WO2016189199A1 - Radio frequency module and circuit board - Google Patents

Radio frequency module and circuit board Download PDF

Info

Publication number
WO2016189199A1
WO2016189199A1 PCT/FI2016/050351 FI2016050351W WO2016189199A1 WO 2016189199 A1 WO2016189199 A1 WO 2016189199A1 FI 2016050351 W FI2016050351 W FI 2016050351W WO 2016189199 A1 WO2016189199 A1 WO 2016189199A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
antenna
circuit board
ground plane
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FI2016/050351
Other languages
French (fr)
Inventor
Raimo MÄKELÄ
Petri JÄRVINEN
Tauno VÄHÄ-HEIKKILÄ
Mervi Hirvonen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to EP16799413.6A priority Critical patent/EP3304644A4/en
Publication of WO2016189199A1 publication Critical patent/WO2016189199A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Definitions

  • the invention relates to a radio frequency (RF) module and to a circuit board comprising the radio frequency module.
  • RF radio frequency
  • Radio frequency modules are known in the prior art. Radio frequency (RF) modules are small electronic devices used to transmit and/or receive radio signals between two devices.
  • RF Radio frequency
  • Radio frequency (RF) modules are widely used in electronic design owing to the difficulty of designing radio circuitry.
  • Good electronic radio design is complex because of the sensitivity of radio circuits and the accuracy of components and layouts required to achieve operation on a specific frequency.
  • reliable RF communication circuit requires careful monitoring of the manufacturing process to ensure that the RF performance is not adversely affected. For these reasons, pre-made radio modules are often used rather using a discrete design.
  • RF modules may comply with a defined protocol for RF communications such as Zigbee, Bluetooth low energy, or Wi-Fi, or they may implement a Proprietary protocol.
  • the prior art RF-module solutions require strict and complex requirements for the underlying circuit board, e.g. requirements for big external ground plane area connected to the RF-module. If e.g. external ground plane areas are not used with prior art RF-modules, receiving and transmitting frequency range of the antenna can be shifted off from the designed frequency range when the module is attached close to a ground plane or close to living tissue such as skin (skin-effect). Summary of the invention
  • the solution of the present invention is a radio frequency module which is able to operate as a transceiver.
  • the RF-module according to the invention has a sandwich structure which comprises an antenna layer processed from organic substrate material, the antenna layer comprising an antenna element.
  • the RF-module further comprises a ground plane below the antenna layer and a component board below the ground plane, to which components can be attached e.g. by reflow soldering, the components comprising IPD-based matching and filtering circuit of the antenna.
  • the RF-module further comprises connectors for coupling the RF-module to a circuit board.
  • only antenna matching and filter components are implemented in the IPD to ensure small size and competitive price.
  • the invention relates also to a circuit board which comprises the RF- module of the invention.
  • the circuit board comprises a guard ring which is connected to the ground plane of the RF-module and essentially surrounds the module when the RF-module is attached to its place on the circuit board.
  • frequency range of the selective receiver and transmitter of the antenna is not essentially shifted off from the designed range even when the module is attached close to a ground plane or close to living tissue such as skin (skin-effect). If the RF-module is very close to ground plane or tissue, the amplification of the antenna can slightly decrease but the selectivity is not essentially affected and the frequency range transmitted and received by the antenna is not tuned off from the designed range. This kind of performance can't be achieved with the prior art RF-modules without large external ground planes to which the prior art RF-modules are attached.
  • the RF-module of the invention can be attached to any kind of generic circuit board, only the RF module footprint just under the module is specified. This is a considerable advantage compared to prior art RF-modules, e.g. prior art BLE-modules which have much stricter and much more com- plex requirements for the underlying circuit board, e.g. requirements for big ground plane area.
  • Fig. 1 presents an example embodiment of the RF-module and different parts of the RF-module as well as an application board to which the RF-module can be connected.
  • the RF-module of the present invention has a sandwich structure.
  • the antenna is arranged on top of the structure on the antenna layer 102.
  • the antenna can be made of high performance RF material.
  • Other components such as Radio Frequency Integrated Circuit (RFIC), Integrated Passive Devices (IPD) 108 and all other needed RF-components 110 are arranged under the antenna.
  • RFIC and IPD blocks 108 as well as other needed RF- components 110 can be attached to a component board 106, on the opposite side of the antenna.
  • the component board can be e.g. a circuit board such as a FR-4 circuit board to which components are attached.
  • the IPD 108 of the RF-module comprises an antenna matching circuit as well as filter components.
  • the whole structure stands on connectors 112 e.g. BGA balls, leaving the RFIC, IPD 108 and RF-components 110 on the top side of the module.
  • the RF-module can be attached to any generic electric board or circuit board with the connectors 112.
  • the antenna of the RF-module according to the invention needs a matching network to drive the small and highly reactive antenna impedance to e.g. 50 ⁇ standard impedance.
  • This matching can be implemented e.g. by using series capacitor and parallel inductor topology.
  • the antenna matching circuit is implemented on the IPD platform.
  • RF-filter is integrated on the IPD.
  • the IPD in according to one embodiment of the invention can be based on thin film technologies over the quartz or silicon wafers. This solution is cost effective and the line widths and tolerances are excellent.
  • the IPD module integration can be done using flip-chip bonding which provides higher I/O density, RF properties and better mass market manufacturing potential than wire bonding.
  • the IPD block which includes the antenna matching e.g. to 50 ⁇ as well as filtering can be e.g. 1.5x1.2mm.
  • the total size of the RF-module can be e.g. 7.5x13.5x4.5mm.
  • the RF-module can be e.g. a Bluetooth low energy (BLE) RF-module, Bluetooth-, Zigbee-, RFID- or Wi-Fi-module, or it may implement a proprietary protocol .
  • BLE Bluetooth low energy
  • the RF-module can operate e.g. in the 2.4GHz ISM band, more specifically from 2.400 to 2.484 GHz or other ISM radio bands such as 433.92 MHz, 315 MHz, 868 MHz, 915 MHz, 5 GHz, 5.8 GHz or other radio bands.
  • this antenna and RF-module can operate well on any kind of generic board structure; only the module footprint just under the module is specified. So with the RF-module of this invention there are no size specifications, no external ground plane or ground plane opening specifications for the generic board. This is an advantage, since the prior art RF-modules need a special opening area or a certain size of external ground plane on the generic board.
  • the RF-module is connected to a circuit board 114 which comprises a guard ring which is connected to the ground plane of the RF-module and essentially surrounds the RF-module.
  • the performance of the RF-module according to the invention can be even further be increased by having a ground plane in the circuit board to which the RF-module is connected.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Transceivers (AREA)

Abstract

An RF-module and a circuit board comprising an RF-module, wherein the RF-module has a sandwich structure which comprises an antenna layer(102) processed from organic substrate material, the antenna layer comprising an antenna element, a ground plane (104) below the antenna layer,a component board(106) below the ground plane, to which components are attached, e.g. by reflow soldering, the components comprising IPD-based matching and filtering circuit of the antenna (108), and connectors (112) for coupling the RF-module to a circuit board.

Description

RADIO FREQUENCY MODULE AND CIRCUIT BOARD
Technical field
The invention relates to a radio frequency (RF) module and to a circuit board comprising the radio frequency module.
Background of the invention
Radio frequency modules are known in the prior art. Radio frequency (RF) modules are small electronic devices used to transmit and/or receive radio signals between two devices.
Radio frequency (RF) modules are widely used in electronic design owing to the difficulty of designing radio circuitry. Good electronic radio design is complex because of the sensitivity of radio circuits and the accuracy of components and layouts required to achieve operation on a specific frequency. In addition, reliable RF communication circuit requires careful monitoring of the manufacturing process to ensure that the RF performance is not adversely affected. For these reasons, pre-made radio modules are often used rather using a discrete design.
Several carrier frequencies are commonly used in commercially-available RF-modules, including those in the industrial, scientific and medical (ISM) radio bands such as 433.92 MHz, 315 MHz, 868 MHz, 915 MHz, and 2400 MHz. RF modules may comply with a defined protocol for RF communications such as Zigbee, Bluetooth low energy, or Wi-Fi, or they may implement a Proprietary protocol.
The prior art RF-module solutions require strict and complex requirements for the underlying circuit board, e.g. requirements for big external ground plane area connected to the RF-module. If e.g. external ground plane areas are not used with prior art RF-modules, receiving and transmitting frequency range of the antenna can be shifted off from the designed frequency range when the module is attached close to a ground plane or close to living tissue such as skin (skin-effect). Summary of the invention
The solution of the present invention is a radio frequency module which is able to operate as a transceiver. The RF-module according to the invention has a sandwich structure which comprises an antenna layer processed from organic substrate material, the antenna layer comprising an antenna element. The RF-module further comprises a ground plane below the antenna layer and a component board below the ground plane, to which components can be attached e.g. by reflow soldering, the components comprising IPD-based matching and filtering circuit of the antenna. The RF-module further comprises connectors for coupling the RF-module to a circuit board.
In one embodiment of the invention, only antenna matching and filter components are implemented in the IPD to ensure small size and competitive price.
The invention relates also to a circuit board which comprises the RF- module of the invention. In one embodiment of the invention the circuit board comprises a guard ring which is connected to the ground plane of the RF-module and essentially surrounds the module when the RF-module is attached to its place on the circuit board.
With the solution of the present invention frequency range of the selective receiver and transmitter of the antenna is not essentially shifted off from the designed range even when the module is attached close to a ground plane or close to living tissue such as skin (skin-effect). If the RF-module is very close to ground plane or tissue, the amplification of the antenna can slightly decrease but the selectivity is not essentially affected and the frequency range transmitted and received by the antenna is not tuned off from the designed range. This kind of performance can't be achieved with the prior art RF-modules without large external ground planes to which the prior art RF-modules are attached.
The RF-module of the invention can be attached to any kind of generic circuit board, only the RF module footprint just under the module is specified. This is a considerable advantage compared to prior art RF-modules, e.g. prior art BLE-modules which have much stricter and much more com- plex requirements for the underlying circuit board, e.g. requirements for big ground plane area.
Brief description of the drawings
In the following, the invention will be described in more detail by means of an embodiment example with reference to the appended drawings, in which
Fig. 1 presents an example embodiment of the RF-module and different parts of the RF-module as well as an application board to which the RF-module can be connected.
Detailed description of the invention
One example embodiment of the RF-module is illustrated in Fig. 1. The RF-module of the present invention has a sandwich structure. The antenna is arranged on top of the structure on the antenna layer 102. The antenna can be made of high performance RF material. Other components such as Radio Frequency Integrated Circuit (RFIC), Integrated Passive Devices (IPD) 108 and all other needed RF-components 110 are arranged under the antenna. RFIC and IPD blocks 108 as well as other needed RF- components 110 can be attached to a component board 106, on the opposite side of the antenna. The component board can be e.g. a circuit board such as a FR-4 circuit board to which components are attached. The IPD 108 of the RF-module comprises an antenna matching circuit as well as filter components. The whole structure stands on connectors 112 e.g. BGA balls, leaving the RFIC, IPD 108 and RF-components 110 on the top side of the module. The RF-module can be attached to any generic electric board or circuit board with the connectors 112.
The antenna can be a separate component made of high performance RF material like for example RT/Duroid 5870 or Neltec 4 (εΓ=2.33, tan5=0.001). When the antenna is arranged as a separate component, like in the embodiment of Figure 1, the advantage is that good antenna performance as well as competitive price can be reached. The antenna of the RF-module according to the invention needs a matching network to drive the small and highly reactive antenna impedance to e.g. 50Ω standard impedance. This matching can be implemented e.g. by using series capacitor and parallel inductor topology. The antenna matching circuit is implemented on the IPD platform. In addition to the antenna matching components, RF-filter is integrated on the IPD.
The IPD in according to one embodiment of the invention can be based on thin film technologies over the quartz or silicon wafers. This solution is cost effective and the line widths and tolerances are excellent. The IPD module integration can be done using flip-chip bonding which provides higher I/O density, RF properties and better mass market manufacturing potential than wire bonding.
In one embodiment of the invention, only antenna matching and filter components are implemented in the IPD to ensure small size and competitive price. The size of the IPD block which includes the antenna matching e.g. to 50Ω as well as filtering can be e.g. 1.5x1.2mm. The total size of the RF-module can be e.g. 7.5x13.5x4.5mm.
The RF-module can be e.g. a Bluetooth low energy (BLE) RF-module, Bluetooth-, Zigbee-, RFID- or Wi-Fi-module, or it may implement a proprietary protocol . The RF-module can operate e.g. in the 2.4GHz ISM band, more specifically from 2.400 to 2.484 GHz or other ISM radio bands such as 433.92 MHz, 315 MHz, 868 MHz, 915 MHz, 5 GHz, 5.8 GHz or other radio bands.
The special feature of this antenna and RF-module is that it can operate well on any kind of generic board structure; only the module footprint just under the module is specified. So with the RF-module of this invention there are no size specifications, no external ground plane or ground plane opening specifications for the generic board. This is an advantage, since the prior art RF-modules need a special opening area or a certain size of external ground plane on the generic board.
In one embodiment of the invention the RF-module is connected to a circuit board 114 which comprises a guard ring which is connected to the ground plane of the RF-module and essentially surrounds the RF-module. In one embodiment the performance of the RF-module according to the invention can be even further be increased by having a ground plane in the circuit board to which the RF-module is connected.
Although exemplary embodiments of the present invention have been described with reference to the attached drawings, the present invention is not limited to these embodiments, and it should be appreciated to those skilled in the art that a variety of modifications and changes can be made without departing from the spirit and scope of the present invention. Embodiments described in the description in combination with other embodiments can be also used as separate embodiments.

Claims

Claims
1. An RF-module characterized in that the RF-module has a sandwich structure which comprises:
an antenna layer (102) processed from organic substrate material, the antenna layer comprising an antenna element
a ground plane (104) below the antenna layer,
a component board (106) below the ground plane, to which components are attached, e.g. by reflow soldering, the components comprising IPD-based matching and filtering circuit of the antenna (108), and
connectors (112) for coupling the RF-module to a circuit board.
2. An RF-module according to claim 1, characterized in that the connectors (112) are flip chip soldering elements.
3. An RF-module according to claim 1 or 2 characterized in that the antenna element is a loop antenna or a monopole antenna.
4. An RF-module according to any preceding claim characterized in that the antenna layer (102), the ground plane (104) and the component board (106) form an integrated structure.
5. An RF-module according to any preceding claim characterized in that RF-module is Bluetooth-, Bluetooth low energy, Zigbee-, RFID- or Wi-Fi-module.
6. A circuit board characterized in that the circuit board (114) comprises the RF-module according to any claims 1 - 5.
7. A circuit board according to claim 6 characterized in that the circuit board (114) further comprises a guard ring which is connected to the ground plane of the RF-module and arranged essentially to surround the RF-module.
PCT/FI2016/050351 2015-05-25 2016-05-24 Radio frequency module and circuit board Ceased WO2016189199A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP16799413.6A EP3304644A4 (en) 2015-05-25 2016-05-24 Radio frequency module and circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20155386 2015-05-25
FI20155386A FI127701B (en) 2015-05-25 2015-05-25 Radio frequency module and circuit board

Publications (1)

Publication Number Publication Date
WO2016189199A1 true WO2016189199A1 (en) 2016-12-01

Family

ID=57392924

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2016/050351 Ceased WO2016189199A1 (en) 2015-05-25 2016-05-24 Radio frequency module and circuit board

Country Status (3)

Country Link
EP (1) EP3304644A4 (en)
FI (1) FI127701B (en)
WO (1) WO2016189199A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10276521B2 (en) 2016-12-29 2019-04-30 Skyworks Solutions, Inc. Front end systems and related devices, integrated circuits, modules, and methods
US10283859B2 (en) 2016-04-19 2019-05-07 Skyworks Solutions, Inc. Selective shielding of radio frequency modules
US10297913B2 (en) 2016-05-04 2019-05-21 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna
US10515924B2 (en) 2017-03-10 2019-12-24 Skyworks Solutions, Inc. Radio frequency modules
WO2020157315A1 (en) * 2019-01-31 2020-08-06 Thales Method for manufacturing a high-density micromodule board
US11088112B2 (en) 2016-04-18 2021-08-10 Skyworks Solutions, Inc. Radio frequency system-in-package with stacked clocking crystal
WO2022034262A1 (en) 2020-08-14 2022-02-17 Teknologian Tutkimuskeskus Vtt Oy A cover structure and a module for a miniaturized wearable rf-device and a wearable rf-device
US11984857B2 (en) 2015-12-30 2024-05-14 Skyworks Solutions, Inc. Impedance transformation circuit for amplifier

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005011055A1 (en) * 2003-07-24 2005-02-03 Koninklijke Philips Electronics N.V. Tuning improvements in “inverted-l” planar antennas
US20060049986A1 (en) * 2004-09-08 2006-03-09 Dunn Gregory J Integrated patch antenna and electronics assembly and method for fabricating
EP1777551A2 (en) * 2005-10-18 2007-04-25 Hitachi, Ltd. Millimeter-wave radar apparatus and millimeter radar system
US20080036668A1 (en) * 2006-08-09 2008-02-14 White George E Systems and Methods for Integrated Antennae Structures in Multilayer Organic-Based Printed Circuit Devices
US20140253382A1 (en) * 2012-05-07 2014-09-11 Wilocity, Ltd. Graded-ground design in a millimeter-wave radio module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7477197B2 (en) * 2006-12-29 2009-01-13 Intel Corporation Package level integration of antenna and RF front-end module
US9196958B2 (en) * 2012-07-26 2015-11-24 Apple Inc. Antenna structures and shield layers on packaged wireless circuits

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005011055A1 (en) * 2003-07-24 2005-02-03 Koninklijke Philips Electronics N.V. Tuning improvements in “inverted-l” planar antennas
US20060049986A1 (en) * 2004-09-08 2006-03-09 Dunn Gregory J Integrated patch antenna and electronics assembly and method for fabricating
EP1777551A2 (en) * 2005-10-18 2007-04-25 Hitachi, Ltd. Millimeter-wave radar apparatus and millimeter radar system
US20080036668A1 (en) * 2006-08-09 2008-02-14 White George E Systems and Methods for Integrated Antennae Structures in Multilayer Organic-Based Printed Circuit Devices
US20140253382A1 (en) * 2012-05-07 2014-09-11 Wilocity, Ltd. Graded-ground design in a millimeter-wave radio module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3304644A4 *

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11984857B2 (en) 2015-12-30 2024-05-14 Skyworks Solutions, Inc. Impedance transformation circuit for amplifier
US11088112B2 (en) 2016-04-18 2021-08-10 Skyworks Solutions, Inc. Radio frequency system-in-package with stacked clocking crystal
US10931009B2 (en) 2016-04-19 2021-02-23 Skyworks Solutions, Inc. Methods for selectively shielding radio frequency modules
US10283859B2 (en) 2016-04-19 2019-05-07 Skyworks Solutions, Inc. Selective shielding of radio frequency modules
US12003025B2 (en) 2016-04-19 2024-06-04 Skyworks Solutions, Inc. Selectively shielded radio frequency modules
US10320071B2 (en) 2016-04-19 2019-06-11 Skyworks Solutions, Inc. Methods for selectively shielding radio frequency modules
US10530050B2 (en) 2016-04-19 2020-01-07 Skyworks Solutions, Inc. Selectively shielding radio frequency module with multi-layer antenna
US11552393B2 (en) 2016-05-04 2023-01-10 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna and related methods
US11038266B2 (en) 2016-05-04 2021-06-15 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna
US12255394B2 (en) 2016-05-04 2025-03-18 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna
US10297913B2 (en) 2016-05-04 2019-05-21 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna
US11864295B2 (en) 2016-12-29 2024-01-02 Skyworks Solutions, Inc. Selectively shielded radio frequency module with multi-mode stacked power amplifier stage
US12279353B2 (en) 2016-12-29 2025-04-15 Skyworks Solutions, Inc. Packaged module with antenna and front end integrated circuit
US11037893B2 (en) 2016-12-29 2021-06-15 Skyworks Solutions, Inc. Selectively shielded radio frequency module with linearized low noise amplifier
US10629553B2 (en) 2016-12-29 2020-04-21 Skyworks Solutions, Inc. Front end systems with linearized low noise amplifier and injection-locked oscillator power amplifier stage
US10276521B2 (en) 2016-12-29 2019-04-30 Skyworks Solutions, Inc. Front end systems and related devices, integrated circuits, modules, and methods
US11576248B2 (en) 2016-12-29 2023-02-07 Skyworks Solutions, Inc. Front end systems with multi-mode power amplifier stage and overload protection of low noise amplifier
US11682649B2 (en) 2017-03-10 2023-06-20 Skyworks Solutions, Inc. Radio frequency modules
US10515924B2 (en) 2017-03-10 2019-12-24 Skyworks Solutions, Inc. Radio frequency modules
US11043466B2 (en) 2017-03-10 2021-06-22 Skyworks Solutions, Inc. Radio frequency modules
FR3092467A1 (en) * 2019-01-31 2020-08-07 Thales Manufacturing process of a high density micromodule card
WO2020157315A1 (en) * 2019-01-31 2020-08-06 Thales Method for manufacturing a high-density micromodule board
WO2022034262A1 (en) 2020-08-14 2022-02-17 Teknologian Tutkimuskeskus Vtt Oy A cover structure and a module for a miniaturized wearable rf-device and a wearable rf-device

Also Published As

Publication number Publication date
FI20155386A7 (en) 2016-11-26
EP3304644A4 (en) 2019-01-02
FI127701B (en) 2018-12-31
EP3304644A1 (en) 2018-04-11

Similar Documents

Publication Publication Date Title
FI127701B (en) Radio frequency module and circuit board
CN104081676B (en) communication device
KR100981143B1 (en) Integrated circuit antenna structure
US8391927B2 (en) Multiple mode RF transceiver and antenna structure
KR100975544B1 (en) Adjustable Integrated Circuit Antenna Structure
US9252832B2 (en) High-frequency circuit and communication device
US8570229B2 (en) Multiple antenna high isolation apparatus and application thereof
CN104885373B (en) Switch module
CN1578172A (en) RF transceiver module formed of multilayer ceramics
US20200076393A1 (en) Coupled Resonator On-Die Filters for WiFi Applications
US11336278B2 (en) Switching circuit and high frequency module
CN104471788B (en) Communication apparatus
KR20050065861A (en) Wireless transceiver module for ultra wide-band
JP2015109320A (en) Inductor device and high-frequency module
KR20080102518A (en) Triplexer
KR101103971B1 (en) Phase shifter
KR100882102B1 (en) SMS front end module
KR100574533B1 (en) FEM chip manufacturing method
KR100574532B1 (en) Multiband Transceiver Package
KR20050022454A (en) Antenna switch module
HK1142455A (en) An integrate circuit
JP2006279554A (en) High frequency module and wireless communication device using the same
KR20060132092A (en) Phase shifter

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16799413

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2016799413

Country of ref document: EP