WO2017000559A1 - 导热片和电子设备 - Google Patents

导热片和电子设备 Download PDF

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Publication number
WO2017000559A1
WO2017000559A1 PCT/CN2016/073612 CN2016073612W WO2017000559A1 WO 2017000559 A1 WO2017000559 A1 WO 2017000559A1 CN 2016073612 W CN2016073612 W CN 2016073612W WO 2017000559 A1 WO2017000559 A1 WO 2017000559A1
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WIPO (PCT)
Prior art keywords
heat
layer
conductive layer
thermally conductive
conducting layer
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Ceased
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PCT/CN2016/073612
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English (en)
French (fr)
Inventor
徐焰
赵仁哲
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP16816924.1A priority Critical patent/EP3255969B1/en
Priority to KR1020177026624A priority patent/KR20170118883A/ko
Publication of WO2017000559A1 publication Critical patent/WO2017000559A1/zh
Priority to US15/696,496 priority patent/US20180014431A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control

Definitions

  • Embodiments of the present invention relate to the field of electronic devices, and in particular, to a heat conductive sheet and an electronic device.
  • the heat generated by the operation of the chip in an electronic device usually requires the use of a heat sink to diffuse heat to the outside. From a microscopic point of view, there are many bumps on the contact interface between the chip and the heat sink. It is necessary to use the interface heat conductive material to form a heat conductive sheet to fill the contact interface between the chip and the heat sink, thereby reducing the contact thermal resistance.
  • the interface thermal conductive material usually comprises thermal grease, thermal pad, thermal gel, phase change thermal material, thermal double-sided tape, etc. According to different application scenarios, different types and different thermal conductivity interface thermal materials can be used.
  • the existing thermal conductive sheet having a high thermal conductivity only in the thickness direction causes heat of the local hot spot in the chip. Can not get timely diffusion, affecting the life of such chips.
  • Embodiments of the present invention provide a heat conductive sheet and an electronic device for effectively alleviating heat dissipation caused by local hot spots of the heat generating component itself.
  • an embodiment of the present invention provides a heat conductive sheet for dissipating heat from a heat generating component, wherein the heat conductive sheet includes a first heat conductive layer and a second heat conductive layer, and the first surface of the second heat conductive layer is The surface of the heat generating component is in contact with the second surface of the second heat conducting layer being in contact with the first surface of the first heat conducting layer;
  • the first heat conducting layer is a compressible and deformable heat conducting layer, and the first heat conducting layer is in the first
  • the thermal conductivity in the thickness direction of a heat conducting layer is greater than the heat conducting capability of the first heat conducting layer in the planar direction of the first heat conducting layer, and the thickness direction of the first heat conducting layer is perpendicular to the first heat conducting layer. Plane direction
  • the second heat conductive layer is an incompressible heat conductive layer, and the heat conductive capability of the second heat conductive layer in a planar direction of the second heat conductive layer is greater than or equal to that of the second heat conductive layer in the second heat conductive layer.
  • a thermal conductivity in a thickness direction, and a thermal conductivity of the second thermally conductive layer in a planar direction of the second thermally conductive layer is greater than or equal to a thermal conductivity of the first thermally conductive layer in a thickness direction of the first thermally conductive layer.
  • the thickness direction of the second heat conduction layer is perpendicular to the planar direction of the second heat conduction layer.
  • the first heat conductive layer is a compressible and deformable heat conductive layer, specifically:
  • the first heat conductive layer has a compression deformation ratio of 5% to 90% at a first pressure, and the first pressure is between 0 and 5000N.
  • the second heat conductive layer is an incompressible heat conductive layer, specifically:
  • the compressive deformation ratio of the second heat conductive layer at the first pressure is less than or equal to 5%.
  • the thickness is 0.2 to 5 mm, and the thickness of the second heat conduction layer is 0.1 to 5 mm.
  • the first possible implementation of the first aspect, or any one of the possible implementations of the third possible implementation of the first aspect, in a fourth possible implementation of the first aspect ,Also includes:
  • a third heat conductive layer disposed between the heat generating component and the second heat conductive layer, wherein a first surface of the third heat conductive layer is in contact with a surface of the heat generating component, The second surface of the three heat conductive layers is in contact with the first surface of the second heat conductive layer, and the third heat conductive layer is used to fill the microvoids of the surface of the heat generating component.
  • the third heat conductive layer has a thickness of less than or equal to 0.2 mm, and the third heat conductive layer is a prepreg Or the third heat conducting layer is in the form of a gel.
  • the first thermally conductive layer comprises an organic substrate And a thermally conductive filler, the thermally conductive filler being oriented in the first thermally conductive layer in a thickness direction of the first thermally conductive layer.
  • the thermally conductive filler comprises a sheet-shaped thermally conductive filler
  • the thermally conductive filler comprises a fibrous thermally conductive filler
  • the thermally conductive filler includes the sheet-like thermally conductive filler and the fibrous thermally conductive filler.
  • the material of the second heat conductive layer comprises a metal And at least one of graphite.
  • any one of the first to the eighth possible implementations of the first aspect in a ninth possible implementation manner of the first aspect, the second surface of the first heat conductive layer In contact with the radiator.
  • an embodiment of the present invention provides an electronic device, including: a thermal conductive sheet and a heat generating component according to the first aspect of the present invention or the various possible implementations of the first aspect, the surface of the thermal conductive sheet and the The surface of the heat-generating component is in contact;
  • the heat conducting sheet is configured to perform heat dissipation processing on heat generated by the heat generating component.
  • an embodiment of the present invention provides a method for manufacturing a thermal conductive sheet, the method comprising:
  • the second heat conductive layer is an incompressible heat conductive layer, and the second heat conductive layer has a heat conduction capability in a planar direction of the second heat conductive layer greater than or equal to the second heat conductive layer
  • the thermal conductivity of the second heat conductive layer in the thickness direction, the thickness direction of the second heat conductive layer being perpendicular to the planar direction of the second heat conductive layer;
  • first heat conductive layer is a compressible and deformable heat conductive layer, and the first heat conductive layer is in the The thermal conductivity in the thickness direction of the first heat conduction layer is greater than the thermal conductivity in the planar direction of the first heat conduction layer, and the second heat conduction layer is on the plane of the second heat conduction layer
  • the upward thermal conductivity is greater than or equal to the thermal conductivity of the first thermally conductive layer in the thickness direction of the first thermally conductive layer, and the thickness direction of the first thermally conductive layer is perpendicular to the planar direction of the first thermally conductive layer.
  • an embodiment of the present invention provides a method for manufacturing a thermal conductive sheet, the method comprising:
  • first heat conductive layer is a compressible and deformable heat conductive layer, and the first heat conductive layer conducts heat in a thickness direction of the first heat conductive layer
  • the ability is greater than the thermal conductivity in the planar direction of the first thermally conductive layer, the thickness direction of the first thermally conductive layer being perpendicular to the planar direction of the first thermally conductive layer;
  • the second heat conductive layer is incompressible heat conduction a layer, a thermal conductivity of the second heat conducting layer in a planar direction of the second heat conducting layer is greater than or equal to a heat conducting capability of the first heat conducting layer in a thickness direction of the first heat conducting layer, the second The thermal conductivity of the thermal conductive layer in the planar direction of the second thermally conductive layer is greater than or equal to the thermal conductivity of the second thermally conductive layer in the thickness direction of the second thermally conductive layer, and the thickness direction of the second thermally conductive layer is perpendicular to The planar direction of the second thermally conductive layer.
  • the thermal conductive sheet provided by the embodiment of the present invention includes a second heat conductive layer in contact with the surface of the heat generating component, and a first heat conductive layer in contact with the surface of the second heat conductive layer, because the second heat conductive layer is in the plane of the second heat conductive layer.
  • the heat conductivity of the direction is greater than or equal to the heat conductivity of the second heat conductive layer in the thickness direction of the second heat conductive layer. Therefore, after receiving the heat transferred from the heat generating component, the heat of the second heat conductive layer is in the plane direction of the second heat conductive layer.
  • the diffusion capability is greater than the conductivity in the thickness direction of the second heat conduction layer, and the thermal conductivity of the second heat conduction layer in the planar direction of the second heat conduction layer is greater than the thermal conductivity of the first heat conduction layer in the thickness direction of the first heat conduction layer, so
  • the two heat conducting layers can sufficiently diffuse the heat in the plane direction of the second heat conducting layer and then conduct the heat to the first heat conducting layer, thereby avoiding the second heat conduction contacting the heat generating component when the heat generating component is excessively heated locally and the temperature is too high.
  • the heat conductive sheet provided by the embodiment of the invention is applied to the heat generating portion When the heat treatment is performed, it is possible to avoid a local hot spot due to local heat generation of the heat generating component, and the heat of the local hot spot cannot be led out in time to cause the device to be damaged.
  • FIG. 1 is a schematic structural view of a first embodiment of a thermal conductive sheet according to the present invention
  • FIG. 2 is a schematic structural view of a second embodiment of a thermal conductive sheet according to the present invention.
  • FIG. 3 is a schematic structural view of a first embodiment of a first heat conducting layer in a thermally conductive sheet of the present invention
  • FIG. 4 is a schematic structural view of a third embodiment of a thermal conductive sheet of the present invention.
  • FIG. 5 is a schematic structural diagram of Embodiment 1 of an electronic device according to the present invention.
  • FIG. 6 is a flow chart of a first embodiment of a method for manufacturing a thermally conductive sheet according to the present invention
  • FIG. 7 is a flow chart of a second embodiment of a method for manufacturing a thermally conductive sheet of the present invention.
  • FIG. 1 is a schematic structural view of a first embodiment of a thermally conductive sheet according to the present invention. As shown in FIG. 1 , the thermal conductive sheet of the embodiment is used for dissipating heat from a heat generating component, including a first heat conducting layer 11 and a second heat conducting layer 12, and a second heat conducting layer.
  • a heat generating component including a first heat conducting layer 11 and a second heat conducting layer 12, and a second heat conducting layer.
  • the first surface of the layer 12 is in contact with the surface of the heat-generating component, and the second surface of the second heat-conducting layer 12 is in contact with the first surface of the first heat-conducting layer 11; wherein the first heat-conducting layer 11 is a heat-decomposable layer that is compressible and deformable And the heat conduction capability of the first heat conduction layer 11 in the thickness direction of the first heat conduction layer 11 is greater than the heat conduction capability in the plane direction of the first heat conduction layer 11, and it is necessary to say It is obvious that the thickness direction of the first heat conduction layer is perpendicular to the planar direction of the first heat conduction layer.
  • the heat conductive sheet of the embodiment is in the thickness direction of the heat conductive sheet. High thermal conductivity.
  • the second heat conductive layer 12 of the embodiment is an incompressible heat conductive layer, and the heat conductive capability of the second heat conductive layer 12 in the planar direction of the second heat conductive layer 12 is greater than or equal to that of the second heat conductive layer 12 .
  • the thermal conductivity of the second heat conductive layer 12 in the thickness direction of the second heat conductive layer 12 is greater than or equal to the first heat conductive layer 11 at the first heat conductive layer 11
  • the heat conduction capability in the thickness direction it should be noted that the thickness direction of the second heat conduction layer 12 is perpendicular to the planar direction of the second heat conduction layer 12; therefore, the heat conduction sheet of the embodiment is in the horizontal direction of the heat conduction sheet.
  • the thermal conductivity is higher.
  • the thermally conductive sheet of the present embodiment not only has high thermal conductivity in the thickness direction but also has higher thermal conductivity in the planar direction.
  • the first heat conducting layer is a compressible and deformable heat conducting layer, specifically: the first heat conducting layer has a compression deformation ratio of 5%-90% under the first pressure, and the first pressure is at 0 to Between 5000N. Preferably, the first pressure is between 0 and 200N.
  • the second heat conductive layer is an incompressible heat conductive layer, specifically: the second heat conductive layer has a compression deformation ratio of 0-5% at the first pressure.
  • the first heat conductive layer has a thickness of 0.2 to 5 mm
  • the second heat conductive layer has a thickness of 0.1 to 5 mm.
  • the thermally conductive sheet of the embodiment includes a second heat conductive layer in contact with a surface of the heat generating component, and a first heat conductive layer in contact with a surface of the second heat conductive layer, due to a heat conductive capability of the second heat conductive layer in a planar direction of the second heat conductive layer Greater than or equal to the thermal conductivity of the second heat conductive layer in the thickness direction of the second heat conductive layer.
  • the heat transfer capability of the second heat conductive layer in the plane direction of the second heat conductive layer is greater than The conductivity of the second heat conductive layer in the thickness direction, and the heat conductivity of the second heat conductive layer in the planar direction of the second heat conductive layer is greater than the heat conductive capability of the first heat conductive layer in the thickness direction of the first heat conductive layer, so the second heat conductive layer can The heat is sufficiently diffused in the planar direction of the second heat conducting layer and then conducted to the first heat conducting layer, thereby avoiding local occurrence on the second heat conducting layer in contact with the heat generating component when the heat generating component is excessively heated locally and the temperature is too high.
  • Hot spot, and the heat of the local hot spot cannot be exported in time to damage the device; then, due to the thermal conductivity of the first heat conducting layer in the thickness direction of the first heat conducting layer Is greater than the first guide The thermal conductivity of the thermal layer in the planar direction of the first thermal conductive layer, so that the first thermal conductive layer can conduct heat out in time.
  • the heat-dissipating sheet provided by the embodiment of the invention heat-dissipates the heat-generating component, it is possible to avoid a local hot spot due to local heat generation of the heat-generating component, and the heat of the local hot spot cannot be deduced in time to cause the device to be damaged.
  • the thermally conductive sheet of the present embodiment may further include: a third heat conducting layer 13 according to the first embodiment of the present invention, wherein the first The third heat conductive layer 13 is disposed between the heat generating component and the second heat conductive layer 12, the first surface of the third heat conductive layer 13 is in contact with the surface of the heat generating component, and the second surface of the third heat conductive layer 13 and the second heat conductive layer
  • the first surface of the second heat conducting layer 13 is used to fill the micro-voids of the surface of the heat-generating component, and the thickness of the third heat-conducting layer 13 is greater than zero and smaller than the thickness of the first heat-conducting layer 11.
  • the third heat conductive layer 13 of the present embodiment is used for microvoids on the surface of the heat generating component, and the thickness of the third heat conductive layer 13 is smaller than the thickness of the first heat conductive layer 11. Therefore, when the heat conductive sheet of the embodiment is disposed between the heat generating component and the heat sink, the third heat conductive layer 13 is in contact with the heat generating component, and the third heat conductive layer 13 can reduce the relationship between the second heat conductive layer 12 and the heat generating component. Contact thermal resistance further improves heat dissipation.
  • the thickness of the third heat conduction layer 13 is less than or equal to 0.2 mm, and the thickness of the third heat conduction layer is thin, in order to reduce contact thermal resistance; and the third heat conduction layer 13 is a prepreg or the third heat conductive layer 13 is gelatinous.
  • the first heat conduction layer 11 includes an organic substrate 111 and a heat conductive filler 112, and the heat conductive filler 112 is in the first heat conduction layer 11. Oriented in the thickness direction of the first heat conductive layer 11. Since the heat conductive filler 112 is oriented in the thickness direction of the first heat conductive layer 11 in the first heat conductive layer 11, the heat conductivity of the first heat conductive layer 11 in the thickness direction of the first heat conductive layer 11 is greater than that in the first The thermal conductivity of the thermally conductive layer 11 in the planar direction.
  • the organic substrate may include an organopolysiloxane having a vinyl group, an organopolysiloxane having a hydrosilyl group.
  • the thermally conductive filler comprises a sheet-like thermally conductive filler, or the thermally conductive filler comprises a fibrous thermally conductive filler, or the thermally conductive filler comprises a sheet-like thermally conductive filler and a fibrous thermally conductive filler, for example, the thermally conductive filler may comprise spherical alumina particles ( Particle size 2 to 50 ⁇ m) and pitch-based carbon fiber (axial length 60 to 180 ⁇ m, shaft diameter 5 to 15 ⁇ m), or the thermally conductive filler may include spherical alumina particles (particle size 2 to 50 ⁇ m) and flaky boron nitride (particle diameter) It is 5 to 15 ⁇ m).
  • the thermally conductive filler is a thermally conductive fiber
  • the thermally conductive fiber may be carbon fiber or carbon nanotube.
  • the material of the second heat conductive layer 12 includes metal, or graphite, or metal and graphite, or a graphene film, a carbon nanotube film, or the like, which has a high thermal conductivity in a planar direction.
  • the metal may be copper.
  • the second heat conduction layer 12 of the embodiment has a thermal conductivity of several hundred W/mk or even thousands of W/mk in the planar direction, which can effectively reduce the planar expansion thermal resistance.
  • FIG. 4 is a schematic structural view of a third embodiment of a thermally conductive sheet according to the present invention.
  • the thermally conductive sheet of the present embodiment is based on the above embodiments of the thermal conductive sheets of the present invention, and further, the first thermally conductive layer 11 of the thermally conductive sheet.
  • the second surface is in contact with the heat sink 20.
  • the heat dissipation device of the present embodiment may include a heat conductive sheet 10 and a heat generating component 30.
  • the implementation of the thermal conductive sheet is similar to the technical effect, and will not be described here. It is to be noted that the surface of the thermally conductive sheet 10 of the present embodiment is in contact with the surface of the heat generating component 30, and the heat conductive sheet 10 heat-dissipates the heat generated by the heat generating component 30. If the heat conductive sheet 10 is also in contact with the heat sink 20, the surface of the first heat conductive layer of the heat conductive sheet 10 is in contact with the heat sink 20.
  • FIG. 6 is a flowchart of Embodiment 1 of a method for manufacturing a thermally conductive sheet according to the present invention. As shown in FIG. 6, the method of this embodiment may include:
  • the second heat conducting layer is a graphite sheet of 0.9 mm or 0.5 mm or 1 mm thick.
  • a viscous organic composition which may include a thermally conductive filler, such as an organopolysiloxane having a vinyl group, an organopoly group having a hydrosilyl group.
  • Siloxane, spherical alumina particles (particle size 2 to 50 ⁇ m), and pitch-based carbon fibers (axial length 60 to 180 ⁇ m, shaft diameter 5 to 15 ⁇ m) are uniformly mixed in a certain ratio (18:18:34:30) (volume percentage And stirring and dispersing into a viscous organic composition; or, an organopolysiloxane having a vinyl group, an organopolysiloxane having a hydrosilyl group, spherical alumina particles (having a particle diameter of 2 to 50 ⁇ m), And flaky boron nitride (particle size 5-15um) uniformly mixed (weight percentage) in a certain ratio (50:50:80:150) and stirred to dispers
  • the viscous organic composition provided in S101 is applied to one surface of the second heat conducting layer provided by S102; the thermally conductive filler in the organic composition is oriented, and the organic composition is cured.
  • the treatment, the orientation treatment, and the curing treatment of the organic composition form a first heat conduction layer, thereby forming a first heat conduction layer on the second heat conduction layer, and the thermally conductive filler after the orientation treatment is in the first heat conduction layer
  • the orientation in the thickness direction is such that the heat conduction capability of the formed first heat conduction layer in the thickness direction of the first heat conduction layer is greater than the heat conduction capability in the planar direction of the first heat conduction layer.
  • the orientation treatment may be a magnetic field orientation treatment or an electric field orientation treatment or a stress orientation treatment.
  • the second heat conducting layer may be first placed in an orientation mold, and then a magnetic field or an electric field is applied to the orientation mold by pouring a viscous organic composition onto the surface of the second heat conductive layer in the orientation mold.
  • the orientation is performed; and it is formed by heating and curing in a heating furnace at 100 to 120 ° C for 4 to 6 hours to form a first heat conduction layer.
  • the second thermal conductive layer is in the The thermal conductivity of the second heat conducting layer in the planar direction is greater than or equal to the heat conducting capability of the second heat conducting layer in the thickness direction of the second heat conducting layer. Therefore, after receiving the heat transferred from the heat generating component, the second heat conducting layer is in the second heat conduction.
  • the diffusion capability in the layer plane direction is greater than the conductivity in the thickness direction of the second heat conduction layer, and the heat conduction capability of the second heat conduction layer in the planar direction of the second heat conduction layer is greater than the heat conduction of the first heat conduction layer in the thickness direction of the first heat conduction layer.
  • the second heat conducting layer can sufficiently diffuse heat in the planar direction of the second heat conducting layer and then conduct the heat to the first heat conducting layer, thereby avoiding excessive heat generation in the heat generating component and excessive temperature, and the heat generating component A local hot spot occurs on the contacted second heat conducting layer, and the heat of the local hot spot cannot be deduced in time to damage the device; and then, the first heat conducting layer has a higher thermal conductivity in the thickness direction of the first heat conducting layer than the first heat conducting layer is in the first The thermal conductivity of the heat conducting layer in the planar direction, so that the first heat conducting layer can conduct heat out in time.
  • the heat-dissipating sheet provided by the embodiment of the invention heat-dissipates the heat-generating component, it is possible to avoid a local hot spot due to local heat generation of the heat-generating component, and the heat of the local hot spot cannot be deduced in time to cause the device to be damaged.
  • FIG. 7 is a flowchart of a second embodiment of a method for manufacturing a thermally conductive sheet according to the present invention. As shown in FIG. 7, the method of this embodiment may include:
  • the first heat conductive layer is a compressible and deformable heat conductive layer, and the first heat conductive layer is in a thickness direction of the first heat conductive layer.
  • the thermal conductivity is greater than the thermal conductivity of the first thermally conductive layer in the planar direction of the first thermally conductive layer, and the thickness direction of the first thermally conductive layer is perpendicular to the planar direction of the first thermally conductive layer.
  • the second heat conductive layer is incompressible deformation a heat conducting layer, the heat conducting ability of the second heat conducting layer in a planar direction of the second heat conductive layer is greater than or equal to a heat conductive capability of the first heat conductive layer in a thickness direction of the first heat conductive layer,
  • the thermal conductivity of the second thermally conductive layer in the planar direction of the second thermally conductive layer is greater than or equal to the thermal conductivity of the second thermally conductive layer in the thickness direction of the second thermally conductive layer, and the thickness of the second thermally conductive layer is perpendicular In the planar direction of the second heat conducting layer.
  • a viscous organic composition which may include a thermally conductive filler, for example, an organopolysiloxane having a vinyl group, having Hydrosilyl organopolysiloxane, spherical alumina particles (particle size 2 to 50 ⁇ m), and pitch-based carbon fibers (axial length 60 to 180 ⁇ m, shaft diameter 5 to 15 ⁇ m) are in a certain ratio (18:18:34: 30) uniformly mixing (volume percentage) and stirring to disperse into a viscous organic composition; or, an organopolysiloxane having a vinyl group, an organopolysiloxane having a hydrosilyl group, or spherical alumina particles ( A particle size of 2 to 50 ⁇ m) and a sheet-like boron nitride (particle size of 5 to 15 ⁇ m) are uniformly mixed (weight percentage) in a certain ratio (50:50:80:150) and stirred
  • the organic composition is subjected to a curing treatment to form a first heat conductive layer, and the heat conductive filler is oriented in the thickness direction of the first heat conductive layer, so that the first heat conductive layer formed may be in the first
  • the thermal conductivity in the thickness direction of the thermally conductive layer is greater than the thermal conductivity in the planar direction of the first thermally conductive layer.
  • the orientation treatment may be a magnetic field orientation treatment or an electric field orientation treatment or a stress orientation treatment.
  • a viscous organic composition may be poured into an orientation mold, and a magnetic field or an electric field may be applied to the orientation mold to achieve a magnetic field orientation treatment or an electric field orientation treatment of the thermally conductive filler in the organic composition, or by stress pairing.
  • the thermally conductive filler in the organic composition is subjected to stress orientation treatment such that the thermally conductive filler is oriented in the thickness direction of the first thermally conductive layer; and is cured by heating in a heating furnace at 100 to 120 ° C for 4 to 6 hours to form a first A thermally conductive layer.
  • the second heat conducting layer is a graphite sheet of 0.9 mm or 0.5 mm or 1 mm thick.
  • a surface of the second heat conductive layer is attached to the surface of the first heat conductive layer after the alignment treatment and the solidification treatment, thereby forming a heat conductive sheet.
  • a surface of the second heat conducting layer may be coated with a heat conductive pressure sensitive adhesive layer having a thickness of about 10 um, and the separator may be added, and then a surface of the first heat conducting layer and a second heat conducting layer having a heat conductive pressure sensitive adhesive layer on the surface thereof may be The composite is performed such that the second heat conductive layer is attached to the first heat conductive layer to form a heat conductive sheet.
  • the thermal conductivity of the second thermally conductive layer in the planar direction of the second thermally conductive layer is greater than or equal to the second thermally conductive layer in the second thermally conductive layer.
  • the thermal conductivity in the thickness direction so that after the second heat conducting layer receives the heat transferred from the heat generating component, the heat diffusion capability in the plane direction of the second heat conductive layer is greater than the conductive capability in the thickness direction of the second heat conductive layer, and The thermal conductivity of the second thermally conductive layer in the planar direction of the second thermally conductive layer is greater than the thermal conductivity of the first thermally conductive layer in the thickness direction of the first thermally conductive layer, so that the second thermally conductive layer is capable of dissipating heat in the planar direction of the second thermally conductive layer.
  • the first heat conducting layer After being diffused, it is conducted to the first heat conducting layer, so as to avoid local hot spots on the second heat conducting layer in contact with the heat generating component when the heat generating component is excessively heated locally and the temperature is too high, and the heat of the local hot spot cannot be derived in time.
  • the device is damaged; then, since the thermal conductivity of the first heat conduction layer in the thickness direction of the first heat conduction layer is greater than the heat conduction capacity of the first heat conduction layer in the plane direction of the first heat conduction layer, the first heat conduction layer can conduct heat out in time.
  • the heat-dissipating sheet provided by the embodiment of the invention heat-dissipates the heat-generating component, it is possible to avoid a local hot spot due to local heat generation of the heat-generating component, and the heat of the local hot spot cannot be deduced in time to cause the device to be damaged.
  • the method further includes: forming a third heat conducting layer on another surface of the second heat conducting layer opposite to a surface of the first heat conducting layer
  • the third heat conducting layer is used to fill the microvoids on the surface of the heat generating component.
  • a layer of thermal grease of 0.05 mm to 0.15 mm is applied by a printing process on a surface of the second heat conducting layer.
  • the thermally conductive sheet obtained by the method of the embodiment further includes the above-mentioned third heat conductive layer, so that the contact thermal resistance of the heat conductive sheet can be reduced.

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Abstract

一种导热片和电子设备，导热片用于对发热部件进行散热，包括第一导热层（11）和第二导热层（12），第二导热层（12）的第一表面与发热部件的表面相接触，第二导热层（12）的第二表面和第一导热层（11）的第一表面相接触；第一导热层（11）为可压缩变形的导热层，第一导热层（11）在第一导热层（11）的厚度方向上的导热能力大于在平面方向上的导热能力；第二导热层（12）为不可压缩变形的导热层，第二导热层（12）在第二导热层（12）的平面方向上的导热能力大于或等于在厚度方向上的导热能力，第二导热层（12）在平面方向上的导热能力大于或等于第一导热层（11）在厚度方向上的导热能力。因此导热片在平面方向上具有很高的导热能力，可将发热部件的热量均匀扩散，有效缓解发热部件本身局部热点问题带来的散热难。

Description

导热片和电子设备
本申请要求于2015年06月29日提交中国专利局、申请号为201510368581.9、发明名称为“导热片和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明实施例涉及电子设备技术领域，尤其涉及一种导热片和电子设备。
背景技术
电子设备中芯片工作所产生的热量通常需借助散热器实现热量向外部的扩散。从微观角度看，芯片与散热器的接触界面都存在很多的凹凸不平，需使用界面导热材料做成导热片来填充芯片与散热器的接触界面，降低接触热阻。界面导热材料通常包含导热硅脂、导热垫、导热凝胶、相变导热材料、导热双面胶带等，根据不同的应用场景，可使用不同类型、不同导热系数的界面导热材料。
随着电子设备中芯片的功率密度持续上升，对于大功率芯片的散热，由于芯片封装本身存在局部热点问题，现有的仅在厚度方向具有高导热系数的导热片，导致芯片中局部热点的热量无法得到及时扩散，影响此类芯片的使用寿命。
发明内容
本发明实施例提供一种导热片和电子设备，用于有效缓解发热部件本身局部热点问题带来的散热难。
第一方面，本发明实施例提供一种导热片，用于对发热部件进行散热，所述导热片包括第一导热层和第二导热层，所述第二导热层的第一表面与所述发热部件的表面相接触，所述第二导热层的第二表面和所述第一导热层的第一表面相接触；
所述第一导热层为可压缩变形的导热层，所述第一导热层在所述第 一导热层的厚度方向上的导热能力大于所述第一导热层在所述第一导热层的平面方向上的导热能力，所述第一导热层的厚度方向垂直于所述第一导热层的平面方向；
所述第二导热层为不可压缩变形的导热层，所述第二导热层在所述第二导热层的平面方向的导热能力大于或者等于所述第二导热层在所述第二导热层的厚度方向的导热能力，且所述第二导热层在所述第二导热层的平面方向上的导热能力大于或等于所述第一导热层在所述第一导热层的厚度方向上的导热能力；所述第二导热层的厚度方向垂直于所述第二导热层的平面方向。
结合第一方面，在第一方面的第一种可能的实现方式中，所述第一导热层为可压缩变形的导热层，具体是指：
所述第一导热层在第一压力下的压缩变形比率为5％-90％，所述第一压力位于0到5000N之间。
结合第一方面的第一种可能的实现方式，在第一方面的第二种可能的实现方式中，所述第二导热层为不可压缩变形的导热层，具体是指：
所述第二导热层在所述第一压力下的压缩变形比率小于或者等于5％。
结合第一方面或第一方面的第一种可能的实现方式或第一方面的第二种可能的实现方式，在第一方面的第三种可能的实现方式中，所述第一导热层的厚度为0.2～5mm，所述第二导热层的厚度为0.1～5mm。
结合第一方面、第一方面的第一种可能的实现方式至第一方面的第三种可能的实现方式中任一种可能的实现方式，在第一方面的第四种可能的实现方式中，还包括：
第三导热层，所述第三导热层设置在所述发热部件和所述第二导热层之间，所述第三导热层的第一表面与所述发热部件的表面相接触，所述第三导热层的第二表面和所述第二导热层的第一表面相接触，所述第三导热层用于填充所述发热部件表面的微空隙。
结合第一方面的第四种可能的实现方式，在第一方面的第五种可能的实现方式中，所述第三导热层的厚度小于或者等于0.2mm，且所述第三导热层为半固化片或者所述第三导热层呈凝胶状。
结合第一方面、第一方面的第一种至第五种可能的实现方式中的任意一种，在第一方面的第六种可能的实现方式中，所述第一导热层包括有机基材和导热填料，所述导热填料在所述第一导热层中以所述第一导热层的厚度方向取向。
结合第一方面的第六种可能的实现方式，在第一方面的第七种可能的实现方式中，所述导热填料包括片状的导热填料；或，
所述导热填料包括纤维状的导热填料；或，
所述导热填料包括所述片状的导热填料和所述纤维状的导热填料。
结合第一方面、第一方面的第一种至第七种可能的实现方式中的任意一种，在第一方面的第八种可能的实现方式中，所述第二导热层的材料包括金属和石墨中的至少一种。
结合第一方面、第一方面的第一种至第八种可能的实现方式中的任意一种，在第一方面的第九种可能的实现方式中，所述第一导热层的第二表面与散热器相接触。
第二方面，本发明实施例提供一种电子设备，包括：如本发明第一方面或第一方面的各种可能的实现方式提供的导热片和发热部件，所述导热片的表面与所述发热部件的表面相接触；
所述导热片，用于对所述发热部件产生的热量进行散热处理。
第三方面，本发明实施例提供一种导热片的制造方法，所述方法包括：
提供粘稠状的有机组成物；
提供第二导热层，所述第二导热层为不可压缩变形的导热层，所述第二导热层在所述第二导热层的平面方向的导热能力大于或者等于所述第二导热层在所述第二导热层的厚度方向的导热能力，所述第二导热层的厚度方向垂直于所述第二导热层的平面方向；
将所述粘稠状的有机组成物涂覆至所述第二导热层的一表面上；
对所述有机组成物进行固化处理，以在所述第二导热层的一表面上形成第一导热层，所述第一导热层为可压缩变形的导热层，所述第一导热层在所述第一导热层的厚度方向上的导热能力大于在所述第一导热层的平面方向上的导热能力，所述第二导热层在所述第二导热层的平面方 向上的导热能力大于或等于所述第一导热层在所述第一导热层的厚度方向上的导热能力，所述第一导热层的厚度方向垂直所述第一导热层的平面方向。
第四方面，本发明实施例提供一种导热片的制造方法，所述方法包括：
提供粘稠状的有机组成物；
对所述有机组成物进行固化处理，以形成第一导热层，所述第一导热层为可压缩变形的导热层，所述第一导热层在所述第一导热层的厚度方向上的导热能力大于在所述第一导热层的平面方向上的导热能力，所述第一导热层的厚度方向垂直所述第一导热层的平面方向；
提供第二导热层，并将所述第二导热层的一表面与所述第一导热层的一表面相贴合，以形成所述导热片；所述第二导热层为不可压缩变形的导热层，所述第二导热层在所述第二导热层的平面方向上的导热能力大于或等于所述第一导热层在所述第一导热层的厚度方向上的导热能力，所述第二导热层在所述第二导热层的平面方向的导热能力大于或者等于所述第二导热层在所述第二导热层的厚度方向的导热能力，所述第二导热层的厚度方向垂直于所述第二导热层的平面方向。
可知，本发明实施例提供的导热片包括与发热部件的表面接触的第二导热层、和与第二导热层的表面接触的第一导热层，由于第二导热层在第二导热层的平面方向的导热能力大于或者等于第二导热层在第二导热层的厚度方向的导热能力，所以，第二导热层在接收到发热部件传递过来的热量后，热量在第二导热层平面方向上的扩散能力大于在第二导热层厚度方向上的传导能力，且第二导热层在第二导热层平面方向上的导热能力大于第一导热层在第一导热层厚度方向的导热能力，所以，第二导热层能够将热量在第二导热层的平面方向上充分扩散后再传导给第一导热层，从而避免在发热部件局部发热过多、温度过高时，与该发热部件接触的第二导热层上出现局部热点，且该局部热点的热无法及时导出而损坏器件；然后，由于第一导热层在第一导热层厚度方向上的导热能力大于第一导热层在第一导热层平面方向的导热能力，所以，第一导热层能够把热量及时传导出去。采用发明实施例提供的导热片对发热部 件进行散热处理时，可以避免由于发热部件局部发热较多形成局部热点，且该局部热点的热量无法及时导出而导致器件发热部件毁损的现象。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明导热片实施例一的结构示意图；
图2为本发明导热片实施例二的结构示意图；
图3为本发明导热片中第一导热层实施例一的结构示意图；
图4为本发明导热片实施例三的结构示意图；
图5为本发明电子设备实施例一的结构示意图；
图6为本发明导热片的制造方法实施例一的流程图；
图7为本发明导热片的制造方法实施例二的流程图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
图1为本发明导热片实施例一的结构示意图，如图1所示，本实施例的导热片用于对发热部件进行散热，包括第一导热层11和第二导热层12，第二导热层12的第一表面与发热部件的表面相接触，第二导热层12的第二表面和第一导热层11的第一表面相接触；其中，第一导热层11为可压缩变形的导热层，且该第一导热层11在该第一导热层11的厚度方向上的导热能力大于在该第一导热层11的平面方向上的导热能力，需要说 明的是，该第一导热层的厚度方向垂直于该第一导热层的平面方向。由于第一导热层在该第一导热层11的厚度方向上的导热能力大于在该第一导热层11的平面方向上的导热能力，因此本实施例的导热片在该导热片的厚度方向上的导热能力高。同时，本实施例的第二导热层12为不可压缩变形的导热层，而且该第二导热层12在该第二导热层12的平面方向上的导热能力大于或等于该第二导热层12在该第二导热层12的厚度方向上的导热能力，该第二导热层12在该第二导热层12的平面方向上的导热能力大于或等于该第一导热层11在该第一导热层11的厚度方向上的导热能力，需要说明的是，该第二导热层12的厚度方向垂直于该第二导热层12的平面方向；因此，本实施例的导热片在该导热片的水平方向上的导热能力更高。综上，本实施例的导热片不仅在厚度方向上具有高的导热能力，而且在平面方向上具有更高的导热能力。
其中，所述第一导热层为可压缩变形的导热层，具体是指：所述第一导热层在第一压力下的压缩变形比率为5％-90％，所述第一压力位于0到5000N之间。优选地，第一压力位于0到200N之间。
所述第二导热层为不可压缩变形的导热层，具体是指：所述第二导热层在所述第一压力下的压缩变形比率为0-5％。
可选地，第一导热层的厚度为0.2～5mm，第二导热层的厚度为0.1～5mm。
本实施例的导热片包括与发热部件的表面接触的第二导热层、和与第二导热层的表面接触的第一导热层，由于第二导热层在第二导热层的平面方向的导热能力大于或者等于第二导热层在第二导热层的厚度方向的导热能力，所以，第二导热层在接收到发热部件传递过来的热量后，热量在第二导热层平面方向上的扩散能力大于在第二导热层厚度方向上的传导能力，且第二导热层在第二导热层平面方向上的导热能力大于第一导热层在第一导热层厚度方向的导热能力，所以，第二导热层能够将热量在第二导热层的平面方向上充分扩散后再传导给第一导热层，从而避免在发热部件局部发热过多、温度过高时，与该发热部件接触的第二导热层上出现局部热点，且该局部热点的热无法及时导出而损坏器件；然后，由于第一导热层在第一导热层厚度方向上的导热能力大于第一导 热层在第一导热层平面方向的导热能力，所以，第一导热层能够把热量及时传导出去。采用发明实施例提供的导热片对发热部件进行散热处理时，可以避免由于发热部件局部发热较多形成局部热点，且该局部热点的热量无法及时导出而导致器件发热部件毁损的现象。
图2为本发明导热片实施例二的结构示意图，如图2所示，本实施例的导热片在本发明实施例一的基础上，还可以包括：第三导热层13，其中，该第三导热层13设置在发热部件和该第二导热层12之间，第三导热层13的第一表面与该发热部件的表面相接触，第三导热层13的第二表面与第二导热层12的第一表面相接触；而且该第三导热层13用于填充发热部件表面的微空隙，且该第三导热层13的厚度大于零且小于该第一导热层11的厚度。本实施例的第三导热层13用于发热部件表面的微空隙，且该第三导热层13的厚度小于该第一导热层11的厚度。因此，在将本实施例的导热片设置在发热部件与散热器之间时，第三导热层13与发热部件接触，该第三导热层13可以降低第二导热层12与发热部件之间的接触热阻，进一步提高了散热效果。
在本发明实施例二的基础上，可选地，第三导热层13的厚度小于或等于0.2mm，第三导热层的厚度较薄，目的是为了降低接触热阻；而且该第三导热层13为半固化片或者第三导热层13呈凝胶状。
在本发明实施例一或二的基础上，可选地，如图3所示，第一导热层11包括有机基材111和导热填料112，而且该导热填料112在该第一导热层11中以该第一导热层11的厚度方向取向。由于导热填料112在该第一导热层11中以该第一导热层11的厚度方向取向，因此该第一导热层11在该第一导热层11的厚度方向上的导热能力大于在该第一导热层11的平面方向上的导热能力。可选地，有机基材可以包括具有乙烯基的有机聚硅氧烷、具有氢甲硅烷基的有机聚硅氧烷。导热填料包括片状的导热填料，或者，导热填料包括纤维状的导热填料，或者，导热填料包括片状的导热填料和纤维状的导热填料，举例来说，导热填料可以包括球形氧化铝颗粒(粒径2～50μm)和沥青基碳纤维(轴长60～180μm、轴径5～15μm)，或者，导热填料可以包括球形氧化铝颗粒(粒径2～50μm)和片状氮化硼(粒径为5～15μm)。
可选地，导热填料为导热纤维，导热纤维可以为碳纤维或者碳纳米管。
可选地，第二导热层12的材料包括金属，或者，石墨，或者金属和石墨，或者，石墨烯薄膜，碳纳米管薄膜等具有平面方向高导热性的材料，可选地，金属可以为铜。本实施例的第二导热层12在平面方向上导热系数为数百W/mk甚至上千W/mk，可有效降低平面扩展热阻。
图4为本发明导热片实施例三的结构示意图，如图4所示，本实施例的导热片在本发明上述各导热片实施例的基础上，进一步地，导热片的第一导热层11的第二表面与散热器20相接触。
图5为本发明电子设备实施例一的结构示意图，如图5所示，本实施例的散热装置可以包括导热片10和发热部件30；其中，导热片10为本发明上述各导热片实施例提供的导热片，其实现原理和技术效果类似，此处不再赘述。需要说明的是，本实施例的导热片10的表面与发热部件30的表面相接触，且导热片10对发热部件30产生的热量进行散热处理。若导热片10还与散热器20接触，则由导热片10的第一导热层的表面与散热器20相接触。
图6为本发明导热片的制造方法实施例一的流程图，如图6所示，本实施例的方法可以包括：
S101、提供粘稠状的有机组成物。
S102、提供第二导热层，所述第二导热层为不可压缩变形的导热层，所述第二导热层在所述第二导热层的平面方向的导热能力大于或者等于所述第二导热层在所述第二导热层的厚度方向的导热能力，其中，所述第二导热层的厚度方向垂直于所述第二导热层的平面方向。
例如：第二导热层为0.9mm或者0.5mm或者1mm厚的石墨片。
S103、将所述粘稠状的有机组成物涂覆至所述第二导热层的一表面上。
S104、对所述有机组成物进行固化处理，以在所述第二导热层的一表面上形成第一导热层，所述第一导热层为可压缩变形的导热层，所述第一导热层在所述第一导热层的厚度方向上的导热能力大于所述第一导热层在所述第一导热层的平面方向上的导热能力，所述第一导热层的厚 度方向垂直于所述第一导热层的平面方向。
在本实施例的一种实现方式中，提供粘稠状的有机组成物，该有机组成物可以包括导热填料，例如：将具有乙烯基的有机聚硅氧烷、具有氢甲硅烷基的有机聚硅氧烷、球形氧化铝颗粒(粒径2～50μm)、和沥青基碳纤维(轴长60～180μm、轴径5～15μm)按照一定比例(18:18:34:30)均匀混合(体积百分比)并搅拌分散成粘稠状的有机组成物；或者，将具有乙烯基的有机聚硅氧烷、具有氢甲硅烷基的有机聚硅氧烷、球形氧化铝颗粒(粒径2～50μm)、和片状氮化硼(粒径为5～15um)按照一定比例(50:50:80:150)均匀混合(重量百分比)并搅拌分散成粘稠状的有机组成物；或者，将具有乙烯基的有机聚硅氧烷、具有氢甲硅烷基的有机聚硅氧烷、球形氧化铝颗粒(粒径2～50μm)、片状氮化硼(粒径为5～15um)、纳米石墨烯片(厚度为0.4nm～4nm，长度为5～20un)按照一定比例(50:50:80:60:1.5)均匀混合(重量百分比)并搅拌分散成粘稠状的有机组成物。
然后，将S101中提供的粘稠状的有机组成物涂覆至S102提供的第二导热层的一表面上；再对有机组成物中的导热填料进行取向处理，并对该有机组成物进行固化处理，取向处理以及固化处理后的有机组成物形成了第一导热层，从而在第二导热层上形成了第一导热层，且取向处理后的所述导热填料在所述第一导热层的厚度方向上取向，这样可以使得形成的所述第一导热层在所述第一导热层的厚度方向上的导热能力大于在所述第一导热层的平面方向上的导热能力。其中，取向处理可以为磁场取向处理或者电场取向处理或者应力取向处理。
例如：可以先将第二导热层放置在取向模具中，然后在将粘稠状的有机组成物倒入取向模具中的第二导热层的表面上，对该取向模具施加磁场或者电场，以实现对该有机组成物中导热填料的磁场取向处理或者电场取向处理，或者，通过应力对该有机组成物中导热填料进行应力取向处理，以使得该导热填料在垂直于第二导热层的平面方向上进行取向；并在100～120℃的加热炉中加热固化4～6小时成型，以形成第一导热层。
本实施例中，通过上述方式获得的导热片中，由于第二导热层在第 二导热层的平面方向的导热能力大于或者等于第二导热层在第二导热层的厚度方向的导热能力，所以，第二导热层在接收到发热部件传递过来的热量后，热量在第二导热层平面方向上的扩散能力大于在第二导热层厚度方向上的传导能力，且第二导热层在第二导热层平面方向上的导热能力大于第一导热层在第一导热层厚度方向的导热能力，所以，第二导热层能够将热量在第二导热层的平面方向上充分扩散后再传导给第一导热层，从而避免在发热部件局部发热过多、温度过高时，与该发热部件接触的第二导热层上出现局部热点，且该局部热点的热无法及时导出而损坏器件；然后，由于第一导热层在第一导热层厚度方向上的导热能力大于第一导热层在第一导热层平面方向的导热能力，所以，第一导热层能够把热量及时传导出去。采用发明实施例提供的导热片对发热部件进行散热处理时，可以避免由于发热部件局部发热较多形成局部热点，且该局部热点的热量无法及时导出而导致器件发热部件毁损的现象。
图7为本发明导热片的制造方法实施例二的流程图，如图7所示，本实施例的方法可以包括：
S201、提供粘稠状的有机组成物。
S202、对所述有机组成物进行固化处理，以形成第一导热层，所述第一导热层为可压缩变形的导热层，所述第一导热层在所述第一导热层的厚度方向上的导热能力大于所述第一导热层在所述第一导热层的平面方向上的导热能力，所述第一导热层的厚度方向垂直于所述第一导热层的平面方向。
S203、提供第二导热层，并将所述第二导热层的一表面与所述第一导热层的一表面相贴合，以形成所述导热片；所述第二导热层为不可压缩变形的导热层，所述第二导热层在所述第二导热层的平面方向上的导热能力大于或等于所述第一导热层在所述第一导热层的厚度方向上的导热能力，所述第二导热层在所述第二导热层的平面方向的导热能力大于或者等于所述第二导热层在所述第二导热层的厚度方向的导热能力，所述第二导热层的厚度方向垂直于所述第二导热层的平面方向。
在本实施例的一种实现方式中，提供粘稠状的有机组成物，该有机组成物可以包括导热填料，例如：将具有乙烯基的有机聚硅氧烷、具有 氢甲硅烷基的有机聚硅氧烷、球形氧化铝颗粒(粒径2～50μm)、和沥青基碳纤维(轴长60～180μm、轴径5～15μm)按照一定比例(18:18:34:30)均匀混合(体积百分比)并搅拌分散成粘稠状的有机组成物；或者，将具有乙烯基的有机聚硅氧烷、具有氢甲硅烷基的有机聚硅氧烷、球形氧化铝颗粒(粒径2～50μm)、和片状氮化硼(粒径为5～15um)按照一定比例(50:50:80:150)均匀混合(重量百分比)并搅拌分散成粘稠状的有机组成物；或者，将具有乙烯基的有机聚硅氧烷、具有氢甲硅烷基的有机聚硅氧烷、球形氧化铝颗粒(粒径2～50μm)、片状氮化硼(粒径为5～15um)、纳米石墨烯片(厚度为0.4nm～4nm，长度为5～20un)按照一定比例(50:50:80:60:1.5)均匀混合(重量百分比)并搅拌分散成粘稠状的有机组成物。
然后，对有机组成物进行固化处理，以形成第一导热层，并沿第一导热层的厚度方向，对导热填料进行取向处理，这样可以使得形成的所述第一导热层在所述第一导热层的厚度方向上的导热能力大于在所述第一导热层的平面方向上的导热能力。其中，取向处理可以为磁场取向处理或者电场取向处理或者应力取向处理。
例如：可以将粘稠状的有机组成物倒入取向模具中，对该取向模具施加磁场或者电场，以实现对该有机组成物中导热填料的磁场取向处理或者电场取向处理，或者，通过应力对该有机组成物中导热填料进行应力取向处理，以使得该导热填料在第一导热层的厚度方向上进行取向；并在100～120℃的加热炉中加热固化4～6小时成型，以形成第一导热层。
例如：第二导热层为0.9mm或者0.5mm或者1mm厚的石墨片。在S202之后，将第二导热层的一表面贴合至取向处理和固化处理后的第一导热层的表面上，从而形成导热片。
例如：可以在第二导热层的表面涂覆有厚度约10um的导热压敏胶层，并增加隔离膜，再将第一导热层的一表面与表面有导热压敏胶层的第二导热层进行复合，使得第二导热层贴合至第一导热层上，以形成导热片。
本实施例中，通过上述方式获得的导热片中，由于第二导热层在第二导热层的平面方向的导热能力大于或者等于第二导热层在第二导热层 的厚度方向的导热能力，所以，第二导热层在接收到发热部件传递过来的热量后，热量在第二导热层平面方向上的扩散能力大于在第二导热层厚度方向上的传导能力，且第二导热层在第二导热层平面方向上的导热能力大于第一导热层在第一导热层厚度方向的导热能力，所以，第二导热层能够将热量在第二导热层的平面方向上充分扩散后再传导给第一导热层，从而避免在发热部件局部发热过多、温度过高时，与该发热部件接触的第二导热层上出现局部热点，且该局部热点的热无法及时导出而损坏器件；然后，由于第一导热层在第一导热层厚度方向上的导热能力大于第一导热层在第一导热层平面方向的导热能力，所以，第一导热层能够把热量及时传导出去。采用发明实施例提供的导热片对发热部件进行散热处理时，可以避免由于发热部件局部发热较多形成局部热点，且该局部热点的热量无法及时导出而导致器件发热部件毁损的现象。
可选地，在本发明方法实施例一或二的基础上，还包括：在所述第二导热层的与所述第一导热层结合的一表面相对的另一表面上形成第三导热层；所述第三导热层用于填充发热部件表面的微空隙。例如：在第二导热层的一表面通过印刷工艺施加一层厚度为0.05mm～0.15mm的导热硅脂。本实施例的方法获得的导热片还包括上述的第三导热层，从而可以降低导热片的接触热阻。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (11)

  1. 一种导热片，用于对发热部件进行散热，其特征在于，
    所述导热片包括第一导热层和第二导热层，所述第二导热层的第一表面与所述发热部件的表面相接触，所述第二导热层的第二表面和所述第一导热层的第一表面相接触；
    所述第一导热层为可压缩变形的导热层，所述第一导热层在所述第一导热层的厚度方向上的导热能力大于所述第一导热层在所述第一导热层的平面方向上的导热能力，所述第一导热层的厚度方向垂直于所述第一导热层的平面方向；
    所述第二导热层为不可压缩变形的导热层，所述第二导热层在所述第二导热层的平面方向的导热能力大于或者等于所述第二导热层在所述第二导热层的厚度方向的导热能力，且所述第二导热层在所述第二导热层的平面方向上的导热能力大于或等于所述第一导热层在所述第一导热层的厚度方向上的导热能力；所述第二导热层的厚度方向垂直于所述第二导热层的平面方向。
  2. 根据权利要求1所述的导热片，其特征在于，所述第一导热层为可压缩变形的导热层，具体是指：
    所述第一导热层在第一压力下的压缩变形比率为5％-90％，所述第一压力位于0到5000N之间。
  3. 根据权利要求2所述的导热片，其特征在于，所述第二导热层为不可压缩变形的导热层，具体是指：
    所述第二导热层在所述第一压力下的压缩变形比率小于或等于5％。
  4. 根据权利要求1至3任一项所述的导热片，其特征在于：
    所述第一导热层的厚度为0.2～5mm，所述第二导热层的厚度为0.1～5mm。
  5. 根据权利要求1至4任一项所述的导热片，其特征在于，还包括：
    第三导热层，所述第三导热层设置在所述发热部件和所述第二导热层之间，所述第三导热层的第一表面与所述发热部件的表面相接触，所 述第三导热层的第二表面和所述第二导热层的第一表面相接触，所述第三导热层用于填充所述发热部件表面的微空隙。
  6. 根据权利要求5所述的导热片，其特征在于，所述第三导热层的厚度小于或者等于0.2mm，且所述第三导热层为半固化片或者所述第三导热层呈凝胶状。
  7. 根据权利要求1至6任一项所述的导热片，其特征在于，所述第一导热层包括有机基材和导热填料，所述导热填料在所述第一导热层中以所述第一导热层的厚度方向取向。
  8. 根据权利要求7所述的导热片，其特征在于，
    所述导热填料包括片状的导热填料；或，
    所述导热填料包括纤维状的导热填料；或，
    所述导热填料包括所述片状的导热填料和所述纤维状的导热填料。
  9. 根据权利要求1至8任一项所述的导热片，其特征在于，所述第二导热层的材料包括金属和石墨中的至少一种。
  10. 根据权利要求1至9任一项所述的导热片，其特征在于，所述第一导热层的第二表面与散热器相接触。
  11. 一种电子设备，其特征在于，包括：如权利要求1至10任一项所述的导热片和发热部件，所述导热片的表面与所述发热部件的表面相接触；
    所述导热片，用于对所述发热部件产生的热量进行散热处理。
PCT/CN2016/073612 2015-06-29 2016-02-05 导热片和电子设备 Ceased WO2017000559A1 (zh)

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