WO2016161539A1 - 一体式散热结构的led照明灯 - Google Patents

一体式散热结构的led照明灯 Download PDF

Info

Publication number
WO2016161539A1
WO2016161539A1 PCT/CN2015/000285 CN2015000285W WO2016161539A1 WO 2016161539 A1 WO2016161539 A1 WO 2016161539A1 CN 2015000285 W CN2015000285 W CN 2015000285W WO 2016161539 A1 WO2016161539 A1 WO 2016161539A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
led light
upper cover
chip
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/000285
Other languages
English (en)
French (fr)
Inventor
李峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to KR1020167027445A priority Critical patent/KR20160132898A/ko
Priority to US15/310,763 priority patent/US20180031210A1/en
Priority to JP2016559990A priority patent/JP6531956B2/ja
Priority to EP15888096.3A priority patent/EP3282173A4/en
Publication of WO2016161539A1 publication Critical patent/WO2016161539A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0083—Array of reflectors for a cluster of light sources, e.g. arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • the present invention relates to an LED illumination structure, and more particularly to a heat dissipation structure suitable for an LED illumination lamp and an LED illumination lamp having the same.
  • the existing LED lamp has a complicated structure, is cumbersome to assemble, requires multiple components to be assembled, requires manual installation and assembly, and has low efficiency and cannot be automatically upgraded.
  • the general LED lamp comprises a lamp bead encapsulated by silver glue, the lamp bead is soldered on the PCB board, and the PCB board is adhered to the aluminum substrate through the thermal conductive adhesive for heat dissipation, and a heat sink is usually required under the aluminum substrate to assist in heat dissipation.
  • a light distribution lens is also arranged on the lamp bead, and the light distribution lens is fixedly mounted on the lamp bead through the outer casing.
  • the heat dissipation path can only be: LED light-emitting chip ⁇ solid crystal colloid ⁇ PCB copper foil ⁇ insulating layer ⁇ aluminum substrate ⁇ thermal conductive silicone ⁇ heat sink conduction heat dissipation mode, the whole lamp is bulky and the thermal resistance is too large, sometimes the whole lamp The temperature reaches 80 ° C or higher. This will cause the internal components to accumulate heat and increase the temperature. Over time, the life of the LED chip is seriously affected, resulting in a short LED life and premature retirement.
  • the present invention provides a simplified structure and integrated heat dissipation LED illumination lamp for the above problems.
  • the LED illumination lamp comprises a PCB board, an upper cover plate and a lower bottom plate, and the upper cover plate, the PCB board and the lower bottom plate are laminated and assembled together. among them:
  • the upper cover plate includes a peripheral area and a hollow area, wherein the hollow area corresponds to LED illumination on the PCB board
  • the chip layout area includes a plurality of chip separation units, and each chip separation unit corresponds to one LED light-emitting chip.
  • the periphery of the LED light emitting chip is sprayed with an insulating reflective paint layer.
  • the chip separation unit is a hollow small lattice including an upper surface, a lower bottom surface and a side wall surface, and the side wall surface connects the upper surface and the lower bottom surface.
  • the height of the upper surface is lower than the surface height of the peripheral area, and the lower surface is attached to the insulating reflective paint layer of the PCB, which forms a space for accommodating a single LED light-emitting chip.
  • the side wall surface is an inclined side surface, the opening of the lower bottom surface is small, and the opening of the upper surface is large.
  • a plurality of LED light-emitting chips are rectangularly arrayed on the PCB, and a corresponding array of chip separation units is disposed on the corresponding upper cover.
  • a plurality of LED light-emitting chips are fan-shaped arrayed on the PCB, and a corresponding chip-separating unit of the fan-shaped array is disposed on the corresponding upper cover.
  • the invention relates to an integrated heat dissipation structure, which integrates the function of the lamp body shell and the heat dissipation function, and adopts a chip separation unit corresponding to a single LED light-emitting chip on the upper cover plate to reduce the heat resistance of the heat dissipation of the chip and make the chip face positive.
  • the heat dissipation using the entire casing as the heat dissipation structure of the chip, simplifies the assembly structure of the LED lamp, simplifies the required accessories, and is easy to install and easy to assemble automatically.
  • the heat-dissipating treatment is started when the LED light-emitting chip is placed on the PCB copper foil line surface, and the heat generated by the LED light-emitting chip is diffused to the hollow area of the upper cover plate in the shortest path.
  • the hollowed out area and the surrounding area are integrated, so that the six sides of the lamp body are all heat dissipating surfaces, and the lamp body can be made 6 mm thick, and the limit can be about 2 mm.
  • the temperature control is at a minimum of 45° at room temperature of 25°.
  • FIG. 1 is a schematic view showing the overall structure of an LED illumination lamp with an integrated heat dissipation structure according to the present invention
  • FIG. 2 is a schematic structural view of an upper cover plate of an LED illumination lamp with an integrated heat dissipation structure according to the present invention
  • FIG. 3 is a schematic structural view of a light-emitting area of an upper cover of an LED illumination lamp with an integrated heat dissipation structure according to the present invention
  • Embodiment 4 is a schematic structural view of Embodiment 2 of an LED illumination lamp with an integrated heat dissipation structure according to the present invention
  • FIG. 1 shows an integrated heat-dissipating LED illumination lamp, which mainly comprises a PCB board 20 , an upper cover 10 , a lower base 30 , the upper cover 10 , the PCB 20 and the lower base 30 .
  • the laminate bonding is assembled together, and the PCB board is encapsulated therein by the upper cover 10 and the lower substrate 30.
  • a plurality of LED light-emitting chips 21 are fixed on the PCB board 20; the LED light-emitting chips 21 are mounted on the PCB board 20 by means of solid crystal bonding, and are sprayed on the PCB board 20 at a position fixed by the LED light-emitting chip.
  • the insulating reflective lacquer layer is only reserved on the PCB board 20 for mounting the LED light-emitting chip 21, and a gold wire connecting the LED light-emitting chip and the circuit is prefabricated on the PCB board 20.
  • the upper cover 10 includes a peripheral area 11 and a hollowed out area 12, wherein the hollowed out area 12 corresponds to an LED light emitting chip arrangement area on the PCB board 20, and the hollowed out area 12 includes a plurality of chip separation units 121, each The chip separation unit 121 corresponds to one LED light-emitting chip 21.
  • the chip separation unit 121 is a hollow small lattice including an upper surface 1211, a lower bottom surface 1212 and a side wall surface 1213.
  • the side wall surface 1213 connects the upper surface 1211 and the lower bottom surface 1212.
  • the height of the upper surface 1211 is lower than the surface height of the peripheral region 11, and the lower bottom surface 1212 is attached to the insulating reflective lacquer layer of the PCB board 20, and the side wall surface 1213 constitutes a space for accommodating the single LED light-emitting chip 21.
  • the side wall surface 1213 is an inclined side surface, the opening of the lower bottom surface is small, and the opening of the upper surface is large.
  • a plurality of LED illuminating cores 21 are rectangularly arrayed on the PCB board 20, and the corresponding upper cover 10 is provided with a rectangular array of chip separating units 121.
  • the chip separating unit 121 corresponds to each LED illuminating chip, and respectively has different The LED light emitting chips are incorporated into different chip separation units 121.
  • a plurality of LED light-emitting chips 21 are fan-arranged on the PCB board 20, and the corresponding upper cover 10 is provided with a fan-shaped array of chip separation units, and the chip separation unit corresponds to each LED.
  • the light-emitting chips 21 respectively incorporate different LED light-emitting chips 21 into different chip separation units 121.
  • the single LED light-emitting chip 21 is directly incorporated into the separation unit 121, the heat generated by the LED light-emitting chip 21 during operation can be directly radiated from above the chip according to the heat rising principle, and the metal upper cover becomes the optimal heat-dissipating and heat-conducting structure. Since there are several chip separation units in the hollow area, each unit structure is directly responsible for the heat dissipation of a single LED light-emitting chip.
  • the entire upper cover 10 as a whole has a large overall heat dissipation structure, realizing a front heat dissipation system that has never been seen before.
  • the structural design there is no insulating and heat-resistant structure between the LED light-emitting chip and the metal upper cover, and a vacuum environment is between the LED light-emitting chip and the upper cover. All the heat can be directly emitted by the LED light-emitting chip.
  • the entire upper cover can be the radiator of the entire LED lighting, the heat is quickly conducted out, the temperature does not accumulate, and the service life of the LED lighting can be effectively extended.
  • the heat-dissipating treatment is started when the LED light-emitting chip is placed on the PCB copper foil line surface, and the heat generated by the LED light-emitting chip is diffused to the hollow area of the upper cover plate in the shortest path.
  • the hollowed out area and the surrounding area are integrated, so that the six sides of the lamp body are all heat dissipating surfaces, and the lamp body can be made 6 mm thick, and the limit can be about 2 mm.
  • the temperature control is at a minimum of 45° at room temperature of 25°.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Planar Illumination Modules (AREA)

Abstract

一种一体式散热结构的LED照明灯，包括层叠粘合在一起的PCB板（20）、上盖板（10）和下底板（30）。PCB板（20）上设有若干颗LED发光芯片（21）。上盖板（10）包括周边区域（11）和镂空区域（12），其中镂空区域（12）包含多个芯片分隔单元（121），每个芯片分隔单元（121）对应一颗LED发光芯片（21）。这种LED照明灯将灯体外壳和散热的功能融为一体，整个上盖板（10）作为一个大型的整体的散热结构，让芯片（21）进行正面散热，简化了组装结构，安装简单易于自动化组装。在LED发光芯片（21）和金属上盖板（10）之间是真空环境，没有任何绝缘阻热结构，所有的热量能够直接由LED发光芯片（21）散发出去。温度不会累积，能够有效延长LED照明灯的使用寿命。

Description

一体式散热结构的LED照明灯 【技术领域】
本发明涉及LED照明结构，尤其涉及适用于LED照明灯的散热结构以及具备该散热结构的LED照明灯。
【背景技术】
现有的LED灯结构复杂，组装繁琐，需要多个部件组装在一起，需要人工手工安装装配，效率低，无法实现自动化升级。
一般LED灯包含被银胶封装的灯珠，灯珠焊接在PCB板上，PCB板通过导热胶黏贴到铝基板上进行散热，铝基板之下通常还需要加设散热器，辅助进行散热，而在灯珠之上还需要配置一个配光透镜，配光透镜通过外壳固定安装在灯珠上。这样的结构需要的配件非常多而零碎，而且灯珠内发光芯片产生的热量通过层层包裹非常难以传导出来，原有的基于LED发光芯片的SMD封装、直插封装以及COB封装，LED发光芯片的散热途径只能是：LED发光芯片→固晶胶体→PCB铜箔→绝缘层→铝基板→导热硅胶→散热器的传导散热模式，整灯体积大且热阻过大，有时会使得整灯温度达到80℃或更高。这样会导致内部元件热量累积，温度升高，长此以往，严重影响了LED芯片的寿命，导致LED使用年限短，过早报废。
【发明内容】
本发明针对以上问题提出了简化结构、一体式散热的LED照明灯，该LED照明灯包括PCB板、上盖板、下底板，该上盖板、PCB板和下底板层叠粘合组装在一起，其中：
在PCB板上固晶并搭线若干颗LED发光芯片；
上盖板包括周边区域和镂空区域，其中镂空区域对应PCB板上的LED发光 芯片布置区域，该镂空区域包含多个芯片分隔单元，每个芯片分隔单元对应一颗LED发光芯片。
在该PCB板上，该LED发光芯片的周边喷涂有绝缘反光漆层。
该芯片分隔单元为镂空的小格子，包括上表面、下底面和侧壁面，侧壁面连接上表面和下底面。
该上表面的高度低于周边区域的表面高度，而下底面贴合在PCB板的绝缘反光漆层上，该侧壁面构成一个容纳单颗LED发光芯片的空间。
该侧壁面为倾斜侧面，下底面的开口小，而上表面开口大。
在该PCB板上矩形阵列了多个LED发光芯片，而对应的上盖板上设有矩形阵列的芯片分隔单元。
在该PCB板上扇形阵列了多个LED发光芯片，而对应的上盖板上设有扇形阵列的芯片分隔单元。
本发明所述涉及一体式散热结构，将灯体外壳和散热的功能融为一体，在上盖板上采用对应单颗LED发光芯片的芯片分隔单元，减少芯片散热的热阻，让芯片进行正面散热，用整个外壳作为芯片的散热结构，简化了LED灯的组装结构，精简了所需要的配件，安装简单易于自动化组装。
而本发明所采用的一体散热结构，在PCB铜箔线路面放置LED发光芯片位置就开始散热处理，LED发光芯片发出的热量，以最短路径扩散到上盖板的镂空区域上。该镂空区域与周边区域是一个整体，从而灯体的六面都是散热面，灯体可以制作成6mm厚，极限可以2mm左右。温度控制在室温25°时最低在45°左右。
【附图说明】
图1是本发明一体式散热结构的LED照明灯的整体结构示意图；
图2是本发明一体式散热结构的LED照明灯的上盖板结构示意图；
图3是本发明一体式散热结构的LED照明灯上盖板发光区域的结构示意图；
图4是本发明一体式散热结构的LED照明灯实施例2的结构示意图；
其中：10、上盖板；11、周边区域；12、镂空区域；121、芯片分隔单元；1211、上表面；1212、下底面；1213、侧壁面；20、PCB板；21、LED发光芯片；30、下底板。
【具体实施方式】
下面将结合附图及实施例对本发明进行详细说明。
请参考附图1：其中示出了一体式散热的LED照明灯，该LED照明灯主要包括PCB板20、上盖板10、下底板30，该上盖板10、PCB板20和下底板30层叠粘合组装在一起，PCB板被上盖板10和下底板30封装在其中。
在该PCB板20上固晶并搭线若干颗LED发光芯片21；LED发光芯片21通过固晶并搭线装设在PCB板20上，在PCB板20上LED发光芯片所固定的位置周边喷涂有绝缘反光漆层，只是在PCB板20上预留出安装LED发光芯片21的位置，且在PCB板20上预制了连接LED发光芯片和电路的金线。
请参考附图2：该上盖板10包括周边区域11和镂空区域12，其中镂空区域12对应PCB板20上的LED发光芯片布置区域，该镂空区域12包含多个芯片分隔单元121，每个芯片分隔单元121对应一颗LED发光芯片21。
请参考附图3：该芯片分隔单元121为镂空的小格子，包括上表面1211、下底面1212和侧壁面1213，侧壁面1213连接上表面1211和下底面1212。
该上表面1211的高度低于周边区域11的表面高度，而下底面1212贴合在PCB板20的绝缘反光漆层上，该侧壁面1213构成一个容纳单颗LED发光芯片21的空间。
该侧壁面1213为倾斜侧面，下底面的开口小，而上表面开口大。
在该PCB板20上矩形阵列了多个LED发光芯21，而对应的上盖板10上设有矩形阵列的芯片分隔单元121，芯片分隔单元121对应每一颗LED发光芯片，分别将不同的LED发光芯片纳入到不同的芯片分隔单元121中。
请参考附图4：在该PCB板20上扇形阵列了多个LED发光芯片21，而对应的上盖板10上设有扇形阵列的芯片分隔单元，芯片分隔单元对应每一颗LED 发光芯片21，分别将不同的LED发光芯片21纳入到不同的芯片分隔单元121中。
由于单颗LED发光芯片21直接纳入到分隔单元121中，LED发光芯片21在工作时产生的热量可以直接根据热量上升原理从芯片上方散热，而金属的上盖板则成为最佳的散热导热结构，由于在镂空区域有若干个芯片分隔单元，每个单元结构都直接负责单颗LED发光芯片散热。整个上盖板10整体成为一个大型的整体的散热结构，实现了从未有过的正面散热体系。而且由于结构设计的特殊结构，在LED发光芯片和金属上盖板之间没有任何绝缘阻热结构，LED发光芯片和上盖板之间是真空环境。所有的热量能够直接由LED发光芯片散发出去。而整个上盖板都能够成为整个LED照明灯的散热器，热量迅速传导出去，温度不会累积，能够有效延长LED照明灯的使用寿命。
而本发明所采用的一体散热结构，在PCB铜箔线路面放置LED发光芯片位置就开始散热处理，LED发光芯片发出的热量，以最短路径扩散到上盖板的镂空区域上。该镂空区域与周边区域是一个整体，从而灯体的六面都是散热面，灯体可以制作成6mm厚，极限可以2mm左右。温度控制在室温25°时最低在45°左右。
以上所述，仅是本发明较佳实施例而已，并非对本发明作任何形式上的限制，虽然本发明以较佳实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当利用上述揭示的技术内容作出些许变更或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本发明技术是指对以上实施例所作的任何简单修改、等同变化与修饰，均属于本发明技术方案的范围内。

Claims (7)

  1. 一种一体式散热结构的LED照明灯，其特征在于，该LED照明灯包括PCB板、上盖板、下底板，该上盖板、PCB板和下底板层叠粘合组装在一起，其中：
    在PCB板上固晶并搭线若干颗LED发光芯片；
    上盖板包括一体的周边区域和镂空区域，其中镂空区域对应PCB板上的LED发光芯片布置区域，该镂空区域包含多个芯片分隔单元，每个芯片分隔单元对应一颗LED发光芯片。
  2. 根据权利要求1所述一体式散热结构的LED照明灯，其特征在于，在该PCB板上，该LED发光芯片的周边喷涂有绝缘反光漆层。
  3. 根据权利要求2所述一体式散热结构的LED照明灯，其特征在于，该芯片分隔单元为镂空的小格子，包括上表面、下底面和侧壁面，侧壁面连接上表面和下底面。
  4. 根据权利要求3所述一体式散热结构的LED照明灯，其特征在于，该上表面的高度低于周边区域的表面高度，而下底面贴合在PCB板的绝缘反光漆层上，该侧壁面构成一个容纳单颗LED发光芯片的空间。
  5. 根据权利要求4所述一体式散热结构的LED照明灯，其特征在于，该侧壁面为倾斜侧面，下底面的开口小，而上表面开口大。
  6. 根据权利要求1所述一体式散热结构的LED照明灯，其特征在于，在该PCB板上矩形阵列了多个LED发光芯片，而对应的上盖板上设有矩形阵列的芯片分隔单元。
  7. 根据权利要求1所述一体式散热结构的LED照明灯，其特征在于，在该PCB板上扇形阵列了多个LED发光芯片，而对应的上盖板上设有扇形阵列的芯片分隔单元。
PCT/CN2015/000285 2015-04-10 2015-04-24 一体式散热结构的led照明灯 Ceased WO2016161539A1 (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020167027445A KR20160132898A (ko) 2015-04-10 2015-04-24 일체형 방열 구조의 led 조명등
US15/310,763 US20180031210A1 (en) 2015-04-10 2015-04-24 LED lamp
JP2016559990A JP6531956B2 (ja) 2015-04-10 2015-04-24 一体型放熱構造のｌｅｄ照明灯
EP15888096.3A EP3282173A4 (en) 2015-04-10 2015-04-24 Led illumination lamp with integrated heat dissipation structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510169705.0 2015-04-10
CN201510169705.0A CN104763903A (zh) 2015-04-10 2015-04-10 一体式散热结构的led照明灯

Publications (1)

Publication Number Publication Date
WO2016161539A1 true WO2016161539A1 (zh) 2016-10-13

Family

ID=53645911

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/000285 Ceased WO2016161539A1 (zh) 2015-04-10 2015-04-24 一体式散热结构的led照明灯

Country Status (6)

Country Link
US (1) US20180031210A1 (zh)
EP (1) EP3282173A4 (zh)
JP (1) JP6531956B2 (zh)
KR (1) KR20160132898A (zh)
CN (1) CN104763903A (zh)
WO (1) WO2016161539A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104776396A (zh) * 2015-05-08 2015-07-15 李峰 Led反射结构
CN105336831A (zh) * 2015-09-24 2016-02-17 李峰 一种液体填充式led灯
DE202016105841U1 (de) 2016-10-19 2018-01-22 Tridonic Jennersdorf Gmbh CSP LED Modul mit Reflexionsmittel
CN108278499B (zh) * 2017-01-06 2020-08-14 松下知识产权经营株式会社 Led光源装置和led灯具
CN116171466B (zh) 2021-09-24 2025-03-28 瑞仪(广州)光电子器件有限公司 背光模组及显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202469634U (zh) * 2012-03-05 2012-10-03 陕西唐华能源有限公司 一种led格栅灯
CN203517367U (zh) * 2013-08-05 2014-04-02 史杰 一次成型led格栅灯

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657290A (en) * 1984-10-03 1987-04-14 Linden Craig L Co-generation plant module system
JP4924337B2 (ja) * 2007-09-28 2012-04-25 東芝ライテック株式会社 照明装置
CN101725948A (zh) * 2008-10-28 2010-06-09 富准精密工业(深圳)有限公司 发光二极管灯具
JP5637344B2 (ja) * 2009-02-19 2014-12-10 東芝ライテック株式会社 ランプ装置および照明器具
JP2011023345A (ja) * 2009-06-19 2011-02-03 Toshiba Lighting & Technology Corp 光源ユニット及び照明装置
JP5304572B2 (ja) * 2009-09-25 2013-10-02 東芝ライテック株式会社 発光モジュール及びこれを備えた照明器具
TWM388608U (en) * 2010-05-20 2010-09-11 Yu-Lin Peng Improved structure of light steel frame lamp
CN102444793A (zh) * 2010-10-07 2012-05-09 富准精密工业(深圳)有限公司 发光二极管灯具
KR101201490B1 (ko) * 2010-12-07 2012-11-14 경희대학교 산학협력단 친환경 염료감응 태양전지를 활용한 루버형 엘이디 조명 기구
JP5871402B2 (ja) * 2011-06-17 2016-03-01 東芝ライテック株式会社 照明器具
JP2013004389A (ja) * 2011-06-20 2013-01-07 Mitsubishi Electric Corp 照明装置
JP2013179003A (ja) * 2012-02-29 2013-09-09 Toshiba Lighting & Technology Corp 照明器具
DE102012102973A1 (de) * 2012-04-05 2013-10-10 Siteco Beleuchtungstechnik Gmbh Leuchte mit integriertem Kühlkörper
CN104214533A (zh) * 2013-05-29 2014-12-17 深圳市海洋王照明工程有限公司 一种led平板灯
US11306896B2 (en) * 2014-05-30 2022-04-19 Abl Ip Holding Llc Integrated light engines including flexible optics and flexible light sources
CN203927533U (zh) * 2014-07-04 2014-11-05 杭州铭利科技有限公司 带网格状聚光杯的投光灯
JP2017527973A (ja) * 2014-09-19 2017-09-21 フィリップス ライティング ホールディング ビー ヴィ テーブルランプ及びテーブルランプからの光出力の方向を調整する方法
CN204879507U (zh) * 2015-06-05 2015-12-16 光明世界科技有限公司 简易安装灯具

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202469634U (zh) * 2012-03-05 2012-10-03 陕西唐华能源有限公司 一种led格栅灯
CN203517367U (zh) * 2013-08-05 2014-04-02 史杰 一次成型led格栅灯

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3282173A4 *

Also Published As

Publication number Publication date
KR20160132898A (ko) 2016-11-21
US20180031210A1 (en) 2018-02-01
JP2017527066A (ja) 2017-09-14
EP3282173A1 (en) 2018-02-14
EP3282173A4 (en) 2018-09-12
JP6531956B2 (ja) 2019-06-19
CN104763903A (zh) 2015-07-08

Similar Documents

Publication Publication Date Title
JP3965929B2 (ja) Ｌｅｄ照明装置
JP2006253689A (ja) 熱放散性の高いｌｅｄの実装
TW201017049A (en) Light-emitting arrangement
JP4337310B2 (ja) Ｌｅｄ点灯装置
CN203642078U (zh) 光源及具备该光源的照明器具
JP2010153044A (ja) 光源ユニット及び照明器具
JP2014187305A (ja) 発光装置
CN102348928A (zh) 发光模块及照明器具
WO2011105030A1 (ja) 口金付ランプおよび照明器具
JP2009037796A (ja) 光源および照明装置
CN104763903A (zh) 一体式散热结构的led照明灯
JP2020038764A (ja) 照明装置
JP4973398B2 (ja) 発光装置及びこれを備えた照明装置
WO2015109675A1 (zh) 新型led照明装置
JP2017212052A (ja) 車両用灯具及びその車両用灯具の製造方法
JP2014525657A (ja) 照明装置
JP6011765B2 (ja) Ｌｅｄ照明器具
JP2012256572A (ja) 照明装置
CN202307882U (zh) 发光装置及具备该发光装置的照明器具
JP6277014B2 (ja) 電球型照明装置
JP2015513220A (ja) 発光装置及び発光装置の製造方法
JP2011258454A (ja) 光源および照明器具
JP6098457B2 (ja) 点灯装置及び点灯装置を備えた灯具
WO2015109674A1 (zh) Led照明装置
JP5948677B2 (ja) 発光装置および照明器具

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2016559990

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20167027445

Country of ref document: KR

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15888096

Country of ref document: EP

Kind code of ref document: A1

REEP Request for entry into the european phase

Ref document number: 2015888096

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2015888096

Country of ref document: EP