项所述的散热装置，其特征在于，所述散热片与所述小尺寸器件分别分布在所述电路板的两侧，且所述小尺寸器件的中心与所述散热片的中心点位于同一条垂直于所述电路板的垂线上。
  8. 根据权利要求1至6中任一项所述的散热装置，其特征在于，所述散热片与所述小尺寸器件分别分布在所述电路板的两侧，且所述小尺寸器件的中心点与所述散热片的中心点不位于同一条垂直于所述电路板的垂线上。
  9. 根据权利要求7或8所述的散热装置，其特征在于，散热片的焊接铜皮与小尺寸器件的焊接铜皮通过电路板上的过孔相连接。
  10. 根据权利要求1至6中任一项所述的散热装置，其特征在于，所述散热片与所述小尺寸器件均分布在所述电路板的同一侧。
  11. 一种电路板散热系统，其特征在于，包括：
    电路板，焊接在所述电路板上的小尺寸器件，和权利要求1至11中任一 项所述的散热装置。
  12. 根据权利要求11所述的散热系统，其特征在于，所述电路板上还焊接有除所述小尺寸器件之外的其他元器件；
    所述小尺寸器件的焊接铜皮与所述其他元器件的焊接铜皮通过FR4隔离开。
PCT/CN2015/071292 2015-01-22 2015-01-22 一种小尺寸器件的散热装置和电路板散热系统 Ceased WO2016115702A1 (zh)

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